CN105916931A - 树脂组合物、反射器、带反射器的引线框、及半导体发光装置 - Google Patents
树脂组合物、反射器、带反射器的引线框、及半导体发光装置 Download PDFInfo
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- CN105916931A CN105916931A CN201580004539.7A CN201580004539A CN105916931A CN 105916931 A CN105916931 A CN 105916931A CN 201580004539 A CN201580004539 A CN 201580004539A CN 105916931 A CN105916931 A CN 105916931A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- -1 reflector Substances 0.000 title claims description 50
- 239000011342 resin composition Substances 0.000 title abstract description 8
- 239000011256 inorganic filler Substances 0.000 claims abstract description 22
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 22
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011787 zinc oxide Substances 0.000 claims abstract description 8
- 239000005083 Zinc sulfide Substances 0.000 claims abstract description 6
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052984 zinc sulfide Inorganic materials 0.000 claims abstract description 6
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 5
- 239000006229 carbon black Substances 0.000 claims abstract description 5
- 239000004927 clay Substances 0.000 claims abstract description 5
- 229910052570 clay Inorganic materials 0.000 claims abstract description 5
- 239000000454 talc Substances 0.000 claims abstract description 5
- 229910052623 talc Inorganic materials 0.000 claims abstract description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 84
- 239000011347 resin Substances 0.000 claims description 84
- 239000000463 material Substances 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 125000002769 thiazolinyl group Chemical group 0.000 claims description 13
- 125000004665 trialkylsilyl group Chemical group 0.000 claims description 10
- 229920000306 polymethylpentene Polymers 0.000 claims description 9
- 239000011116 polymethylpentene Substances 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 235000012222 talc Nutrition 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 abstract description 4
