JPH09135067A - Shielding cover lay film - Google Patents
Shielding cover lay filmInfo
- Publication number
- JPH09135067A JPH09135067A JP22984196A JP22984196A JPH09135067A JP H09135067 A JPH09135067 A JP H09135067A JP 22984196 A JP22984196 A JP 22984196A JP 22984196 A JP22984196 A JP 22984196A JP H09135067 A JPH09135067 A JP H09135067A
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- adhesive
- light
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はカバーレイフィルム
に関し、特に光学機器等に用いられる遮光性カバーレイ
フィルムに係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coverlay film, and more particularly to a light-shielding coverlay film used for optical equipment and the like.
【０００２】[0002]
【従来の技術】近年エレクトロニクス分野の発展が目覚
ましく、特に通信用・民生用の電子機器の小型化、軽量
化、高密度化が進み、これらの性能に対する要求がます
ます高度なものとなっている。このような要求に対して
フレキシブル印刷配線板は、可撓性を有し繰り返し屈曲
に耐えるため、狭い空間に立体的高密度の実装が可能で
あり、電子機器への配線、ケーブル、あるいはコネクタ
ー機能を付与した複合部品としてのその用途が拡大しつ
つある。特に最近では、カメラ、ビデオカメラ、CD-ROM
ドライブの光ピックアップ部等の電子・光学機器に使用
されることが多くなり、それに伴ってフレキシブル印刷
配線板に対する遮光性というものが重要となっている。
この遮光性とは光学機器の嫌光部に用いられるフレキシ
ブル印刷配線板に必要な特性で、外部から嫌光部に侵入
しようとする光を配線板で遮り、かつ配線板によって遮
られた光の反射光が再び嫌光部に侵入しないよう拡散さ
せる必要がある。2. Description of the Related Art In recent years, the development of the electronics field has been remarkable, and in particular, electronic devices for communication and consumer have been made smaller, lighter and higher in density, and requirements for these performances have become more and more advanced. . In response to such demands, flexible printed wiring boards are flexible and can withstand repeated bending, so that they can be mounted in three-dimensionally high density in a narrow space, and function as wiring to electronic devices, cables, or connector functions. Its use as a composite part with the addition of is being expanded. Especially recently, cameras, camcorders, CD-ROMs
It is often used in electronic / optical devices such as an optical pickup part of a drive, and accordingly, the light shielding property for a flexible printed wiring board is important.
This light-shielding property is a characteristic required for a flexible printed wiring board used in the shaded area of an optical device, and blocks the light that tries to enter the shaded area from the outside with the wiring board and the light blocked by the wiring board. It is necessary to diffuse the reflected light so that it does not enter the anaerobic part again.
【０００３】[0003]
【発明が解決しようとする課題】このような遮光性を付
与させるために、従来はフレキシブル印刷配線板のカバ
ーレイフィルム側の電気絶縁性フィルムに直接スクリー
ン印刷法等により黒色インクを印刷して対応していた。
しかしながらこの方法では凹凸のあるフレキシブル印刷
配線板にスクリーン印刷を行うため作業性が悪く、かつ
回路加工工程中に印刷工程が増えることから、作業効率
も悪くなってしまう。また、回路の外形加工時及び折り
曲げ時に、黒色インクが折れたり剥れたりして遮光性が
失われたり、黒色インクにより機器内部が汚染されてし
まうという欠点があった。In order to impart such a light-shielding property, conventionally, a black ink is printed directly on the electrically insulating film on the coverlay film side of a flexible printed wiring board by a screen printing method or the like. Was.
However, according to this method, since the screen printing is performed on the flexible printed wiring board having irregularities, the workability is poor, and since the printing process is increased during the circuit processing process, the work efficiency is also degraded. In addition, there are drawbacks that the black ink is broken or peeled off at the time of external processing and bending of the circuit to lose the light shielding property, or the inside of the device is contaminated by the black ink.
【０００４】[0004]
【課題を解決するための手段】本発明者等は、かかる課
題を解決するために鋭意検討した結果、カバーレイフィ
ルムに用いられる電気絶縁性フィルム、熱硬化性接着剤
のいずれかもしくは両方に、黒色顔料を含有させること
によって、優れた遮光性を有するフレキシブル印刷配線
板が得られることを見出し、種々検討して本発明を完成
するに至った。その要旨とするところは、電気絶縁性フ
ィルムに熱硬化性接着剤を塗布し、これを加熱乾燥した
後、離型材と貼り合せてなるカバーレイフィルムにおい
て、電気絶縁性フィルム側からの可視領域光の全透過度
Ｘが０≦Ｘ≦３％、かつ鏡面光沢度Ｙが０＜Ｙ≦50％で
ある遮光性カバーレイフィルムにある。以下、本発明の
詳細について説明する。Means for Solving the Problems As a result of intensive studies for solving the above problems, the present inventors have found that either or both of an electrically insulating film used for a coverlay film and a thermosetting adhesive, It has been found that a flexible printed wiring board having an excellent light-shielding property can be obtained by containing a black pigment, and various studies have been conducted to complete the present invention. The gist of this is that in a cover lay film formed by applying a thermosetting adhesive to an electrically insulating film, heating and drying it, and then bonding it to a release material, visible light from the electrically insulating film side The total transmittance X is 0 ≦ X ≦ 3% and the specular gloss Y is 0 <Y ≦ 50%. Hereinafter, details of the present invention will be described.
