CN105453706A - 安装发光部件用挠性印刷基板和安装发光部件的挠性印刷基板 - Google Patents
安装发光部件用挠性印刷基板和安装发光部件的挠性印刷基板 Download PDFInfo
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Abstract
本发明提供安装发光部件用挠性印刷基板和在该安装发光部件用挠性印刷基板上安装有发光部件的安装发光部件的挠性印刷基板,所述安装发光部件用挠性印刷基板即便为了显示弯曲性而使厚度变薄,也抑制了所安装的发光部件的光线透射,抑制了不同颜色发光部件之间的影响带来的光线色调的变化。本发明提供一种挠性印刷基板,其特征在于,其为在绝缘性基材的至少一侧面上,隔着粘接树脂层层叠有线路图案状的金属箔的安装发光部件用挠性印刷基板,其中,前述粘接树脂层含有遮光性颗粒,且波长380~750nm的光线透射率为65%以下。
Description
技术领域
本发明涉及用于安装发光部件的挠性印刷基板、即安装发光部件用挠性印刷基板,和在该挠性印刷基板上安装有发光部件的安装发光部件的挠性印刷基板。
背景技术
以往,制造了使用有LED等发光部件的电子产品。这样的电子产品中,例如,安装有LED的线路基板作为用于液晶显示器用途、荧光管代替用途等的面发光体使用,作为这样的用于面发光体的线路基板,通常是将铜箔与含浸有树脂的玻璃布(glasscloth)热压粘的、FR-4或CEM-3等硬质基板。
近年来,作为LED安装用基板,提出了:活用弯曲性优异的特性,将使用了具有弯曲性的挠性印刷基板(以下,有时也称为FPC。)的面发光体加工成丝带(ribbon)状形态的、具有外观设计性的LED照明器具等。作为这样的LED照明器具中使用的FPC,提出了使用如下基板的FPC:该基板通过粘接剂层将基底薄膜与金属层层叠,配合有作为粘接性树脂组合物的环氧树脂(参照例如专利文献1)。
然而,上述的FPC中,作为形成粘接剂层的粘接性树脂组合物配合有环氧树脂的物质,此外,在除去金属层(铜箔)后残留的基底薄膜和粘接剂层的厚度最厚为100μm左右,存在透射LED等发光部件的光线的问题。例如,制作在上述FPC单面安装有红色的发光部件的红色发光部件安装基板以及安装有绿色的发光部件的绿色发光部件安装基板,并将这些安装基板按照各安装基板的基底薄膜之间接触的方式重合来使用,此时存在如下问题:上述的FPC中,发光部件的光线会透射粘接剂层和基底薄膜,来自各发光部件的光相互影响,色调微带有黄色,会变成与实际的发光部件的光线色调不同的色调。
因此,期望开发一种安装发光部件用挠性印刷基板,其即便为了显示弯曲性而使厚度变薄,也抑制了所安装的发光部件的光线透射,抑制了不同颜色发光部件之间的影响带来的光线色调的变化。
现有技术文献
专利文献
专利文献1:日本特开2011-241294号公报
发明内容
发明要解决的技术问题
本发明的目的在于,提供:安装发光部件用挠性印刷基板,其即便为了显示弯曲性而使厚度变薄,也抑制了所安装的发光部件的光线透射,抑制了不同颜色发光部件之间的影响带来的光线色调的变化;和,在该安装发光部件用挠性印刷基板上安装有发光部件的安装发光部件的挠性印刷基板。
用于解决问题的方法
本发明人为了实现上述目的而进行反复深入研究,结果发现,对于在绝缘性基材的至少一侧面上隔着粘接树脂层层叠有线路图案状的金属箔的安装发光部件用挠性印刷基板,通过粘接树脂层含有遮光性颗粒,且粘接树脂层的波长380~750nm的光线透射率为65%以下,即便是挠性印刷基板这样的厚度薄的基板,也抑制了所安装的发光部件的光线透射,抑制了不同颜色发光部件之间的影响带来的光线色调的变化,直至完成了本发明。
即,本发明涉及下述的安装发光部件用挠性印刷基板和安装发光部件的挠性印刷基板。
1.一种挠性印刷基板,其特征在于,其为在绝缘性基材的至少一侧面上,隔着粘接树脂层层叠有线路图案状的金属箔的安装发光部件用挠性印刷基板,其中,
前述粘接树脂层含有遮光性颗粒,且波长380~750nm的光线透射率为65%以下。
2.上述项1所述的挠性印刷基板,其中,前述遮光性颗粒为无机颗粒。
3.上述项1或2所述的挠性印刷基板,其中,前述遮光性颗粒含有选自二氧化钛、氧化镁、氧化锌、氧化硅、碳酸钙、硫酸钡、滑石、氧化铁、孔雀石、铝粉、铜粉、不锈钢粉所组成的组中的至少1种。
4.上述项1~3中任一项所述的挠性印刷基板,其中,前述粘接树脂层含有选自环氧树脂、聚酯树脂、丙烯酸类树脂、聚氨酯树脂和硅树脂所组成的组中的至少1种。
5.上述项1~4中任一项所述的挠性印刷基板,其中,前述遮光性颗粒为二氧化钛,相对于100质量%前述粘接树脂层,前述二氧化钛的含量为6质量%以上。
6.上述项1~4中任一项所述的挠性印刷基板,其中,前述遮光性颗粒为铝粉,相对于100质量%前述粘接树脂层,前述铝粉的含量为2质量%以上。
7.上述项1~6中任一项所述的挠性印刷基板,其中,前述绝缘性基材含有选自聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚酰亚胺、液晶聚合物、聚醚醚酮(PEEK)、聚对苯二甲酰对苯二胺(PPTA)、氟树脂和氟树脂共聚物所组成的组中的至少1种。
8.一种安装发光部件的挠性印刷基板,其在上述项1~7中任一项所述的挠性印刷基板上安装有发光部件。
9.一种安装发光部件的挠性印刷基板的制造方法,其特征在于,该安装发光部件的挠性印刷基板的制造方法包括:
(1)工序1:在金属箔上,隔着含有遮光性颗粒的粘接树脂组合物层叠绝缘性基材;
(2)工序2:使前述粘接树脂组合物固化,形成波长380~750nm的光线透射率为65%以下的粘接树脂层;
(3)工序3:在前述金属箔的、与形成有前述粘接树脂层的面相反一侧的面上印刷图案状的抗蚀层;和
(4)工序4:通过蚀刻处理,使未印刷前述抗蚀层的区域的前述金属箔溶解以形成线路图案。
发明效果
具有上述特征的本发明的安装发光部件用挠性印刷基板,粘接树脂层含有遮光性颗粒,且,粘接树脂层的波长380~750nm的光线透射率为65%以下,因此,即便是挠性印刷基板这样的厚度薄的基板也抑制了光线的透射,可抑制不同颜色发光部件之间的影响带来的光线色调的变化。
进而,本发明的安装发光部件的挠性印刷基板具有含有遮光性颗粒、且波长380~750nm的光线透射率为65%以下的粘接树脂层,因此,抑制了发光部件的光线透射,抑制了光源之间的影响带来的色调变化。
附图说明
图1为显示本发明的安装发光部件用挠性印刷基板的层结构的一例的截面图。
具体实施方式
1.安装发光部件用挠性印刷基板
本发明的安装发光部件用挠性印刷基板(以下,有时也仅称为”挠性印刷基板”。),其为在绝缘性基材的至少一侧面上,隔着粘接树脂层层叠有线路图案状的金属箔的安装发光部件用挠性印刷基板,其中,上述粘接树脂层含有遮光性颗粒,且波长380~750nm的光线透射率为65%以下。
本发明的挠性印刷基板,只要在绝缘性基材的至少一侧面上,隔着上述粘接树脂层形成线路图案状的金属箔即可,也可在绝缘性基材的两面分别隔着粘接树脂层形成线路图案状的金属箔。即便是该方式,由于上述粘接树脂层含有遮光性颗粒,且波长380~750nm的光线透射率为65%以下,因而即便在挠性印刷基板的两面安装了不同颜色的发光部件时,也抑制了光线的透射,可抑制不同颜色发光部件之间的影响带来的光线色调的变化。
本发明的挠性印刷基板的厚度优选20~200μm,更优选35~150μm。若厚度过厚,可能有损挠性印刷基板的弯曲性,若厚度过薄,可能光线透射的抑制不充分。
(绝缘性基材)
作为绝缘性基材,只要具有绝缘性、具备耐热性等为了用作线路基板的基材的性能则没有特别限定,可列举例如,含有聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚酰亚胺、液晶聚合物、聚醚醚酮(PEEK)、聚对苯二甲酰对苯二胺(PPTA)、氟树脂或氟树脂共聚物的基材。绝缘性基材可单独含有这些树脂,也可含有2种以上。
这些当中,从耐热性优异的观点出发,优选含有聚对苯二甲酸乙二醇酯或聚酰亚胺的绝缘性基材。
通过适当选择用于上述绝缘性基材的树脂,可对本发明的挠性印刷基板赋予如下的特性:根据使用了发光部件的电子产品等的目的,可选择性抑制特定颜色光线的透射。例如,在使用了含有聚酰亚胺的绝缘性基材时,绝缘性基材略带黄色。这样的略带黄色的绝缘性基材可特别选择性抑制蓝色光线的透射,由此,挠性印刷基板特别抑制蓝色光线的透射。
绝缘性基材的厚度优选为挠性印刷基板可显示弯曲性的程度的厚度,通常优选15~50μm的厚度。
(粘接树脂层)
作为形成粘接树脂层的树脂,为可粘接绝缘性基材和金属箔的树脂即可,可列举例如,环氧树脂、聚酯树脂、丙烯酸类树脂、聚氨酯树脂、硅树脂、聚酰亚胺树脂、氯乙烯树脂等。这些树脂可单独使用,也可混合2种以上使用。这些当中,优选含有选自环氧树脂、聚酯树脂、丙烯酸类树脂、聚氨酯树脂和硅树脂所组成的组中的至少1种的树脂。
粘接树脂层含有遮光性颗粒。遮光性颗粒只要是可对粘接树脂层赋予遮光性、抑制光线透射率的颗粒则没有限定,优选使用无机颗粒。
作为遮光性颗粒,具体地说,可列举例如,二氧化钛、氧化镁、氧化锌、氧化硅、碳酸钙、硫酸钡、滑石、氧化铁、孔雀石、铝粉、铜粉、不锈钢粉。其中,在遮光性特别优异的方面,优选二氧化钛、铝粉。粘接树脂层可单独含有这些遮光性颗粒,也可含有2种以上。
作为遮光性颗粒使用二氧化钛时,二氧化钛的含量优选相对于100质量%粘接树脂层优选为6质量%以上。含量少时,可能遮光性不充分。此外,二氧化钛的含量相对于100质量%粘接树脂层优选80质量%以下,更优选50质量%以下。含量过多时,用于形成粘接树脂层的粘接树脂组合物难以集聚,粘接树脂层的粘接性可能变差。
作为遮光性颗粒使用铝粉时,铝粉的含量相对于100质量%粘接树脂层优选2质量%以上。含量少时,遮光性可能不充分。此外,铝粉的含量相对于100质量%粘接树脂层优选80质量%以下,更优选50质量%以下。含量过多时,用于形成粘接树脂层的粘接树脂组合物难以集聚,粘接树脂层的粘接性可能变差。
作为遮光性颗粒,此外还优选使用氧化铁或孔雀石。作为遮光性颗粒使用氧化铁时,粘接树脂层逐渐能特别抑制红色以外的光线的透射。此外,使用孔雀石时,粘接树脂层逐渐能特别抑制绿色以外的光线的透射。可见,通过适当选择遮光性颗粒,可根据使用了发光部件的电子产品等的目的,选择性抑制特定颜色以外的光线的透射。
上述遮光性颗粒的平均颗粒径优选0.1~15.0μm,更优选0.2~10.0μm。另外,本说明书中,遮光性颗粒的平均颗粒径是通过激光衍射法测定的值。
遮光性颗粒的形状没有限定,可以是鳞片状、球状、针状等形状,优选使用鳞片状的遮光性颗粒。通过使用鳞片状的遮光性颗粒,可发挥更高的遮光性。
遮光性颗粒优选为表面被树脂覆盖的状态。特别是,使用了具有导电性的遮光性颗粒时,由于含有该颗粒的粘接树脂层的绝缘性降低,挠性印刷基板的绝缘性也可能降低。通过遮光性颗粒被树脂覆盖,可抑制这样的粘接树脂层的绝缘性的降低。
粘接树脂层的波长380~750nm的光线透射率为65%以下。通过粘接树脂层含有上述遮光性颗粒,粘接树脂层的、波长380~750nm的光线透射率为65%以下,抑制了挠性印刷基板的光线的透射,可抑制不同颜色发光部件之间的影响带来的光线色调的变化。上述光线透射率优选60%以下。此外,上述光线透射率的下限没有特别限定,可以是0%。
上述光线透射率可通过如下来求出:使用紫外可见近红外分光光度仪(产品名”JASCOV570型”日本分光社制造)测定全部光线的透射率,在380~750nm的范围以每5nm波长的透射率的值求平均值。另外,上述光度仪的规格为,支架形式:积分球式、测定尺寸:长8mm×宽9mm、积分球内径:60mm、积分球内壁涂布剂:硫酸钡。
粘接树脂层的厚度没有限定,优选5~50μm左右,更优选10~25μm左右。上述厚度过薄时,因绝缘性基材的种类而可能不显示充分的层间密合性,过厚时从金属箔侧向绝缘性基材侧的导热性降低,线路基板的放热性可能差。
(金属箔)
作为形成金属箔的金属,为可用于金属线路的金属即可,可列举例如铝、铜、银。本发明中,上述金属箔为线路图案状的金属箔。上述金属箔可通过蚀刻等形成为线路图案状,可制成铝线路、铜线路等。
上述线路图案例如可通过用光刻胶法、抗蚀刻层(etchingresist)法等公知的图案形成方法加工铝箔、铜箔等来形成。上述铝箔不限于纯铝箔,还包括铝合金箔。具体地说,作为铝箔,例如可采用以JIS(AA)的记号计为1030、1N30、1050、1100、8021、8079等纯铝箔或铝合金箔。
铜箔并不限于纯铜箔,还包括铜合金箔。具体地说,作为铜箔,例如可采用以JIS(AA)的记号计为C1100、C2600、C7025等纯铜箔或铜合金箔。
上述线路图案状的金属箔可如下形成:在粘接树脂层上层叠金属箔,接着通过公知的图案形成方法加工成线路图案状,从而形成在粘接树脂层上。
金属箔的厚度没有限定,优选5~100μm左右,更优选12~70μm左右。
作为本发明的制造安装发光部件用挠性印刷基板的制造方法,可列举例如如下的制造方法,其包括:在绝缘性基材上涂布含有遮光性颗粒的粘接树脂组合物以使其固化,形成粘接树脂层的工序;在该粘接树脂层上层叠金属箔的工序;和,通过对金属箔实施蚀刻以制成线路图案状的工序。
作为本发明的制造安装发光部件用挠性印刷基板的制造方法,还可列举如下的制造方法,其包括:(1)工序1:在金属箔上,隔着含有遮光性颗粒的粘接树脂组合物层叠绝缘性基材;(2)工序2:使上述粘接树脂组合物固化,形成波长380~750nm的光线透射率为65%以下的粘接树脂层;(3)工序3:在上述金属箔的、与形成有上述粘接树脂层的面相反一侧的面上印刷图案状的抗蚀层;和,(4)工序4:通过蚀刻处理,使未印刷上述抗蚀层的区域的上述金属箔溶解以形成线路图案。
2.发光部件安装线路基板
本发明的安装发光部件用挠性印刷基板,通过在线路图案状的金属箔上安装发光部件,成为安装发光部件的挠性印刷基板。
作为发光部件,可列举例如,LED芯片、激光二极管、有机EL等发光原件和这些的阵元(arrayelement)等。
[实施例]
以下,示出实施例和比较例来具体说明本发明。然而,本发明不限于实施例。
(实施例1)