- 229910002804 graphite Inorganic materials 0.000 abstract description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 abstract 2
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 239000010445 mica Substances 0.000 abstract 1
- 229910052618 mica group Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 18
- 238000010894 electron beam technology Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 7
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 7
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 229920001519 homopolymer Polymers 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 6
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 6
- 235000014692 zinc oxide Nutrition 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000008187 granular material Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 5
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000002537 cosmetic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 3
- 229940117958 vinyl acetate Drugs 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 231100000987 absorbed dose Toxicity 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000006103 coloring component Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000005066 dodecenyl group Chemical group C(=CCCCCCCCCCC)* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- PQJZHMCWDKOPQG-UHFFFAOYSA-N 2-anilino-2-oxoacetic acid Chemical compound OC(=O)C(=O)NC1=CC=CC=C1 PQJZHMCWDKOPQG-UHFFFAOYSA-N 0.000 description 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 235000002918 Fraxinus excelsior Nutrition 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- JHXVRRJXCDAINK-UHFFFAOYSA-N NC(=O)N.N#CC#N Chemical compound NC(=O)N.N#CC#N JHXVRRJXCDAINK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920005533 TPX™ RT18 Polymers 0.000 description 1
- 229920010741 Ultra High Molecular Weight Polyethylene (UHMWPE) Polymers 0.000 description 1
