CN206452594U - A kind of use liquid photosensitive PI flexible electric circuit board - Google Patents
A kind of use liquid photosensitive PI flexible electric circuit board Download PDFInfo
- Publication number
- CN206452594U CN206452594U CN201621267415.6U CN201621267415U CN206452594U CN 206452594 U CN206452594 U CN 206452594U CN 201621267415 U CN201621267415 U CN 201621267415U CN 206452594 U CN206452594 U CN 206452594U
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- CN
- China
- Prior art keywords
- liquid photosensitive
- fpc
- backing material
- films
- material plates
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of use liquid photosensitive PI flexible electric circuit board, including FPC backing material plates and liquid photosensitive PI films, liquid photosensitive PI films are all covered with two faces of the FPC backing material plates, liquid photosensitive PI is for high density FPC wiring boards, the aligning accuracy of exposure imaging can be more much higher than cover layer manual alignment, and due to liquid photosensitive PI characteristic, it is first attached on FPC backing material plates, it is exposed, development, toast to complete, thus substantially increase production efficiency and product quality, and it can make more accurate in FPC wiring board performances, simplify FPC wiring boards processing procedure, with excellent electric insulating quality and good physics and chemically, it is thinned product, apply to thinner smart mobile phone.
Description
Technical field
The utility model is related to field of circuit boards, and in particular to a kind of use liquid photosensitive PI flexible electric circuit board.
Background technology
Liquid photosensitive PI is for high density FPC, and the aligning accuracy of exposure imaging can be higher than cover layer manual alignment very
It is many, and due to liquid photosensitive PI characteristic, it is first attached on FPC backing material plates, through exposure and development, toasts to complete, thus
Substantially increase production efficiency and product quality production.And it can make more accurate in FPC wiring board performances, make FPC wiring board systems
Journey simplifies, and with excellent electric insulating quality and good physics and chemically, is thinned product, applies to thinner intelligence
Mobile phone.
Flexible PCB is that the one kind being made using polyimides or polyester film as base material has height reliability, excellent
Flexible printed circuit.With Distribution density is high, lightweight, thickness of thin, good bending property the characteristics of.In current industry mainly
The polyimides hot pressing of window will be held successfully on FPC base materials, polyimides material easy harmomegathus can excessive glue, and the area that opens a window after hot pressing
Domain is typically all mould stamp, and tolerance is larger.Product with BGA or 0201 pad, spacing are smaller, polyimides mould
Can not make, and its manufacturing procedure is more, by sawing sheet → drilling → PTH → plating → pre-treatment → patch dry film → contraposition →
Exposure → development → graphic plating → demoulding → pre-treatment → patch dry film → contraposition exposure → development → etching → demoulding → surface
The processing such as epiphragma → compacting → solidification is handled → pasted, in order to solve these problems, liquid photosensitive is used we have proposed one kind
PI flexible electric circuit board.
Utility model content
The technical problems to be solved in the utility model is that the defect for overcoming prior art uses liquid photosensitive PI there is provided one kind
Flexible electric circuit board, the use in providing amenities for the people increases the security that uses.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme：One kind uses liquid photosensitive
Liquid photosensitive is all covered with PI flexible electric circuit board, including FPC backing material plates and liquid photosensitive PI films, two faces of the FPC
PI films.
It is preferred that, the liquid photosensitive PI films are affixed in the FPC backing material plates upper and lower surface, through overexposure → development → baking
The process such as roasting is fixed in the upper and lower surface of FPC backing material plates.
It is preferred that, the liquid photosensitive PI films use the liquid photosensitive ink of resistance to plating against corrosion.
The beneficial effect that the utility model is reached is：
The utility model replaces polyimides using liquid photosensitive PI, solve the easy excessive glue of polyimides, tolerance it is big and
The cumbersome shortcoming of manufacturing procedure, liquid photosensitive PI is for high density FPC, and the aligning accuracy of exposure imaging can be than cover layer hand
Work contraposition is much higher, and due to liquid photosensitive PI characteristic, it is first attached on FPC backing material plates, through exposure and development, toasts
To complete, thus substantially increase production efficiency and product quality production.And it can make more accurate in FPC wiring board performances, make
FPC wiring boards processing procedure simplifies, and with excellent electric insulating quality and good physics and chemically, is thinned product, uses
In thinner smart mobile phone.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and constitutes a part for specification, with this practicality
New embodiment is used to explain the utility model together, does not constitute to limitation of the present utility model.In the accompanying drawings：
Fig. 1 is a kind of use liquid photosensitive PI of the present utility model flexible circuit plate structure schematic diagram；
In figure：1-FPC backing material plates, 2- liquid photosensitive PI films.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
As shown in figure 1, a kind of use liquid photosensitive PI of the present embodiment flexible electric circuit board, including FPC backing material plates 1 and liquid
Liquid photosensitive PI films 2 are all covered with the photosensitive PI films 2 of state, two faces of the FPC.
The liquid photosensitive PI films 2 are affixed in the upper and lower surface of FPC backing material plates 1, through overexposure → development → baking etc.
Process is fixed in the upper and lower surface of FPC backing material plates 1, and the liquid photosensitive PI films 2 use the liquid photosensitive ink of resistance to plating against corrosion.
It should be noted that a kind of use liquid photosensitive PI flexible electric circuit board workflow of the utility model is：This reality
Polyimides is replaced with new use liquid photosensitive PI, solves that the easy excessive glue of polyimides, tolerance are big and manufacturing procedure is cumbersome
Shortcoming, liquid photosensitive PI is for high density FPC, and the aligning accuracy of exposure imaging can be higher than cover layer manual alignment very
It is many, and due to liquid photosensitive PI characteristic, it is first attached on FPC backing material plates 1, through exposure and development, toasts to complete, because
And substantially increase production efficiency and product quality production.And it can make more accurate in FPC wiring board performances, make FPC wiring boards
Processing procedure simplifies, and with excellent electric insulating quality and good physics and chemically, is thinned product, applies to thinner intelligence
Can mobile phone.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (3)
1. a kind of use liquid photosensitive PI flexible electric circuit board, including FPC backing material plates (1) and liquid photosensitive PI films (2), its feature
It is：Liquid photosensitive PI films (2) are all covered with two faces of the FPC backing material plates (1).
2. a kind of use liquid photosensitive PI according to claim 1 flexible electric circuit board, it is characterised in that：The liquid sense
Light PI films (2) are affixed in FPC backing material plates (1) upper and lower surface, and FPC bases are fixed on through processes such as overexposure → development → bakings
In the upper and lower surface of material plate (1).
3. a kind of use liquid photosensitive PI according to claim 1 or 2 flexible electric circuit board, it is characterised in that：The liquid
The photosensitive PI films (2) of state use the liquid photosensitive ink of resistance to plating against corrosion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621267415.6U CN206452594U (en) | 2016-11-22 | 2016-11-22 | A kind of use liquid photosensitive PI flexible electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621267415.6U CN206452594U (en) | 2016-11-22 | 2016-11-22 | A kind of use liquid photosensitive PI flexible electric circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206452594U true CN206452594U (en) | 2017-08-29 |
Family
ID=59662263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621267415.6U Expired - Fee Related CN206452594U (en) | 2016-11-22 | 2016-11-22 | A kind of use liquid photosensitive PI flexible electric circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206452594U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470687A (en) * | 2018-03-22 | 2018-08-31 | 江西芯创光电有限公司 | A kind of overlay film plate-making method |
-
2016
- 2016-11-22 CN CN201621267415.6U patent/CN206452594U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470687A (en) * | 2018-03-22 | 2018-08-31 | 江西芯创光电有限公司 | A kind of overlay film plate-making method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170829 Termination date: 20201122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |