JP6426095B2 - Flexible printed circuit board for light emitting component mounting and flexible printed circuit board mounted with light emitting component - Google Patents

Flexible printed circuit board for light emitting component mounting and flexible printed circuit board mounted with light emitting component Download PDF

Info

Publication number
JP6426095B2
JP6426095B2 JP2015534174A JP2015534174A JP6426095B2 JP 6426095 B2 JP6426095 B2 JP 6426095B2 JP 2015534174 A JP2015534174 A JP 2015534174A JP 2015534174 A JP2015534174 A JP 2015534174A JP 6426095 B2 JP6426095 B2 JP 6426095B2
Authority
JP
Japan
Prior art keywords
adhesive resin
flexible printed
light
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015534174A
Other languages
Japanese (ja)
Other versions
JPWO2015029887A1 (en
Inventor
大樹 東山
大樹 東山
猿渡　昌隆
昌隆 猿渡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOYO ALMINIUM KABUSHIKI KAISHA
Original Assignee
TOYO ALMINIUM KABUSHIKI KAISHA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOYO ALMINIUM KABUSHIKI KAISHA filed Critical TOYO ALMINIUM KABUSHIKI KAISHA
Publication of JPWO2015029887A1 publication Critical patent/JPWO2015029887A1/en
Application granted granted Critical
Publication of JP6426095B2 publication Critical patent/JP6426095B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Led Device Packages (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

本発明は、発光部品を実装するためのフレキシブルプリント基板である、発光部品実装用フレキシブルプリント基板、及び、当該フレキシブルプリント基板上に発光部品を実装した発光部品実装フレキシブルプリント基板に関する。   The present invention relates to a flexible printed circuit for mounting a light emitting component, which is a flexible printed circuit for mounting a light emitting component, and a flexible printed circuit on which a light emitting component is mounted on the flexible printed circuit.

従来、ＬＥＤ等の発光部品を用いた電子製品が製造されている。このような電子製品では、例えば、ＬＥＤを実装した回路基板が液晶ディスプレイ用途や蛍光管代替用途等に使用される面発光体として用いられており、このような面発光体に用いられる回路基板としては、銅箔と、樹脂を含浸させたガラスクロスとを熱圧着させた、ＦＲ−４やＣＥＭ−３等の硬質基板が一般的である。   BACKGROUND Conventionally, electronic products using light emitting components such as LEDs have been manufactured. In such an electronic product, for example, a circuit board on which an LED is mounted is used as a surface light emitter used for liquid crystal display applications, fluorescent tube replacement applications, etc. As a circuit substrate used for such a surface light emitter In general, a hard substrate such as FR-4 or CEM-3, in which a copper foil and a glass cloth impregnated with a resin are thermocompression bonded.

近年、ＬＥＤ実装用基板として、屈曲性を有するフレキシブルプリント基板（以下、ＦＰＣともいうことがある。）を用いた面発光体を、屈曲性に優れる特性を活かしてリボン状に形態加工した、意匠性を有するＬＥＤ照明器具等が提案されている。このようなＬＥＤ照明器具に用いるＦＰＣとして、ベースフィルムと金属層とを接着剤層によりラミネートして、接着性樹脂組成物として、エポキシ樹脂が配合されたものを用いたＦＰＣが提案されている（例えば、特許文献１参照）。   In recent years, a design in which a surface light emitter using a flexible printed circuit board having flexibility (hereinafter sometimes referred to as an FPC) as a substrate for mounting an LED is processed into a ribbon shape utilizing the excellent property of flexibility. LED lighting apparatus etc. which have flexibility are proposed. As FPC used for such an LED lighting fixture, FPC which laminates a base film and a metal layer with an adhesive bond layer, and uses an epoxy resin compounded as an adhesive resin composition is proposed. For example, refer to Patent Document 1).

しかしながら、上述のＦＰＣでは、接着剤層を形成する接着性樹脂組成物としてエポキシ樹脂が配合されたものを用いており、また、金属層（銅箔）を除去した後に残るベースフィルムと接着剤層の厚みは、厚くとも１００μｍ程度であり、ＬＥＤ等の発光部品の光線を透過するという問題がある。例えば、上述のＦＰＣの片面に、赤色の発光部品を実装した赤色発光部品実装基板と、緑色の発光部品を実装した緑色発光部品実装基板とを作製し、これらの実装基板を、それぞれの実装基板のベースフィルム同士が接するように重ね合わせて使用する際、上述のＦＰＣでは、発光部品の光線が接着剤層及びベースフィルムを透過してしまい、それぞれの発光部品からの光が互いに影響し合い、色調が黄色身を帯びて、実際の発光部品の光線の色調と異なる色調となってしまうという問題がある。   However, in the above-described FPC, as the adhesive resin composition forming the adhesive layer, one containing an epoxy resin is used, and the base film and the adhesive layer remaining after removing the metal layer (copper foil) The thickness of the light emitting element is about 100 .mu.m at most, and there is a problem of transmitting the light beam of the light emitting component such as the LED. For example, a red light emitting component mounting substrate in which a red light emitting component is mounted on one side of the above-mentioned FPC and a green light emitting component mounting substrate in which a green light emitting component is mounted are manufactured. When the base films of the above are used in contact with each other, in the above-mentioned FPC, the light beam of the light emitting component passes through the adhesive layer and the base film, and the light from each light emitting component mutually affects each other There is a problem that the color tone becomes yellowish and becomes different from the color tone of the light of the actual light emitting component.

従って、屈曲性を示すために厚みが薄くされていても、実装された発光部品の光線の透過が抑制されており、異なる色の発光部品同士の影響による光線の色調の変化が抑制された発光部品実装用フレキシブルプリント基板の開発が望まれている。   Therefore, even if the thickness is reduced to show flexibility, the transmission of the light beam of the mounted light emitting component is suppressed, and the light emission in which the change in the color tone of the light beam due to the influence of the light emitting components of different colors is suppressed. Development of a flexible printed circuit board for component mounting is desired.

特開２０１１−２４１２９４号公報JP, 2011-241294, A

本発明は、屈曲性を示すために厚みが薄くされていても、実装された発光部品の光線の透過が抑制されており、異なる色の発光部品同士の影響による光線の色調の変化が抑制された発光部品実装用フレキシブルプリント基板、及び当該発光部品実装用フレキシブルプリント基板に発光部品が実装された発光部品実装フレキシブルプリント基板を提供することを目的とする。   In the present invention, even if the thickness is reduced to show flexibility, the transmission of the light beam of the mounted light emitting component is suppressed, and the change of the light color tone due to the influence of the light emitting components of different colors is suppressed. It is an object of the present invention to provide a flexible printed circuit board for mounting a light emitting component, and a flexible printed circuit board mounted with a light emitting component in which a light emitting component is mounted on the flexible printed circuit board for mounting the light emitting component.

本発明者は上記目的を達成すべく鋭意研究を重ねた結果、絶縁性基材の少なくとも一方面上に、接着樹脂層を介して回路パターン状の金属箔が積層されている発光部品実装用フレキシブルプリント基板において、接着樹脂層が遮光性粒子を含み、且つ、接着樹脂層の波長３８０〜７５０ｎｍの光線透過率を６５％以下とすることにより、フレキシブルプリント基板のような厚みの薄い基板であっても、実装された発光部品の光線の透過が抑制され、異なる色の発光部品同士の影響による光線の色調の変化が抑制されることを見出し、本発明を完成するに至った。   As a result of intensive studies to achieve the above object, the inventor of the present invention is flexible for mounting a light emitting component in which a metal foil in the form of a circuit pattern is laminated via an adhesive resin layer on at least one surface of an insulating substrate. In a printed circuit board, the adhesive resin layer contains light shielding particles, and the light transmittance of a wavelength of 380 to 750 nm of the adhesive resin layer is 65% or less, whereby a thin substrate such as a flexible printed circuit board is obtained. Also, it has been found that the transmission of the light beam of the mounted light emitting component is suppressed and the change of the color tone of the light beam due to the influence of the light emitting components of different colors is suppressed, and the present invention has been completed.

即ち、本発明は、下記の発光部品実装用フレキシブルプリント基板、及び発光部品実装フレキシブルプリント基板に関する。
１．絶縁性基材の少なくとも一方面上に、接着樹脂層を介して回路パターン状の金属箔が積層されている発光部品実装用フレキシブルプリント基板であって、
前記接着樹脂層は、遮光性粒子を含み、且つ、波長３８０〜７５０ｎｍの光線透過率が６５％以下である、
ことを特徴とする、フレキシブルプリント基板。
２．前記遮光性粒子は、無機粒子である、上記項１に記載のフレキシブルプリント基板。
３．前記遮光性粒子は、酸化チタン、酸化マグネシウム、酸化亜鉛、酸化ケイ素、炭酸カルシウム、硫酸バリウム、タルク、酸化第二鉄、孔雀石、アルミニウム粉、銅粉、ステンレス粉からなる群より選択される少なくとも１種を含有する、上記項１又は２に記載のフレキシブルプリント基板。
４．前記接着樹脂層が、エポキシ樹脂、ポリエステル樹脂、アクリル樹脂、ウレタン樹脂、及びシリコン樹脂からなる群より選択される少なくとも１種を含有する、上記項１〜３のいずれかに記載のフレキシブルプリント基板。
５．前記遮光性粒子が酸化チタンであり、前記酸化チタンの含有量は、前記接着樹脂層１００質量％に対して６質量％以上である、上記項１〜４のいずれかに記載のフレキシブルプリント基板。
６．前記遮光性粒子がアルミニウム粉であり、前記アルミニウム粉の含有量は、前記接着樹脂層１００質量％に対して２質量％以上である、上記項１〜４のいずれかに記載のフレキシブルプリント基板。
７．前記絶縁性基材が、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリイミド、液晶ポリマー、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリパラフェニレンテレフタルアミド（ＰＰＴＡ）、フッ素樹脂、及びフッ素樹脂共重合体からなる群より選択される少なくとも１種を含有する、上記項１〜６のいずれかに記載のフレキシブルプリント基板。
８．上記項１〜７のいずれかに記載のフレキシブルプリント基板に発光部品を実装した、発光部品実装フレキシブルプリント基板。
９．発光部品実装フレキシブルプリント基板の製造方法であって、
（１）金属箔上に、遮光性粒子を含有する接着樹脂組成物を介して絶縁性基材を積層する工程１、
（２）前記接着樹脂組成物を硬化させて、波長３８０〜７５０ｎｍの光線透過率が６５％以下である接着樹脂層を形成する工程２、
（３）前記金属箔の、前記接着樹脂層が形成された面とは反対側の面にレジスト層をパターン状に印刷する工程３、及び、
（４）エッチング処理により、前記レジスト層が印刷されていない領域の前記金属箔を溶解させて回路パターンを形成する工程４
を有することを特徴とする、発光部品実装フレキシブルプリント基板の製造方法。That is, the present invention relates to the following flexible printed circuit board for mounting a light emitting component, and the flexible printed circuit board mounting a light emitting component.
1. A flexible printed circuit board for mounting a light emitting component, wherein a metal foil in the form of a circuit pattern is laminated on at least one surface of an insulating base through an adhesive resin layer,
The adhesive resin layer contains light shielding particles, and the light transmittance of a wavelength of 380 to 750 nm is 65% or less.
A flexible printed circuit board characterized by
2. The flexible printed board according to Item 1, wherein the light shielding particles are inorganic particles.
3. The light shielding particles are at least selected from the group consisting of titanium oxide, magnesium oxide, zinc oxide, silicon oxide, calcium carbonate, barium sulfate, talc, ferric oxide, malachite, aluminum powder, copper powder, stainless steel powder 3. The flexible printed board according to item 1 or 2, which contains one kind.
4. The flexible printed board according to any one of Items 1 to 3, wherein the adhesive resin layer contains at least one selected from the group consisting of an epoxy resin, a polyester resin, an acrylic resin, a urethane resin, and a silicon resin.
5. 5. The flexible printed board according to any one of Items 1 to 4, wherein the light shielding particles are titanium oxide, and the content of the titanium oxide is 6% by mass or more with respect to 100% by mass of the adhesive resin layer.
6. The flexible printed circuit board according to any one of Items 1 to 4, wherein the light shielding particles are aluminum powder, and the content of the aluminum powder is 2% by mass or more with respect to 100% by mass of the adhesive resin layer.
7. The insulating base material is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, liquid crystal polymer, polyetheretherketone (PEEK), polyparaphenylene terephthalamide (PPTA), fluorocarbon resin, and fluorocarbon resin copolymer. The flexible printed circuit board according to any one of Items 1 to 6, which contains at least one selected from the group consisting of uniting.
8. The light emitting component mounting flexible printed circuit board which mounted the light emitting component on the flexible printed circuit board in any one of said claim | item 1-7.
9. A method of manufacturing a light emitting component mounting flexible printed circuit board, comprising:
(1) Step 1 of laminating an insulating base on a metal foil via an adhesive resin composition containing light shielding particles,
(2) Step 2 of curing the adhesive resin composition to form an adhesive resin layer having a light transmittance of 65% or less at a wavelength of 380 to 750 nm;
(3) Step 3 of printing a resist layer in a pattern on the surface of the metal foil opposite to the surface on which the adhesive resin layer is formed;
(4) A step 4 of dissolving the metal foil in a region where the resist layer is not printed by etching treatment to form a circuit pattern
A method of manufacturing a light emitting component mounting flexible printed circuit board, comprising:

上記特徴を有する本発明の発光部品実装用フレキシブルプリント基板は、接着樹脂層が遮光性粒子を含み、且つ、接着樹脂層の波長３８０〜７５０ｎｍの光線透過率が６５％以下であるので、フレキシブルプリント基板のような厚みの薄い基板であっても光線の透過が抑制され、異なる色の発光部品同士の影響による光線の色調の変化を抑制することができる。   Since the adhesive resin layer contains light shielding particles and the light transmittance of the adhesive resin layer at a wavelength of 380 to 750 nm is 65% or less, the flexible printed circuit board for light emitting component mounting of the present invention having the above characteristics Even in the case of a thin substrate such as a substrate, the transmission of light is suppressed, and it is possible to suppress the change in color tone of light due to the influence of light emitting components of different colors.

更に、本発明の発光部品実装フレキシブルプリント基板は、遮光性粒子を含み、且つ、波長３８０〜７５０ｎｍの光線透過率が６５％以下である接着樹脂層を有するので、発光部品の光線の透過が抑制され、光源同士の影響による色調の変化が抑制される。   Furthermore, since the light emitting component mounting flexible printed circuit board of the present invention includes a light shielding particle and has an adhesive resin layer having a light transmittance of 65% or less at a wavelength of 380 to 750 nm, the light transmission of the light emitting component is suppressed. And the change of the color tone due to the influence of the light sources is suppressed.

本発明の発光部品実装用フレキシブルプリント基板の層構成の一例を示す断面図である。It is sectional drawing which shows an example of the laminated constitution of the flexible printed circuit board for light-emitting component mounting of this invention.

１．発光部品実装用フレキシブルプリント基板
本発明の発光部品実装用フレキシブルプリント基板（以下、単に「フレキシブルプリント基板」とも言うことがある。）は、絶縁性基材の少なくとも一方面上に、接着樹脂層を介して回路パターン状の金属箔が積層されている発光部品実装用フレキシブルプリント基板であって、上記接着樹脂層は、遮光性粒子を含み、且つ、波長３８０〜７５０ｎｍの光線透過率が６５％以下である。 1. Flexible printed circuit board for light emitting component mounting The flexible printed circuit board for light emitting component mounting of the present invention (hereinafter sometimes referred to simply as "flexible printed circuit board") has an adhesive resin layer on at least one surface of an insulating substrate. It is a flexible printed circuit board for light emitting parts mounting on which metal foil of circuit pattern shape is laminated, and the above-mentioned adhesion resin layer contains light-shielding particles, and light transmittance of wavelength 380-750 nm is 65% or less It is.

本発明のフレキシブルプリント基板は、絶縁性基材の少なくとも一方面上に、上記接着樹脂層を介して回路パターン状の金属箔が形成されていればよく、絶縁性基材の両面に、それぞれ接着樹脂層を介して回路パターン状の金属箔が形成されていてもよい。この形態においても、上記接着樹脂層が遮光性粒子を含み、且つ、波長３８０〜７５０ｎｍの光線透過率が６５％以下であるので、フレキシブルプリント基板の両面に異なる色の発光部品を実装した場合であっても、光線の透過が抑制され、異なる色の発光部品同士の影響による光線の色調の変化を抑制することが可能となる。   In the flexible printed circuit board of the present invention, a metal foil in the form of a circuit pattern may be formed on at least one surface of the insulating substrate via the adhesive resin layer, and it is adhered to both surfaces of the insulating substrate A metal foil in a circuit pattern may be formed via the resin layer. Also in this embodiment, since the adhesive resin layer contains the light shielding particles and the light transmittance at a wavelength of 380 to 750 nm is 65% or less, when light emitting components of different colors are mounted on both sides of the flexible printed board Even if it exists, the transmission of the light beam is suppressed, and it becomes possible to suppress the change of the color tone of the light beam due to the influence of light emitting components of different colors.

本発明のフレキシブルプリント基板の厚みは、２０〜２００μｍが好ましく、３５〜１５０μｍがより好ましい。厚みが厚すぎると、フレキシブルプリント基板の屈曲性が損われるおそれがあり、薄すぎると、光線の透過の抑制が十分でないおそれがある。   20-200 micrometers is preferable and, as for the thickness of the flexible printed circuit board of this invention, 35-150 micrometers is more preferable. If the thickness is too thick, the flexibility of the flexible printed circuit may be impaired. If the thickness is too thin, the transmission of light may not be sufficiently suppressed.

（絶縁性基材）
絶縁性基材としては、絶縁性を有しており、耐熱性等回路基板の基材として用いるための性能を備えていれば特に限定されないが、例えば、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリイミド、液晶ポリマー、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリパラフェニレンテレフタルアミド（ＰＰＴＡ）、フッ素樹脂、又はフッ素樹脂共重合体を含有する基材が挙げられる。絶縁性基材は、これらの樹脂を単独で含有していてもよいし、２種以上を含有していてもよい。(Insulating base material)
The insulating substrate is not particularly limited as long as it has insulating properties and is provided with the ability to be used as a substrate of a circuit board such as heat resistance, for example, polyethylene terephthalate (PET), polyethylene naphthalate ( Examples include substrates containing PEN), polyimide, liquid crystal polymer, polyetheretherketone (PEEK), polyparaphenylene terephthalamide (PPTA), fluorocarbon resin, or fluorocarbon resin copolymer. The insulating substrate may contain these resins alone, or may contain two or more of them.

これらの中でも、耐熱性に優れる点から、ポリエチレンテレフタレート、又はポリイミドを含有する絶縁性基材が好ましい。   Among these, from the point of being excellent in heat resistance, an insulating base material containing polyethylene terephthalate or polyimide is preferable.

上記絶縁性基材に用いる樹脂を適宜選択することで、本発明のフレキシブルプリント基板に、発光部品を用いた電子製品等の目的に応じて、選択的に特定の色の光線の透過を抑制することができるという特性を付与することができる。例えば、ポリイミドを含有する絶縁性基材を用いた場合、絶縁性基材が黄色味を帯びることとなる。このような黄色味を帯びた絶縁性基材は、特に青色の光線の透過を選択的に抑制し、これにより、フレキシブルプリント基板が、特に青色の光線の透過を抑制することとなる。   By appropriately selecting the resin used for the insulating substrate, transmission of light of a specific color is selectively suppressed according to the purpose of the electronic product or the like using the light emitting component in the flexible printed circuit of the present invention. Can be given the characteristic of being able to For example, when an insulating base material containing polyimide is used, the insulating base material has a yellowish color. Such a yellowish insulating substrate selectively suppresses the transmission of particularly blue light, whereby the flexible printed board suppresses the transmission of particularly blue light.

絶縁性基材の厚みは、フレキシブルプリント基板が屈曲性を示すことができる程度の厚みであることが好ましく、通常１５〜５０μｍの厚みが好ましい。   The thickness of the insulating substrate is preferably such a thickness that the flexible printed substrate can exhibit flexibility, and usually a thickness of 15 to 50 μm is preferable.

（接着樹脂層）
接着樹脂層を形成する樹脂としては、絶縁性基材と金属箔とを接着できる樹脂であればよく、例えば、エポキシ樹脂、ポリエステル樹脂、アクリル樹脂、ウレタン樹脂、シリコン樹脂、ポリイミド樹脂、塩化ビニル樹脂等が挙げられる。これらの樹脂は、単独で用いてもよいし、２種以上を混合して用いてもよい。これらの中でも、エポキシ樹脂、ポリエステル樹脂、アクリル樹脂、ウレタン樹脂、およびシリコン樹脂からなる群より選択される少なくとも１種を含有する樹脂が好ましい。(Adhesive resin layer)
The resin for forming the adhesive resin layer may be any resin as long as it can bond the insulating base material and the metal foil. For example, epoxy resin, polyester resin, acrylic resin, urethane resin, silicon resin, polyimide resin, vinyl chloride resin Etc. These resins may be used alone or in combination of two or more. Among these, a resin containing at least one selected from the group consisting of an epoxy resin, a polyester resin, an acrylic resin, a urethane resin, and a silicon resin is preferable.

接着樹脂層は、遮光性粒子を含む。遮光性粒子は、接着樹脂層に遮光性を付与し、光線透過率を抑制することができる粒子であれば限定されないが、無機粒子が好適に用いられる。   The adhesive resin layer contains light shielding particles. The light shielding particles are not limited as long as they can impart light shielding to the adhesive resin layer and can suppress light transmittance, but inorganic particles are preferably used.

遮光性粒子としては、具体的には、例えば、酸化チタン、酸化マグネシウム、酸化亜鉛、酸化ケイ素、炭酸カルシウム、硫酸バリウム、タルク、酸化第二鉄、孔雀石、アルミニウム粉、銅粉、ステンレス粉が挙げられる。中でも、遮光性に特に優れる点で、酸化チタン、アルミニウム粉が好ましい。接着樹脂層は、これらの遮光性粒子を単独で含有していてもよいし、２種以上を含有していてもよい。   Specific examples of the light shielding particles include, for example, titanium oxide, magnesium oxide, zinc oxide, silicon oxide, calcium carbonate, barium sulfate, talc, ferric oxide, malachite, aluminum powder, copper powder and stainless steel powder. It can be mentioned. Among them, titanium oxide and aluminum powder are preferable in that they are particularly excellent in the light shielding property. The adhesive resin layer may contain these light shielding particles alone, or may contain two or more kinds.

遮光性粒子として酸化チタンを用いる場合、酸化チタンの含有量は、接着樹脂層１００質量％に対して６質量％以上が好ましい。含有量が少ないと、遮光性が十分でないおそれがある。また、酸化チタンの含有量は、接着樹脂層１００質量％に対して８０質量％以下が好ましく、５０質量％以下がより好ましい。含有量が多すぎると、接着樹脂層を形成するための接着樹脂組成物が凝集し難くなり、接着樹脂層が接着性に劣るおそれがある。   When titanium oxide is used as the light shielding particles, the content of titanium oxide is preferably 6% by mass or more with respect to 100% by mass of the adhesive resin layer. When the content is small, the light shielding property may not be sufficient. Moreover, 80 mass% or less is preferable with respect to 100 mass% of adhesive resin layers, and, as for content of a titanium oxide, 50 mass% or less is more preferable. When the content is too large, the adhesive resin composition for forming the adhesive resin layer becomes difficult to coagulate, and the adhesive resin layer may be inferior in adhesiveness.

遮光性粒子としてアルミニウム粉を用いる場合、アルミニウム粉の含有量は、接着樹脂層１００質量％に対して２質量％以上が好ましい。含有量が少ないと、遮光性が十分でないおそれがある。また、アルミニウム粉の含有量は、接着樹脂層１００質量％に対して８０質量％以下が好ましく、５０質量％以下がより好ましい。含有量が多すぎると、接着樹脂層を形成するための接着樹脂組成物が凝集し難くなり、接着樹脂層が接着性に劣るおそれがある。   When aluminum powder is used as the light shielding particles, the content of the aluminum powder is preferably 2% by mass or more based on 100% by mass of the adhesive resin layer. When the content is small, the light shielding property may not be sufficient. Moreover, 80 mass% or less is preferable with respect to 100 mass% of adhesive resin layers, and, as for content of aluminum powder, 50 mass% or less is more preferable. When the content is too large, the adhesive resin composition for forming the adhesive resin layer becomes difficult to coagulate, and the adhesive resin layer may be inferior in adhesiveness.

遮光性粒子としては、また、酸化第二鉄、又は孔雀石を用いることも好ましい。遮光性粒子として、酸化第二鉄を用いると、接着樹脂層が赤色以外の光線の透過を特に抑制するようになる。また、孔雀石を用いると、接着樹脂層が緑色以外の光線の透過を特に抑制するようになる。このように、遮光性粒子を適宜選択することにより、発光部品を用いた電子製品等の目的に応じて、選択的に特定の色以外の光線の透過を抑制することができる。   It is also preferable to use ferric oxide or malachite as the light shielding particles. When ferric oxide is used as the light shielding particles, the adhesive resin layer particularly suppresses transmission of light other than red. In addition, when the malachite is used, the adhesive resin layer particularly suppresses the transmission of light beams other than green. As described above, by appropriately selecting the light shielding particles, it is possible to selectively suppress the transmission of light beams other than the specific color according to the purpose of the electronic product or the like using the light emitting component.

上記遮光性粒子の平均粒子径は、０．１〜１５．０μｍが好ましく、０．２〜１０．０μｍがより好ましい。なお、本明細書において、遮光性粒子の平均粒子径は、レーザー回折法により測定される値である。   The average particle diameter of the light shielding particles is preferably 0.1 to 15.0 μm, and more preferably 0.2 to 10.0 μm. In the present specification, the average particle size of the light shielding particles is a value measured by a laser diffraction method.

遮光性粒子の形状は限定されず、鱗片状、球状、針状等の形状であってもよいが、鱗片状の遮光性粒子を用いることが好ましい。鱗片状の遮光性粒子を用いることで、より高い遮光性を発揮することができる。   The shape of the light shielding particles is not limited, and may be scaly, spherical, needle-like or the like, but it is preferable to use scaly light shielding particles. By using scale-like light shielding particles, higher light shielding properties can be exhibited.

遮光性粒子は、表面が樹脂で被覆されている状態であることが好ましい。特に、導電性を有する遮光性粒子を用いた場合、これを含有する接着樹脂層の絶縁性が低下することによりフレキシブルプリント基板の絶縁性も低下するおそれがある。遮光性粒子が樹脂で被覆されていることにより、このような接着樹脂層の絶縁性の低下を抑制することができる。   It is preferable that the light shielding particles be in a state in which the surface is covered with a resin. In particular, when light shielding particles having conductivity are used, the insulating properties of the adhesive resin layer containing the same may be lowered, and the insulating properties of the flexible printed circuit may also be lowered. By covering the light shielding particles with a resin, it is possible to suppress such a decrease in the insulating property of the adhesive resin layer.

接着樹脂層は、波長３８０〜７５０ｎｍの光線透過率が６５％以下である。接着樹脂層が、上記遮光性粒子を含有しており、接着樹脂層の、波長３８０〜７５０ｎｍの光線透過率を６５％以下とすることにより、フレキシブルプリント基板の光線の透過が抑制され、異なる色の発光部品同士の影響による光線の色調の変化を抑制することがきる。上記光線透過率は、６０％以下が好ましい。また、上記光線透過率の下限は特に限定されず、０％であってもよい。   The adhesive resin layer has a light transmittance of 65% or less at a wavelength of 380 to 750 nm. The adhesive resin layer contains the light-shielding particles, and by setting the light transmittance of the adhesive resin layer at a wavelength of 380 to 750 nm to 65% or less, transmission of light of the flexible printed circuit is suppressed, and different colors It is possible to suppress the change of the color tone of the light beam due to the influence of the light emitting components of The light transmittance is preferably 60% or less. The lower limit of the light transmittance is not particularly limited, and may be 0%.

上記光線透過率は、紫外可視近赤外分光光度計（製品名「ＪＡＳＣＯ Ｖ５７０型」日本分光社製）を用いて全光線の透過率を測定し、３８０〜７５０ｎｍの範囲の波長５ｎｍごとの透過率の値を平均することにより求めることができる。なお上記光度計の仕様は、ホルダー形式：積分球式、測定サイズ：長さ８ｍｍ×幅９ｍｍ、積分球内径：６０ｍｍ、積分球内壁塗布剤：硫酸バリウムとした。   The light transmittance is measured by using a UV-visible near-infrared spectrophotometer (product name "JASCO V 570" manufactured by Nippon Bunko Co., Ltd.) to measure the transmittance of total light, It can be determined by averaging the values of rates. The specifications of the photometer are holder type: integrating sphere type, measurement size: length 8 mm × width 9 mm, integrating sphere inner diameter: 60 mm, integrating sphere inner wall coating agent: barium sulfate.

接着樹脂層の厚みは限定されないが、５〜５０μｍ程度が好ましく、１０〜２５μｍ程度がより好ましい。上記厚みが薄過ぎると、絶縁性基材の種類によっては十分な層間密着性を示さないおそれがあり、厚過ぎると金属箔側から絶縁性基材側への熱伝導性が低下し、回路基板の放熱性が劣るおそれがある。   The thickness of the adhesive resin layer is not limited, but is preferably about 5 to 50 μm, and more preferably about 10 to 25 μm. If the thickness is too thin, depending on the type of the insulating substrate, sufficient interlayer adhesion may not be exhibited. If the thickness is too thick, the thermal conductivity from the metal foil side to the insulating substrate side decreases, and the circuit board The heat dissipation of the

（金属箔）
金属箔を形成する金属としては、金属回路に用いることができる金属であればよく、例えば、アルミニウム、銅、銀が挙げられる。本発明において、上記金属箔は、回路パターン状の金属箔である。上記金属箔は、エッチング等により回路パターン状に形成することができ、アルミニウム回路、銅回路等とすることができる。(Metal foil)
The metal for forming the metal foil may be any metal that can be used for the metal circuit, and examples thereof include aluminum, copper and silver. In the present invention, the metal foil is a circuit pattern metal foil. The metal foil can be formed in a circuit pattern by etching or the like, and can be an aluminum circuit, a copper circuit, or the like.

上記回路パターンは、例えば、アルミニウム箔、銅箔等をフォトリソグラフィー法、エッチングレジスト法等の公知のパターン形成方法で加工することにより形成することができる。上記アルミニウム箔は、純アルミニウム箔に限定されず、アルミニウム合金箔も含む。具体的には、アルミニウム箔としては、例えば、ＪＩＳ（ＡＡ）の記号で１０３０、１Ｎ３０、１０５０、１１００、８０２１、８０７９等の純アルミニウム箔又はアルミニウム合金箔を採用することができる。   The circuit pattern can be formed, for example, by processing an aluminum foil, a copper foil or the like by a known pattern forming method such as a photolithography method or an etching resist method. The aluminum foil is not limited to pure aluminum foil, but also includes aluminum alloy foil. Specifically, as the aluminum foil, for example, a pure aluminum foil or an aluminum alloy foil such as 1030, 1N30, 1050, 1100, 8021, 8079 or the like can be adopted as a symbol of JIS (AA).

銅箔は、純銅箔に限定されるものではなく、銅合金箔も含む。具体的には、銅箔としては、例えば、ＪＩＳ（ＡＡ）の記号でＣ１１００、Ｃ２６００、Ｃ７０２５等の純銅箔又は銅合金箔を採用することができる。   The copper foil is not limited to pure copper foil, but also includes copper alloy foil. Specifically, as the copper foil, for example, a pure copper foil or a copper alloy foil such as C1100, C2600, C7025 or the like by a symbol of JIS (AA) can be adopted.

上記回路パターン状の金属箔は、金属箔を接着樹脂層上に積層し、次いで公知のパターン形成方法により回路パターン状に加工することにより、接着樹脂層上に形成することができる。   The metal foil in the form of a circuit pattern can be formed on the adhesive resin layer by laminating a metal foil on the adhesive resin layer and then processing into a circuit pattern by a known pattern forming method.

金属箔の厚みは限定的ではないが、５〜１００μｍ程度が好ましく、１２〜７０μｍ程度がより好ましい。   The thickness of the metal foil is not limited, but is preferably about 5 to 100 μm, and more preferably about 12 to 70 μm.

本発明の発光部品実装用フレキシブルプリント基板を製造する製造方法としては、例えば、絶縁性基材上に、遮光性粒子を含有する接着樹脂組成物を塗布して硬化させ、接着樹脂層を形成する工程、当該接着樹脂層上に金属箔を積層する工程、及び金属箔にエッチングを施すことにより回路パターン状とする工程を含む製造方法が挙げられる。   As a manufacturing method for manufacturing the flexible printed circuit board for light emitting component mounting of the present invention, for example, an adhesive resin composition containing light shielding particles is coated and cured on an insulating substrate to form an adhesive resin layer. A manufacturing method including a process, a process of laminating a metal foil on the adhesive resin layer, and a process of forming a circuit pattern by etching the metal foil may be mentioned.

本発明の発光部品実装用フレキシブルプリント基板を製造する製造方法としては、また、（１）金属箔上に、遮光性粒子を含有する接着樹脂組成物を介して絶縁性基材を積層する工程１、（２）上記接着樹脂組成物を硬化させて、波長３８０〜７５０ｎｍの光線透過率が６５％以下である接着樹脂層を形成する工程２、（３）上記金属箔の、上記接着樹脂層が形成された面とは反対側の面にレジスト層をパターン状に印刷する工程３、及び、（４）エッチング処理により、上記レジスト層が印刷されていない領域の上記金属箔を溶解させて回路パターンを形成する工程４を有する製造方法が挙げられる。   As a manufacturing method of manufacturing the flexible printed circuit board for light-emitting component mounting of the present invention, (1) a step of laminating an insulating substrate on a metal foil via an adhesive resin composition containing light-shielding particles (2) Step 2 of curing the adhesive resin composition to form an adhesive resin layer having a light transmittance of 65% or less at a wavelength of 380 to 750 nm, (3) the adhesive resin layer of the metal foil Step 3 of printing a resist layer in a pattern on the surface opposite to the formed surface; and (4) etching the metal foil in the area where the resist layer is not printed by the etching process to form a circuit pattern And a manufacturing method having a step 4 of forming

２．発光部品実装回路基板
本発明の発光部品実装用フレキシブルプリント基板は、回路パターン状の金属箔に発光部品を実装することにより、発光部品実装フレキシブルプリント基板となる。 2. Light-emitting component mounting circuit board The light-emitting component mounting flexible printed circuit board of the present invention becomes a light-emitting component mounting flexible printed circuit board by mounting the light-emitting component on the circuit pattern metal foil.

発光部品としては、例えば、ＬＥＤチップ、レーザーダイオード、有機ＥＬ等の発光素子及びこれらのアレイ素子等が挙げられる。   As a light emitting component, light emitting elements, such as a LED chip, a laser diode, organic EL, and these array elements etc. are mentioned, for example.

以下に実施例及び比較例を示して本発明を具体的に説明する。但し、本発明は実施例に限定されない。   Hereinafter, the present invention will be specifically described by showing Examples and Comparative Examples. However, the present invention is not limited to the examples.

（実施例１）
３５μｍの厚みの電解銅箔と、３８μｍの厚みのポリエチレンテレフタレートフィルムとを、接着樹脂組成物を用いて貼り合わせ、積層体を作製した。接着樹脂組成物は、ウレタン樹脂系接着剤（ＤＩＣ株式会社製 商品名：ＬＸ５００を１００重量部、及びＤＩＣ株式会社製 商品名ＫＷ７５を１０重量部採取して混合し、酢酸エチルで希釈して調製したもの）に、平均粒子径０．２４μｍの酸化チタンを添加して調製した。Example 1
An electrolytic copper foil having a thickness of 35 μm and a polyethylene terephthalate film having a thickness of 38 μm were bonded together using an adhesive resin composition to produce a laminate. The adhesive resin composition is prepared by collecting 100 parts by weight of a urethane resin adhesive (trade name: LX500 manufactured by DIC Corporation) and 10 parts by weight of trade name KW 75 manufactured by DIC Corporation and diluting with ethyl acetate. ) Was prepared by adding titanium oxide having an average particle size of 0.24 μm.

作製された積層体を、６０℃で５日間養生することにより接着樹脂組成物を加熱硬化させて接着樹脂層とした。接着樹脂層の厚みは１５μｍであり、接着樹脂層中の酸化チタンの含有量は、接着樹脂層１００質量％に対して３０質量％であった。また、接着樹脂層の波長３８０〜７５０ｎｍの光線透過率は、４２．２％であった。なお、接着樹脂層の光線透過率は、上記接着樹脂層と同一の接着樹脂層を別途単層で調製して光線透過率測定用接着樹脂層を作製し、紫外可視近赤外分光光度計（製品名「ＪＡＳＣＯ Ｖ５７０型」日本分光社製）を用いて当該光線透過率測定用接着樹脂層の全光線の透過率を測定し、３８０〜７５０ｎｍの範囲の波長５ｎｍごとの光線透過率の値を平均することにより求めた。なお上記光度計の仕様は、ホルダー形式：積分球式、測定サイズ：長さ８ｍｍ×幅９ｍｍ、積分球内径：６０ｍｍ、積分球内壁塗布剤：硫酸バリウムとした。   The produced laminated body was cured at 60 ° C. for 5 days to heat and cure the adhesive resin composition to form an adhesive resin layer. The thickness of the adhesive resin layer was 15 μm, and the content of titanium oxide in the adhesive resin layer was 30% by mass with respect to 100% by mass of the adhesive resin layer. Moreover, the light transmittance of wavelength 380-750 nm of an adhesive resin layer was 42.2%. The light transmittance of the adhesive resin layer is prepared by preparing an adhesive resin layer identical to the adhesive resin layer separately as a single layer to produce an adhesive resin layer for measuring light transmittance, and then using an ultraviolet visible near infrared spectrophotometer ( The total light transmittance of the adhesive resin layer for light transmittance measurement is measured using a product name “JASCO V 570 type” manufactured by Nippon Bunko Co., Ltd., and the light transmittance of each wavelength 5 nm in the range of 380 to 750 nm is It calculated by averaging. The specifications of the photometer are holder type: integrating sphere type, measurement size: length 8 mm × width 9 mm, integrating sphere inner diameter: 60 mm, integrating sphere inner wall coating agent: barium sulfate.

電解銅箔の表面に、グラビア印刷によりエッチングレジストを印刷し、４２ボーメの塩化第２鉄でエッチングして回路パターンを形成し、フレキシブルプリント基板を作製した。   An etching resist was printed by gravure printing on the surface of the electrolytic copper foil, and etching was performed using 42-bm ferric chloride to form a circuit pattern, whereby a flexible printed substrate was produced.

フレキシブルプリント基板上に、緑色ＬＥＤパッケージ（ローム株式会社製ＳＭＬ−Ｅ１２Ｐ８Ｗ）を半田で実装して、発光部品実装フレキシブルプリント基板を作製した。また、別途作製したフレキシブルプリント基板上に、赤色ＬＥＤパッケージ（ローム株式会社製ＳＭＬ−Ｅ１２Ｕ８Ｗ）を半田で実装して、発光部品実装フレキシブルプリント基板を作製した。   A green LED package (SML-E12P8W manufactured by ROHM Co., Ltd.) was mounted on a flexible printed circuit board by soldering to produce a light emitting component mounted flexible printed circuit board. In addition, a red LED package (SML-E12U8W manufactured by ROHM Co., Ltd.) was mounted on a separately prepared flexible printed circuit by soldering to fabricate a light emitting component mounted flexible printed circuit.

上述のようにして作製された、緑色ＬＥＤパッケージが実装された発光部品実装フレキシブルプリント基板と、赤色ＬＥＤパッケージが実装された発光部品実装フレキシブルプリント基板とを、絶縁性基材同士が接するように重ねて固定した。定格電圧を印加してＬＥＤパッケージを発光させて、出力された光線の色調を目視により観察し、以下の評価基準に従って評価した。
Ａ：出力された光線の色調が、単独で発光させた際の色調と同じである。
Ｂ：出力された光線の色調が、裏面から透過した光線の影響を受けて変化している。The light emitting component mounting flexible printed circuit board on which the green LED package is mounted and the light emitting component mounting flexible printed circuit board on which the red LED package is mounted are stacked such that the insulating substrates are in contact with each other. Fixed. The rated voltage was applied to make the LED package emit light, and the color tone of the outputted light was visually observed and evaluated according to the following evaluation criteria.
A: The color tone of the output light is the same as the color tone when light is emitted alone.
B: The color tone of the output light is changed under the influence of the light transmitted from the back surface.

（実施例２）
接着樹脂層中の酸化チタンの含有量を１５質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Example 2)
The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1 except that the content of titanium oxide in the adhesive resin layer was 15% by mass, and the color tone of light was evaluated.

（実施例３）
接着樹脂層中の酸化チタンの含有量を１０質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Example 3)
The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1 except that the content of titanium oxide in the adhesive resin layer was 10% by mass, and the color tone of light was evaluated.

（実施例４）
接着樹脂層中の酸化チタンの含有量を７質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Example 4)
The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1 except that the content of titanium oxide in the adhesive resin layer was 7% by mass, and the color tone of light was evaluated.

（実施例５）
酸化チタンに代えて、平均粒子径１０μｍの鱗片状のアルミニウム粉を用い、 接着樹脂層中の鱗片状のアルミニウム粉の含有量を２０質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Example 5)
An adhesive resin is used in the same manner as in Example 1 except that titanium oxide is used and scaly aluminum powder having an average particle diameter of 10 μm is used, and the content of scaly aluminum powder in the adhesive resin layer is 20 mass%. The light transmittance of the layer was measured to evaluate the color tone of the light.

（実施例６）
酸化チタンに代えて、平均粒子径１０μｍの鱗片状のアルミニウム粉を用い、 接着樹脂層中の鱗片状のアルミニウム粉の含有量を５質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Example 6)
An adhesive resin is used in the same manner as in Example 1 except that titanium oxide is used and scaly aluminum powder having an average particle diameter of 10 μm is used, and the content of scaly aluminum powder in the adhesive resin layer is 5 mass%. The light transmittance of the layer was measured to evaluate the color tone of the light.

（実施例７）
酸化チタンに代えて、平均粒子径１０μｍの鱗片状のアルミニウム粉を用い、 接着樹脂層中の鱗片状のアルミニウム粉の含有量を３質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Example 7)
An adhesive resin is used in the same manner as in Example 1 except that a scale-like aluminum powder having an average particle diameter of 10 μm is used instead of titanium oxide and the content of the scale-like aluminum powder in the adhesive resin layer is 3 mass%. The light transmittance of the layer was measured to evaluate the color tone of the light.

（比較例１）
接着樹脂層が酸化チタンを含有しない以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Comparative example 1)
The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1 except that the adhesive resin layer did not contain titanium oxide, and the color tone of light was evaluated.

（比較例２）
接着樹脂層中の酸化チタンの含有量を５質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Comparative example 2)
The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1 except that the content of titanium oxide in the adhesive resin layer was changed to 5% by mass, and the color tone of light was evaluated.

（比較例３）
酸化チタンに代えて、平均粒子径１０μｍの鱗片状のアルミニウム粉を用い、 接着樹脂層中の鱗片状のアルミニウム粉の含有量を１質量％とした以外は実施例１と同様にして、接着樹脂層の光線透過率を測定し、光線の色調を評価した。(Comparative example 3)
An adhesive resin is used in the same manner as in Example 1 except that titanium oxide is used and scaly aluminum powder having an average particle diameter of 10 μm is used, and the content of scaly aluminum powder in the adhesive resin layer is 1 mass%. The light transmittance of the layer was measured to evaluate the color tone of the light.

結果を表１に示す。   The results are shown in Table 1.

Figure 0006426095
Figure 0006426095

表１の結果から明らかな通り、絶縁性基材の少なくとも一方面上に、接着樹脂層を介して回路パターン状の金属箔が積層され、接着樹脂層が遮光性粒子を含み、且つ、接着樹脂層の波長３８０〜７５０ｎｍの光線透過率が６５％以下である実施例１〜７のフレキシブルプリント基板は、接着樹脂層が遮光性粒子を含んでおり、接着樹脂層の上記光線透過率が６５％以下に調整されているので、厚みの薄いフレキシブルプリント基板においても発光部品であるＬＥＤの光線の透過が抑制されており、緑色ＬＥＤと、赤色ＬＥＤとの異なる色の発光部品同士の影響による光線の色調の変化が抑制されていた。   As is clear from the results in Table 1, a metal foil in the form of a circuit pattern is laminated on at least one surface of the insulating substrate via the adhesive resin layer, the adhesive resin layer contains light shielding particles, and the adhesive resin The adhesive resin layer contains light-shielding particles, and the light transmittance of the adhesive resin layer is 65%. Since the adjustment is made as follows, the transmission of the light beam of the LED which is the light emitting component is suppressed even in the thin flexible printed circuit board, and the light rays of the light beams due to the influence of the light emitting components of different colors of the green LED and the red LED The change in color tone was suppressed.

これに対して、比較例１のフレキシブルプリント基板は、接着樹脂層が遮光性粒子を含有しておらず、接着樹脂層の光線透過率が８７．６％と高い値を示すので、発光部品であるＬＥＤの光線の透過の抑制が十分でなく、緑色ＬＥＤと、赤色ＬＥＤとの異なる色の発光部品同士の影響により、光線の色調が変化してしまった。   On the other hand, in the flexible printed circuit board of Comparative Example 1, since the adhesive resin layer does not contain the light shielding particles and the light transmittance of the adhesive resin layer exhibits a high value of 87.6%, The suppression of the light transmission of a certain LED is not sufficient, and the color tone of the light has changed due to the influence of light emitting components of different colors from the green LED and the red LED.

比較例２及び３のフレキシブルプリント基板は、接着樹脂層が遮光性粒子を含有しているものの、接着樹脂層の光線透過率が６５％を超えているので、発光部品であるＬＥＤの光線の透過の抑制が十分でなく、緑色ＬＥＤと、赤色ＬＥＤとの異なる色の発光部品同士の影響により、光線の色調が変化してしまった。   In the flexible printed circuit boards of Comparative Examples 2 and 3, although the adhesive resin layer contains the light shielding particles, the light transmittance of the adhesive resin layer exceeds 65%, so the light transmission of the LED which is a light emitting component The color tone of the light beam has changed due to the influence of light emitting components of different colors from the green LED and the red LED.

１…発光部品実装用フレキシブルプリント基板、２…絶縁性基材、３…接着樹脂層、４…回路パターン状の金属箔   DESCRIPTION OF SYMBOLS 1 ... Flexible printed circuit board for light emission component mounting, 2 ... Insulating base material, 3 ... Adhesive resin layer, 4 ... Circuit pattern metal foil

Claims (5)

絶縁性基材の少なくとも一方面上に、接着樹脂層を介して回路パターン状の金属箔が積層されている発光部品実装用フレキシブルプリント基板であって、
前記接着樹脂層は、遮光性粒子を含み、且つ、波長３８０〜７５０ｎｍの光線透過率が６５％以下であり、
前記遮光性粒子は、酸化チタン及び／又はアルミニウム粉であり、
前記遮光性粒子の含有量は、前記接着樹脂層１００質量％に対して２０質量％以上である、
ことを特徴とするフレキシブルプリント基板。 A flexible printed circuit board for mounting a light emitting component, wherein a metal foil in the form of a circuit pattern is laminated on at least one surface of an insulating base through an adhesive resin layer,
The adhesive resin layer contains a light-shielding particles, and state, and are light transmittance of 65% or less of the wavelength of 380 nm to 750 nm,
The light shielding particles are titanium oxide and / or aluminum powder,
The content of the light shielding particles is 20% by mass or more with respect to 100% by mass of the adhesive resin layer.
Flexible printed circuit board characterized by 前記接着樹脂層が、エポキシ樹脂、ポリエステル樹脂、アクリル樹脂、ウレタン樹脂、及びシリコン樹脂からなる群より選択される少なくとも１種を含有する、請求項１に記載のフレキシブルプリント基板。 The flexible printed circuit board according to claim 1, wherein the adhesive resin layer contains at least one selected from the group consisting of an epoxy resin, a polyester resin, an acrylic resin, a urethane resin, and a silicon resin. 前記絶縁性基材が、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリイミド、液晶ポリマー、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリパラフェニレンテレフタルアミド（ＰＰＴＡ）、フッ素樹脂、及びフッ素樹脂共重合体からなる群より選択される少なくとも１種を含有する、請求項１又は２に記載のフレキシブルプリント基板。 The insulating base material is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, liquid crystal polymer, polyetheretherketone (PEEK), polyparaphenylene terephthalamide (PPTA), fluorocarbon resin, and fluorocarbon resin copolymer. containing at least one selected from the group consisting of coalescence, a flexible printed circuit board according to claim 1 or 2. 請求項１〜３のいずれかに記載のフレキシブルプリント基板に発光部品を実装した、発光部品実装フレキシブルプリント基板。 A light emitting component mounted flexible printed circuit board, wherein the light emitting component is mounted on the flexible printed circuit board according to any one of claims 1 to 3 . 発光部品実装フレキシブルプリント基板の製造方法であって、
（１）金属箔上に、遮光性粒子を含有する接着樹脂組成物を介して絶縁性基材を積層する工程１、
（２）前記接着樹脂組成物を硬化させて、波長３８０〜７５０ｎｍの光線透過率が６５％以下である接着樹脂層を形成する工程２、
（３）前記金属箔の、前記接着樹脂層が形成された面とは反対側の面にレジスト層をパターン状に印刷する工程３、及び、
（４）エッチング処理により、前記レジスト層が印刷されていない領域の前記金属箔を溶解させて回路パターンを形成する工程４
を有し、
前記遮光性粒子は、酸化チタン及び／又はアルミニウム粉であり、
前記遮光性粒子の含有量は、前記接着樹脂層１００質量％に対して２０質量％以上である、
ことを特徴とする、発光部品実装フレキシブルプリント基板の製造方法。

A method of manufacturing a light emitting component mounting flexible printed circuit board, comprising:
(1) Step 1 of laminating an insulating base on a metal foil via an adhesive resin composition containing light shielding particles,
(2) Step 2 of curing the adhesive resin composition to form an adhesive resin layer having a light transmittance of 65% or less at a wavelength of 380 to 750 nm;
(3) Step 3 of printing a resist layer in a pattern on the surface of the metal foil opposite to the surface on which the adhesive resin layer is formed;
(4) A step 4 of dissolving the metal foil in a region where the resist layer is not printed by etching treatment to form a circuit pattern
I have a,
The light shielding particles are titanium oxide and / or aluminum powder,
The content of the light shielding particles is 20% by mass or more with respect to 100% by mass of the adhesive resin layer.
A manufacturing method of a light emitting component mounting flexible printed circuit board characterized in that.

JP2015534174A 2013-08-29 2014-08-22 Flexible printed circuit board for light emitting component mounting and flexible printed circuit board mounted with light emitting component Active JP6426095B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013178509 2013-08-29
JP2013178509 2013-08-29
PCT/JP2014/071953 WO2015029887A1 (en) 2013-08-29 2014-08-22 Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component

Publications (2)

Publication Number Publication Date
JPWO2015029887A1 JPWO2015029887A1 (en) 2017-03-02
JP6426095B2 true JP6426095B2 (en) 2018-11-21

Family

ID=52586446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015534174A Active JP6426095B2 (en) 2013-08-29 2014-08-22 Flexible printed circuit board for light emitting component mounting and flexible printed circuit board mounted with light emitting component

Country Status (5)

Country Link
JP (1) JP6426095B2 (en)
KR (1) KR102175092B1 (en)
CN (1) CN105453706A (en)
TW (1) TWI633629B (en)
WO (1) WO2015029887A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115425388A (en) * 2020-04-08 2022-12-02 群创光电股份有限公司 Electromagnetic wave emission structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63303389A (en) * 1987-06-03 1988-12-09 富士通株式会社 Flexible led display device
JPH0250826A (en) * 1988-08-12 1990-02-20 Sony Chem Corp Flexible printed-wiring board
JPH09135067A (en) * 1995-09-08 1997-05-20 Shin Etsu Chem Co Ltd Shielding cover lay film
JP2002221801A (en) * 2001-01-29 2002-08-09 Hitachi Ltd Method of manufacturing wiring board
JP2003133704A (en) * 2001-10-26 2003-05-09 Ube Ind Ltd Circuit board and bonding sheet for coverlay
KR20040085622A (en) * 2003-04-01 2004-10-08 주식회사 코오롱 Reflection film for back-light unit of LCD
JP5761837B2 (en) * 2003-10-17 2015-08-12 宇部興産株式会社 Method for producing resin composition using pulverized waste plastic material
US7118801B2 (en) * 2003-11-10 2006-10-10 Gore Enterprise Holdings, Inc. Aerogel/PTFE composite insulating material
JP4265529B2 (en) * 2004-11-29 2009-05-20 パナソニック電工株式会社 Printed wiring board material, printed wiring board, and printed wiring board manufacturing method
CN101241205B (en) * 2007-02-07 2010-07-21 毅嘉科技股份有限公司 Light guide board light-guiding method and key structure using the light guide board
JP2010256717A (en) * 2009-04-27 2010-11-11 Asahi Kasei E-Materials Corp Novel photopolymerizable resin laminate, and electromagnetic wave shield and transparent conductive substrate using the same
JP5491276B2 (en) 2010-05-18 2014-05-14 株式会社フジクラ Adhesive resin composition, coverlay, adhesive film, metal-clad laminate and flexible printed wiring board
US9201176B2 (en) * 2010-05-20 2015-12-01 Toyobo Co., Ltd. Light-shielding film
JP2012043833A (en) * 2010-08-12 2012-03-01 Arisawa Mfg Co Ltd Light-blocking coverlay film and resin composition

Also Published As

Publication number Publication date
JPWO2015029887A1 (en) 2017-03-02
TW201519376A (en) 2015-05-16
CN105453706A (en) 2016-03-30
KR20160048813A (en) 2016-05-04
WO2015029887A1 (en) 2015-03-05
KR102175092B1 (en) 2020-11-05
TWI633629B (en) 2018-08-21

Similar Documents

Publication Publication Date Title
EP1887031B1 (en) White prepreg, white laminated plate, and metal foil clad white laminated plate
JP5475625B2 (en) LED mounting board
WO2012046591A1 (en) White reflective flexible printed circuit board
TWI526301B (en) A metal foil laminate, an LED mounting substrate, and a light source device
KR102432750B1 (en) electromagnetic shielding film
JP2014003260A (en) Printed wiring board, printed wiring board assembly, manufacturing method of printed wiring board, and lighting device
JP2014146685A (en) Led mounting substrate
JP2011241279A (en) Epoxy resin composition and prepreg, laminated board, and wiring board
JP2009302110A (en) Cover ray film
KR20140059080A (en) Manufacturing for metal printed circuit board
JP6426095B2 (en) Flexible printed circuit board for light emitting component mounting and flexible printed circuit board mounted with light emitting component
JP2014179410A (en) Circuit board for mounting light-emitting component, and light-emitting component mounted circuit board
JP2017532586A (en) Reflective sheet and manufacturing method thereof
JP6634668B2 (en) Manufacturing method of mounting board and mounting board
JP2021082639A (en) Flexible printed circuit board and manufacturing method of flexible printed circuit board
KR101668273B1 (en) Led interior walls for improving lamp efficiency and method for manufacturing the same
TW202100345A (en) Double-layer cover film with high reflection performance
CN112236618B (en) Vehicle lamp and method for manufacturing same
JP2013045788A (en) Mounting substrate for light emitting element
WO2024070281A1 (en) Display device and display device manufacturing method, and connecting film and connecting film manufacturing method
JP2016184715A (en) Flexible light-emitting device, electronic device, and flexible printed wiring board
JP2010275404A (en) Glass cloth-containing white film, metal laminate and substrate for led loading
KR101100379B1 (en) Silver Coated Halogen Free Coverlay Film
JP6610327B2 (en) LED element substrate and LED display device
JP6565153B2 (en) WIRING BOARD AND MANUFACTURING METHOD THEREOF, MOUNTING BOARD AND ITS MANUFACTURING METHOD, AND LIGHTING DEVICE PROVIDED WITH MOUNTING BOARD

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170512

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180427

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180925

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181024

R150 Certificate of patent or registration of utility model

Ref document number: 6426095

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250