- 239000004708 Very-low-density polyethylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- VVJKKWFAADXIJK-UHFFFAOYSA-N allylamine Natural products NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002956 ash Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011805 ball Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- TUCXJNLELWQJRZ-UHFFFAOYSA-N cyclobuten-1-yl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C1=CCC1 TUCXJNLELWQJRZ-UHFFFAOYSA-N 0.000 description 1
- MKVPFJQZXSECJP-UHFFFAOYSA-N cyclobuten-1-yl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C1=CCC1 MKVPFJQZXSECJP-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- IQDGSYLLQPDQDV-UHFFFAOYSA-N dimethylazanium;chloride Chemical compound Cl.CNC IQDGSYLLQPDQDV-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- WRNFRRJFNJVKBT-UHFFFAOYSA-N hept-1-enyl(trimethoxy)silane Chemical compound CCCCCC=C[Si](OC)(OC)OC WRNFRRJFNJVKBT-UHFFFAOYSA-N 0.000 description 1
- XWHJQTQOUDOZGR-UHFFFAOYSA-N hex-1-enyl(trimethoxy)silane Chemical compound CCCCC=C[Si](OC)(OC)OC XWHJQTQOUDOZGR-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical group CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940095068 tetradecene Drugs 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- DVFZJTWMDGYBCD-UHFFFAOYSA-N triethoxy(hex-1-enyl)silane Chemical compound CCCCC=C[Si](OCC)(OCC)OCC DVFZJTWMDGYBCD-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- ADQDBBLXGLRLPS-UHFFFAOYSA-N trimethoxy(pent-1-enyl)silane Chemical compound CCCC=C[Si](OC)(OC)OC ADQDBBLXGLRLPS-UHFFFAOYSA-N 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C08K5/00—Use of organic ingredients
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- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
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-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2924/181—Encapsulation
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Abstract
本发明提供一种树脂组合物、及使用该树脂组合物的反射器、带反射器的引线框、及半导体发光装置,所述树脂组合物含有:烯烃树脂、具有烯基的烷氧基硅烷化合物、选自氧化钛、氧化铝、滑石、粘土、铝、氢氧化铝、云母、氧化铁、石墨、炭黑、碳酸钙、硫化锌、氧化锌、硫酸钡、钛酸钾中的至少一种无机填料。可以提供即使在制成成形体的情况下也能够发挥优异的耐热性(特别是耐热变形性)的树脂组合物、使用该树脂组合物的反射器、带反射器的引线框、及半导体发光装置。
Description
技术领域
本发明涉及树脂组合物、反射器、带反射器的引线框、及半导体发光装置。
目前,作为使电子零件安装于基板等的方法,可采用在规定的场所预先点有焊剂的基板上临时固定电子零件之后,将该基板通过红外线、热风等手段进行加热而使焊剂熔融并固定电子零件的方法(回流焊法)。通过该方法可以提高基板表面电子零件的安装密度。
但是,目前所使用的电子零件,其耐热性不能说充分,特别是在利用红外线加热的回流焊工序中,存在零件表面的温度局部地升高且产生变形等问题,期望耐热性(特别是耐热变形性)更优异的树脂组合物及电子零件。
另外,作为半导体发光装置之一的LED元件为小型且长寿命、省电性优异,因此,作为显示灯等的光源被广泛利用。而且,近年来,比较廉价地制造亮度更高的LED元件,因此,正在研究作为荧光灯及白热灯泡的替代光源的利用。适用于这种光源的情况下,为了得到大的照度,多采用表面安装型LED封装,即铝等金属制的基板(引线框)上配置LED元件,在各LED元件的周围配设使光向给定方向反射的反射器(反射体)的方式。
但是,由于LED元件在发光时伴有发热,因此,在这种方式的LED照明装置中,反射器因LED元件发光时的温度上升而劣化,其反射率会降低。其结果,亮度降低,导致LED元件的短寿命化等。因此,要求反射器具有耐热性。
为了适应上述耐热性的要求,在专利文献1中提出了由具有碳-氢键的氟树脂(A)及氧化钛(B)构成的树脂组合物。另外,专利文献2中提出了包含聚甲基戊烯、白色颜料和球状熔融二氧化硅粒子和/或异形截面玻璃纤维的反射器用树脂组合物。
现有技术文献
专利文献
专利文献1:(日本)特开2011-195709号公报
专利文献2:(日本)特开2012-180432号公报
发明内容
发明所要解决的课题
但是,对于专利文献1及专利文献2记载的树脂组合物,没有进行针对耐热变形性的探讨。另外,专利文献1的含有氟的树脂组合物在利用热或放射线的固化过程中,产生氟化氢等有毒气体,从环境污染这方面来看,无法实际应用。
如上,本发明的目的在于,提供一种即使在制成成形体的情况下也能够发挥优异的耐热性(尤其是耐热变形性)的树脂组合物、使用该树脂组合物的反射器、带反射器的引线框、及半导体发光装置。
用于解决课题的方案
本发明人等为了实现上述目的而重复深入研究,结果发现通过下述发明能实现该目的。即,本发明如下述。
[1]一种树脂组合物,其含有:烯烃树脂、具有烯基的烷氧基硅烷化合物、以及选自氧化钛、氧化铝、滑石、粘土、铝、氢氧化铝、云母、氧化铁、石墨、炭黑、碳酸钙、硫化锌、氧化锌、硫酸钡、钛酸钾中的至少一种无机填料。
[2]如[1]所述的树脂组合物,其中,所述烯烃树脂为聚乙烯、聚丙烯及聚甲基戊烯中的至少任一种。
[3]如[1]或[2]所述的树脂组合物,其中,所述具有烯基的烷氧基硅烷化合物为具有碳原子数1~20的烯基的三烷氧基硅烷。
[4]如[1]~[3]中任一项所述的树脂组合物,其还含有二氧化硅。
[5]如[1]~[4]中任一项所述的树脂组合物,其还含有流动性改进剂。
[6]一种反射器,其由[1]~[5]中任一项所述的树脂组合物的固化物制成。
[7]一种带反射器的引线框,其由[1]~[5]中任一项所述的树脂组合物的固化物制成。
[8]一种半导体发光装置,其在基板上具有光半导体元件、设于所述光半导体元件周围且使来自该光半导体元件的光向给定方向反射的反射器,
所述反射器的光反射面由[1]~[5]中任一项所述的树脂组合物的固化物制成。
发明的效果
本发明能提供即使在制成成形体的情况下也能够发挥优异的耐热性(特别是耐热变形性)的树脂组合物、使用该树脂组合物的反射器、带反射器的引线框、及半导体发光装置。
附图说明
图1是示出本发明的半导体发光装置的一例的示意性剖面图;
图2是示出本发明的半导体发光装置的一例的示意性剖面图。
标记说明
10 光半导体元件
12 反射器
14 基板
15 绝缘部
16 引线
18 透镜
具体实施方式
[1.树脂组合物]
本发明的树脂组合物包含烯烃树脂、具有烯基的烷氧基硅烷化合物、以及选自氧化钛、氧化铝、滑石、粘土、铝、氢氧化铝、云母、氧化铁、石墨、炭黑、碳酸钙、硫化锌、氧化锌、硫酸钡、钛酸钾中的至少一种无机填料。本发明的树脂组合物利用上述硅烷化合物提高无机填料在烯烃树脂中的分散性,另外,耐光性也优异。
此外,本发明的树脂组合物优选作为利用电子束固化的电子束固化性树脂组合物使用。本发明的树脂组合物具有在水解后与无机填料呈现脱水缩合反应的烷氧基、以及与树脂具有反应性的双键,因此,在作为电子束固化性树脂组合物的情况下能够减小其照射线量。其结果,能够降低对树脂的损害,实现照射时间的缩短化。
以下,对本发明的树脂组合物进行说明。
(烯烃树脂)
烯烃树脂是指主链由碳-碳键构成的构成单元的聚合物,碳键有时包含环状结构。可以是均聚物,也可以是与其它单体共聚而成的共聚物。碳-碳键由于不引起水解反应,所以耐水性优异。作为烯烃树脂,例如可举出:使降冰片烯衍生物开环易位聚合的树脂或其氢化物、乙烯、丙烯等烯烃各自的均聚物、或乙烯-丙烯的嵌段共聚物、无规共聚物、或乙烯和/或丙烯与丁烯、戊烯、己烯等其它烯烃的共聚物、另外还有乙烯和/或丙烯与醋酸乙烯酯等其它单体的共聚物等。其中,优选为聚乙烯、聚丙烯、聚甲基戊烯,更优选为聚甲基戊烯。
聚乙烯可以是乙烯的均聚物,也可以是乙烯和可以与乙烯共聚的其它共聚单体(例如,丙烯、1-丁烯、1-己烯、1-辛烯等α-烯烃、醋酸乙烯酯、乙烯醇等)的共聚物。作为聚乙烯树脂,例如可举出:高密度聚乙烯(HDPE)、中密度聚乙烯(MDPE)、低密度聚乙烯(LDPE)、直链低密度聚乙烯(LLDPE)、超低密度聚乙烯(VLDPE)、超高分子量聚乙烯(UHMWPE)、交联聚乙烯(PEX)等。这些聚乙烯可以单独使用1种,也可以并用2种以上。
聚丙烯可以是丙烯的均聚物,也可以是丙烯和可以与丙烯共聚的其它共聚单体(例如,乙烯、1-丁烯、1-己烯、1-辛烯等α-烯烃、醋酸乙烯酯、乙烯醇等)的共聚物。这些聚丙烯可以单独使用1种,也可以并用2种以上。
作为聚甲基戊烯,优选4-甲基戊烯-1的均聚物,也可以为4-甲基戊烯-1与其它α-烯烃(例如乙烯、丙烯、1-丁烯、1-戊烯、1-己烯、1-辛烯、1-癸烯、1-十二碳烯、1-十四碳烯、1-十八碳烯、1-二十碳烯、3-甲基-1-丁烯、3-甲基-1-戊烯等碳原子数2~20的α-烯烃)的共聚物,且为以包含90摩尔%以上的4-甲基-1-戊烯的4-甲基-1-戊烯为主体的共聚物。
就4-甲基戊烯-1的均聚物的分子量而言,用凝胶渗透色谱法测定的聚苯乙烯换算的重量均分子量Mw为1,000以上,特别优选为5,000以上。
烯烃树脂的折射率比一般的树脂低,因此,在与氧化钛粒子那样的高折射率材料组合时能够增大折射率的差,可以有效地提高反射率。就折射率而言,聚乙烯为约1.53,聚丙烯为约1.48,聚甲基戊烯为约1.46,更优选为聚甲基戊烯。
另外,由于在树脂结构中存在芳香环,从而变得容易引起由紫外光的吸收造成的着色成分的生成。若生成着色成分,则引起光的反射率降低,因此,树脂结构中芳香环的数量越少越好,更优选为实质上不含芳香环。若考虑该观点,则例如适合用作半导体发光装置的反射器。
(具有烯基的烷氧基硅烷化合物)
在本发明的树脂组合物中,含有具有烯基的烷氧基硅烷化合物而成。优选有机链的碳原子数设为1~20,但由于因碳原子数增加而硬度或密度降低,因此更优选为1~10。
作为具有烯基的烷氧基硅烷化合物,优选为具有碳原子数为1~20的烯基的三烷氧基硅烷,更优选为具有碳原子数为1~10的烯基的三烷氧基硅烷。作为该烷氧基硅烷化合物,可举出:乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、丙烯基三甲氧基硅烷、丙烯基三乙氧基硅烷、丁烯基三甲氧基硅烷、丁烯基三乙氧基硅烷、戊烯基三甲氧基硅烷、戊烯基三乙氧基硅烷、己烯基三甲氧基硅烷、己烯基三乙氧基硅烷、庚烯基三甲氧基硅烷、庚烯基三乙氧基硅烷、辛烯基三甲氧基硅烷、辛烯基三乙氧基硅烷、壬烯基三甲氧基硅烷、壬烯基三乙氧基硅烷、癸烯基三甲氧基硅烷、癸烯基三乙氧基硅烷、十一碳烯基三甲氧基硅烷、十一碳烯基三乙氧基硅烷、十二碳烯基三甲氧基硅烷、十二碳烯基三乙氧基硅烷等。其中,优选为乙烯基三甲氧基硅烷、辛烯基三甲氧基硅烷。
就具有烯基的烷氧基硅烷化合物的含量而言,相对于100质量份的烯烃树脂,优选设为0.1~20质量份,更优选为0.5~10质量份,进一步优选为1~7质量份。通过设为1~7质量份,能够使填料分散在树脂中。即,利用上述硅烷化合物提高无机填料在烯烃树脂中的分散性,能够表现出优异的反射率、耐光性。在烷氧基硅烷化合物中,芳香环的数量越少越好,更优选为没有芳香环。
[无机填料]
另外,在本发明的树脂组合物中,包含选自氧化钛、氧化铝、滑石、粘土、铝、氢氧化铝、云母、氧化铁、石墨、炭黑、碳酸钙、硫化锌、氧化锌、硫酸钡、钛酸钾中的至少一种无机填料。其中,优选为包含白色颜料。通过包含白色颜料,能够供于反射器等用途。作为白色颜料,可单独或是混合使用氧化钛、硫化锌、氧化锌、硫酸钡、钛酸钾等,其中,优选为氧化钛。
另外,无机填料的形状没有特别的限定。例如,可以使用粒子状及纤维状、异形截面纤维状、凹凸差大的形状、厚度薄的薄片状等形状。
就无机填料的含量而言,相对于烯烃树脂100质量份,优选为设为10~600质量份,更优选为30~500质量份,进一步优选为50~450质量份。通过设为30~500质量份,能够良好地保持制品性能(例如,反射器的光反射率、强度、成形翘曲)。另外,能够防止无机成分多而无法加工、或者是即使能够加工成形状态也不佳而制品性能(例如反射器的光反射率)降低的情况。
考虑成形性,无机填料的平均粒径在一次粒度分布中优选为0.01~100μm,更优选为0.05~10μm,进一步优选为0.10~1μm。平均粒径能够作为利用激光衍射法的粒度分布测定中的质量平均值D50求得。
(其它成分)