【０００５】[0005]
【発明の実施の形態】本発明の実施の形態について以下
に説明する。本発明で使用される電気絶縁性フィルム
は、ポリイミドフィルム、ＰＥＴ（ポリエチレンテレフ
タレート）フィルム、ポリエステルフィルム、ポリパラ
バン酸フィルム、ポリエーテルエーテルケトンフィル
ム、ポリフェニレンサルファイドフィルム、アラミドフ
ィルム等が例示される。厚さは通常12.5〜75μｍの範囲
であるが、必要に応じて適宜の厚さのものが使用され
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. Examples of the electrically insulating film used in the present invention include a polyimide film, a PET (polyethylene terephthalate) film, a polyester film, a polyparabanic acid film, a polyether ether ketone film, a polyphenylene sulfide film, and an aramid film. The thickness is usually in the range of 12.5 to 75 μm, but an appropriate thickness is used if necessary.
【０００６】熱硬化性接着剤としては、ナイロン／エポ
キシ系、ＮＢＲ／フェノール系、カルボキシル基含有Ｎ
ＢＲ／エポキシ系、ポリエステル／エポキシ系等が挙げ
られ、配線板の使用条件を十分考慮して選択される。接
着剤に用いる溶剤としては、メタノール、エタノール、
メチルエチルケトン、トルエン等で特に限定されない。
また無機フィラー、難燃剤等を加えることも可能であ
る。接着剤層の厚さは通常乾燥時15〜50μｍの範囲でよ
いが、必要に応じて適宜の厚さのものが使用される。As the thermosetting adhesive, nylon / epoxy type, NBR / phenol type, carboxyl group-containing N
BR / epoxy type, polyester / epoxy type and the like can be mentioned, and they are selected in consideration of the usage conditions of the wiring board. As the solvent used for the adhesive, methanol, ethanol,
Methyl ethyl ketone, toluene, etc. are not particularly limited.
It is also possible to add an inorganic filler, a flame retardant or the like. The thickness of the adhesive layer may usually be in the range of 15 to 50 μm when dried, but an appropriate thickness may be used if necessary.
【０００７】離型材としては、ポリエチレンフィルム、
ポリプロピレンフィルム、ＴＰＸフィルム、シリコーン
離型材付きポリオレフィンフィルム（ＰＥ、ＰＰ等）、
塩化ビニリデンフィルムコート紙、ポリオレフィン樹脂
（ＰＥ、ＰＰ等）コート紙等が挙げられる。吸放湿によ
るカールを防止するために、原紙の両面にプラスチック
フィルムが貼り合わされているものが最適に用いられ
る。厚さは、必要に応じて適宜の厚さのものが使用され
るが、30〜200 μｍが好ましく、さらに好ましくは40〜
120 μｍである。As a release material, polyethylene film,
Polypropylene film, TPX film, polyolefin film with silicone release material (PE, PP, etc.),
Examples thereof include vinylidene chloride film-coated paper and polyolefin resin (PE, PP, etc.) coated paper. In order to prevent curling due to moisture absorption and desorption, a material in which plastic films are attached to both sides of the base paper is optimally used. The thickness is appropriately selected according to need, but is preferably 30 to 200 μm, more preferably 40 to 200 μm.
It is 120 μm.
【０００８】本発明で用いられる黒色顔料としては、カ
ーボンブラック、アセチレンブラック、松煙、グラファ
イト、酸化鉄黒、マンガン黒等が挙げられ、いずれでも
本発明の効果が得られるが、色調、着色力、隠蔽力等が
優れているカーボンブラックが特に好ましい。また、黒
色顔料は、熱硬化性接着剤と電気絶縁性フィルムとのい
ずれかまたは両方に含有させることができ、特に、比較
的作業性に優れている熱硬化性接着剤に混入させること
が好ましい。黒色顔料の平均粒径Ｚは0.01≦Ｚ≦５μｍ
が好ましく、0.05≦Ｚ≦ 1.0μｍがさらに好ましい。平
均粒径Ｚが0.01μｍより小さいと、熱硬化性接着剤また
は電気絶縁性フィルムへの分散性が著しく悪くなり、５
μｍより大きいと、着色力、隠蔽力が著しく低下してし
まう。熱硬化性接着剤または電気絶縁性フィルムへの黒
色顔料の配合量は、黒色顔料の種類、平均粒径等によっ
て異なるが、カバーレイフィルムの状態で、透過面に対
する黒色顔料の単位面積あたりの含有量（以下、顔料含
有率とする）αが 100≦α≦1000μｇ/cm2であり、最終
的に電気絶縁性フィルム側からの可視領域光の全透過度
Ｘが０≦Ｘ≦３％、鏡面光沢度Ｙが０＜Ｙ≦50％とな
り、かつカバーレイフィルムの特性（耐熱性、引き剥し
強度、電気特性等）が損なわれない範囲で適宜配合する
ことが好ましい。接着剤に黒色顔料を混入する場合、用
いる接着剤 100重量部に対し、黒色顔料を０〜15重量部
混入することが好ましく、さらに好ましくは０〜12重量
部である。15重量部を超えると、剥離強度、半田耐熱
性、電気特性が低下する。ここで０重量部の混入とは、
電気絶縁性フィルムのみに黒色顔料を混入する場合であ
る。Examples of the black pigment used in the present invention include carbon black, acetylene black, pine smoke, graphite, iron oxide black, manganese black and the like, and any of them can obtain the effect of the present invention, but the color tone and the coloring power are not limited. Particularly preferred is carbon black, which is excellent in hiding power. Further, the black pigment can be contained in either or both of the thermosetting adhesive and the electrically insulating film, and it is particularly preferable to mix it in the thermosetting adhesive which is relatively excellent in workability. . The average particle size Z of the black pigment is 0.01 ≦ Z ≦ 5 μm
Is preferable, and 0.05 ≦ Z ≦ 1.0 μm is more preferable. If the average particle size Z is smaller than 0.01 μm, the dispersibility in a thermosetting adhesive or an electrically insulating film is significantly deteriorated, and
If it is larger than μm, the coloring power and the hiding power are significantly reduced. The amount of the black pigment compounded in the thermosetting adhesive or the electrically insulating film varies depending on the type of the black pigment, the average particle size, etc. The amount (hereinafter, referred to as pigment content) α is 100 ≦ α ≦ 1000 μg / cm 2 , and finally the total transmittance X of visible region light from the electrically insulating film side is 0 ≦ X ≦ 3%, mirror surface. It is preferable that the glossiness Y be 0 <Y ≦ 50%, and that the content of the coverlay film (heat resistance, peeling strength, electrical characteristics, etc.) is not impaired, so that the content is appropriately mixed. When a black pigment is mixed in the adhesive, 0 to 15 parts by weight of the black pigment is preferably mixed with 100 parts by weight of the adhesive used, and more preferably 0 to 12 parts by weight. If it exceeds 15 parts by weight, the peel strength, solder heat resistance, and electrical characteristics will deteriorate. Here, mixing 0 parts by weight means
This is a case where the black pigment is mixed only in the electrically insulating film.
【０００９】電気絶縁性フィルムに黒色顔料を混入する
場合、用いる樹脂 100重量部に対し、黒色顔料を０〜10
重量部混入することが好ましく、さらに好ましくは０〜
６重量部である。ここで０重量部の混入とは、接着剤の
みに黒色顔料を混入する場合である。電気絶縁性フィル
ムとしては、通常フレキシブル印刷配線用基板に使用が
可能であればいずれのものでも良く、その中でも特に耐
熱性・電気特性・混入作業性等からポリイミドフィルム
が好ましい。この黒色顔料を配合したポリイミドフィル
ムの製造方法としては、一般にピロメリット酸二無水物
（ＰＭＤＡ）や、３，３′，４，４′−ビフェニルテト
ラカルボン酸二無水物（ＢＰＤＡ）等の酸二無水物と、
４，４′−ジアミノジフェニルエーテル（ＤＤＥ）やｐ
−フェニレンジアミン（ＰＤＡ）等のジアミン成分とを
溶液中で反応させて得られるポリアミド酸溶液に、黒色
顔料を適量混入、分散させ、得られた黒色ポリアミド酸
溶液をフィルム化し、化学的または熱的に脱水、イミド
化することにより製造される。なお、黒色顔料はポリア
ミド酸溶液に反応前もしくは反応後のいずれかに混合さ
せれば良く、反応前に溶媒中に分散させると操作性が良
好となる。溶媒は一般にポリイミドを製造する際に使用
される溶媒であれば良く、例えば、Ｎ，Ｎ−ジメチルホ
ルムアミド、ジメチルアセトアミド等の極性溶媒が好ま
しい。When the black pigment is mixed in the electrically insulating film, the black pigment is added in an amount of 0 to 10 relative to 100 parts by weight of the resin used.
It is preferable to mix by weight, more preferably 0 to
6 parts by weight. Here, the mixing of 0 parts by weight means that the black pigment is mixed only in the adhesive. As the electrically insulating film, any film can be used as long as it can be used for a substrate for flexible printed wiring, and among them, a polyimide film is preferable in view of heat resistance, electric characteristics, mixing workability and the like. As a method for producing a polyimide film containing the black pigment, acid dianhydrides such as pyromellitic dianhydride (PMDA) and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (BPDA) are generally used. Anhydrous,
4,4'-diaminodiphenyl ether (DDE) and p
An appropriate amount of a black pigment is mixed and dispersed in a polyamic acid solution obtained by reacting a diamine component such as phenylenediamine (PDA) in a solution, and the obtained black polyamic acid solution is formed into a film and chemically or thermally. It is produced by dehydration and imidization. The black pigment may be mixed in the polyamic acid solution either before or after the reaction, and if it is dispersed in the solvent before the reaction, the operability becomes good. The solvent may be any solvent generally used in the production of polyimide, and for example, polar solvents such as N, N-dimethylformamide and dimethylacetamide are preferable.
【００１０】電気絶縁性フィルムまたは熱硬化性接着剤
へ黒色顔料を混入させる際、溶剤等を用いる湿式での混
入、もしくは樹脂を加熱溶融させる乾式での混入等いず
れでもよいが、作業性・分散性の点から湿式での混入の
方がより好ましい。混合方法としては、一般的に使用が
提案されている公知の方法でよく、例えば、ポットミ
ル、ロールミル、ホモジナイザー、スーパーミル等を用
いての混合が挙げられる。これらについて、黒色顔料の
種類、平均粒径を考慮した上で適宜決められる。なお、
分散性の点から、黒色顔料に予めメタノール、エタノー
ル、メチルエチルケトン、トルエン等の溶剤を加え、さ
らに超音波処理等を施した後、接着剤等に混入すること
が好ましい。When the black pigment is mixed into the electrically insulating film or the thermosetting adhesive, it may be mixed by a wet method using a solvent or a dry method in which a resin is heated and melted, but workability and dispersion are also possible. From the viewpoint of properties, wet mixing is more preferable. The mixing method may be a known method that is generally proposed to be used, and examples thereof include mixing using a pot mill, a roll mill, a homogenizer, a super mill and the like. These are appropriately determined in consideration of the type of black pigment and the average particle size. In addition,
From the viewpoint of dispersibility, it is preferable to add a solvent such as methanol, ethanol, methyl ethyl ketone, and toluene in advance to the black pigment, subject it to ultrasonic treatment, and then mix it with an adhesive or the like.
【００１１】本発明においては、電気絶縁性フィルムに
表面処理を行う。これはカバーレイフィルムの鏡面光沢
度Ｙを０＜Ｙ≦50％とするための表面粗化処理、接着剤
との密着性を上げるための表面活性化処理である。な
お、表面処理を行う面として、電気絶縁性フィルムの少
なくとも接着剤面に低温プラズマ処理、非接着剤面に表
面粗化処理が施されていることが必要であり、これらの
処理をそれぞれの面について併用してもよい。低温プラ
ズマ処理としては、減圧可能な低温プラズマ処理装置に
電気絶縁性フィルムを入れ、装置内を無機ガスの雰囲気
として圧力を0.001 〜10トール、好ましくは0.01〜１ト
ールに保持した状態で電極間に 0.1〜10 kＶの直流ある
いは交流を印加してグロー放電させることにより無機ガ
スの低温プラズマを発生させ、該フィルムを順次移動さ
せながら表面を連続的にプラズマ処理するが、プラズマ
処理時間は概ね 0.1〜100 秒とするのが良い。無機ガス
としては、ヘリウム、ネオン、アルゴン等の不活性ガ
ス、または酸素、一酸化炭素、二酸化炭素、アンモニ
ア、空気が使用されるが、これらは一種に限らず二種以
上混合して使用してもよい。表面粗化処理としては、フ
ィルムに粒径５〜100 μｍ、好ましくは５〜20μｍの窒
化珪素、シリカ等の粉体を１分間当たり1.5 × 103〜15
×103 ｇ／ｍ2 の割合で直接放射するサンドマット処理
等が挙げられる。処理時間は30秒〜３分間とすることが
好ましく、さらに処理速度を10ｍ／秒〜60ｍ／秒とする
ことが好ましい。最終的にはカバーレイフィルムの状態
で電気絶縁性フィルム側からの可視領域光の鏡面光沢度
Ｙが０＜Ｙ≦50％であれば良い。In the present invention, the electrically insulating film is surface-treated. This is a surface roughening treatment for making the specular gloss Y of the coverlay film 0 <Y ≦ 50%, and a surface activation treatment for improving the adhesion with the adhesive. As the surface to be surface-treated, it is necessary that at least the adhesive surface of the electrically insulating film is subjected to low-temperature plasma treatment, and the non-adhesive surface is subjected to surface roughening treatment. May be used together. For low-temperature plasma treatment, an electrically insulating film is placed in a low-pressure plasma treatment apparatus capable of reducing pressure, and the apparatus is kept in an atmosphere of inorganic gas at a pressure of 0.001 to 10 Torr, preferably 0.01 to 1 Torr between electrodes. A low temperature plasma of an inorganic gas is generated by applying a glow discharge by applying a direct current or an alternating current of 0.1 to 10 kV, and the surface is continuously plasma treated while sequentially moving the film, but the plasma treatment time is generally 0.1 to 100 seconds is recommended. As the inorganic gas, an inert gas such as helium, neon, or argon, or oxygen, carbon monoxide, carbon dioxide, ammonia, or air is used, but these are not limited to one type, and two or more types may be used as a mixture. Good. As the surface roughening treatment, a powder of silicon nitride, silica or the like having a particle size of 5 to 100 μm, preferably 5 to 20 μm is applied to the film for 1.5 × 10 3 to 15 per minute.
Examples include sand mat treatment which directly radiates at a rate of × 10 3 g / m 2 . The processing time is preferably 30 seconds to 3 minutes, and the processing speed is preferably 10 m / second to 60 m / second. Finally, in the state of the coverlay film, the specular gloss Y of the visible region light from the electrically insulating film side may be 0 <Y ≦ 50%.
【００１２】本発明のカバーレイフィルムは、接着剤溶
液を電気絶縁性フィルムに乾燥状態で厚さ15〜50μｍに
なるようにロールコーター等により塗布し、溶剤を蒸発
させて接着剤を半硬化状態とする。この場合、必要に応
じて50〜 150℃で約３〜20分加熱するとよい。次にこの
接着剤付き電気絶縁性フィルムを離型材と重ね合わせ、
ロールラミネータ等で圧着積層させる。この際の加熱圧
着条件は、温度20〜 100℃、線圧0.5〜20kg／cmのも
と、１〜10ｍ／分の速度が好ましい。In the coverlay film of the present invention, the adhesive solution is applied to the electrically insulating film in a dry state by a roll coater or the like so as to have a thickness of 15 to 50 μm, and the solvent is evaporated to semi-cure the adhesive. And In this case, it may be heated at 50 to 150 ° C. for about 3 to 20 minutes, if necessary. Next, superimpose this electrically insulating film with adhesive on the release material,
Laminate with pressure using a roll laminator. At this time, the thermocompression bonding conditions are preferably a temperature of 20 to 100 ° C., a linear pressure of 0.5 to 20 kg / cm, and a speed of 1 to 10 m / min.
【００１３】本発明で特に重要なことは遮光性であり、
電気絶縁性フィルムの種類・厚み・表面粗化条件、黒色
顔料の種類・平均粒径・配合量、熱硬化性接着剤の種類
・厚み等を十分に考慮した上で、最終的には、カバーレ
イフィルムの状態で電気絶縁性フィルム側からの可視領
域光の全透過度Ｘが０≦Ｘ≦３％、かつ鏡面光沢度Ｙが
０＜Ｙ≦50％であることが必要である。好ましくは、全
透過度Ｘが０≦Ｘ≦１％、かつ鏡面光沢度Ｙが０＜Ｙ≦
30％である。全透過度が３％を超えると、光学機器の嫌
光部に光が侵入してしまい、嫌光部等に悪影響を及ぼ
す。また、鏡面光沢度が50％を超えると、配線板により
反射された光が再び嫌光部に侵入してしまう。Of particular importance in the present invention is the light-shielding property,
After fully considering the type / thickness / surface roughening condition of the electrically insulating film, the type / average particle size / blending amount of the black pigment, the type / thickness of the thermosetting adhesive, etc. In the lay film state, it is necessary that the total transmittance X of visible region light from the electrically insulating film side is 0 ≦ X ≦ 3% and the specular gloss Y is 0 <Y ≦ 50%. Preferably, the total transmittance X is 0 ≦ X ≦ 1% and the specular gloss Y is 0 <Y ≦.
