CN105101659A - Processing method for circuit board and nickel-gold circuit board - Google Patents
Processing method for circuit board and nickel-gold circuit board Download PDFInfo
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- CN105101659A CN105101659A CN201410219479.8A CN201410219479A CN105101659A CN 105101659 A CN105101659 A CN 105101659A CN 201410219479 A CN201410219479 A CN 201410219479A CN 105101659 A CN105101659 A CN 105101659A
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- insulation board
- nickel
- wet film
- gold
- layer
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Abstract
The invention discloses a processing method for a circuit board and a nickel-gold circuit board. The technical problems are solved that manufacturing technological flows of a present double-sided printed circuit board are complex and the cost is high. The method comprises steps: a surface of an insulating plate is coated with a wet film, and the wet film covers a non-circuit graph region of the surface of the insulating plate; an activated palladium technology is employed, and a layer of activated palladium metal is adsorbed on the circuit graph region, which is not covered by the wet film, of the surface of the insulating plate; a nickel and gold deposition technology is employed, a nickel layer and a gold layer are deposited on the circuit graph region, which adsorbs activated palladium metal, of the surface of the insulating plate as a circuit graph; the wet film covering the surface of the insulating plate is removed.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of circuit board processing method and nickel gold circuit board.
Background technology
Conventional two sided pcb manufacture craft generally comprises following steps: blanking-boring-heavy copper-plating-outer figure-outer erosion-outer inspection-welding resistance-exposure-character-Biao painting-profile-electrical measurement-last instance-one-tenth inspection-packaging.
Visible, existing fabrication processing is complicated, and expend time in length, and easily timeliness is paid in impact.
And existing manufacture craft adopts Copper Foil to form line pattern, and cost is higher.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board processing method and nickel gold circuit board, complicated to solve existing two sided pcb fabrication processing, the technical problem that cost is higher.
First aspect present invention provides a kind of circuit board processing method, comprising:
At insulation board surface-coated wet film, described wet film covers the logicalnot circuit graphics field on insulation board surface;
Adopt activation palladium technique, do not cover the line pattern region of wet film on insulation board surface, absorption one deck activation palladium metal;
Adopt heavy nickel gold process, in the line pattern region on insulation board surface adsorption activation palladium metal, nickel deposited layer gold, as line pattern;
Remove the wet film of described insulation board surface-coated.
Second aspect present invention provides a kind of nickel gold circuit board, comprising:
Insulation board, and be formed in described insulation board line pattern at least simultaneously;
Described line pattern comprises one deck activation palladium metal be adsorbed on described insulation board, and the nickel dam be deposited on successively in described activation palladium metal and layer gold.
Therefore the embodiment of the present invention adopts activation palladium technique and heavy nickel gold process to form the technical scheme of line pattern on insulation board surface, achieves following technique effect:
Flow process is simple, and the course of processing expends time in shorter;
Direct employing nickel gold, as line layer, without the need to copper foil layer, reduces cost;
The loss of signal of nickel line layer is little, and antijamming capability is strong;
The nickel golden circuit graphical quality formed is higher.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of a kind of circuit board processing method that the embodiment of the present invention provides;
Fig. 2 a is the schematic diagram of the insulation board of processing oil via and location hole;
Fig. 2 b is the schematic diagram of the insulation board covered after wet film;
Fig. 2 c is the schematic diagram forming line pattern on insulation board;
Fig. 2 d is the schematic diagram removing wet film;
Fig. 2 e is the vertical view of the circuit board obtained.
Embodiment
The embodiment of the present invention provides a kind of circuit board processing method and nickel gold circuit board, complicated to solve existing two sided pcb fabrication processing, the technical problem that cost is higher.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of circuit board processing method, can comprise:
110, at insulation board surface-coated wet film, described wet film covers the logicalnot circuit graphics field on insulation board surface.
Embodiment of the present invention method, does not adopt copper-clad plate, but adopts insulation board, directly on insulation board, forms line pattern.Said insulation board, also can be described as false central layer, that is, the insulating barrier in the middle of copper-clad plate, is removed by the copper foil layer on copper-clad plate two sides, is said insulation board in the present embodiment.General, said insulation board can be various types of resin plate, such as epoxy resin board.
In the present embodiment, according to size and the dielectric thickness requirement of circuit board product, the insulation board of blanking corresponding size and thickness.Further, preprocessing can be carried out to this insulation board in advance, such as, shown in Fig. 2 a, can comprise: on insulation board 200, process via 201 and location hole 202; Roughening treatment is carried out to the surface of described insulation board 200; Deng.Said roughening treatment can comprise: adopt abrasive band or grinder buffing, the modes such as desmearing dye, by the alligatoring of insulation board surface resin, to improve adhesion when the various metal level of subsequent deposition.
As shown in Figure 2 b, after preliminary treatment is carried out to insulation board 200, can at insulation board 200 surface-coated wet film 203, to prepare processing line figure.In this step, coated wet film covers the logicalnot circuit graphics field on insulation board 200 surface, and manifest line pattern region, wherein, the various boring such as the via processed also reveals.In some embodiments, can in the one side of insulation board, whole plate covers wet film; At the another side of insulation board, only cover wet film in logicalnot circuit graphics field.In other embodiments, wet film then can cover the logicalnot circuit graphics field on insulation board two sides, and the line pattern region on two sides all reveals.
In some embodiments of the invention, above-mentioned can comprise at insulation board surface-coated wet film:
At the whole plate roller coating wet film in insulation board surface;
After pre-firing processes, figure transfer process is adopted the development of the wet film in line pattern region to be removed;
To the wet film baking-curing covering logicalnot circuit graphics field.
120, adopt activation palladium technique, do not cover the line pattern region of wet film on insulation board surface, absorption one deck activation palladium metal; Then, adopt heavy nickel gold process, in the line pattern region on insulation board surface adsorption activation palladium metal, nickel deposited layer gold, as line pattern.
As shown in Figure 2 c, in this step, first adopt activation palladium technique, do not cover the line pattern region of wet film 203 on insulation board 200 surface, absorption one deck activation palladium metal.This activation palladium metal as catalyst, for facilitating the deposition of nickel on follow-up base material.Then, directly adopt heavy nickel gold process, by activation palladium as catalyst, in the line pattern region on insulation board surface adsorption activation palladium metal, nickel deposited layer gold, as line pattern 204.
Described nickel-gold layer comprises nickel dam and is attached to the layer gold on nickel dam surface; Wherein, optionally, the thickness of the nickel dam of deposition can be 5-10um, and the thickness of layer gold can be 0.03-0.1um.
Wherein, before heavy nickel gold process, chemical nickel and gold pre-treatment is skipped.
130, the wet film of described insulation board surface-coated is removed.
As shown in Figure 2 d, in this step, remove the wet film 203 of insulation board 200 surface-coated, obtain required circuit board 20.The vertical view of this circuit board 20 as shown in Figure 2 e.At least one side of this circuit board 20 is formed with line pattern 204, and this line pattern 204 comprises nickel dam and layer gold.Layer gold, for the protection of nickel dam, prevents nickel dam to be oxidized.
Optionally, the wet film of the described insulation board surface-coated of described removal comprises:
Alkaline solution is adopted described wet film etching to be removed;
Adopt acid easily by the booty on described layer gold surface and oxide removal.
Concrete, the alkaline solution of 5-15% can be adopted, such as NaOH, by the mode of soaking or spray, wet film be got rid of; Then, the acid solution of 3-5% can be adopted, such as sulfuric acid, the booty on layer gold surface or oxide are disposed.
Follow-up, common process can be adopted to carry out milling profile, pack etc., repeat no more.
Above, the embodiment of the invention discloses a kind of circuit board processing method, adopt activation palladium technique and heavy nickel gold process to form the technical scheme of line pattern on insulation board surface, achieve following technique effect:
Flow process is simple, and the course of processing expends time in shorter;
Direct employing nickel gold, as line layer, without the need to copper foil layer, reduces cost;
The loss of signal of nickel line layer is little, and antijamming capability is strong;
The nickel golden circuit graphical quality formed is higher.
Embodiment two,
Please refer to Fig. 2 d and 2e, the embodiment of the present invention provides a kind of nickel gold circuit board, can comprise:
Insulation board 200, and be formed in described insulation board 200 line pattern 204 at least simultaneously;
Described line pattern 204 comprises one deck activation palladium metal be adsorbed on described insulation board, and is deposited on the nickel-gold layer in described activation palladium metal successively.
Described nickel-gold layer comprises nickel dam and is attached to the layer gold on nickel dam surface; Wherein, optionally, the thickness of described nickel dam is 5 to 10 microns; The thickness of described layer gold is 0.03 to 0.1 micron.
Above, the embodiment of the invention discloses a kind of nickel gold circuit board, achieve following technique effect:
Adopt nickel gold as line layer, without the need to copper foil layer, reduce cost;
The loss of signal of nickel line layer is little, and antijamming capability is strong;
The nickel golden circuit graphical quality formed is higher.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
The circuit board processing method provided the embodiment of the present invention above and nickel gold circuit board are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (7)
1. a circuit board processing method, is characterized in that, comprising:
At insulation board surface-coated wet film, described wet film covers the logicalnot circuit graphics field on insulation board surface;
Adopt activation palladium technique, do not cover the line pattern region of wet film on insulation board surface, absorption one deck activation palladium metal;
Adopt heavy nickel gold process, in the line pattern region on insulation board surface adsorption activation palladium metal, nickel deposited layer gold, as line pattern;
Remove the wet film of described insulation board surface-coated.
2. method according to claim 1, is characterized in that, described before insulation board surface-coated wet film, also comprises:
Described insulation board is processed via and location hole;
Roughening treatment is carried out to the surface of described insulation board.
3. method according to claim 1, is characterized in that, describedly comprises at insulation board surface-coated wet film:
At the whole plate roller coating wet film in insulation board surface;
After pre-firing processes, figure transfer process is adopted the development of the wet film in line pattern region to be removed;
To the wet film baking-curing covering logicalnot circuit graphics field.
4. method according to claim 1, is characterized in that:
Described nickel-gold layer comprises nickel dam and is attached to the layer gold on nickel dam surface; Wherein,
The thickness of described nickel dam is 5 to 10 microns;
The thickness of described layer gold is 0.03 to 0.1 micron.
5. method according to claim 1, is characterized in that, the wet film of the described insulation board surface-coated of described removal comprises:
Alkaline solution is adopted described wet film etching to be removed;
Adopt acid easily by the booty on described layer gold surface and oxide removal.
6. a nickel gold circuit board, is characterized in that, comprising:
Insulation board, and be formed in described insulation board line pattern at least simultaneously;
Described line pattern comprises one deck activation palladium metal be adsorbed on described insulation board, and is deposited on the nickel-gold layer in described activation palladium metal.
7. nickel gold circuit board according to claim 6, is characterized in that:
Described nickel-gold layer comprises nickel dam and is attached to the layer gold on nickel dam surface; Wherein,
The thickness of described nickel dam is 5 to 10 microns;
The thickness of described layer gold is 0.03 to 0.1 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219479.8A CN105101659A (en) | 2014-05-22 | 2014-05-22 | Processing method for circuit board and nickel-gold circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219479.8A CN105101659A (en) | 2014-05-22 | 2014-05-22 | Processing method for circuit board and nickel-gold circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101659A true CN105101659A (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410219479.8A Pending CN105101659A (en) | 2014-05-22 | 2014-05-22 | Processing method for circuit board and nickel-gold circuit board |
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| Country | Link |
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| CN (1) | CN105101659A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402607A (en) * | 2001-08-13 | 2003-03-12 | 实密科技股份有限公司 | Method for selectively plating metal by screen printing |
| CN1403628A (en) * | 2001-08-30 | 2003-03-19 | 长春石油化学股份有限公司 | Method of activating non-conducting base plate for non-electric plating |
| JP2014031576A (en) * | 2012-08-06 | 2014-02-20 | Samsung Electro-Mechanics Co Ltd | Method for producing printed circuit board |
-
2014
- 2014-05-22 CN CN201410219479.8A patent/CN105101659A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402607A (en) * | 2001-08-13 | 2003-03-12 | 实密科技股份有限公司 | Method for selectively plating metal by screen printing |
| CN1403628A (en) * | 2001-08-30 | 2003-03-19 | 长春石油化学股份有限公司 | Method of activating non-conducting base plate for non-electric plating |
| JP2014031576A (en) * | 2012-08-06 | 2014-02-20 | Samsung Electro-Mechanics Co Ltd | Method for producing printed circuit board |
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Application publication date: 20151125 |
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