只要不损害性能,则也可以含有本发明的无机填料以外的其它无机填料。作为其它无机填料,通常,可以单独或者混合使用可配合于热塑性树脂组合物及环氧树脂、丙烯酸树脂、硅酮树脂那种的热固化树脂组合物的物质。其它无机填料的形状及粒径没有特别限定。例如,可以使用粒子状及纤维状、异形截面纤维状、凹凸差大的形状、厚度薄的薄片状之类的形状。具体而言,可以使用二氧化硅,作为二氧化硅,优选为二氧化硅粒子、玻璃纤维等,更优选为含有玻璃纤维。该二氧化硅粒子的平均粒径优选为0.01~1000μm,更优选为0.1~200μm,进一步优选为1~100μm。另外,玻璃纤维的平均长度(纤维长度)优选为5~3000μm,更优选为20~200μm,进一步优选为40~100μm。通过设为该范围内的平均粒径或纤维长度,纤维状材料被大量填充于成形物中,能够提高成形物的强度。
需要说明的是,纤维长度可以通过在温度600℃的电炉中将混合物进行2小时灰化,使其分散在溶液中,使该分散溶液在载玻片上干燥,用显微镜进行拍照,并用影像解析软件处理来求得。
就其它无机填料的含量而言,相对于100质量份的烯烃树脂为10~300质量份,更优选为30~200质量份,进一步优选为50~120质量份。
另外,本发明的树脂组合物优选含有流动性改进剂。通过含有该流动性改进剂,可提高树脂的成形性。作为该流动性改进剂,可以举出:三烯丙基异氰脲酸酯、单缩水甘油基二烯丙基异氰脲酸酯、二缩水甘油基单烯丙基异氰脲酸酯、三甲基烯丙基异氰脲酸酯、单缩水甘油基二甲基烯丙基异氰脲酸酯、二缩水甘油基单甲基烯丙基异氰脲酸酯、三烯丙基氰脲酸酯、单缩水甘油基二烯丙基氰脲酸酯、二缩水甘油基单烯丙基氰脲酸酯、三甲基烯丙基氰脲酸酯、单缩水甘油基二甲基烯丙基氰脲酸酯、二缩水甘油基单甲基烯丙基氰脲酸酯、烯丙基缩水甘油胺、二烯丙基单缩水甘油胺、单烯丙基二缩水甘油胺、单缩水甘油基二甲基烯丙胺、二缩水甘油基单甲基烯丙胺、缩水甘油基烯丙基氯茵酸酯、烯丙基缩水甘油基己二酸酯、烯丙基缩水甘油基碳酸酯、烯丙基缩水甘油基二甲基氯化铵、烯丙基缩水甘油基富马酸酯、烯丙基缩水甘油基间苯二甲酸酯、烯丙基缩水甘油基丙二酸酯、烯丙基缩水甘油基草酸酯、烯丙基缩水甘油基邻苯二甲酸酯、烯丙基缩水甘油基丙基异氰脲酸酯、烯丙基缩水甘油基癸二酸酯、烯丙基缩水甘油基琥珀酸酯、烯丙基缩水甘油基对苯二甲酸酯、缩水甘油基甲基烯丙基邻苯二甲酸酯等。相对于烯烃树脂100质量份,流动性改进剂优选为0.1~30质量份,更优选为1~20质量份。
此外,树脂组合物的流动性可以利用熔体体积流动速率(MVR)进行评价。MVR通过根据JIS K 7210:1999热塑性塑料的MVR记载的方法进行测定。具体而言,在试验温度240℃、试验荷重2.16kg、60秒钟下进行。作为测定装置,可以使用Tester公司制的熔体流动测试机。
此外,只要不损害本发明的效果,可以含有各种添加剂。例如,出于改善树脂组合物的性质的目的,可以配合各种的晶须、硅酮粉末、热塑性弹性体、有机合成橡胶、脂肪酸酯、甘油酸酯、硬脂酸锌、硬脂酸钙等内部脱模剂;二苯甲酮系、水杨酸系、氰基丙烯酸酯系、异氰脲酸酯系、草酸酰替苯胺系、苯甲酸酯系、受阻胺系、苯并***系、酚系等抗氧化剂;受阻胺系、苯甲酸酯系等光稳定剂;公知的交联处理剂之类的添加剂。
在此,本发明的树脂组合物具有无机填料、在水解后与无机填料呈现脱水缩合反应的烷氧基、和与树脂具有反应性的双键,因此,即使不含交联处理剂也能够发挥优异的耐热性。
本发明的树脂组合物可以以规定比例混合已述的烯烃树脂、具有烯基的烷氧基硅烷化合物、无机填料、及根据需要的其它无机填料等来制作。
作为混合方法,可应用2根辊或3根辊、均质机、行星式混合机等搅拌机;POLYLAB***或LABPLAST研磨机等熔融混炼机等公知的手段。这些方法可以在常温、冷却状态、加热状态、常压、减压状态、加压状态中的任一种状态下进行。
通过使用本发明的树脂组合物,可以形成各种成形体,也可以制作厚度更薄的成形体(例如,反射器)。在以本发明的树脂组合物作为电子束固化性树脂组合物的情况下,本发明的成形体优选利用例如下述方法来制造。
即,优选为对于本发明的树脂组合物、在汽缸温度200~400℃、模具温度20~150℃下进行注射成形的注射成形工序来制作。另外,虽然什么方法都没有关系,但优选为在注射成形工序之后实施固化工序。例如,可以举出实施电子束照射处理的电子束照射工序等。
关于电子束的加速电压,可以根据使用的树脂或层的厚度适宜选定而得到。例如,在厚度为1mm左右的成形体的情况下,通常优选为在加速电压250~3000kV左右下使未固化树脂层固化。此外,在电子束的照射中,由于加速电压越高则透过能力越增加,所以在使用会因电子束而劣化的基材作为基材的情况下,能够以使电子束的透过深度和树脂层的厚度实质上相等的方式选定加速电压,由此,能够控制照射至基材的多余的电子束,能将过量电子束造成的基材的劣化限制在最小限。另外,照射电子束时的吸收线量可以根据树脂组合物的组成适宜设定,但优选为树脂层的交联密度饱和的量,照射线量优选为50~600kGy。
进而,作为电子束源,没有特别的限制,例如,可使用Cockroft-Walton型、VanDeGraft型、共振变压器型、绝缘芯变压器型、或直线型、高频高压(Dynamitron)型、高频型等各种电子束加速器。
