CN104439714A - Method for filling and cutting materials through ultrashort pulse lasers - Google Patents
Method for filling and cutting materials through ultrashort pulse lasers Download PDFInfo
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- CN104439714A CN104439714A CN201410641852.9A CN201410641852A CN104439714A CN 104439714 A CN104439714 A CN 104439714A CN 201410641852 A CN201410641852 A CN 201410641852A CN 104439714 A CN104439714 A CN 104439714A
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- fill
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- cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention discloses a method for filling and cutting materials through ultrashort pulse lasers. The method comprises the following steps that a path to be cut is set; the path to be cut is expanded to a filling area, and path filling is carried out; laser scanning is carried out on the filling area until cutting is completed. The defects that an existing laser cutting technology is used, materials cannot fall off naturally, and the materials need to be cut through a subsequent method are overcome, and meanwhile the quality and efficiency of laser cutting are guaranteed.
Description
Technical field
The invention belongs to Laser Micro-Machining field, particularly a kind of method utilizing ultra-short pulse laser to fill cutting material.
Background technology
Decades, development was swift and violent in the past for laser technology, and the range of application of laser and level are also thereupon fast-developing.Laser micro-machining technology, due to the advantage of its uniqueness, plays important role in micro-nano manufacture field, has the advantage that traditional processing mode is incomparable.Along with the expansion gradually of the range of work, also more and more higher requirement is proposed to the precision and stability of laser micro-machining technology.Laser instrument coordinates galvanometer to use, and process velocity is fast, and machining accuracy advantages of higher, has become the main flow in Laser Micro-Machining, is more and more used in various laser micro-processing equipment, greatly improves quality and the efficiency of Laser Micro-Machining.In addition, galvanometer energy flexible positioning light beam, almost can meet the process requirements of various shape profile.
Glass, sapphire and pottery are the materials being widely used in micro-processing technology and retrofit.Safety glass is commonly used to the display screen making smart mobile phone; Hard and the stable chemical nature of pottery, can be used to make electronic component and circuit substrate, and electrical insulators; Sapphire is extremely hard, damage resistant, is suitable for semiconductor and LED technology.But material has individual common ground to be exactly be difficult to processing.When processing this type of material, avoiding producing gap is the challenge that often will run into; In addition, when cutting this kind of material, the photon caused because joint-cutting is narrow not exclusively absorb with material not easily cut falling be the difficult problem of laser cutting material; The cutting efficiency that the problems referred to above cause and cut quality are lowly current laser cutting material urgent problems.
Hard, the frangible material of laser beam processing can show good effect, and wherein ultrashort pulse laser is particularly suitable for the material of processing fragile.Pulse is less than to the laser beam of 10 psecs, heat transfer to periphery material before, the material of area to be machined is removed.For the light in visible ray and near infrared spectral region, the such broad-band gap of glass is printing opacity.But the ultrashort pulse of high strength produces free electron by multiphoton ionization, a large amount of continuous print ionization discharges charge carrier further, and these charge carriers can destroy the chemical bond in material, finally reach the object of ablator.Suitable Processing Strategies can prevent the formation of crackle.This is comprising precisely defining machined parameters, as pulse energy, pulse overlap degree, repetition rate, focus diameter and laser scanning number of times.
Existing ultrafast laser direct etching processing method has following deficiency: one is that machining accuracy is not high, and working position is difficult to reach element surface roughness requirements, thus result in it and can not use as high precision optics; Two is that efficiency is low, requires very high to the energy density of ultrafast laser bundle; Three is that laser instrument coordinates galvanometer cutting material, and cutting part is difficult to automatically fall, and needs following process means to be separated from incision by material, greatly have impact on cut quality and cutting efficiency.
Summary of the invention
Goal of the invention: the invention provides a kind of method utilizing ultra-short pulse laser to fill cutting material, is intended to the problem that solution material can not fall naturally, also guarantees smoothness and the cutting tapering of cut edge simultaneously.
Technical scheme: a kind of method utilizing ultra-short pulse laser to fill cutting material of the present invention, comprises the steps:
1) path to be cut is loaded into;
2) Path extension to be cut is become fill area;
3) fill area is filled;
4) laser scanning fill area is until cut.
Described step 2) also comprise the size that fill area is set.
Described step 3) also comprise arrange fill path, packed density and fill number of times.
Described step 4) comprise fill area machined parameters is set, according to machined parameters scanning filling region until cut.
Described path to be cut is straight line, curve, regular figure or irregular figure.
The cutting head that described laser uses is galvanometer cutting head.
The cutting head that described laser uses is the meticulous laser Machining head being furnished with high-speed displacement platform or linear electric motors.
Described laser is ultra-short pulsed laser beam, and the burst length is 100 psec to 100 femtoseconds, and wavelength is 1080 nanometer to 355 nanometers.
Beneficial effect: this Path extension, by choosing cutting path, is become the region that can fill by the present invention, and laser is processed by fill path successively in this region, until complete material cutting.Present invention achieves the ultraprecise cutting of material, compare existing art method, its machining accuracy is higher, and working (machining) efficiency is higher; And the problem that after solving cutting, material can not fall automatically; Ensure that smoothness and the cutting tapering of cut edge simultaneously.
