CN104902701A - Circuit board processing method and circuit board having single-surface hole ring - Google Patents
Circuit board processing method and circuit board having single-surface hole ring Download PDFInfo
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- CN104902701A CN104902701A CN201410079813.4A CN201410079813A CN104902701A CN 104902701 A CN104902701 A CN 104902701A CN 201410079813 A CN201410079813 A CN 201410079813A CN 104902701 A CN104902701 A CN 104902701A
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Abstract
The invention discloses a circuit board processing method and a circuit board having a single-surface hole ring so as to solve the technical problem of how to produce the circuit board having the single-surface hole ring. In some feasible execution modes, the method comprises the following steps: processing an outer-layer metal layer on a first surface of a multilayer laminated board to form a first outer-layer circuit layer; laminating an isolation protection film, an insulating layer and a false core plate on the first outer-layer circuit layer; producing a metalized through hole in a circuit board structure obtained through laminating, the metalized through hole running through a non-circuit graph area of the first outer-layer circuit layer; processing an outer-layer metal layer on a second surface of the multilayer laminated board to form a second outer-layer circuit layer, the second outer-layer circuit layer comprising a hole ring formed around the metalized through hole; and removing the isolation protection film, the insulating layer and the false core plate laminated on the first outer-layer circuit layer to obtain the circuit board having the single-surface hole ring.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of circuit board processing method and the circuit board with one side orifice ring.
Background technology
For the circuit board with plated-through hole, in the etching step forming surface lines figure, need with etchant resist, through hole to be covered, in order to avoid etching solution enters, the coat of metal etching on through-hole wall is removed.So after etching step, all can form orifice ring around the through hole aperture of circuit board both side surface, two orifice rings laying respectively at circuit board two sides are connected with the metallization inwall of through hole.
But, along with the development that circuit board is intensive, circuit board surface wiring and welding density more and more higher, do not need in some application scenarios circuit board side surface formed orifice ring.Adopt one side orifice ring structure fabrication louvre and general via by the development trend through becoming future.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board processing method and has the circuit board of one side orifice ring, to solve the technical problem how making the circuit board with one side orifice ring.
First aspect present invention provides a kind of circuit board processing method, comprising:
The outer layer metal layer of multilayer laminate first surface is processed as the first outer-layer circuit layer;
Pressing isolation protection film, insulating barrier and false central layer on described first outer-layer circuit layer;
The board structure of circuit that pressing obtains makes plated-through hole, and described plated-through hole is through the logicalnot circuit graphics field of described first outer-layer circuit layer;
The outer layer metal layer of described multilayer laminate second is processed as the second outer-layer circuit layer, and described second outer-layer circuit layer comprises the orifice ring be formed in around described plated-through hole aperture;
The isolation protection film, insulating barrier and the false central layer that are pressed together on described first outer-layer circuit layer are removed, obtains the circuit board with one side orifice ring.
Second aspect present invention provides a kind of circuit board with one side orifice ring;
The two sides of described circuit board has the first outer-layer circuit layer and the second outer-layer circuit layer respectively, at least one plated-through hole is through described circuit board, wherein, described plated-through hole is through the logicalnot circuit graphics field of described first outer-layer circuit layer, and described second outer-layer circuit layer comprises the orifice ring be formed in around described plated-through hole aperture.