如上所述的本发明的树脂组合物可以作为涂布于基材上并固化的复合材料或该树脂组合物的固化物适用于各种用途。例如,可以用作耐热性绝缘膜、耐热性脱模片、耐热性透明基材、太阳能电池的光反射片或以LED为代表的照明或电视机用的光源的反射器。
[2.反射器]
本发明的反射器包含将上述本发明的树脂组合物固化而成的固化物。
该反射器可以与后述的半导体发光装置组合使用,也可以与包含其它材料的半导体发光装置组合使用。
本发明的反射器主要具有使来自半导体发光装置的LED元件的光向透镜(出光部)侧反射的作用。关于反射器的详情,由于与适用于本发明的半导体发光装置的反射器(后述的反射器12)相同,因此在此予以省略。
[3.引线框]
本发明中的引线框表示用于载置反射器用的基板。引线框只要是半导体发光装置的领域中使用的引线框,则不论什么都可以使用。作为引线框的材料,例如可举出由氧化铝、或氮化铝、莫来石、玻璃等烧结体构成的陶瓷等。除此之外,也可以举出聚酰亚胺等具有挠性的树脂材料等。尤其是作为由金属制成的引线框,多使用铝、铜及铜的合金,为了提高反射率,也多利用银等反射率高的贵金属予以镀敷。尤其是用金属形成的反射器用基板多被称为引线框。
[4.带反射器的引线框]
本发明的带反射器的引线框由上述本发明的树脂组合物成形而成的固化物制成。具体而言,通过在引线框上利用注射成形将本发明的树脂组合物成形为所需的反射器形状,制造本发明的带反射器的引线框。
带反射器的引线框的厚度优选为0.1~3.0mm,更优选为0.1~1.0mm,进一步优选为0.1~0.8mm。
在本发明的树脂组合物中,可以制作厚度比使用例如玻璃纤维制作的树脂架小的树脂架。具体而言,可以制作厚度0.1~3.0mm的树脂架。另外,这样成形而成的本发明的带反射器的引线框即使减小厚度,也不会发生因包含玻璃纤维等填料所引起的翘曲,因此在形态稳定性或操作性上也优异。
本发明的带反射器的引线框通过使LED芯片承载于其上并进一步利用公知的密封剂进行密封,进行管芯键合并制成所需的形状,由此制成半导体发光装置。此外,本发明的带反射器的引线框作为反射器起作用,但也发挥作为支撑半导体发光装置的框的功能。
[5.半导体发光装置]
如图1所例示,本发明的半导体发光装置在基板14上具有光半导体元件(例如LED元件)10、和设置在该光半导体元件10的周围且使来自光半导体元件10的光向给定方向反射的反射器12。而且,反射器12的光反射面的至少一部分(图1的情况为全部)由已述的本发明的反射器组合物的固化物制成。
光半导体元件10为具有将放出放射光(一般而言,在白色光LED中为UV或蓝色光)且利用n型及p型的包覆层夹持由例如AlGaAs、AlGaInP、GaP或GaN制成的活性层的双异质结构的半导体芯片(发光体),例如,形成一边的长度为0.5mm左右的六面体的形状。而且,在管芯键合安装的形态的情况下,通过引线16与未图示的电极(连接端子)连接。
需要说明的是,连接有光半导体元件10和引线16的上述电极利用由树脂等形成的绝缘部15保持电绝缘。
反射器12的形状根据透镜18的端部(接合部)的形状,通常为方形、圆形、椭圆形等筒状或轮状。在图1的概略剖面图中,反射器12为筒状体(轮状体),反射器12的全部端面与基板14的表面接触、固定。
需要说明的是,为了提高来自光半导体元件10的光的指向性,反射器12的内面可以以锥形在上方扩展(参照图1)。
另外,在将透镜18侧的端部加工成与该透镜18的形状相应的形状的情况下,反射器12也可以作为透镜架起作用。
如图2所示,反射器12可以仅将光反射面侧设为由本发明的树脂组合物制成的光反射层12a。该情况下,从降低热电阻等的观点出发,光反射层12a的厚度优选设为500μm以下,更优选设为300μm以下。形成光反射层12a的部件12b可以由公知的耐热性树脂制成。
如上所述,在反射器12上设置有透镜18,但其通常为树脂制,有时根据目的、用途等而采用各种结构并被着色。
由基板14、反射器12和透镜18形成的空间部既可以为透明密封部,也可以根据需要为空隙部。该空间部通常为填充有赋予透光性及绝缘性的材料等的透明密封部,在管芯键合安装中,通过与引线16直接接触而施加的力、及间接地施加的振动、冲击等,可以防止因引线16从与光半导体元件10的连接部和/或与电极的连接部偏离、或切断、或短路而导致的电连接不良。另外,可以同时保护光半导体元件10免受湿气、尘埃等影响,可以长时间保持可靠性。
作为该赋予透光性及绝缘性的材料(透明密封剂组合物),通常可举出硅酮树脂、环氧硅酮树脂、环氧系树脂、丙烯酸系树脂、聚酰亚胺系树脂、聚碳酸酯树脂等。其中,从耐热性、耐候性、低收缩性及耐变色性的观点出发,优选硅酮树脂。
以下,对图1所示的半导体发光装置的制造方法的一例进行说明。
首先,将上述本发明的树脂组合物通过使用备有规定形状的空腔空间的模具的传递成形、压缩成形、注射成形等成形为规定形状的反射器12。其后,将另外准备的光半导体元件10、电极及引线16利用粘接剂或接合部件固定于基板14。接着,向由基板14及反射器12形成的凹部注入含有硅酮树脂等的透明密封剂组合物,通过加热、干燥等使其固化,制成透明密封部。其后,在透明密封部上配设透镜18,得到图1所示的半导体发光装置。
需要说明的是,在透明密封剂组合物为未固化状态下载置透镜18后,可以使组合物固化。
实施例
接着,通过实施例更详细说明本发明,但本发明并不受这些例子限定。
需要说明的是,在本实施例1~8、10~15及比较例1~6中使用的材料如下。
(树脂)
聚甲基戊烯:TPX RT18(三井化学(株)制)
聚乙烯:HI-ZEX1300((株)Primepolymer制)
聚丙烯:Primepolypro137G((株)Primepolymer制)
(硅烷化合物)
·7-辛烯基三甲氧基硅烷
·乙烯基三甲氧基硅烷
·3-甲基丙烯酰氧基丙基三甲氧基硅烷
·3-丙烯酰氧基丙基三甲氧基硅烷
·己基三甲氧基硅烷
(无机填料)
·氧化钛PF-691(石原产业(株)制金红石型结构平均粒径0.21μm)
(其它无机填料)
·玻璃纤维PF70E-001(日东纺(株)制,纤维长度70μm)
(添加剂)
添加剂如下述。
·TAIC(三烯丙基异氰脲酸酯)日本化成(株)制
·IRGANOX 1010(BASF·JAPAN(株)制)
·PEP 36((株)ADEKA制)
·SZ-2000(堺化学工业(株)制)
[实施例1~8、10~15,比较例1~6]
如下述表1~表3所示配合、混炼各种材料,得到树脂组合物。
此外,评价2及评价3用的树脂组合物通过配合各种材料并使用挤出机(日本Placon(株)MAX30:模径3.0mm)和造粒机((株)东洋精机制作所MPETC1)而进行制作。
关于这些树脂组合物,在250℃、30秒、20MPa的条件下加压成形为750mm×750mm×厚度0.5mm,制作成形体(1)。
以加速电压800kV,在400kGy的吸收线量下对成形体(1)照射电子束。评价它们的下述诸特性(评价2、3)。将结果示于下述表1~表3。
(评价1)
·颗粒化
如下进行树脂组合物的颗粒化用于评价1。首先,计量各种材料,利用POLYLAB***(分批式双轴)进行混炼,得到树脂组合物。之后,通过切割来制作颗粒。将能否颗粒化的结果示于下述表1~表3。
需要说明的是,表中的A表示可以颗粒化,B表示无法成为颗粒。
(评价2)
·耐热性
利用RSAG2(TA INSTRUMENTS制),在测定温度25~400℃、升温速度5℃/分钟、Strain 0.1%的条件下测定成形体(1)的各试料的贮藏弹性模量。将在270℃下的贮藏弹性模量示于下述表1~表3。
(评价3)
·耐热性
将成形体(1)的各试料用目视确认在150℃下、处理24小时后的外观变化(变色性)。将结果示于下述表1~表3。
需要说明的是,表中的A表示在上述处理前后没有外观变化,即没有变色,B表示可看到细微变色,C表示在处理后可看到外观变化(变色)。
[表1]
[表2]
[表3]
由上述实施例的结果可知,本发明的树脂组合物即使在作为成形体的情况下,也能够发挥优异的耐热变形性。由以上的内容可知,本发明的树脂组合物可以说是适合用于反射器或半导体发光装置用的反射材料。
Claims (8)
1.一种树脂组合物,其含有:烯烃树脂、具有烯基的烷氧基硅烷化合物、以及无机填料,
其中,所述无机填料为选自氧化钛、氧化铝、滑石、粘土、铝、氢氧化铝、云母、氧化铁、石墨、炭黑、碳酸钙、硫化锌、氧化锌、硫酸钡、钛酸钾中的至少一种。
2.如权利要求1所述的树脂组合物,其中,
所述烯烃树脂为聚乙烯、聚丙烯及聚甲基戊烯中的至少任一种。
3.如权利要求1或2所述的树脂组合物,其中,
所述具有烯基的烷氧基硅烷化合物为具有碳原子数1~20的烯基的三烷氧基硅烷。
4.如权利要求1~3中任一项所述的树脂组合物,其还含有二氧化硅。
5.如权利要求1~4中任一项所述的树脂组合物,其还含有流动性改进剂。
6.一种反射器,其由权利要求1~5中任一项所述的树脂组合物的固化物制成。
7.一种带反射器的引线框,其由权利要求1~5中任一项所述的树脂组合物的固化物制成。
8.一种半导体发光装置,其在基板上具有光半导体元件、设于所述光半导体元件周围且使来自该光半导体元件的光向给定方向反射的反射器,
所述反射器的光反射面由权利要求1~5中任一项所述的树脂组合物的固化物制成。
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US10454008B2 (en) | 2019-10-22 |
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CN105916931B (zh) | 2019-07-12 |
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