30%. If the total transmittance exceeds 3%, the light penetrates into the anaerobic part of the optical device, which adversely affects the anaerobic part. Further, when the specular glossiness exceeds 50%, the light reflected by the wiring board invades the anaerobic part again.
【００１４】このように、本発明により、遮光性に優れ
た遮光性カバーレイフィルムが得られる。また回路工程
中でフレキシブル印刷配線板に黒色インクを印刷する工
程が不要となり、作業性・作業効率が大幅に改良され
る。As described above, according to the present invention, a light-shielding coverlay film having an excellent light-shielding property can be obtained. In addition, the process of printing black ink on the flexible printed wiring board is not required during the circuit process, and workability and work efficiency are greatly improved.
【００１５】[0015]
【実施例】以下、本発明を、実施例及び比較例を挙げて
説明するが、本発明はこれら実施例に限定されるもので
はない。 実施例１〜実施例４ （フィルムの表面処理）厚さ25μｍ、長さ20ｃｍ、幅17
ｃｍのカプトン（東レ・デュポン社製ポリイミドフィル
ム商品名）フィルムの片面に、平均粒径10μｍの窒化珪
素を用い、粒速20ｍ／秒で60秒間、サンドマット処理
（窒化珪素で、表面に350 ｇ／分）を行った。次にこの
フィルムのもう一方の面について低温プラズマ処理を施
した。この時のプラズマ処理条件は、真空度 0.1Torr、
酸素流量を3.0 リットル／分で供給し、印加電圧２ｋ
Ｖ、周波数 110ｋHzで30ｋＷの電力を入力した。プラズ
マ発生装置は、電極４本を円筒状に配置し、電極の外側
40mmの距離でフィルムを電極の外側に沿って10ｍ／分
（処理時間約25秒）の速度で移動させて処理した。EXAMPLES The present invention will be described below with reference to examples and comparative examples, but the present invention is not limited to these examples. Examples 1 to 4 (Surface treatment of film) Thickness 25 μm, length 20 cm, width 17
cm Kapton (trade name of Toray-DuPont polyimide film) silicon nitride with an average particle size of 10 μm on one side of the film for 60 seconds at a grain speed of 20 m / sec. / Min). Next, the other surface of this film was subjected to a low temperature plasma treatment. The plasma processing conditions at this time are vacuum degree 0.1 Torr,
Oxygen flow rate is 3.0 liters / minute, applied voltage is 2k
Power of 30 kW was input at V and frequency of 110 kHz. In the plasma generator, four electrodes are arranged in a cylindrical shape, and
The film was processed by moving the film along the outside of the electrode at a distance of 40 mm at a speed of 10 m / min (processing time: about 25 seconds).
【００１６】（カバーレイフィルムの作製）エポキシ樹
脂／ＮＢＲ樹脂系熱硬化性接着剤をメチルエチルケトン
に溶解させ、固形分30％の接着剤溶液とした。この接着
剤の固形分 100重量部に対して、平均粒径0.07μｍのカ
ーボンブラックを、表１に示す重量部を接着剤溶液に添
加し、これをボールミルにより十分に混合した。このよ
うにして得られた黒色顔料入り熱硬化性接着剤を、表面
処理を施した電気絶縁性フィルムの低温プラズマ処理面
に、乾燥後の接着剤層の厚みが表１に示す厚みとなるよ
う塗布し、100 ℃×10分間加熱乾燥させた。その後、接
着剤塗布面にポリエチレンコート紙（離型材）を貼り合
せてカバーレイフィルムを得た。(Preparation of Coverlay Film) An epoxy resin / NBR resin thermosetting adhesive was dissolved in methyl ethyl ketone to prepare an adhesive solution having a solid content of 30%. With respect to 100 parts by weight of the solid content of this adhesive, carbon black having an average particle diameter of 0.07 μm was added to the adhesive solution in the amount by weight shown in Table 1, and this was thoroughly mixed by a ball mill. The black pigment-containing thermosetting adhesive thus obtained was applied to the surface of the electrically insulating film which had been surface treated at low temperature so that the thickness of the adhesive layer after drying would be as shown in Table 1. It was applied and heated and dried at 100 ° C. for 10 minutes. Then, a polyethylene-coated paper (release material) was attached to the adhesive-coated surface to obtain a coverlay film.
【００１７】得られたカバーレイフィルムから離型材を
剥し、該接着剤塗布面と、厚さ35μｍの 3EC−III （三
井金属社製、電解銅箔商品名）の光沢面とを、160 ℃、
50kg／cm2 、30分間の条件で加熱圧着して、物性測定用
サンプルを得た。上記カバーレイフィルム及び物性測定
用サンプルについて物性評価を行った。その結果を表１
に併記する。なお表中の顔料含有率αの値は、ポリイミ
ドフィルムの密度 1.42g/cm3、接着剤の密度 1.40g/cm3
として、カーボンブラックの添加量から算出した。The release material was peeled off from the obtained coverlay film, and the adhesive-coated surface and the glossy surface of 35 μm of 3EC-III (manufactured by Mitsui Kinzoku Co., Ltd., electrolytic copper foil brand name) were treated at 160 ° C.
By thermocompression bonding under the conditions of 50 kg / cm 2 for 30 minutes, a sample for measuring physical properties was obtained. The physical properties of the coverlay film and the sample for measuring physical properties were evaluated. Table 1 shows the results.
It is described together. The value of the pigment content α in the table is the density of the polyimide film 1.42 g / cm 3 , the density of the adhesive 1.40 g / cm 3
Was calculated from the amount of carbon black added.
【００１８】実施例５ カーボンブラックの平均粒径を 0.1μｍとしたこと以外
は、実施例２と同じ条件で行った。物性評価の結果を表
１に併記する。Example 5 Example 5 was carried out under the same conditions as in Example 2 except that the average particle size of carbon black was set to 0.1 μm. The results of physical property evaluation are also shown in Table 1.
【００１９】実施例６ カプトン（前出、ポリイミドフィルム商品名）フィルム
をルミラー（東レ社製ＰＥＴフィルム商品名）フィルム
に変更した以外は、実施例２と同じ条件で行った。物性
評価の結果を表１に併記する。Example 6 The same conditions as in Example 2 were used, except that the Kapton film (trade name of polyimide film, mentioned above) was changed to the Lumirror film (trade name of PET film manufactured by Toray Industries, Inc.). The results of physical property evaluation are also shown in Table 1.
【００２０】比較例１ 熱硬化性接着剤に添加するカーボンブラックを加えない
以外は、実施例１と同じ条件で行った。物性評価の結果
を表１に併記する。Comparative Example 1 The same conditions as in Example 1 were used except that the carbon black added to the thermosetting adhesive was not added. The results of physical property evaluation are also shown in Table 1.
【００２１】比較例２〜３ 熱硬化性接着剤に添加するカーボンブラックの量、及び
乾燥後の厚みを表１に示す値とし、ポリイミドフィルム
にサンドマット処理を施さないこと以外は、実施例１と
同じ条件で行った。物性評価の結果を表１に併記する。Comparative Examples 2 to 3 Example 1 was repeated except that the amount of carbon black added to the thermosetting adhesive and the thickness after drying were set to the values shown in Table 1 and the polyimide film was not subjected to sand mat treatment. The same conditions were used. The results of physical property evaluation are also shown in Table 1.
【００２２】比較例４ 接着剤中のカーボンブラックの平均粒径を10μｍとし、
接着剤の厚みを30μｍから25μｍに変更したこと以外
は、実施例４と同じ条件で行った。物性評価の結果を表
１に併記する。Comparative Example 4 The average particle size of carbon black in the adhesive was set to 10 μm,
The same conditions as in Example 4 were used except that the thickness of the adhesive was changed from 30 μm to 25 μm. The results of physical property evaluation are also shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】実施例７ （フィルムの作製）Ｎ，Ｎ−ジメチルホルムアルデヒド
（ＤＭＦ） 100ｇ中に、平均粒径0.07μｍのカーボンブ
ラックを、最終的にポリイミド樹脂 100重量部に対して
表２に示す重量部になるように加え（例えば２部であれ
ば、約0.65ｇ）、ホモジナイザーに５分間かけた後、こ
れを１リットルのセパラブルフラスコに移し、ＤＭＦを
212.9 ｇ加え、攪拌してカーボンブラック分散液を調製
した。このフラスコにＤＤＥ16.012ｇを加え、分散液に
溶解させた。次に、窒素雰囲気下、攪拌しながらＰＭＤ
Ａ17.450ｇを、発熱を抑えて25℃前後に保ちながら徐々
に加えていき、添加終了後、25℃で反応させた。その後
３時間攪拌を続け、濃度10wt％の黒色ポリアミド酸溶液
を得た。得られた該溶液をガラス上にアプリケーターで
フィルム状に薄く伸ばし、オーブン中 110℃で60分乾燥
し、溶剤を部分的に除去した後、ガラスから黒色ポリア
ミド酸のフィルムを剥し、鉄枠に固定し、さらにオーブ
ン中で 200℃で60分加熱して溶媒を完全に除去し、さら
に350 ℃で60分加熱してイミド化を行い、50μｍ厚さの
黒色ポリイミドフィルムを得た。Example 7 (Production of film) In 100 g of N, N-dimethylformaldehyde (DMF), carbon black having an average particle size of 0.07 μm was finally added in a weight shown in Table 2 with respect to 100 parts by weight of a polyimide resin. (For example, if it is 2 parts, about 0.65 g), put it in a homogenizer for 5 minutes, transfer it to a 1 liter separable flask, and add DMF.
212.9 g was added and stirred to prepare a carbon black dispersion. DDE16.012g was added to this flask and it was made to melt | dissolve in a dispersion liquid. Next, PMD with stirring under a nitrogen atmosphere
17.450 g of A was gradually added while suppressing the heat generation and maintaining at around 25 ° C, and after the addition was completed, the reaction was allowed to proceed at 25 ° C. Then, stirring was continued for 3 hours to obtain a black polyamic acid solution having a concentration of 10 wt%. The obtained solution was thinly spread on glass with an applicator to form a film, dried in an oven at 110 ° C for 60 minutes to partially remove the solvent, and then the black polyamic acid film was peeled from the glass and fixed on an iron frame. Then, the solvent was completely removed by heating in an oven at 200 ° C. for 60 minutes, and further at 350 ° C. for 60 minutes to perform imidization to obtain a black polyimide film having a thickness of 50 μm.
【００２５】（フィルムの表面処理）上記黒色ポリイミ
ドフィルムを、長さ20ｃｍ、幅17ｃｍに切り取り、この
フィルムの片面に、実施例１と同じ条件でサンドマット
処理を行った。次に、このフィルムのもう一方の面につ
いて、実施例１と同じ条件で低温プラズマ処理を施し
た。(Surface Treatment of Film) The above black polyimide film was cut into a piece having a length of 20 cm and a width of 17 cm, and one surface of this film was subjected to sand mat treatment under the same conditions as in Example 1. Next, the other surface of this film was subjected to low temperature plasma treatment under the same conditions as in Example 1.
【００２６】（カバーレイフィルムの作製）エポキシ樹
脂／ＮＢＲ樹脂系熱硬化性接着剤をメチルエチルケトン
に溶解させ、固形分30％の接着剤溶液とした。この熱硬
化性接着剤を、表面処理を施した電気絶縁性フィルムの
低温プラズマ処理面に乾燥後の接着剤層の厚みが表２に
示す厚みとなるよう塗布し、100 ℃×10分間加熱乾燥さ
せた。その後、接着剤塗布面にポリエチレンコート紙を
貼り合せてカバーレイフィルムを得た。得られたカバー
レイフィルムから離型材を剥し、該接着剤塗布面と、厚
さ35μｍの 3EC−III （前出、三井金属社製電解銅箔商
品名）の光沢面とを、実施例１と同じ条件で加熱圧着し
て、物性測定用サンプルを得た。上記カバーレイフィル
ム及び物性測定用サンプルについて物性評価を行った。
その結果を表２に併記する。(Preparation of Coverlay Film) An epoxy resin / NBR resin type thermosetting adhesive was dissolved in methyl ethyl ketone to obtain an adhesive solution having a solid content of 30%. This thermosetting adhesive is applied to the surface of the electrically insulating film that has been surface-treated at low temperature plasma treatment so that the thickness of the adhesive layer after drying will be as shown in Table 2, and dried by heating at 100 ° C for 10 minutes. Let Then, a polyethylene-coated paper was attached to the adhesive-coated surface to obtain a coverlay film. The release material was peeled off from the obtained coverlay film, and the adhesive-coated surface and the glossy surface of 3 μCm-thick 3EC-III (explained above, Mitsui Kinzoku Co., Ltd. electrolytic copper foil trade name) were used as in Example 1. By thermocompression bonding under the same conditions, a sample for measuring physical properties was obtained. The physical properties of the coverlay film and the sample for measuring physical properties were evaluated.
The results are also shown in Table 2.
【００２７】実施例８ 黒色ポリイミドフィルム中のカーボンブラックを４重量
部、フィルム厚みを25μｍに変更したこと以外は、実施
例７と同様にしてカバーレイフィルムを得た。この物性
評価の結果を表２に併記する。Example 8 A coverlay film was obtained in the same manner as in Example 7, except that the carbon black in the black polyimide film was changed to 4 parts by weight and the film thickness was changed to 25 μm. The results of this physical property evaluation are also shown in Table 2.
【００２８】実施例９ 黒色ポリイミドフィルム中のカーボンブラックの平均粒
径を0.07μｍから 0.1μｍに変更したこと以外は、実施
例８と同様にしてカバーレイフィルムを得た。この物性
評価の結果を表２に併記する。Example 9 A coverlay film was obtained in the same manner as in Example 8 except that the average particle size of carbon black in the black polyimide film was changed from 0.07 μm to 0.1 μm. The results of this physical property evaluation are also shown in Table 2.
【００２９】実施例１０ 黒色ポリイミドフィルム中のカーボンブラックを２重量
部、接着剤中のカーボンブラックを２重量部、接着剤の
厚みを35μｍに変更したこと以外は、実施例１もしくは
実施例８と同様にしてカバーレイフィルムを得た。この
物性評価の結果を表２に併記する。Example 10 Example 1 or Example 8 except that the carbon black in the black polyimide film was changed to 2 parts by weight, the carbon black in the adhesive was changed to 2 parts by weight, and the thickness of the adhesive was changed to 35 μm. A coverlay film was obtained in the same manner. The results of this physical property evaluation are also shown in Table 2.
【００３０】比較例５ ポリイミドフィルム中のカーボンブラック量を２重量部
に変更したこと以外は、実施例８と同様にしてカバーレ
イフィルムを得た。この物性評価の結果を表２に併記す
る。Comparative Example 5 A coverlay film was obtained in the same manner as in Example 8 except that the amount of carbon black in the polyimide film was changed to 2 parts by weight. The results of this physical property evaluation are also shown in Table 2.
【００３１】比較例６ ポリイミドフィルム中のカーボンブラックを15重量部と
し、ポリイミドフィルムにサンドマット処理を施さなか
ったこと以外は、実施例８と同様にしてカバーレイフィ
ルムを得た。この物性評価の結果を表２に併記する。Comparative Example 6 A coverlay film was obtained in the same manner as in Example 8 except that the carbon black in the polyimide film was set to 15 parts by weight and the polyimide film was not subjected to the sand mat treatment. The results of this physical property evaluation are also shown in Table 2.
【００３２】比較例７ ポリイミドフィルム中のカーボンブラックを１重量部と
し、接着剤中のカーボンブラックを１重量部に変更した
こと以外は、実施例８と同様にしてカバーレイフィルム
を得た。この物性評価の結果を表２に併記する。Comparative Example 7 A coverlay film was obtained in the same manner as in Example 8 except that the carbon black in the polyimide film was changed to 1 part by weight and the carbon black in the adhesive was changed to 1 part by weight. The results of this physical property evaluation are also shown in Table 2.
【００３３】[0033]
【表２】 [Table 2]
【００３４】各物性の評価方法については以下に記す。 ａ）全透過度（％）：カバーレイフィルムの電気絶縁性
フィルム側から可視領域500 〜600 nmの光をフィルムに
対して垂直に当て、その際の光の全透過度について測定
した。 使用機器：デジタル濁度（曇度）計 NDH-20D 日本電色
工業社製 ｂ）鏡面光沢度（％）：ＪＩＳ Z 8741 準拠。カバーレ
イフィルムの電気絶縁性フィルム側から可視領域500 〜
600 nmの光をフィルムに対して60度方向から当て、その
際の光の反射量について測定した。 使用機器：変角光沢度計 VGS-1D 日本電色工業社製 ｃ）引き剥し強度（kg/cm ）：ＪＩＳ C 6481 準拠。加
熱圧着により得られたサンプルを10mm幅に切り取り、こ
れを90度方向に50mm／分の速度で銅箔側から引き剥し
た。 ｄ）半田耐熱性（℃）：ＪＩＳ C 6481 準拠。加熱圧着
により得られたサンプルを25mm角に切り取り、これをフ
ロー半田上に30秒間浮かべ、ふくれ、剥れ等が生じない
最高温度を測定した。 ｅ）線間絶縁抵抗（×1012Ω）：ＪＩＳ C 6471 準拠。
加熱圧着により得られたサンプルを用いて常法によりＩ
ＰＣ ＦＣ 241（線間絶縁抵抗）記載の回路を作製し、
これを20℃、60％ＲＨの雰囲気中に96時間調整した後、
常法の条件で線間絶縁抵抗を測定した。 ｆ）引張強度（kg/mm2）：ＪＩＳ C 2318 準拠。実施例
により得られたポリイミドフィルムを15mm×200mm に切
り取り、これを 200mm／分の速度で引張強度を測定し
た。The evaluation method of each physical property will be described below. a) Total transmittance (%): Light in the visible region of 500 to 600 nm was perpendicularly applied to the film from the electrically insulating film side of the coverlay film, and the total transmittance of light at that time was measured. Equipment used: Digital turbidity (cloudiness) meter NDH-20D manufactured by Nippon Denshoku Industries Co., Ltd. b) Specular gloss (%): JIS Z 8741 compliant. Visible range from the electrically insulating film side of the coverlay film 500 ~
Light of 600 nm was applied to the film from the direction of 60 degrees, and the amount of light reflection at that time was measured. Equipment used: Deflection gloss meter VGS-1D manufactured by Nippon Denshoku Industries Co., Ltd. c) Peel strength (kg / cm): JIS C 6481 compliant. A sample obtained by thermocompression bonding was cut into a width of 10 mm, which was peeled from the copper foil side at a speed of 50 mm / min in the 90 ° direction. d) Soldering heat resistance (° C): According to JIS C 6481. The sample obtained by thermocompression bonding was cut into a 25 mm square, which was floated on the flow solder for 30 seconds, and the maximum temperature at which swelling and peeling did not occur was measured. e) Insulation resistance between wires (× 10 12 Ω): JIS C 6471 compliant.
Using a sample obtained by thermocompression bonding, I
The circuit described in PC FC 241 (Insulation resistance between wires) is made,
After adjusting this in an atmosphere of 20 ° C and 60% RH for 96 hours,
The line insulation resistance was measured under the usual conditions. f) Tensile strength (kg / mm 2 ): According to JIS C 2318. The polyimide film obtained in the example was cut into a size of 15 mm × 200 mm, and the tensile strength of this was measured at a speed of 200 mm / min.
【００３５】表１、表２より、実施例１〜１０のカバー
レイフィルムは遮光性が高く、電気特性・耐熱性・引き
剥し強度も損なわれていないことがわかった。From Tables 1 and 2, it was found that the coverlay films of Examples 1 to 10 had a high light-shielding property and did not impair the electrical characteristics, heat resistance and peel strength.
【００３６】[0036]
【発明の効果】本発明によれば、遮光性の高いカバーレ
イフィルムが提供され、これにより、優れた遮光性を有
するフレキシブル印刷配線板を、作業効率の良い回路工
程で作成することができる。According to the present invention, a coverlay film having a high light-shielding property is provided, whereby a flexible printed wiring board having an excellent light-shielding property can be produced in a circuit process with good work efficiency.
Claims (4)
塗布し、これを加熱乾燥した後、離型材と貼り合せてな
るカバーレイフィルムにおいて、電気絶縁性フィルム側
からの可視領域光の全透過度Ｘが０≦Ｘ≦３％、かつ鏡
面光沢度Ｙが０＜Ｙ≦50％であることを特徴とする遮光
性カバーレイフィルム。1. A cover lay film obtained by applying a thermosetting adhesive to an electrically insulating film, heating and drying the adhesive, and then bonding the release layer to a release layer. A light-shielding coverlay film having a transmittance X of 0 ≦ X ≦ 3% and a specular gloss Y of 0 <Y ≦ 50%.
いずれかもしくは両方に平均粒径Ｚが0.01≦Ｚ≦５μｍ
の黒色顔料を含有する請求項１に記載の遮光性カバーレ
イフィルム。2. An average particle size Z of 0.01 ≦ Z ≦ 5 μm in either or both of the electrically insulating film and the thermosetting adhesive.
The light-shielding coverlay film according to claim 1, containing the black pigment.
黒色顔料を単位面積あたりの含有量αで 100≦α≦1000
μｇ/cm2含有する請求項１または２に記載の遮光性カバ
ーレイフィルム。3. The content α of the black pigment per unit area to the transparent surface of the coverlay film is 100 ≦ α ≦ 1000.
The light-shielding coverlay film according to claim 1, which contains μg / cm 2 .
剤面に、低温プラズマ処理、非接着剤面に表面粗化処理
が施されている請求項１ないし３のいずれかに記載の遮
光性カバーレイフィルム。4. The light-shielding coverlay according to claim 1, wherein at least the adhesive surface of the electrically insulating film is subjected to a low temperature plasma treatment and the non-adhesive surface is subjected to a surface roughening treatment. the film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22984196A JPH09135067A (en) | 1995-09-08 | 1996-08-30 | Shielding cover lay film |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-230844 | 1995-09-08 | ||
| JP23084495 | 1995-09-08 | ||
| JP22984196A JPH09135067A (en) | 1995-09-08 | 1996-08-30 | Shielding cover lay film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09135067A true JPH09135067A (en) | 1997-05-20 |
Family
ID=26529024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22984196A Pending JPH09135067A (en) | 1995-09-08 | 1996-08-30 | Shielding cover lay film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09135067A (en) |
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