CN105458531A - Hard and brittle material special-shaped hole machining equipment and method based on laser cutting - Google Patents
Hard and brittle material special-shaped hole machining equipment and method based on laser cutting Download PDFInfo
- Publication number
- CN105458531A CN105458531A CN201511023684.8A CN201511023684A CN105458531A CN 105458531 A CN105458531 A CN 105458531A CN 201511023684 A CN201511023684 A CN 201511023684A CN 105458531 A CN105458531 A CN 105458531A
- Authority
- CN
- China
- Prior art keywords
- laser
- brittle material
- galvanometer
- hard brittle
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses hard and brittle material special-shaped hole machining equipment based on laser cutting. The equipment comprises a laser head; a beam expanding lens, a galvanometer, a focusing field lens and a machining platform are arranged in a transmission direction of laser pulse emitted by the laser head in sequence; an air blowing device is arranged on the inclined upper side of the machining platform; the machining platform is used for placing a hard and brittle material; an outlet of the air blowing device is towards the hard and brittle material; the laser head is electrically connected with a computer control module; the computer control module controls the laser head to emit laser and controls the operation of the galvanometer; and the galvanometer is a 2D galvanometer. The equipment improves the machining quality of special-shaped holes, prominently improves the machining efficiency of the special-shaped holes, preferably prevents the fragment of the hard and brittle material caused by excessive thermal stress, and greatly improves the machining efficiency and the machining quality.
Description
Technical field
The present invention relates to Laser cutting technical field, particularly relate to a kind of hard brittle material processing special holes Apparatus and method for based on laser cutting.
Background technology
In recent years, laser processing technology is widely used in the cutting of hard brittle material, in especially retrofit technique.The profiled holes of traditional hard material (as glass, sapphire, pottery etc.) adopts to cut based on the mechanism of carbon dioxide laser or optical fiber laser, the method is more effective for large-sized abnormal shape cutting, but its zlasing mode is poor, the feature that focal beam spot is large, causing it when processing meticulous profiled holes, occurring pass weak effect and stitching wide situation.
Laser cutting utilizes the high power density laser bundle of line focus to irradiate workpiece, makes irradiated material melt rapidly or vaporize, thus realize a kind of hot-working method of work piece cut.The working mechanism of laser instrument mainly by laser beam focusing in material surface, make photon energy convert chemical energy or heat energy to and by sputtering of materials out.Wherein, solid state laser has the advantages that beam mode is good, focal beam spot is little, coordinates the relative motion of workpiece can process the good pass of effect, but its structural cost is high and present the slow feature of working (machining) efficiency when processing multiple profiled holes.And adopt high power solid state laser to cut, because focal beam spot is little and energy density is high, in light beam, carry very large heat, so easily cause cracked in process because thermal stress is excessive.
Summary of the invention
The technical problem to be solved in the present invention is, for the deficiencies in the prior art, provides a kind of and can reduce product cost, improves irregularly-shaped hole hole shape, avoids the processing special holes Apparatus and method for that causes because thermal stress is excessive hard brittle material cracked.
For solving the problems of the technologies described above, the present invention adopts following technical scheme.
A kind of hard brittle material processing special holes equipment based on laser cutting, it includes laser head, the transmission direction of the laser pulse sent along laser head is disposed with beam expanding lens, galvanometer, focusing field lens and processing platform, described processing platform oblique upper is provided with blowning installation, for placing hard brittle material on described processing platform, the outlet of described blowning installation is towards hard brittle material, described laser head is electrically connected with computer control module, control laser head shoot laser by described computer control module and control galvanometer running, described galvanometer is 2D galvanometer.
Preferably, described laser head is nanosecond ND:YAG, YLF, YVO4 type solid-state laser.
Preferably, the outlet of described blowning installation is flat outlet.
Based on a hard brittle material processing special holes method for laser cutting, it includes following steps: step S1, utilizes computer control module to edit different in nature hole to be processed, profiled holes is resolved into multiple aperture; Step S2, the laser of laser emitting is delivered to the surface of hard brittle material via beam expanding lens, galvanometer and focusing field lens, repeatedly draw circular arc and be cut into profiled holes via described galvanometer; Step S3, described computer control module controls galvanometer and rotates, and repairs along the edge of profiled holes to make the laser of laser head outgoing.
Preferably, in described step S1, during Drilling operation, the size of aperture is
Preferably, in described step S1, the processing speed of aperture is 40-50 hole/second.
Hard brittle material processing special holes equipment based on laser cutting disclosed by the invention, its beneficial effect is compared to existing technologies, present invention employs nanosecond laser with low cost and 2D galvanometer can realize processing special holes, without the need to processing platform auxiliary moving, thus improve the crudy of profiled holes, significantly improve processing special holes efficiency, avoid preferably and cause hard brittle material cracked because thermal stress is excessive, substantially increase working (machining) efficiency and processing quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of hard brittle material processing special holes equipment of the present invention.
Fig. 2 is the distribution trajectory schematic diagram of aperture in processing special holes process.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in more detail.
The invention discloses a kind of hard brittle material processing special holes equipment based on laser cutting, as shown in Figure 1, it includes laser head 1, the transmission direction of the laser pulse sent along laser head 1 is disposed with beam expanding lens 2, galvanometer 3, focus on field lens 4 and processing platform 5, described processing platform 5 oblique upper is provided with blowning installation 6, for placing hard brittle material 7 on described processing platform 5, the outlet of described blowning installation 6 is towards hard brittle material 7, described laser head 1 is electrically connected with computer control module 8, control laser head 1 shoot laser by described computer control module 8 and control galvanometer 3 to operate, described galvanometer 3 is 2D galvanometer.Described laser head 1 is nanosecond ND:YAG, YLF, YVO4 type solid-state laser.Further, the outlet of described blowning installation 6 is flat outlets.
In the course of work, laser carries out light beam amplification and collimation via beam expanding lens 2, the scanning of profiled holes path is carried out again through galvanometer 3, the hard brittle material 7 on processing platform 5 is transferred to by focusing field lens 4, this hard brittle material 7 can be aluminium oxide ceramic substrate, also can be that other have the substrate of hard, crisp characteristic, blowning installation 6 to be blown heat radiation for giving hard brittle material 7, and computer control module 8 is for controlling laser head 1 shoot laser and galvanometer 3 operates.
The above-mentioned hard brittle material processing special holes equipment based on laser cutting, which employs nanosecond laser with low cost and 2D galvanometer can realize processing special holes, without the need to processing platform auxiliary moving, thus improve the crudy of profiled holes, significantly improve processing special holes efficiency, avoid preferably and cause hard brittle material cracked because thermal stress is excessive, substantially increase working (machining) efficiency and processing quality.
Based on the hard brittle material processing special holes method of laser cutting, shown in composition graphs 1 and Fig. 2, include following steps:
Step S1, utilizes computer control module 8 to edit different in nature hole to be processed, profiled holes is resolved into multiple aperture 100, and wherein, during Drilling operation, the size of aperture 100 is
the processing speed of aperture 100 is 40-50 hole/second, and because aperture is short for process time, thermal stress cannot be accumulated in a large number, thus makes hard brittle material be unlikely to break;
Step S2, the laser of laser instrument 1 outgoing is via beam expanding lens 2, galvanometer 3 and focus on the surface that field lens 4 is delivered to hard brittle material 7, draws circular arc more than 3 time and be cut into profiled holes via described galvanometer;
Step S3, described computer control module 8 controls galvanometer 3 and rotates, and repairs along the edge of profiled holes to make the laser of laser head 1 outgoing.
Disclosed by the invention based in the hard brittle material processing special holes Apparatus and method for of laser cutting, laser head is without the need to the psec of selecting accumulation of heat less or femto-second laser, and the 3D galvanometer system of galvanometer without the need to selecting price higher, processing platform 5 is without the need to completing working motion by XY axle driving mechanism simultaneously, add and only below cutting pass, do hollow out process man-hour, can find out in conjunction with the above, present invention reduces equipment cost, and the profiled holes of stitching wide minimum 40um can be obtained, compare optical fiber laser or the carbon dioxide laser in traditional working special-shaped hole, the quality of the profiled holes of the present invention's processing is improved, simultaneously, the speed that galvanometer jumps hole machined can reach 5000mm/s, much larger than the speed of platform movement, thus improve working (machining) efficiency.
More than just preferred embodiment of the present invention, is not limited to the present invention, all make in technical scope of the present invention amendment, equivalently to replace or improvement etc., all should be included in scope that the present invention protects.
Claims (6)
1. the hard brittle material processing special holes equipment based on laser cutting, it is characterized in that, include laser head, the transmission direction of the laser pulse sent along laser head is disposed with beam expanding lens, galvanometer, focus on field lens and processing platform, described processing platform oblique upper is provided with blowning installation, for placing hard brittle material on described processing platform, the outlet of described blowning installation is towards hard brittle material, described laser head is electrically connected with computer control module, control laser head shoot laser by described computer control module and control galvanometer running, described galvanometer is 2D galvanometer.
2., as claimed in claim 1 based on the hard brittle material processing special holes equipment of laser cutting, it is characterized in that, described laser head is nanosecond ND:YAG, YLF, YVO4 type solid-state laser.
3. as claimed in claim 1 based on the hard brittle material processing special holes equipment of laser cutting, it is characterized in that, the outlet of described blowning installation is flat outlet.
4., based on a hard brittle material processing special holes method for laser cutting, it is characterized in that, include following steps:
Step S1, utilizes computer control module to edit different in nature hole to be processed, profiled holes is resolved into multiple aperture;
Step S2, the laser of laser emitting is delivered to the surface of hard brittle material via beam expanding lens, galvanometer and focusing field lens, repeatedly draw circular arc and be cut into profiled holes via described galvanometer;
Step S3, described computer control module controls galvanometer and rotates, and repairs along the edge of profiled holes to make the laser of laser head outgoing.
5., as claimed in claim 4 based on the hard brittle material processing special holes method of laser cutting, it is characterized in that, in described step S1, during Drilling operation, the size of aperture is
6., as claimed in claim 5 based on the hard brittle material processing special holes method of laser cutting, it is characterized in that, in described step S1, the processing speed of aperture is 40-50 hole/second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511023684.8A CN105458531A (en) | 2015-12-30 | 2015-12-30 | Hard and brittle material special-shaped hole machining equipment and method based on laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511023684.8A CN105458531A (en) | 2015-12-30 | 2015-12-30 | Hard and brittle material special-shaped hole machining equipment and method based on laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105458531A true CN105458531A (en) | 2016-04-06 |
Family
ID=55596923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511023684.8A Pending CN105458531A (en) | 2015-12-30 | 2015-12-30 | Hard and brittle material special-shaped hole machining equipment and method based on laser cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105458531A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026694A (en) * | 2019-05-07 | 2019-07-19 | 英诺激光科技股份有限公司 | Two-beam double-sided laser system of processing and method |
| CN110405366A (en) * | 2019-06-28 | 2019-11-05 | 北京航天控制仪器研究所 | A kind of ceramic material laser processing device and method |
| CN113579507A (en) * | 2021-07-01 | 2021-11-02 | 大族激光科技产业集团股份有限公司 | Mesh processing method and processing equipment |
| CN114619157A (en) * | 2022-03-16 | 2022-06-14 | 新代科技(苏州)有限公司 | Glass drilling device based on 2D galvanometer laser machining and Z-axis movement |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100039680A1 (en) * | 2008-08-13 | 2010-02-18 | Samsung Electro-Mechanics Co. Ltd. | Laser processing apparatus and method |
| JP2011028250A (en) * | 2009-07-02 | 2011-02-10 | Mitsubishi Electric Corp | Laser beam machine |
| CN103586586A (en) * | 2013-10-22 | 2014-02-19 | 苏州镭明激光科技有限公司 | Pulse laser etching device used for transparent electroconductive thin film and control method of pulse laser etching device |
| CN103785955A (en) * | 2014-01-28 | 2014-05-14 | 深圳英诺激光科技有限公司 | Laser drilling device used for machining hard and brittle substrate |
| CN104625437A (en) * | 2015-01-12 | 2015-05-20 | 李凯 | Scanning mechanism for precision processing of laser drilling and cutting of special-shaped hole |
| CN104668785A (en) * | 2015-03-10 | 2015-06-03 | 苏州德龙激光股份有限公司 | Laser rapid drilling device and laser rapid drilling method |
| CN105127604A (en) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | Laser processing system and method |
| CN205437508U (en) * | 2015-12-30 | 2016-08-10 | 常州英诺激光科技有限公司 | Hard brittle material heterotype hole processing equipment based on laser cutting |
-
2015
- 2015-12-30 CN CN201511023684.8A patent/CN105458531A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100039680A1 (en) * | 2008-08-13 | 2010-02-18 | Samsung Electro-Mechanics Co. Ltd. | Laser processing apparatus and method |
| JP2011028250A (en) * | 2009-07-02 | 2011-02-10 | Mitsubishi Electric Corp | Laser beam machine |
| CN103586586A (en) * | 2013-10-22 | 2014-02-19 | 苏州镭明激光科技有限公司 | Pulse laser etching device used for transparent electroconductive thin film and control method of pulse laser etching device |
| CN103785955A (en) * | 2014-01-28 | 2014-05-14 | 深圳英诺激光科技有限公司 | Laser drilling device used for machining hard and brittle substrate |
| CN104625437A (en) * | 2015-01-12 | 2015-05-20 | 李凯 | Scanning mechanism for precision processing of laser drilling and cutting of special-shaped hole |
| CN104668785A (en) * | 2015-03-10 | 2015-06-03 | 苏州德龙激光股份有限公司 | Laser rapid drilling device and laser rapid drilling method |
| CN105127604A (en) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | Laser processing system and method |
| CN205437508U (en) * | 2015-12-30 | 2016-08-10 | 常州英诺激光科技有限公司 | Hard brittle material heterotype hole processing equipment based on laser cutting |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026694A (en) * | 2019-05-07 | 2019-07-19 | 英诺激光科技股份有限公司 | Two-beam double-sided laser system of processing and method |
| CN110405366A (en) * | 2019-06-28 | 2019-11-05 | 北京航天控制仪器研究所 | A kind of ceramic material laser processing device and method |
| CN110405366B (en) * | 2019-06-28 | 2021-07-13 | 北京航天控制仪器研究所 | Ceramic material laser processing device and method |
| CN113579507A (en) * | 2021-07-01 | 2021-11-02 | 大族激光科技产业集团股份有限公司 | Mesh processing method and processing equipment |
| CN113579507B (en) * | 2021-07-01 | 2023-06-23 | 大族激光科技产业集团股份有限公司 | Mesh processing method and processing equipment |
| CN114619157A (en) * | 2022-03-16 | 2022-06-14 | 新代科技(苏州)有限公司 | Glass drilling device based on 2D galvanometer laser machining and Z-axis movement |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105458531A (en) | Hard and brittle material special-shaped hole machining equipment and method based on laser cutting | |
| US20110132885A1 (en) | Laser machining and scribing systems and methods | |
| CN105127755A (en) | Workpiece forming and reinforcing composite machining device and method | |
| CN212470228U (en) | Double-laser heat cracking cutting device for solar cell | |
| US20150136744A1 (en) | Methods and systems for laser processing of coated substrates | |
| CN104014936A (en) | Laser processing method and laser cutting systems of high molecular workpieces | |
| JP2002205180A5 (en) | Laser processing method and laser processing apparatus | |
| CN105127604A (en) | Laser processing system and method | |
| CN103753022A (en) | Method of laser-welding metal materials by double lasers | |
| CN105014243A (en) | Carbon dioxide laser cutting machine | |
| CN205437508U (en) | Hard brittle material heterotype hole processing equipment based on laser cutting | |
| CN103962734A (en) | Laser cutting rapid zooming mechanism and rapid zooming punching method | |
| WO2019119617A1 (en) | High-refractive-index and low-hardness transparent material laser cutting device and method | |
| CN104439715A (en) | Laser cutting device for transparent materials and laser cutting process applied to laser cutting device | |
| CN108356414A (en) | A kind of laser path and method for laser welding of Laser Welding contact | |
| CN111055028A (en) | Laser cutting device and method for expanding controllable cracks based on plasma | |
| CN103387335B (en) | Cutter for substrate and method thereof | |
| CN113649701B (en) | Laser edge cleaning method and device for solar cell | |
| CN207656103U (en) | A kind of high refractive index, low-rigidity transparent material laser cutter device | |
| CN102179635B (en) | Processing method and device for carrying out microwave cutting on brittle material | |
| CN102489885A (en) | Method and device for boring taper hole by using laser | |
| KR100984719B1 (en) | Laser processing apparatus | |
| CN204975719U (en) | Carbon dioxide laser cutting machine | |
| JP2010129987A (en) | Wafer processing method, laser processing device, and program for laser processing | |
| CN110605483A (en) | Laser cutting device of LED wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Wujin District of Jiangsu city in Changzhou province 213000 Chang Wu Road No. 801 Changzhou Science City building room 1111-1126 South Hui research Applicant after: Inno Machining Co., Ltd. Applicant after: Innovo laser Polytron Technologies Inc Address before: Wujin District of Jiangsu city in Changzhou province 213000 Chang Wu Road No. 801 Changzhou Science City building room 1111-1126 South Hui research Applicant before: Inno Machining Co., Ltd. Applicant before: Shenzhen Inno Laser Technology Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
|
| RJ01 | Rejection of invention patent application after publication |