Therefore; the embodiment of the present invention adopts first at the first surface etching formation first outer-layer circuit layer of multilayer laminate; then pressing isolation protection film, insulating barrier and false central layer are protected; make plated-through hole again; after the second facet etch forms the second outer-layer circuit layer; remove the technical scheme of isolation protection film, insulating barrier and false central layer, achieve following technique effect:
Owing to being first form the first outer-layer circuit layer at first surface, then make plated-through hole, and plated-through hole is non-line pattern region through the region of first surface, thus can not form orifice ring at first surface;
Owing to being after producing plated-through hole, then form the second outer-layer circuit layer at second, thus, when forming the second outer-layer circuit layer, be easy to form orifice ring at second;
Due to when the second facet etch, plated-through hole is protected by the isolation protection film of pressing, insulating barrier and false central layer in the aperture of first surface, the aperture of second can be protected by etchant resist, therefore, can ensure that the metallization inwall of leading plated-through hole is not removed by etching;
To sum up, adopt embodiment of the present invention method, easily the obtained circuit board with one side orifice ring.And this circuit board with one side orifice ring, outer space can be saved to a great extent, increase the layout density of circuit and pad, improve the utilance of unit are circuit board, improve intensive level.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of a kind of circuit board processing method that the embodiment of the present invention provides;
Fig. 2 a to 2e is the schematic diagram in each process segment when adopting embodiment of the present invention method making circuit board;
Fig. 3 is a kind of schematic diagram with the circuit board of one side orifice ring that the embodiment of the present invention provides.
Embodiment
The embodiment of the present invention provides a kind of circuit board processing method and has the circuit board of one side orifice ring, to solve the technical problem how making the circuit board with one side orifice ring.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of circuit board processing method, can comprise:
110, the outer layer metal layer of multilayer laminate first surface is processed as the first outer-layer circuit layer.
In the embodiment of the present invention, said circuit board can be the multilayer laminate based on double face copper lamination.Concrete, this multilayer laminate can be, one or more layers double face copper stacked in centre, the direct laminated copper foil layer on two sides, and stacked insulating bond such as prepreg between each layer double face copper and copper foil layer, pressing forms.Wherein, before pressing, double face copper is produced out line layer.
Embodiment of the present invention method, can make the plated-through hole with one side orifice ring in multilayer laminate.Wherein, suppose to need second in multilayer laminate to form orifice ring, then do not form orifice ring at first surface.Then, above-mentioned pressing is formed in the step of multilayer laminate, at first surface, the thickness of the line layer that can be formed as required to configure the copper foil layer of respective thickness, the copper foil layer of such as 1 ounce (1OZ approximates 0.035 millimeter for OZ, thickness unit) thickness; At second, because follow-up can plating thickens, during matching board, thinner copper foil layer can be configured, such as, configure the copper foil layer that thickness is 3/7ths ounce thickness.
In the embodiment of the present invention, will distinguish and make outer-layer circuit layer in two steps.As shown in Figure 2 a, in this step, first at the first surface not needing formation orifice ring of multilayer laminate 20, make the first outer-layer circuit layer 21.Concrete steps can comprise: needed by multilayer laminate 20 first surface to form the region of line pattern and whole second covering etchant resist, be then placed in etching bath and etch, form outer-layer circuit figure 21 at first surface, then, remove etchant resist.
120, pressing isolation protection film, insulating barrier and false central layer on described first outer-layer circuit layer.
As shown in Figure 2 b, this step is pressing isolation protection film 22, insulating barrier 23 and false central layer 24 on the first outer-layer circuit layer 21, protects the first surface of multilayer laminate 20, affects to avoid follow-up flow process.Wherein, insulating barrier 23 can comprise the insulating medium layer 2301 of not gummosis or low gummosis and can be specifically prepreg for playing the insulating bond 2032(of cementation).
Said isolation protection film 22 can be the diaphragm with following character: on the one hand, has stronger anti-caking, avoids combining closely with multilayer laminate 20 and insulating barrier 23, facilitates follow-up removal; On the other hand, stronger plating resist can be had, avoid the follow-up part as through-hole wall to be plated.In some embodiments of the invention, described isolation protection film can be the isolation protection film of Teflon material.In some other embodiment, described isolation protection film also can be that other meets the diaphragm of above-mentioned character.
Said false central layer 24 can be a kind of insulation board had compared with strong hardness, can be glass-epoxy plate, such as FR4.In some embodiments, the etching of the copper foil layer on common double face copper two sides can be removed, the insulating barrier in the middle of retaining is as this false central layer.In another kind of embodiment, also prepreg thoroughly can be solidified, form harder insulation board, as this false central layer.
In some embodiments of the invention, step 120 can comprise: fold isolation protection film 22 in the central circuit area level of described first outer-layer circuit layer 21, and, at the stacked not gummosis in circuit peripheral region of described first outer-layer circuit layer 21 or the insulating medium layer 2301 of low gummosis; Described isolation protection film and insulating medium layer stack gradually insulating bond 2302 and false central layer 24; Then pressing is carried out.
Wherein, said circuit peripheral region can be multilayer laminate 20 first surface apart from its border the neighboring area of distance within 10 to 20 millimeters, the material in this region can in the end be removed by milling profile.Said central land is multilayer laminate 20 first surface, by the middle section that said circuit peripheral region surrounds.Due to the anti-caking of isolation protection film 22; it is caused to be difficult to be pressed together in multilayer laminate; therefore; adopting makes the area of isolation protection film 22 be less than the area of multilayer laminate 20; around isolation protection film 22 with top the mode of stacked insulating barrier; isolation protection film 22 is included in inside insulating barrier 23, completes pressing.The false central layer 24 arranged above insulating barrier 23, then for guaranteeing the plate face planarization after pressing, because insulating barrier 23 is generally prepreg, the resin material that it comprises in the process of high-temperature laminating can melt flowing, can not directly as outermost layer.
130, the board structure of circuit obtained in pressing makes plated-through hole, and described plated-through hole is through the logicalnot circuit graphics field of described first outer-layer circuit layer.
As shown in Figure 2 c, the board structure of circuit obtained in pressing in this step makes plated-through hole 25.
In some embodiments of the invention, this step specifically can comprise: holes drilled through 25 on the board structure of circuit that pressing obtains, and described through hole 25 is through the logicalnot circuit graphics field of described first outer-layer circuit layer; Carry out heavy copper and plating, metallized by described through hole 25, wherein, the hole wall being positioned at described isolation protection film scope of described through hole 25 can not be coated with metal.
Wherein, in order to the first surface not in multilayer laminate 20 forms orifice ring, plated-through hole 25 should be logicalnot circuit graphics field through the region of first surface.
Wherein, in the step of described heavy copper and plating, the outer layer metal layer of described multilayer laminate 20 second can be plated the thickness thickened to required, such as 1OZ.
140, the outer layer metal layer of described multilayer laminate second is processed as the second outer-layer circuit layer, described second outer-layer circuit layer comprises the orifice ring be formed in around described plated-through hole aperture.
As shown in Figure 2 d, the second outer-layer circuit layer 26 can be made multilayer laminate 20 second in this step.Manufacturing process can comprise: multilayer laminate 20 second is needed the region forming line pattern, comprise the aperture of plated-through hole 25, cover etchant resist, then be placed in etching bath to etch, form outer-layer circuit figure 21 at second, finally, remove etchant resist.Wherein, because the aperture of plated-through hole 25 is coated with etchant resist, then the circle outer layer metal layer around aperture can be retained, and form orifice ring 27, this orifice ring 27 is connected with the metallization inwall of plated-through hole 25.
150, the isolation protection film, insulating barrier and the false central layer that are pressed together on described first outer-layer circuit layer are removed, obtain the circuit board with one side orifice ring.
Can adopt the dark miller skill of control in this step, isolation protection film, insulating barrier and the false central layer be just pressed together on described first outer-layer circuit layer is removed, the obtained circuit board with one side orifice ring.
As shown in Figure 2 e; in some embodiments of the invention; step 150 specifically can comprise: adopt the dark miller skill of control; to be pressed together on described first outer-layer circuit layer 21 and correspond to the false central layer 24 of described insulation blocking diaphragm area and insulating bond 2302 mills; and take out described isolation protection film 22; make, the insulating medium layer 2301 of described circuit peripheral region, insulating bond 2302 and false central layer 24 form edges of boards frame 28.
