CN105127604A - Laser processing system and method - Google Patents
Laser processing system and method Download PDFInfo
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- CN105127604A CN105127604A CN201510559385.XA CN201510559385A CN105127604A CN 105127604 A CN105127604 A CN 105127604A CN 201510559385 A CN201510559385 A CN 201510559385A CN 105127604 A CN105127604 A CN 105127604A
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Abstract
The invention relates to the technical field of lasers, in particular to a laser processing system and method. The system comprises a computer control system, a laser device, a beam expanding lens, a reflective mirror assembly, a vibrating mirror focusing system and a platform used for carrying parts to be processed, wherein the laser device, the beam expanding lens, the reflective mirror assembly and the vibrating mirror focusing system are sequentially connected; the laser device is connected with the computer control system, and the platform is provided with a first conveying device used for driving the parts to be machined to move. According to the laser processing system, due to the fact that the first conveying device on the platform for carrying the parts to be machined, the parts to be machined can move in the preset direction on the platform and are processed by adopting different lasers at different working stations, and the processing precision and efficiency of the parts to be processed are improved. The invention further relates to the sapphire two-beam laser processing method performed by adopting the processing system. The method comprises the steps that 1, rough processing is performed by adopting the high-power nanosecond laser device; 2, fine processing is performed by adopting the ultrafast lasers, so that the efficient and high-quality processing effects on sapphire can be achieved.
Description
Technical field
The present invention relates to laser technology field, be specifically related to a kind of laser-processing system and method.
Background technology
Current Laser Processing sapphire has two kinds of methods, one adopts nanosecond laser, especially ultraviolet nanosecond laser is processed sapphire, the shortcoming of this method is that crudy is poor, generally need post-processed, as polishing etc., another kind adopts ultrafast laser, such as psec, femtosecond laser, direct processing, the i.e. mode of successively ablation or cutting processing, the laser beam focus of high pulse energy is at sapphire surface, by the thawing of material, the modes such as gasification are removed, thus acquisition hole, groove, the fine structures such as cutting edge, but it is higher that the shortcoming of this method is cost, working (machining) efficiency is lower.
Summary of the invention
The object of the invention is to propose a kind of laser-processing system and method, machining accuracy and working (machining) efficiency can be improved.
For reaching this object, the present invention by the following technical solutions:
As one aspect of the present invention, a kind of laser-processing system provided, comprise: computer control system, the laser instrument connected successively, beam expanding lens, speculum group and galvanometer focusing system, for placing the platform of workpiece to be added, wherein said laser instrument is connected with computer control system, described platform is provided with the first conveyer for driving described workpiece motion s to be added.
Preferably, described laser instrument comprises the first laser instrument and second laser, correspondingly, described beam expanding lens comprises the first beam expanding lens and the second beam expanding lens, described speculum group comprises the first speculum group and the second speculum group, described galvanometer focusing system comprises the first galvanometer focusing system and the second galvanometer focusing system, and described first laser instrument and the first beam expanding lens, the first speculum group, the first galvanometer focusing system are in turn connected to form the first light path; Described second laser and the second beam expanding lens, the second speculum group, the second galvanometer focusing system are in turn connected to form the second light path.
Preferably, described first speculum group and the second speculum group are all made up of two parallel speculums.
Preferably, semi-transparent semi-reflecting lens group is also provided with between described laser instrument and beam expanding lens, described semi-transparent semi-reflecting lens group comprises the first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens, described laser instrument comprises the first laser instrument and second laser, described first laser instrument is connected with the first semi-transparent semi-reflecting lens, described second laser is connected with the second semi-transparent semi-reflecting lens, and the laser that described first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens export all is sent to described beam expanding lens.
Preferably, the first described laser instrument is short-pulse laser, and described second laser is ultrashort pulse laser.
Preferably, also comprise ccd image sensor, described ccd image sensor is connected with computer control system, for gathering the image of described workpiece to be added.
Preferably, the second conveyer for driving described galvanometer focusing system is also comprised.
Preferably, also comprise setting blowning installation on the platform and dust arrester, in described blowning installation, be provided with compressed air, oxygen or nitrogen.
Preferably, described workpiece to be added is sapphire.
As another aspect of the present invention, a kind of laser processing provided, is applicable to above-mentioned laser-processing system, comprises:
Workpiece to be added is adjusted to the first default station;
Start the first laser instrument and launch the first laser, described first laser carries out first time processing through the first beam expanding lens, the first speculum group and the first galvanometer focusing system to described workpiece to be added;
By the first conveyer described in computer system control, workpiece to be added is moved to the second default station;
Start second laser and launch the second laser, described second laser carries out second time processing through the second beam expanding lens, the second speculum group and the second galvanometer focusing system to described workpiece to be added.
Beneficial effect of the present invention is: a kind of laser-processing system and method, this system comprises: computer control system, the laser instrument connected successively, beam expanding lens, speculum group and galvanometer focusing system, for placing the platform of workpiece to be added, wherein said laser instrument is connected with computer control system, described platform is provided with the first conveyer for driving described workpiece motion s to be added, the present invention by arranging the first conveyer on the platform placing workpiece to be added, workpiece to be added can be moved according to the direction of presetting on platform, and adopt different laser to process at different stations, improve machining accuracy and the efficiency of workpiece to be added.
