CN105984700B - 基板传送*** - Google Patents

基板传送*** Download PDF

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Publication number
CN105984700B
CN105984700B CN201510671752.5A CN201510671752A CN105984700B CN 105984700 B CN105984700 B CN 105984700B CN 201510671752 A CN201510671752 A CN 201510671752A CN 105984700 B CN105984700 B CN 105984700B
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CN
China
Prior art keywords
substrate
alignment
unit
substrate transfer
pallet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201510671752.5A
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English (en)
Chinese (zh)
Other versions
CN105984700A (zh
Inventor
崔汉铉
金教承
卢光硕
徐正欢
麴今镐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Publication of CN105984700A publication Critical patent/CN105984700A/zh
Application granted granted Critical
Publication of CN105984700B publication Critical patent/CN105984700B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201510671752.5A 2015-03-16 2015-10-15 基板传送*** Expired - Fee Related CN105984700B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0036256 2015-03-16
KR1020150036256A KR102270563B1 (ko) 2015-03-16 2015-03-16 기판 이송 시스템

Publications (2)

Publication Number Publication Date
CN105984700A CN105984700A (zh) 2016-10-05
CN105984700B true CN105984700B (zh) 2020-06-26

Family

ID=57039597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510671752.5A Expired - Fee Related CN105984700B (zh) 2015-03-16 2015-10-15 基板传送***

Country Status (2)

Country Link
KR (1) KR102270563B1 (ko)
CN (1) CN105984700B (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1433940A (zh) * 2002-01-09 2003-08-06 Asml美国公司 利用机器人分划板末端执行器来输送和加装分划板所用的方法和装置
KR100560628B1 (ko) * 1997-11-19 2006-08-10 삼성전자주식회사 반도체 웨이퍼 승강식 정렬장치 및 이를 이용한 웨이퍼 이송방법
CN101533225A (zh) * 2008-03-11 2009-09-16 株式会社阿迪泰克工程 玻璃掩模和掩模保持器的位置对准装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
KR20050035714A (ko) * 2003-10-14 2005-04-19 삼성전자주식회사 웨이퍼 핸들링 시스템

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100560628B1 (ko) * 1997-11-19 2006-08-10 삼성전자주식회사 반도체 웨이퍼 승강식 정렬장치 및 이를 이용한 웨이퍼 이송방법
CN1433940A (zh) * 2002-01-09 2003-08-06 Asml美国公司 利用机器人分划板末端执行器来输送和加装分划板所用的方法和装置
CN101533225A (zh) * 2008-03-11 2009-09-16 株式会社阿迪泰克工程 玻璃掩模和掩模保持器的位置对准装置

Also Published As

Publication number Publication date
CN105984700A (zh) 2016-10-05
KR102270563B1 (ko) 2021-06-30
KR20160111602A (ko) 2016-09-27

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Granted publication date: 20200626

Termination date: 20211015