使用粘接树脂组合物将35μm厚度的电解铜箔与38μm厚度的聚对苯二甲酸乙二醇酯薄膜贴合,制作层叠体。粘接树脂组合物是在聚氨酯树脂系粘接剂(取100质量份DIC株式会社制造的商品名:LX500和10质量份DIC株式会社制造的商品名KW75来混合,用乙酸乙酯稀释来制备)中添加平均颗粒径0.24μm的二氧化钛来制备。
通过将所制作的层叠体在60℃下培养5天,加热粘接树脂组合物使其固化来制成粘接树脂层。粘接树脂层的厚度为15μm,粘接树脂层中的二氧化钛的含量相对于100质量%粘接树脂层为30质量%。此外,粘接树脂层的波长380~750nm的光线透射率为42.2%。另外,粘接树脂层的光线透射率如下求出:另行制备单层的与上述粘接树脂层相同的粘接树脂层以制作光线透射率测定用粘接树脂层,使用紫外可见近红外分光光度仪(产品名”JASCOV570型”日本分光社制造)测定该光线透射率测定用粘接树脂层的全部光线的透射率,在380~750nm的范围以每5nm波长的光线透射率求平均值。另外,上述光度仪的规格为,支架形式:积分球式、测定尺寸:长8mm×宽9mm、积分球内径:60mm、积分球内壁涂布剂:硫酸钡。
通过凹版印刷在电解铜箔的表面印刷抗蚀刻层,利用42波美的氯化铁蚀刻以形成线路图案,制作挠性印刷基板。
用焊料在挠性印刷基板上安装绿色LED封装(罗姆株式会社制造的SML-E12P8W),制作安装发光部件的挠性印刷基板。此外,用焊料在另行制作的挠性印刷基板上安装红色LED封装(罗姆株式会社製SML-E12U8W),制作安装发光部件的挠性印刷基板。
按照绝缘性基材之间接触的方式,将如上述制作的、安装有绿色LED封装的安装发光部件的挠性印刷基板和安装有红色LED封装的安装发光部件的挠性印刷基板重合固定。施加额定电压使LED封装发光,目视观察发出的光线色调,根据以下的评价基准评价。
A:发出的光线色调与单独发光时的色调相同。
B:发出的光线色调受到从里面透射的光线影响而发生变化。
(实施例2)
粘接树脂层中的二氧化钛的含量为15质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(实施例3)
粘接树脂层中的二氧化钛的含量为10质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(实施例4)
粘接树脂层中的二氧化钛的含量为7质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(实施例5)
使用平均颗粒径10μm的鳞片状的铝粉而代替二氧化钛,粘接树脂层中的鳞片状的铝粉的含量为20质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(实施例6)
使用平均颗粒径10μm的鳞片状的铝粉而代替二氧化钛,粘接树脂层中的鳞片状的铝粉的含量为5质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(实施例7)
使用平均颗粒径10μm的鳞片状的铝粉而代替二氧化钛,粘接树脂层中的鳞片状的铝粉的含量为3质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(比较例1)
粘接树脂层不含有二氧化钛,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(比较例2)
粘接树脂层中的二氧化钛的含量为5质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
(比较例3)
使用平均颗粒径10μm的鳞片状的铝粉而代替二氧化钛,粘接树脂层中的鳞片状的铝粉的含量为1质量%,除此以外,与实施例1同样操作,测定粘接树脂层的光线透射率,评价光线的色调。
结果示于表1。
表1
从表1的结果可知,在绝缘性基材的至少一侧面上隔着粘接树脂层层叠线路图案状的金属箔,粘接树脂层含有遮光性颗粒、且粘接树脂层的波长380~750nm的光线透射率为65%以下的实施例1~7的挠性印刷基板,由于粘接树脂层含遮光性颗粒,粘接树脂层的上述光线透射率被调节为65%以下,因而即便是厚度薄的挠性印刷基板,抑制了发光部件即LED的光线的透射,抑制了绿色LED与红色LED的不同颜色发光部件之间的影响带来的光线色调的变化。
相对于此,比较例1的挠性印刷基板,粘接树脂层不含有遮光性颗粒,粘接树脂层的光线透射率显示87.6%这一高值,因此,发光部件即LED的光线透射的抑制不充分,光线的色调可能因绿色LED与红色LED的不同颜色的发光部件之间的影响而变化。
比较例2和3的挠性印刷基板,尽管粘接树脂层含有遮光性颗粒,但由于粘接树脂层的光线透射率超过65%,发光部件即LED的光线透射的抑制不充分,光线的色调可能因绿色LED与红色LED的不同颜色的发光部件之间的影响而变化。
附图标记说明
1:安装发光部件用挠性印刷基板
2:绝缘性基材
3:粘接树脂层
4:线路图案状的金属箔
Claims (9)
1.一种挠性印刷基板,其特征在于,其为在绝缘性基材的至少一侧面上,隔着粘接树脂层层叠有线路图案状的金属箔的安装发光部件用挠性印刷基板,其中,
所述粘接树脂层含有遮光性颗粒,且波长380~750nm的光线透射率为65%以下。
2.根据权利要求1所述的挠性印刷基板,其中,
所述遮光性颗粒为无机颗粒。
3.根据权利要求1或2所述的挠性印刷基板,其中,
所述遮光性颗粒含有选自二氧化钛、氧化镁、氧化锌、氧化硅、碳酸钙、硫酸钡、滑石、氧化铁、孔雀石、铝粉、铜粉、不锈钢粉所组成的组中的至少1种。
4.根据权利要求1~3中任一项所述的挠性印刷基板,其中,
所述粘接树脂层含有选自环氧树脂、聚酯树脂、丙烯酸类树脂、聚氨酯树脂和硅树脂所组成的组中的至少1种。
5.根据权利要求1~4中任一项所述的挠性印刷基板,其中,
所述遮光性颗粒为二氧化钛,相对于100质量%所述粘接树脂层,所述二氧化钛的含量为6质量%以上。
6.根据权利要求1~4中任一项所述的挠性印刷基板,其中,
所述遮光性颗粒为铝粉,相对于100质量%所述粘接树脂层,所述铝粉的含量为2质量%以上。
7.根据权利要求1~6中任一项所述的挠性印刷基板,其中,
所述绝缘性基材含有选自聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚酰亚胺、液晶聚合物、聚醚醚酮(PEEK)、聚对苯二甲酰对苯二胺(PPTA)、氟树脂和氟树脂共聚物所组成的组中的至少1种。
8.一种安装发光部件的挠性印刷基板,其在权利要求1~7中任一项所述的挠性印刷基板上安装有发光部件。
9.一种安装发光部件的挠性印刷基板的制造方法,其特征在于,该安装发光部件的挠性印刷基板的制造方法包括以下工序:
(1)工序1:在金属箔上,隔着含有遮光性颗粒的粘接树脂组合物层叠绝缘性基材;
(2)工序2:使所述粘接树脂组合物固化,形成波长380~750nm的光线透射率为65%以下的粘接树脂层;
(3)工序3:在所述金属箔的、与形成有所述粘接树脂层的面相反一侧的面上印刷图案状的抗蚀层;和
(4)工序4:通过蚀刻处理,使未印刷所述抗蚀层的区域的所述金属箔溶解以形成线路图案。
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