CN105453706A - Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component - Google Patents

Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component Download PDF

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Publication number
CN105453706A
CN105453706A CN201480044070.5A CN201480044070A CN105453706A CN 105453706 A CN105453706 A CN 105453706A CN 201480044070 A CN201480044070 A CN 201480044070A CN 105453706 A CN105453706 A CN 105453706A
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CN
China
Prior art keywords
light
printing substrate
flexible printing
adhering resin
resin layer
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Pending
Application number
CN201480044070.5A
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Chinese (zh)
Inventor
东山大树
猿渡昌隆
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Toyo Aluminum KK
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Toyo Aluminum KK
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Publication date
Application filed by Toyo Aluminum KK filed Critical Toyo Aluminum KK
Publication of CN105453706A publication Critical patent/CN105453706A/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Led Device Packages (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention provides the following: a flexible printed substrate for mounting a light emitting component with which, even if the substrate is made thin to show flexibility, the transmission of light rays from the mounted light emitting component is suppressed and changes in the color of light due to the impact of light emitting components of different colors are suppressed; and a flexible printed substrate mounted with a light emitting element, in which a light emitting component is mounted on the flexible printed substrate for mounting a light emitting component. The present invention provides a flexible printed substrate for mounting a light emitting component, on which a metal foil is layered in a circuit pattern onto at least one side of an insulative base material with an adhesive resin interposed therebetween, and that is characterized in that the adhesive resin layer contains light-blocking particles and has a light transmission rate of 65% or less for wavelengths in the range 380-750 nm.

Description

The flexible printing substrate of luminous component flexible printing substrate and installation luminous component is installed
Technical field
The present invention relates to the flexible printing substrate for installing luminous component, namely luminous component flexible printing substrate being installed, and the flexible printing substrate of installation luminous component of luminous component is installed on this flexible printing substrate.
Background technology
In the past, the electronic product that use has the luminous components such as LED had been manufactured.In such electronic product, such as, the circuit base plate being provided with LED replaces the planar luminous body of purposes etc. to use as liquid crystal display purposes, fluorescent tube, as such circuit base plate for planar luminous body, normally by Copper Foil with containing glass cloth (glasscloth) hot pressing being soaked with resin sticky, the hard substrate such as FR-4 or CEM-3.
In recent years, as LED mounting substrate, propose: the characteristic applying flexibly bendability excellence, by employ there is bendability flexible printing substrate (following, sometimes also referred to as FPC.) planar luminous body be processed into silk ribbon (ribbon) shape form, the LED illumination utensil etc. with appearance design.As the FPC used in such LED illumination utensil, propose and use as the FPC of infrabasal plate: this substrate by bond layer by substrate film and metal level stacked, be combined with the epoxy resin (reference example is as patent documentation 1) as adhesive resin composition.
But, in above-mentioned FPC, the material of epoxy resin is combined with as the adhesive resin composition forming bond layer, in addition, the thickest at the thickness removing metal level (Copper Foil) substrate film residual afterwards and bond layer is about 100 μm, there is the problem of the light of the luminous components such as transmission LED.Such as, be produced on above-mentioned FPC one side the emitting red light component-mounted substrate of red luminous component is installed and the green emitting component-mounted substrate of viridescent luminous component is installed, and these installation base plates are overlapped according to the mode of the Contact of the substrate film of each installation base plate use, now there are the following problems: in above-mentioned FPC, the light meeting transmission bond layer of luminous component and substrate film, light from each luminous component influences each other, tone is micro-with yellow, can become the tone different from the light tone of the luminous component of reality.
Therefore, expect to develop a kind of installation luminous component flexible printing substrate, even if it makes thinner to show bendability, also inhibits the ght transmission of installed luminous component, the change of the light tone that inhibit the impact between different colours luminous component to bring.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2011-241294 publication
Summary of the invention
the technical problem that invention will solve
The object of the invention is to, there is provided: luminous component flexible printing substrate is installed, even if it makes thinner to show bendability, also inhibits the ght transmission of installed luminous component, the change of the light tone that inhibit the impact between different colours luminous component to bring; With, this installation luminous component flexible printing substrate is provided with the flexible printing substrate of the installation luminous component of luminous component.
for the method for dealing with problems
The present inventor furthers investigate to achieve these goals and repeatedly, found that, for folding the installation luminous component flexible printing substrate having the metal forming of circuit pattern-like at least one side of insulating properties base material layer by layer across adhering resin, light-proofness particle is contained by adhering resin layer, and the light transmittance of the wavelength 380 ~ 750nm of adhering resin layer is less than 65%, even if the substrate that the such thickness of flexible printing substrate is thin, also inhibits the ght transmission of installed luminous component, the change of the light tone that inhibit the impact between different colours luminous component to bring, until complete the present invention.
That is, the present invention relates to the flexible printing substrate of following installation luminous component flexible printing substrate and installation luminous component.
1. a flexible printing substrate, is characterized in that, it is at least one side of insulating properties base material, across the adhering resin folded installation luminous component flexible printing substrate having the metal forming of circuit pattern-like layer by layer, wherein,
Aforementioned adhering resin layer contains light-proofness particle, and the light transmittance of wavelength 380 ~ 750nm is less than 65%.
2. the flexible printing substrate described in above-mentioned item 1, wherein, aforementioned light-proofness particle is inorganic particle.
3. the flexible printing substrate described in above-mentioned item 1 or 2, wherein, aforementioned light-proofness particle contain be selected from titanium dioxide, in group that magnesium oxide, zinc oxide, silica, calcium carbonate, barium sulfate, talcum, iron oxide, malachite, aluminium powder, copper powder, stainless steel powder form at least a kind.
4. the flexible printing substrate according to any one of above-mentioned item 1 ~ 3, wherein, aforementioned adhering resin layer is containing at least a kind that is selected from group that epoxy resin, mylar, acrylic resin, polyurethane resin and silicones form.
5. the flexible printing substrate according to any one of above-mentioned item 1 ~ 4, wherein, aforementioned light-proofness particle is titanium dioxide, and relative to the aforementioned adhering resin layer of 100 quality %, the content of aforesaid titanium dioxide is more than 6 quality %.
6. the flexible printing substrate according to any one of above-mentioned item 1 ~ 4, wherein, aforementioned light-proofness particle is aluminium powder, and relative to the aforementioned adhering resin layer of 100 quality %, the content of aforementioned aluminium powder is more than 2 quality %.
7. the flexible printing substrate according to any one of above-mentioned item 1 ~ 6, wherein, aforementioned dielectric base material contains at least a kind that is selected from group that PETG (PET), PEN (PEN), polyimides, liquid crystal polymer, polyether-ether-ketone (PEEK), PPTA (PPTA), fluororesin and fluororesin copolymer form.
8. install a flexible printing substrate for luminous component, it is provided with luminous component on the flexible printing substrate according to any one of above-mentioned item 1 ~ 7.
9. install a manufacture method for the flexible printing substrate of luminous component, it is characterized in that, the manufacture method of the flexible printing substrate of this installation luminous component comprises:
(1) operation 1: on metal foil, across the stacked insulating properties base material of the adhering resin composition containing light-proofness particle;
(2) operation 2: aforementioned adhering resin composition is solidified, the light transmittance forming wavelength 380 ~ 750nm is the adhering resin layer of less than 65%;
(3) operation 3: aforementioned metal paper tinsel, be formed aforementioned adhering resin layer face opposite side face on the resist layer of printed patterns shape; With
(4) operation 4: by etch processes, makes the aforementioned metal paper tinsel in the region of not printing aforementioned resist layer dissolve to form line pattern.
invention effect
There is the installation luminous component flexible printing substrate of the present invention of above-mentioned feature, adhering resin layer contains light-proofness particle, and, the light transmittance of the wavelength 380 ~ 750nm of adhering resin layer is less than 65%, therefore, even if the substrate that the such thickness of flexible printing substrate is thin also inhibits the transmission of light, the change of the light tone that the impact between different colours luminous component can be suppressed to bring.