In some embodiments of the invention, in the step of follow-up circuit board milling profile, can be removed by described edges of boards frame 28, final formation has the circuit board of one side orifice ring, as shown in Figure 3.This circuit board with plated-through hole is only formed with orifice ring in the second face, does not then have orifice ring at first surface.
To sum up; the embodiment of the invention discloses a kind of circuit board processing method; the method adopts first at the first surface etching formation first outer-layer circuit layer of multilayer laminate; then pressing isolation protection film, insulating barrier and false central layer are protected; make plated-through hole again, after the second facet etch forms the second outer-layer circuit layer, remove the technical scheme of isolation protection film, insulating barrier and false central layer; for processing the circuit board with one side orifice ring, there is following technique effect:
Owing to being first form the first outer-layer circuit layer at first surface, then make plated-through hole, and plated-through hole is non-line pattern region through the region of first surface, thus can not form orifice ring at first surface;
Owing to being after producing plated-through hole, then form the second outer-layer circuit layer at second, thus, when forming the second outer-layer circuit layer, be easy to form orifice ring at second;
Due to when the second facet etch, plated-through hole is protected by the isolation protection film of pressing, insulating barrier and false central layer in the aperture of first surface, the aperture of second can be protected by etchant resist, therefore, can ensure that the metallization inwall of leading plated-through hole is not removed by etching;
To sum up, adopt embodiment of the present invention method, easily the obtained circuit board with one side orifice ring.And this circuit board with one side orifice ring, outer space can be saved to a great extent, increase the layout density of circuit and pad, improve the utilance of unit are circuit board, improve intensive level.
Embodiment two,
Please refer to Fig. 3, the embodiment of the present invention provides a kind of circuit board with one side orifice ring.
The two sides of described circuit board has the first outer-layer circuit layer 21 and the second outer-layer circuit layer 26 respectively, at least one plated-through hole 25 is through described circuit board, wherein, described plated-through hole 25 is through the logicalnot circuit graphics field of described first outer-layer circuit layer 21, and described second outer-layer circuit layer 26 comprises the orifice ring 27 be formed in around described plated-through hole 25 aperture.
In some embodiments of the invention, described circuit board comprises at least one deck internal layer circuit layer, and described plated-through hole 25 is connected with one or more layers in described at least one deck internal layer circuit layer.
To sum up, the embodiment of the invention discloses a kind of circuit board with one side orifice ring, treat that circuit board can adopt method disclosed in embodiment one to process, about the more detailed description of this circuit board, the related content can recorded in reference example one.
The circuit board of what the embodiment of the present invention provided have one side orifice ring, outer space can be saved to a great extent, increase the layout density of circuit and pad, improve the utilance of unit are circuit board, improve intensive level, reduce the space hold to institute's application apparatus.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
Above the circuit board processing method that the embodiment of the present invention provides is described in detail with the circuit board with one side orifice ring, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (9)
1. a circuit board processing method, is characterized in that, comprising:
The outer layer metal layer of multilayer laminate first surface is processed as the first outer-layer circuit layer;
Pressing isolation protection film, insulating barrier and false central layer on described first outer-layer circuit layer;
The board structure of circuit that pressing obtains makes plated-through hole, and described plated-through hole is through the logicalnot circuit graphics field of described first outer-layer circuit layer;
The outer layer metal layer of described multilayer laminate second is processed as the second outer-layer circuit layer, and described second outer-layer circuit layer comprises the orifice ring be formed in around described plated-through hole aperture;
The isolation protection film, insulating barrier and the false central layer that are pressed together on described first outer-layer circuit layer are removed, obtains the circuit board with one side orifice ring.
2. method according to claim 1, is characterized in that, described on described first outer-layer circuit layer pressing isolation protection film, insulating barrier and false core layer comprise:
Isolation protection film is folded in the central circuit area level of described first outer-layer circuit layer, and, at the stacked not gummosis in circuit peripheral region of described first outer-layer circuit layer or the insulating medium layer of low gummosis;
Described isolation protection film and insulating medium layer stack gradually insulating bond and false central layer;
Carry out pressing.
3. method according to claim 2, is characterized in that, the described isolation protection film, insulating barrier and the false core layer that are pressed together on described first outer-layer circuit layer removals comprises:
Adopt the dark miller skill of control; to be pressed together on described first outer-layer circuit layer and correspond to the false central layer of described insulation blocking diaphragm area and insulating bond mills; and take out described isolation protection film; make, the dielectric layer region of described circuit peripheral region, insulating bond and false central layer form edges of boards frame.
4. method according to claim 3, is characterized in that, also comprises:
In the step of circuit board milling profile, described edges of boards frame is removed.
5. method according to claim 1, is characterized in that, the described board structure of circuit obtained in pressing makes plated-through hole and comprises:
Holes drilled through on the board structure of circuit that pressing obtains, described through hole is through the logicalnot circuit graphics field of described first outer-layer circuit layer;
Carry out heavy copper and plating, by described via metal, wherein, the hole wall being positioned at described isolation protection film scope of described through hole can not be coated with metal.
6. method according to claim 5, is characterized in that:
In the step of described heavy copper and plating, the outer layer metal layer of described multilayer laminate second is plated the thickness thickened to required.
7. method according to any one of claim 1 to 6, is characterized in that:
Described isolation protection film is the isolation protection film of Teflon material.
8. there is a circuit board for one side orifice ring, it is characterized in that:
The two sides of described circuit board has the first outer-layer circuit layer and the second outer-layer circuit layer respectively, at least one plated-through hole is through described circuit board, wherein, described plated-through hole is through the logicalnot circuit graphics field of described first outer-layer circuit layer, and described second outer-layer circuit layer comprises the orifice ring be formed in around described plated-through hole aperture.
9. circuit board according to claim 8, is characterized in that:
Described circuit board comprises at least one deck internal layer circuit layer, and described plated-through hole is connected with one or more layers in described at least one deck internal layer circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410079813.4A CN104902701B (en) | 2014-03-05 | 2014-03-05 | A kind of circuit board processing method and the circuit board with single side orifice ring |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410079813.4A CN104902701B (en) | 2014-03-05 | 2014-03-05 | A kind of circuit board processing method and the circuit board with single side orifice ring |
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| CN104902701A true CN104902701A (en) | 2015-09-09 |
| CN104902701B CN104902701B (en) | 2019-03-05 |
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| CN201410079813.4A Active CN104902701B (en) | 2014-03-05 | 2014-03-05 | A kind of circuit board processing method and the circuit board with single side orifice ring |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018130229A1 (en) * | 2017-01-16 | 2018-07-19 | 中兴通讯股份有限公司 | Printed circuit board and method for preparing same |
| CN109195363A (en) * | 2018-11-13 | 2019-01-11 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB of Z-direction interconnection |
| CN111565524A (en) * | 2020-05-29 | 2020-08-21 | 新华三技术有限公司合肥分公司 | Circuit board and preparation process thereof |
| CN113905541A (en) * | 2021-09-08 | 2022-01-07 | 东山精密新加坡有限公司 | Circuit board manufacturing method with cavity and circuit board |
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| KR20090125613A (en) * | 2008-06-02 | 2009-12-07 | 삼성전기주식회사 | Multi-layer circuit substrate and method of menufacturing multi-layer circuit substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018130229A1 (en) * | 2017-01-16 | 2018-07-19 | 中兴通讯股份有限公司 | Printed circuit board and method for preparing same |
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| CN113905541A (en) * | 2021-09-08 | 2022-01-07 | 东山精密新加坡有限公司 | Circuit board manufacturing method with cavity and circuit board |
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| CN104902701B (en) | 2019-03-05 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |