CN105274584A - 成膜用金属溶液和金属膜形成方法 - Google Patents

成膜用金属溶液和金属膜形成方法 Download PDF

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Publication number
CN105274584A
CN105274584A CN201510426952.4A CN201510426952A CN105274584A CN 105274584 A CN105274584 A CN 105274584A CN 201510426952 A CN201510426952 A CN 201510426952A CN 105274584 A CN105274584 A CN 105274584A
Authority
CN
China
Prior art keywords
film
metal
base material
solid electrolyte
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510426952.4A
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English (en)
Chinese (zh)
Inventor
平冈基记
柳本博
佐藤祐规
赤松谦祐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of CN105274584A publication Critical patent/CN105274584A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
CN201510426952.4A 2014-07-22 2015-07-20 成膜用金属溶液和金属膜形成方法 Pending CN105274584A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-148867 2014-07-22
JP2014148867A JP6065886B2 (ja) 2014-07-22 2014-07-22 金属皮膜の成膜方法

Publications (1)

Publication Number Publication Date
CN105274584A true CN105274584A (zh) 2016-01-27

Family

ID=54146903

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510426952.4A Pending CN105274584A (zh) 2014-07-22 2015-07-20 成膜用金属溶液和金属膜形成方法

Country Status (7)

Country Link
US (1) US20160024675A1 (ja)
EP (1) EP2977488A1 (ja)
JP (1) JP6065886B2 (ja)
KR (1) KR20160011594A (ja)
CN (1) CN105274584A (ja)
BR (1) BR102015017213A2 (ja)
RU (1) RU2614655C2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108624924A (zh) * 2017-03-23 2018-10-09 丰田自动车株式会社 镍皮膜的形成方法和用于该方法的镍溶液
CN109416326A (zh) * 2016-06-30 2019-03-01 国立大学法人京都大学 探针的制造方法和探针

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020132948A (ja) * 2019-02-20 2020-08-31 トヨタ自動車株式会社 金属皮膜の成膜装置
JP7151673B2 (ja) 2019-09-13 2022-10-12 トヨタ自動車株式会社 金属めっき皮膜の形成方法
JP7238712B2 (ja) * 2019-09-18 2023-03-14 トヨタ自動車株式会社 配線基板の製造方法および配線基板
JP2022066011A (ja) 2020-10-16 2022-04-28 トヨタ自動車株式会社 金属めっき皮膜の成膜方法及び成膜装置
JP7472770B2 (ja) * 2020-12-15 2024-04-23 トヨタ自動車株式会社 金属めっき皮膜の成膜装置及び成膜方法

Citations (4)

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GB503956A (en) * 1937-09-11 1939-04-11 Degussa Improvements in the electrodeposition of nickel on metals
JPH01165786A (ja) * 1987-12-22 1989-06-29 Hitachi Cable Ltd 固相めっき方法
CN1772950A (zh) * 2005-11-01 2006-05-17 桂林工学院 塑料表面化学镀镍无钯活化配方及工艺
JP2012219362A (ja) * 2011-04-13 2012-11-12 Toyota Motor Corp 固体電解質膜を用いた金属膜形成方法

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US6585933B1 (en) * 1999-05-03 2003-07-01 Betzdearborn, Inc. Method and composition for inhibiting corrosion in aqueous systems
US6860976B2 (en) * 2000-06-20 2005-03-01 Lynntech International, Ltd. Electrochemical apparatus with retractable electrode
US7754061B2 (en) * 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US7645364B2 (en) * 2004-06-30 2010-01-12 Lam Research Corporation Apparatus and method for plating semiconductor wafers
US7998323B1 (en) * 2006-06-07 2011-08-16 Actus Potentia, Inc. Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces
JP2010037622A (ja) * 2008-08-07 2010-02-18 Nippon Mining & Metals Co Ltd 無電解置換めっきにより銅薄膜を形成しためっき物
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
RU2413039C1 (ru) * 2009-09-07 2011-02-27 Открытое акционерное общество "Технологическое оснащение" Способ нанесения металлического покрытия на материал в виде зернистого порошка или гранул
US9834677B2 (en) * 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
KR101623677B1 (ko) * 2012-02-23 2016-05-23 도요타 지도샤（주） 금속 피막의 성막 장치 및 성막 방법
JP5803858B2 (ja) * 2012-09-06 2015-11-04 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
JP2014098183A (ja) * 2012-11-14 2014-05-29 Toyota Motor Corp 金属被膜の成膜装置および成膜方法
JP5849941B2 (ja) * 2012-12-20 2016-02-03 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
JP6088295B2 (ja) * 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 スズ合金めっき液

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB503956A (en) * 1937-09-11 1939-04-11 Degussa Improvements in the electrodeposition of nickel on metals
JPH01165786A (ja) * 1987-12-22 1989-06-29 Hitachi Cable Ltd 固相めっき方法
CN1772950A (zh) * 2005-11-01 2006-05-17 桂林工学院 塑料表面化学镀镍无钯活化配方及工艺
JP2012219362A (ja) * 2011-04-13 2012-11-12 Toyota Motor Corp 固体電解質膜を用いた金属膜形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109416326A (zh) * 2016-06-30 2019-03-01 国立大学法人京都大学 探针的制造方法和探针
US10900905B2 (en) 2016-06-30 2021-01-26 Horiba, Ltd. Probe manufacturing method and probe
CN109416326B (zh) * 2016-06-30 2021-12-14 国立大学法人京都大学 探针的制造方法和探针
CN108624924A (zh) * 2017-03-23 2018-10-09 丰田自动车株式会社 镍皮膜的形成方法和用于该方法的镍溶液

Also Published As

Publication number Publication date
RU2614655C2 (ru) 2017-03-28
JP6065886B2 (ja) 2017-01-25
BR102015017213A2 (pt) 2016-01-26
EP2977488A1 (en) 2016-01-27
US20160024675A1 (en) 2016-01-28
RU2015128877A (ru) 2017-01-23
KR20160011594A (ko) 2016-02-01
JP2016023338A (ja) 2016-02-08

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Application publication date: 20160127