And then, the flexible printing substrate of installation luminous component of the present invention have containing light-proofness particle and the light transmittance of wavelength 380 ~ 750nm be less than 65% adhering resin layer, therefore, inhibit the ght transmission of luminous component, inhibit the tone variations that the impact between light source brings.
Accompanying drawing explanation
Fig. 1 is the sectional view of an example of the Rotating fields showing installation luminous component flexible printing substrate of the present invention.
Embodiment
1. luminous component flexible printing substrate is installed
Installation luminous component flexible printing substrate of the present invention (following, to be sometimes also only called " flexible printing substrate ".), it is at least one side of insulating properties base material, across the adhering resin folded installation luminous component flexible printing substrate having the metal forming of circuit pattern-like layer by layer, wherein, above-mentioned adhering resin layer contains light-proofness particle, and the light transmittance of wavelength 380 ~ 750nm is less than 65%.
Flexible printing substrate of the present invention, as long as at least one side of insulating properties base material, form the metal forming of line pattern shape across above-mentioned adhering resin layer, also can form the metal forming of line pattern shape on the two sides of insulating properties base material respectively across adhering resin layer.Even if which, because above-mentioned adhering resin layer contains light-proofness particle, and the light transmittance of wavelength 380 ~ 750nm is less than 65%, even if thus when the luminous component of different colours has been installed on the two sides of flexible printing substrate, also inhibits the transmission of light, the change of the light tone that the impact between different colours luminous component can be suppressed to bring.
The thickness of flexible printing substrate of the present invention preferably 20 ~ 200 μm, more preferably 35 ~ 150 μm.If thickness is blocked up, can be detrimental to the bendability of flexible printing substrate, if thickness is excessively thin, the suppression of possible ght transmission is insufficient.
(insulating properties base material)
As insulating properties base material, as long as there is insulating properties, possess thermal endurance etc. in order to the performance of the base material being used as circuit base plate and be not particularly limited, can enumerate such as, the base material containing PETG (PET), PEN (PEN), polyimides, liquid crystal polymer, polyether-ether-ketone (PEEK), PPTA (PPTA), fluororesin or fluororesin copolymer.Insulating properties base material can contain these resins separately, also can contain two or more.
In the middle of these, from the view point of excellent heat resistance, preferably contain the insulating properties base material of PETG or polyimides.
By suitably selecting to be used for the resin of above-mentioned insulating properties base material, following characteristic can be given to flexible printing substrate of the present invention: according to the object of electronic product etc. employing luminous component, the alternative transmission suppressing particular color light.Such as, when employing the insulating properties base material containing polyimides, insulating properties base material yellowish.The insulating properties base material of such yellowish can the transmission of Selective depression blue ray especially, and thus, flexible printing substrate suppresses the transmission of blue ray especially.
The thickness of insulating properties base material is preferably the thickness that flexible printing substrate can show the degree of bendability, usually the preferred thickness of 15 ~ 50 μm.
(adhering resin layer)
As the resin forming adhering resin layer, for can the resin of bonding insulating properties base material and metal forming, can enumerate such as, epoxy resin, mylar, acrylic resin, polyurethane resin, silicones, polyimide resin, vinyl chloride resin etc.These resins can be used alone, and also can mix two or more and use.In the middle of these, preferably containing the resin of at least a kind be selected from group that epoxy resin, mylar, acrylic resin, polyurethane resin and silicones form.
Adhering resin layer contains light-proofness particle.As long as light-proofness particle can be given light-proofness to adhering resin layer, suppress the particle of light transmittance then not limit, preferably use inorganic particle.
As light-proofness particle, specifically, can enumerate such as, titanium dioxide, magnesium oxide, zinc oxide, silica, calcium carbonate, barium sulfate, talcum, iron oxide, malachite, aluminium powder, copper powder, stainless steel powder.Wherein, in light-proofness especially excellence, preferred titanium dioxide, aluminium powder.Adhering resin layer can contain these light-proofness particles separately, also can contain two or more.
During as light-proofness particle use titanium dioxide, the content of titanium dioxide is preferably preferably more than 6 quality % relative to 100 quality % adhering resin layers.When content is few, possible light-proofness is insufficient.In addition, the content of titanium dioxide is relative to 100 quality % adhering resin layer preferably below 80 quality %, more preferably below 50 quality %.When content is too much, the adhering resin composition for the formation of adhering resin layer is difficult to gather, the cementability possible deviation of adhering resin layer.
During as light-proofness particle use aluminium powder, the content of aluminium powder is relative to 100 quality % adhering resin layer preferably more than 2 quality %.When content is few, light-proofness may be insufficient.In addition, the content of aluminium powder is relative to 100 quality % adhering resin layer preferably below 80 quality %, more preferably below 50 quality %.When content is too much, the adhering resin composition for the formation of adhering resin layer is difficult to gather, the cementability possible deviation of adhering resin layer.
As light-proofness particle, preferably use iron oxide or malachite in addition.During as light-proofness particle use iron oxide, adhering resin layer can suppress the transmission of the light beyond redness gradually especially.In addition, when using malachite, adhering resin layer can suppress the transmission of the light beyond green gradually especially.Visible, by suitably selecting light-proofness particle, can according to the object of the electronic product employing luminous component etc., the transmission of the light beyond Selective depression particular color.
Preferably 0.1 ~ 15.0 μm, the average grain footpath of above-mentioned light-proofness particle, more preferably 0.2 ~ 10.0 μm.In addition, in this specification, the average grain footpath of light-proofness particle is the value measured by laser diffractometry.
The shape of light-proofness particle does not limit, and can be the shapes such as flakey, spherical, needle-like, preferably use lepidiod light-proofness particle.By using lepidiod light-proofness particle, higher light-proofness can be played.
Light-proofness particle is preferably the state that surface is covered by resin.Particularly, when employing the light-proofness particle with conductivity, because the insulating properties of the adhering resin layer containing this particle reduces, the insulating properties of flexible printing substrate also may reduce.Covered by resin by light-proofness particle, the reduction of the insulating properties of such adhering resin layer can be suppressed.
The light transmittance of the wavelength 380 ~ 750nm of adhering resin layer is less than 65%.Above-mentioned light-proofness particle is contained by adhering resin layer, adhering resin layer, the light transmittance of wavelength 380 ~ 750nm is less than 65%, inhibit the transmission of the light of flexible printing substrate, the change of the light tone that the impact between different colours luminous component can be suppressed to bring.Above-mentioned light transmittance preferably less than 60%.In addition, the lower limit of above-mentioned light transmittance is not particularly limited, and can be 0%.
Above-mentioned light transmittance is by obtaining as follows: use UV, visible light near-infrared spectrophotometer (ProductName " JASCOV570 type " Japanese light splitting society manufactures) to measure the transmissivity of whole light, average in the scope of 380 ~ 750nm with the value of the transmissivity of every 5nm wavelength.In addition, the specification of above-mentioned photometer is, rack form: integrating sphere type, size up: long 8mm × wide 9mm, integrating sphere internal diameter: 60mm, integrating sphere inwall smears: barium sulfate.
The thickness of adhering resin layer does not limit, preferably about 5 ~ 50 μm, more preferably about 10 ~ 25 μm.When above-mentioned thickness is crossed thin, may not show sufficient interlayer adaptation because of the kind of insulating properties base material, reduce from the thermal conductivity of metal forming side direction insulating properties substrate side time blocked up, the exothermicity of circuit base plate may be poor.
(metal forming)
As the metal forming metal forming, for can be used for the metal of metallic circuit, such as aluminium, copper, silver can be enumerated.In the present invention, above-mentioned metal forming is the metal forming of line pattern shape.Above-mentioned metal forming is formed as line pattern shape by etching etc., can be made into aluminum steel road, copper wire etc.
Above-mentioned line pattern is such as formed by the known pattern formation method processing such as method, resistant layer (etchingresist) method with photoresist aluminium foil, Copper Foil etc.Above-mentioned aluminium foil is not limited to pure aluminum foil, also comprises alloy foil.Specifically, as aluminium foil, such as can adopt and count 1030 with the mark of JIS (AA), 1N30,1050,1100,8021, pure aluminum foil or the alloy foils such as 8079.
Copper Foil is not limited to pure copper foil, also comprises copper alloy foil.Specifically, as Copper Foil, such as, can adopt and count the pure copper foil such as C1100, C2600, C7025 or copper alloy foil with the mark of JIS (AA).
The metal forming of above-mentioned line pattern shape can be formed as follows: stacked metal forming on adhering resin layer, is then processed into line pattern shape by known pattern formation method, thus is formed on adhering resin layer.
The thickness of metal forming does not limit, preferably about 5 ~ 100 μm, more preferably about 12 ~ 70 μm.
As the manufacture method of making and installation luminous component flexible printing substrate of the present invention, such as following manufacture method can be enumerated, it comprises: on insulating properties base material, the adhering resin composition of coating containing light-proofness particle solidifies to make it, forms the operation of adhering resin layer; The operation of stacked metal forming on this adhering resin layer; With, by implementing to be etched with the operation making line pattern shape to metal forming.
As the manufacture method of making and installation luminous component flexible printing substrate of the present invention, the manufacture method that also can be listed below, it comprises: (1) operation 1: on metal foil, across the stacked insulating properties base material of the adhering resin composition containing light-proofness particle; (2) operation 2: above-mentioned adhering resin composition is solidified, the light transmittance forming wavelength 380 ~ 750nm is the adhering resin layer of less than 65%; (3) operation 3: above-mentioned metal forming, be formed above-mentioned adhering resin layer face opposite side face on the resist layer of printed patterns shape; With, (4) operation 4: by etch processes, makes the above-mentioned metal forming in the region of not printing above-mentioned resist layer dissolve to form line pattern.
2. luminous component hookup wire base board
Installation luminous component flexible printing substrate of the present invention, by installing luminous component in the metal forming of circuit pattern-like, becomes the flexible printing substrate installing luminous component.
As luminous component, can enumerate such as, the luminous original paper such as LED chip, laser diode, organic EL and these array element (arrayelement) etc.
[embodiment]
Below, illustrate that embodiment and comparative example are to illustrate the present invention.But, the invention is not restricted to embodiment.
(embodiment 1)
Use adhering resin composition to be fitted by the pet film of the electrolytic copper foil of 35 μm of thickness and 38 μm of thickness, make duplexer.Adhering resin composition is prepared by the titanium dioxide adding 0.24 μm, average grain footpath in polyurethane resin system bonding agent (getting the trade name that 100 mass parts Dainippon Ink Chemicals manufacture: the trade name KW75 that LX500 and 10 mass parts Dainippon Ink Chemicals manufacture mixes, and prepares with diluted ethyl acetate).
By being cultivated 5 days at 60 DEG C by made duplexer, caking resin combination makes it solidify to make adhering resin layer.The thickness of adhering resin layer is 15 μm, and the content of the titanium dioxide in adhering resin layer is 30 quality % relative to 100 quality % adhering resin layers.In addition, the light transmittance of the wavelength 380 ~ 750nm of adhering resin layer is 42.2%.In addition, the light transmittance of adhering resin layer is obtained as follows: prepare the adhering resin layer identical with above-mentioned adhering resin layer of individual layer separately to make light transmittance mensuration adhering resin layer, use UV, visible light near-infrared spectrophotometer (ProductName " JASCOV570 type " Japanese light splitting society manufactures) to measure the transmissivity of whole light of this light transmittance mensuration adhering resin layer, average with the light transmittance of every 5nm wavelength in the scope of 380 ~ 750nm.In addition, the specification of above-mentioned photometer is, rack form: integrating sphere type, size up: long 8mm × wide 9mm, integrating sphere internal diameter: 60mm, integrating sphere inwall smears: barium sulfate.
By the surface printing resistant layer of intaglio printing at electrolytic copper foil, utilize the iron chloride of 42 Baumes to be etched with formation line pattern, make flexible printing substrate.
With solder, green LED encapsulation (SML-E12P8W that Roma Co., Ltd manufactures) is installed on flexible printing substrate, the flexible printing substrate of fabrication and installation luminous component.In addition, with solder, red LED encapsulation (Luo nurse Zhu formula Hui She System SML-E12U8W) is installed on the flexible printing substrate made separately, the flexible printing substrate of fabrication and installation luminous component.
According to the mode of the Contact of insulating properties base material, by such as above-mentioned making, the flexible printing substrates while stacking of the flexible printing substrate of the installation luminous component that is provided with green LED encapsulation and the installation luminous component that is provided with red LED encapsulation fixes.Applying rated voltage makes LED luminous, and the light tone that visualization sends, according to following metewand evaluation.
A: the tone when light tone sent and independent luminescence is identical.
B: the light tone sent is subject to the light impact of transmission from the inside and changes.
(embodiment 2)
The content of the titanium dioxide in adhering resin layer is 15 quality %, in addition, operates similarly to Example 1, measures the light transmittance of adhering resin layer, evaluates the tone of light.
(embodiment 3)
The content of the titanium dioxide in adhering resin layer is 10 quality %, in addition, operates similarly to Example 1, measures the light transmittance of adhering resin layer, evaluates the tone of light.
(embodiment 4)
The content of the titanium dioxide in adhering resin layer is 7 quality %, in addition, operates similarly to Example 1, measures the light transmittance of adhering resin layer, evaluates the tone of light.
(embodiment 5)
Use the lepidiod aluminium powder in 10 μm, average grain footpath and replace titanium dioxide, the content of the lepidiod aluminium powder in adhering resin layer is 20 quality %, in addition, operates similarly to Example 1, measure the light transmittance of adhering resin layer, evaluate the tone of light.
(embodiment 6)
Use the lepidiod aluminium powder in 10 μm, average grain footpath and replace titanium dioxide, the content of the lepidiod aluminium powder in adhering resin layer is 5 quality %, in addition, operates similarly to Example 1, measure the light transmittance of adhering resin layer, evaluate the tone of light.
(embodiment 7)
Use the lepidiod aluminium powder in 10 μm, average grain footpath and replace titanium dioxide, the content of the lepidiod aluminium powder in adhering resin layer is 3 quality %, in addition, operates similarly to Example 1, measure the light transmittance of adhering resin layer, evaluate the tone of light.
(comparative example 1)
Adhering resin layer containing titanium dioxide, in addition, does not operate similarly to Example 1, measures the light transmittance of adhering resin layer, evaluates the tone of light.
(comparative example 2)
The content of the titanium dioxide in adhering resin layer is 5 quality %, in addition, operates similarly to Example 1, measures the light transmittance of adhering resin layer, evaluates the tone of light.
(comparative example 3)
Use the lepidiod aluminium powder in 10 μm, average grain footpath and replace titanium dioxide, the content of the lepidiod aluminium powder in adhering resin layer is 1 quality %, in addition, operates similarly to Example 1, measure the light transmittance of adhering resin layer, evaluate the tone of light.
Result is shown in table 1.
Table 1
As can be known from the results of Table 1, across the metal forming of adhering resin superimposing thread road pattern-like layer by layer at least one side of insulating properties base material, adhering resin layer contains light-proofness particle, and the light transmittance of the wavelength 380 ~ 750nm of adhering resin layer is the flexible printing substrate of the embodiment 1 ~ 7 of less than 65%, because adhering resin layer is containing light-proofness particle, the above-mentioned light transmittance of adhering resin layer is adjusted to less than 65%, the flexible printing substrate that thus even if thickness is thin, inhibit the transmission of the light of luminous component and LED, the change of the light tone that inhibit the impact between the different colours luminous component of green LED and red LED to bring.
Relative to this, the flexible printing substrate of comparative example 1, adhering resin layer is not containing light-proofness particle, light transmittance display 87.6% this high level of adhering resin layer, therefore, the suppression of the ght transmission of luminous component and LED is insufficient, and the tone of light may change because of the impact between the luminous component of the different colours of green LED and red LED.
The flexible printing substrate of comparative example 2 and 3, although adhering resin layer contains light-proofness particle, but because the light transmittance of adhering resin layer is more than 65%, the suppression of the ght transmission of luminous component and LED is insufficient, and the tone of light may change because of the impact between the luminous component of the different colours of green LED and red LED.
Description of reference numerals
1: luminous component flexible printing substrate is installed
2: insulating properties base material
3: adhering resin layer
4: the metal forming of line pattern shape

Claims (9)

1. a flexible printing substrate, is characterized in that, it is at least one side of insulating properties base material, across the adhering resin folded installation luminous component flexible printing substrate having the metal forming of circuit pattern-like layer by layer, wherein,
Described adhering resin layer contains light-proofness particle, and the light transmittance of wavelength 380 ~ 750nm is less than 65%.
2. flexible printing substrate according to claim 1, wherein,
Described light-proofness particle is inorganic particle.
3. flexible printing substrate according to claim 1 and 2, wherein,
Described light-proofness particle contain be selected from titanium dioxide, in group that magnesium oxide, zinc oxide, silica, calcium carbonate, barium sulfate, talcum, iron oxide, malachite, aluminium powder, copper powder, stainless steel powder form at least a kind.
4. the flexible printing substrate according to any one of claims 1 to 3, wherein,
Described adhering resin layer is containing at least a kind that is selected from group that epoxy resin, mylar, acrylic resin, polyurethane resin and silicones form.
5. the flexible printing substrate according to any one of Claims 1 to 4, wherein,
Described light-proofness particle is titanium dioxide, and relative to adhering resin layer described in 100 quality %, the content of described titanium dioxide is more than 6 quality %.
6. the flexible printing substrate according to any one of Claims 1 to 4, wherein,
Described light-proofness particle is aluminium powder, and relative to adhering resin layer described in 100 quality %, the content of described aluminium powder is more than 2 quality %.
7. the flexible printing substrate according to any one of claim 1 ~ 6, wherein,
Described insulating properties base material contains at least a kind that is selected from group that PETG (PET), PEN (PEN), polyimides, liquid crystal polymer, polyether-ether-ketone (PEEK), PPTA (PPTA), fluororesin and fluororesin copolymer form.
8. a flexible printing substrate for luminous component is installed, its flexible printing substrate according to any one of claim 1 ~ 7 is provided with luminous component.
9. install a manufacture method for the flexible printing substrate of luminous component, it is characterized in that, the manufacture method of the flexible printing substrate of this installation luminous component comprises following operation:
(1) operation 1: on metal foil, across the stacked insulating properties base material of the adhering resin composition containing light-proofness particle;
(2) operation 2: described adhering resin composition is solidified, the light transmittance forming wavelength 380 ~ 750nm is the adhering resin layer of less than 65%;
(3) operation 3: described metal forming, be formed described adhering resin layer face opposite side face on the resist layer of printed patterns shape; With
(4) operation 4: by etch processes, makes the described metal forming in the region of not printing described resist layer dissolve to form line pattern.
CN201480044070.5A 2013-08-29 2014-08-22 Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component Pending CN105453706A (en)

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