Accompanying drawing explanation
Fig. 1 is the functional schematic of a kind of laser-processing system that the embodiment of the present invention one provides.
Fig. 2 is the functional schematic of a kind of laser-processing system that the embodiment of the present invention two provides.
Fig. 3 is the functional schematic of a kind of laser-processing system that the embodiment of the present invention three provides.
Fig. 4 is the flow chart of a kind of laser processing that the embodiment of the present invention four provides.
Fig. 5 is the machining process schematic diagram of a kind of laser processing that the embodiment of the present invention four provides.
Detailed description of the invention
Technical scheme of the present invention is further illustrated by detailed description of the invention below in conjunction with Fig. 1-Fig. 5.
Embodiment one
Fig. 1 is the functional schematic of a kind of laser-processing system that the present embodiment provides.
A kind of laser-processing system, comprise: computer control system, the laser instrument connected successively, beam expanding lens, speculum group and galvanometer focusing system, for placing the platform of workpiece to be added, wherein said laser instrument is connected with computer control system, described platform is provided with the first conveyer for driving described workpiece motion s to be added.
In the present embodiment, by arranging the first conveyer on the platform placing workpiece to be added, workpiece to be added can be moved according to the direction of presetting on platform, and adopt different laser to process at different stations, improve machining accuracy and the efficiency of workpiece to be added.
In the present embodiment, workpiece to be added is sapphire, described first conveyer be X-Y to two-dimentional conveyer.
Embodiment two
As shown in Figure 2, in the present embodiment, described laser instrument comprises the first laser instrument and second laser, correspondingly, described beam expanding lens comprises the first beam expanding lens and the second beam expanding lens, described speculum group comprises the first speculum group and the second speculum group, and described galvanometer focusing system comprises the first galvanometer focusing system and the second galvanometer focusing system, and described first laser instrument and the first beam expanding lens, the first speculum group, the first galvanometer focusing system are in turn connected to form the first light path; Described second laser and the second beam expanding lens, the second speculum group, the second galvanometer focusing system are in turn connected to form the second light path.
In the present embodiment, the first laser that described first laser instrument sends is long pulse or short-pulse laser, such as nanosecond laser; The second laser that described second laser sends is ultra-short pulse laser, as picosecond laser or femtosecond laser.
In the present embodiment, described first laser is different with the wavelength of the second laser, so adopt different beam expanding lens, speculum and galvanometer focusing system to form different light paths.
In the present embodiment, described first speculum group and the second speculum group are all made up of two parallel speculums.
As another kind of embodiment, described speculum group also can be made up of a speculum.
In the present embodiment, the first described laser instrument is short-pulse laser, and as nanosecond laser, described second laser is ultrashort pulse laser, as picosecond laser or femto-second laser.
In the present embodiment, also comprise CCD(Charge-coupledDevice, charge coupled cell) imageing sensor, described ccd image sensor is connected with computer control system, for gathering the image of described workpiece to be added, in the present embodiment, described ccd image sensor is divided into the first ccd image sensor and the second ccd image sensor, is respectively used to the image of the image of the workpiece to be added of collection first station and the workpiece to be added of the second station.
In the present embodiment, also comprise the second conveyer (not indicating in figure) for driving described galvanometer focusing system, described second conveyer also can be processed workpiece to be added such as the sapphire being in different station by regulating the position of galvanometer focusing system, described second conveyer and the first conveyer complement one another, and improve machining accuracy.
In the present embodiment, also comprise setting blowning installation on the platform, compressed air, oxygen or nitrogen is provided with in described blowning installation, in process, blowning installation can arrange blowing compressed air or oxygen, nitrogen etc., except the effect of dedusting, oxygen can also play the effect that accelerated material is removed, and nitrogen, compressed air etc. can also play the effect of cooling.
In the present embodiment, setting dust arrester on the platform is also comprised.
Embodiment three
As shown in Figure 3, in the present embodiment, semi-transparent semi-reflecting lens group is also provided with between described laser instrument and beam expanding lens, described semi-transparent semi-reflecting lens group comprises the first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens, described laser instrument comprises the first laser instrument and second laser, described first laser instrument is connected with the first semi-transparent semi-reflecting lens, and described second laser is connected with the second semi-transparent semi-reflecting lens, and the laser that described first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens export all is sent to described beam expanding lens.
In the present embodiment, described first laser instrument is identical with the optical maser wavelength that second laser sends, a light path be made up of beam expanding lens, speculum and galvanometer focusing system can be shared, by the first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens, the laser that two laser instruments send was sent in this light path before entering beam expanding lens.
Embodiment four
As shown in Figure 4, a kind of laser processing, is applicable to above-mentioned laser-processing system, comprises:
S10, workpiece to be added is adjusted to the first default station;
S20, start the first laser instrument and launch the first laser, described first laser carries out first time processing through the first beam expanding lens, the first speculum group and the first galvanometer focusing system to described workpiece to be added;
S30, by the first conveyer described in computer system control, workpiece to be added is moved to the second default station;
S40, startup second laser launch the second laser, and described second laser carries out second time processing through the second beam expanding lens, the second speculum group and the second galvanometer focusing system to described workpiece to be added.
In the present embodiment, described first time machining accuracy be more than 20 μm, described second time machining accuracy is less than 20 μm, by machined part as sapphire carries out secondary operations, provides machining accuracy and efficiency, meets processing request better.
As shown in Figure 5, for adopting the machining process schematic diagram of this method in the present embodiment to sapphire, comprise three width figure altogether, for sapphire working groove, the first width figure is sapphire to be processed, first the first default station is placed it in, adopt the first laser to carry out first time processing to sapphire, processing result is as shown in the second width figure, known from the second width figure, sapphire working groove after first time processing is second-rate, and working groove edge exists the phenomenons such as crude, burr; By computer system control first conveyer, the sapphire after first time processing is moved to the second default station, the second laser is adopted to carry out second time processing to sapphire, working groove region is repaired, repaired, processing result is as shown in the 3rd width figure, known from the 3rd width figure, the working groove smoother, smooth after second time processing.
The foregoing is only the specific embodiment of the present invention, these describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other specific implementation method of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (10)
1. a laser-processing system, it is characterized in that, comprise: computer control system, the laser instrument connected successively, beam expanding lens, speculum group and galvanometer focusing system, for placing the platform of workpiece to be added, wherein said laser instrument is connected with computer control system, described platform is provided with the first conveyer for driving described workpiece motion s to be added.
2. a kind of laser-processing system according to claim 1, it is characterized in that, described laser instrument comprises the first laser instrument and second laser, correspondingly, described beam expanding lens comprises the first beam expanding lens and the second beam expanding lens, described speculum group comprises the first speculum group and the second speculum group, described galvanometer focusing system comprises the first galvanometer focusing system and the second galvanometer focusing system, and described first laser instrument and the first beam expanding lens, the first speculum group, the first galvanometer focusing system are in turn connected to form the first light path; Described second laser and the second beam expanding lens, the second speculum group, the second galvanometer focusing system are in turn connected to form the second light path.
3. a kind of laser-processing system according to claim 2, is characterized in that, described first speculum group and the second speculum group are all made up of two parallel speculums.
4. a kind of laser-processing system according to claim 1, it is characterized in that, semi-transparent semi-reflecting lens group is also provided with between described laser instrument and beam expanding lens, described semi-transparent semi-reflecting lens group comprises the first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens, described laser instrument comprises the first laser instrument and second laser, described first laser instrument is connected with the first semi-transparent semi-reflecting lens, described second laser is connected with the second semi-transparent semi-reflecting lens, and the laser that described first semi-transparent semi-reflecting lens and the second semi-transparent semi-reflecting lens export all is sent to described beam expanding lens.
5. a kind of laser-processing system according to claim 2 or 4, is characterized in that, the first described laser instrument is short-pulse laser, and described second laser is ultrashort pulse laser.
6. a kind of laser-processing system according to claim 2 or 4, is characterized in that, also comprise ccd image sensor, described ccd image sensor is connected with computer control system, for gathering the image of described workpiece to be added.
7. a kind of laser-processing system according to claim 1, is characterized in that, also comprises the second conveyer for driving described galvanometer focusing system.
8. a kind of laser-processing system according to claim 1, is characterized in that, also comprises setting blowning installation on the platform and dust arrester, is provided with compressed air, oxygen or nitrogen in described blowning installation.
9. a kind of laser-processing system according to claim 1, is characterized in that, described workpiece to be added is sapphire.
10. a laser processing, is applicable to the laser-processing system described in claim 1-9, it is characterized in that, comprising:
Workpiece to be added is adjusted to the first default station;
Start the first laser instrument and launch the first laser, described first laser carries out first time processing through the first beam expanding lens, the first speculum group and the first galvanometer focusing system to described workpiece to be added;
By the first conveyer described in computer system control, workpiece to be added is moved to the second default station;
Start second laser and launch the second laser, described second laser carries out second time processing through the second beam expanding lens, the second speculum group and the second galvanometer focusing system to described workpiece to be added;
Wherein said first laser is high power nanosecond laser, and the second laser is ultrafast laser.
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| CN201510559385.XA CN105127604A (en) | 2015-09-06 | 2015-09-06 | Laser processing system and method |
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Address after: 518000 Shenzhen province science and Technology Park, Nanshan District, North Hill Road, No. two, No. 8, Qing Guang photoelectric building, No. 305 Applicant after: Innovo laser Polytron Technologies Inc Address before: 518000 Shenzhen province science and Technology Park, Nanshan District, North Hill Road, No. two, No. 8, Qing Guang photoelectric building, No. 305 Applicant before: Shenzhen Inno Laser Technology Co., Ltd. |
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