Accompanying drawing explanation
Fig. 1 is flow chart of the present invention;
Fig. 2 a is the pattern schematic diagram in path to be cut in the present invention;
Fig. 2 b is that in the present invention, Path extension to be cut becomes the pattern schematic diagram behind fill area;
The pattern schematic diagram after the filling of path is carried out in the present invention in fill area by Fig. 2 c;
Fig. 2 d is the schematic diagram after having been cut by material in the present invention;
Fig. 2 e is fill area enlarged diagram one in the present invention;
Fig. 2 f is fill area enlarged diagram two in the present invention.
Detailed description of the invention
As shown in Figure 1, the method utilizing ultra-short pulse laser to fill cutting material of the present invention comprises the following steps:
S1: be loaded into and arrange path to be cut, described path to be cut can be the multiple path such as straight line, curve.
Be loaded into the machining path arranging required cutting, described path to be processed can be single line, and also can be closed curve, described cutting path be not specifically limited, and can be regular figure, also can be irregular figure.As shown in Figure 2 a, the path to be cut pattern of described material 1 comprises path 2 and path 3, and path 2 and path 3 are two different independent cutting paths.Material 1 can be transparent or non-transparent material.
S2: Path extension to be cut is become fill area, walking along the street footpath of going forward side by side is filled.
When cutting path expands to fill area, arrange the size of fill area, the size of this fill area can be arbitrary dimension, specifically can regulate according to split requirement.
As shown in Fig. 2 b, 2c, 2e, 2f, path 2 to be cut and path 3 are expanded into fill area 4 and region 5; Region 4 after expansion and region 5 are carried out path filling and become passage zone 6 and passage zone 7; Fig. 2 e, 2f are the enlarged diagrams of passage zone 6 and passage zone 7.Be only a kind of fill method shown in Fig. 2 e, Fig. 2 f, fill method described in the present invention is not limited to this one.
Because gap is very little during laser cutting, the fragment of vaporizing during cutting solidifies immediately and drops in small gap, the workpiece cut is blocked, cannot automatically fall.As in Fig. 2 a, prior art carries out Linear cut along path 2, occurs that workpiece easily blocks, cannot automatically fall, the problems such as cut edge is coarse.Cut by fill area, the cutting track in path 2 is become there is one fixed width annulus, as fill area 4 in Fig. 2 b, gap has annular width so large, and the fragment of cutting and workpiece can fall automatically, improve cutting efficiency, owing to not having the blocking of fragment, cut edge also can be smooth.
According to cutting object, arrange and fill number of times, fill path and packed density, path filling is carried out in this fill area.According to split requirement, the fill area after expansion can use different filling number of times, fill path and packed density.
S3: the machined parameters arranging each scanning filling region of laser, laser scans this fill area successively by set path.
Passage zone 6 after laser scanning filling and passage zone 7, can carry out the Multiple-Scan of the same area; And the machined parameters that laser scans at every turn is set, can adjust according to split requirement.
S4: complete cutting by this region of laser scanning.
According to fill path and laser parameter setting, laser beam has scanned cutting successively.Be the schematic diagram after material 1 has cut as shown in Figure 2 d.
In the present invention the laser that is suitable for be ultra-short pulsed laser beam, the burst length is 100 psec to 100 femtoseconds, and wavelength is 1080 nanometer to 355 nanometers.The laser cutting head that laser uses can be galvanometer cutting head, also can be meticulous laser Machining head, and coordinates high-speed displacement platform or linear electric motors.
The present invention is by being loaded into path to be cut; Path extension to be cut is become fill area, and walking along the street footpath of going forward side by side is filled; The machined parameters that each laser scanning is filled is set; Laser scans this region successively by set fill path and machined parameters; Cutting task is completed by this region of laser scanning.The present invention adopts ultrashort pulse laser isopulse laser system, focus the laser beam in material sample surface or body by corresponding lens, by controlling the direction of laser beam foucing movement in material sample body, number of times and speed, with reaching the order of laser cutting material.As long as utilize the present invention to control pulsed laser energy, focusing objective len numerical aperture, sweep speed, laser fill area and the parameter such as packed density, multiple scanning number of times, quick high accuracy cutting material can be realized.The present invention is by expansion cutting path, region after filling with laser scanning completes cutting, and avoiding material in prior art can not fall naturally, needs the defect of follow-up means separating materials, ensure that material by complete cutting, can also guarantee quality and the efficiency of laser cutting simultaneously.
Claims (8)
1. utilize ultra-short pulse laser to fill a method for cutting material, it is characterized in that, comprise the steps:
1) path to be cut is set;
2) Path extension to be cut is become fill area;
3) fill area is filled;
4) laser scanning fill area is until cut.
2. a kind of method utilizing ultra-short pulse laser to fill cutting material according to claim 1, is characterized in that, described step 2) also comprise the size that fill area is set.
3. a kind of ultra-short pulse laser that utilizes according to claim 1 fills the method for cutting material, it is characterized in that, described step 3) also comprise and fill path, packed density are set and fill number of times.
4. a kind of ultra-short pulse laser that utilizes according to claim 1 fills the method for cutting material, it is characterized in that, described step 4) comprise fill area machined parameters is set, according to machined parameters scanning filling region until cut.
5. a kind of method utilizing ultra-short pulse laser to fill cutting material according to claim 1, it is characterized in that, described path to be cut is straight line, curve, regular figure or irregular figure.
6. a kind of method utilizing ultra-short pulse laser to fill cutting material according to claim 1, it is characterized in that, the cutting head that described laser uses is galvanometer cutting head.
7. a kind of method utilizing ultra-short pulse laser to fill cutting material according to claim 1, it is characterized in that, the cutting head that described laser uses is the meticulous laser Machining head being furnished with high-speed displacement platform or linear electric motors.
8. a kind of method utilizing ultra-short pulse laser to fill cutting material according to claim 1, it is characterized in that, described laser is ultra-short pulsed laser beam, and the burst length is 100 psec to 100 femtoseconds, and wavelength is 1080 nanometer to 355 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641852.9A CN104439714A (en) | 2014-11-13 | 2014-11-13 | Method for filling and cutting materials through ultrashort pulse lasers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641852.9A CN104439714A (en) | 2014-11-13 | 2014-11-13 | Method for filling and cutting materials through ultrashort pulse lasers |
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| CN104439714A true CN104439714A (en) | 2015-03-25 |
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| CN201410641852.9A Pending CN104439714A (en) | 2014-11-13 | 2014-11-13 | Method for filling and cutting materials through ultrashort pulse lasers |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108015425A (en) * | 2017-11-22 | 2018-05-11 | 武汉华工激光工程有限责任公司 | A kind of process of laser ablation sapphire surface coating |
| CN110421273A (en) * | 2019-07-30 | 2019-11-08 | 深圳市牧激科技有限公司 | Laser processing and laser cutting machine |
| CN111151892A (en) * | 2018-11-08 | 2020-05-15 | 中国科学院西安光学精密机械研究所 | Non-taper laser cutting method |
| CN112801944A (en) * | 2020-12-31 | 2021-05-14 | 东莞材料基因高等理工研究院 | Method and device for improving surface line marks of slow-speed wire cutting machine and cutting machine |
| CN113478107A (en) * | 2021-08-08 | 2021-10-08 | 西安瑞特三维科技有限公司 | Method for cutting electronic additive circuit board by femtosecond laser |
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| US20070228616A1 (en) * | 2005-05-11 | 2007-10-04 | Kyu-Yong Bang | Device and method for cutting nonmetalic substrate |
| CN101613180A (en) * | 2009-07-24 | 2009-12-30 | 深圳市大族激光科技股份有限公司 | A kind of method of cutting glass by laser |
| CN102319958A (en) * | 2011-08-19 | 2012-01-18 | 南京理工大学 | Pulse laser cutting method for fragile materials |
| CN202297372U (en) * | 2011-09-28 | 2012-07-04 | 深圳市木森科技有限公司 | Glass processing equipment |
| CN102814591A (en) * | 2012-05-23 | 2012-12-12 | 苏州德龙激光有限公司 | Laser processing method and laser processing equipment |
-
2014
- 2014-11-13 CN CN201410641852.9A patent/CN104439714A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070228616A1 (en) * | 2005-05-11 | 2007-10-04 | Kyu-Yong Bang | Device and method for cutting nonmetalic substrate |
| CN101613180A (en) * | 2009-07-24 | 2009-12-30 | 深圳市大族激光科技股份有限公司 | A kind of method of cutting glass by laser |
| CN102319958A (en) * | 2011-08-19 | 2012-01-18 | 南京理工大学 | Pulse laser cutting method for fragile materials |
| CN202297372U (en) * | 2011-09-28 | 2012-07-04 | 深圳市木森科技有限公司 | Glass processing equipment |
| CN102814591A (en) * | 2012-05-23 | 2012-12-12 | 苏州德龙激光有限公司 | Laser processing method and laser processing equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108015425A (en) * | 2017-11-22 | 2018-05-11 | 武汉华工激光工程有限责任公司 | A kind of process of laser ablation sapphire surface coating |
| CN111151892A (en) * | 2018-11-08 | 2020-05-15 | 中国科学院西安光学精密机械研究所 | Non-taper laser cutting method |
| CN110421273A (en) * | 2019-07-30 | 2019-11-08 | 深圳市牧激科技有限公司 | Laser processing and laser cutting machine |
| CN112801944A (en) * | 2020-12-31 | 2021-05-14 | 东莞材料基因高等理工研究院 | Method and device for improving surface line marks of slow-speed wire cutting machine and cutting machine |
| CN113478107A (en) * | 2021-08-08 | 2021-10-08 | 西安瑞特三维科技有限公司 | Method for cutting electronic additive circuit board by femtosecond laser |
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Application publication date: 20150325 |
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