CN105658422B - 树脂膜形成用片材 - Google Patents

树脂膜形成用片材 Download PDF

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Publication number
CN105658422B
CN105658422B CN201480057707.4A CN201480057707A CN105658422B CN 105658422 B CN105658422 B CN 105658422B CN 201480057707 A CN201480057707 A CN 201480057707A CN 105658422 B CN105658422 B CN 105658422B
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CN
China
Prior art keywords
film
resin molding
formation layer
resin
molding formation
Prior art date
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Active
Application number
CN201480057707.4A
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English (en)
Chinese (zh)
Other versions
CN105658422A (zh
Inventor
久保田新
村上幸范
野村秀
野村秀一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to CN201710463373.6A priority Critical patent/CN107364191A/zh
Publication of CN105658422A publication Critical patent/CN105658422A/zh
Application granted granted Critical
Publication of CN105658422B publication Critical patent/CN105658422B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/58—Cuttability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
CN201480057707.4A 2013-10-21 2014-04-09 树脂膜形成用片材 Active CN105658422B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710463373.6A CN107364191A (zh) 2013-10-21 2014-04-09 树脂膜形成用片材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-218652 2013-10-21
JP2013218652 2013-10-21
PCT/JP2014/060298 WO2015059944A1 (ja) 2013-10-21 2014-04-09 樹脂膜形成用シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710463373.6A Division CN107364191A (zh) 2013-10-21 2014-04-09 树脂膜形成用片材

Publications (2)

Publication Number Publication Date
CN105658422A CN105658422A (zh) 2016-06-08
CN105658422B true CN105658422B (zh) 2017-07-07

Family

ID=52992556

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710463373.6A Pending CN107364191A (zh) 2013-10-21 2014-04-09 树脂膜形成用片材
CN201480057707.4A Active CN105658422B (zh) 2013-10-21 2014-04-09 树脂膜形成用片材

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201710463373.6A Pending CN107364191A (zh) 2013-10-21 2014-04-09 树脂膜形成用片材

Country Status (5)

Country Link
JP (1) JP6369996B2 (ja)
KR (1) KR102171423B1 (ja)
CN (2) CN107364191A (ja)
TW (1) TWI623432B (ja)
WO (1) WO2015059944A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7402052B2 (ja) * 2018-01-24 2023-12-20 リンテック株式会社 長尺積層シートおよびその巻収体
JP7045201B2 (ja) * 2018-01-24 2022-03-31 リンテック株式会社 長尺積層シートおよびその巻収体
JP7264593B2 (ja) * 2018-01-30 2023-04-25 日東電工株式会社 半導体背面密着フィルム及びダイシングテープ一体型半導体背面密着フィルム
JP7475923B2 (ja) 2020-03-27 2024-04-30 リンテック株式会社 半導体装置製造用シート及び半導体装置製造用シートの製造方法。
WO2023248337A1 (ja) * 2022-06-21 2023-12-28 株式会社レゾナック フィルム、巻回体、接続構造体、及び接続構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005350520A (ja) * 2004-06-08 2005-12-22 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
CN100358126C (zh) * 2002-10-15 2007-12-26 日东电工株式会社 切割/管芯－接合膜，固定芯片半导体的方法和半导体器件
JP2011089048A (ja) * 2009-10-23 2011-05-06 Nippon Steel Chem Co Ltd 多層接着シート及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677758B2 (ja) * 2004-10-14 2011-04-27 日立化成工業株式会社 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法
JP2011144313A (ja) * 2010-01-18 2011-07-28 Hitachi Chem Co Ltd 接着シート及びその製造方法
JP5388892B2 (ja) * 2010-02-12 2014-01-15 新日鉄住金化学株式会社 多層接着シート及びその製造方法
JP5600035B2 (ja) * 2010-06-30 2014-10-01 株式会社ディスコ ウエーハの分割方法
JP5546985B2 (ja) 2010-07-28 2014-07-09 日東電工株式会社 半導体装置製造用フィルム、半導体装置製造用フィルムの製造方法、及び、半導体装置の製造方法。
JP5408571B2 (ja) * 2010-10-06 2014-02-05 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
JP5733049B2 (ja) * 2011-06-23 2015-06-10 日立化成株式会社 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置
JP5998730B2 (ja) * 2011-09-16 2016-09-28 日立化成株式会社 粘着フィルム及び粘着フィルムの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100358126C (zh) * 2002-10-15 2007-12-26 日东电工株式会社 切割/管芯－接合膜，固定芯片半导体的方法和半导体器件
JP2005350520A (ja) * 2004-06-08 2005-12-22 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2011089048A (ja) * 2009-10-23 2011-05-06 Nippon Steel Chem Co Ltd 多層接着シート及びその製造方法

Also Published As

Publication number Publication date
CN107364191A (zh) 2017-11-21
WO2015059944A1 (ja) 2015-04-30
JPWO2015059944A1 (ja) 2017-03-09
CN105658422A (zh) 2016-06-08
TWI623432B (zh) 2018-05-11
TW201515852A (zh) 2015-05-01
JP6369996B2 (ja) 2018-08-08
KR102171423B1 (ko) 2020-10-29
KR20160075510A (ko) 2016-06-29

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