CN104947111A - Oxidation device of cuprous ions in acid etching liquid for printed circuit board - Google Patents
Oxidation device of cuprous ions in acid etching liquid for printed circuit board Download PDFInfo
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- CN104947111A CN104947111A CN201510381421.8A CN201510381421A CN104947111A CN 104947111 A CN104947111 A CN 104947111A CN 201510381421 A CN201510381421 A CN 201510381421A CN 104947111 A CN104947111 A CN 104947111A
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- jet pipe
- acidic etching
- circuit board
- printed circuit
- etching solution
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Abstract
The invention provides an oxidation device of cuprous ions in acid etching liquid for a printed circuit board. The oxidation device comprises a housing, a fixed disk, a cover plate, a spray pipe, a spray disk, a dispersion disk and a water inlet pipe, wherein the fixed disk and the cover plate are arranged at the lower end and the upper end of the housing respectively; the spray pipe is connected with the spray disk, and contained in the housing; the spray pipe is connected with the water inlet pipe by the dispersion disk; an air inlet penetrating through the upper surface and the lower surface of the cover plate is formed in the center of the cover plate; and the spray disk comprises a nozzle connected with the dispersion disk, and air holes surrounding the nozzle. According to the structure, the acid etching liquid flows into the nozzle from the water inlet pipe and is sprayed into the spray pipe, an oxidizing gas enters the spray pipe from the air inlet under the action of negative pressure, the oxidizing gas and the acid etching liquid are converged in the spray pipe and mixed fully to undergo a chemical reaction, so that the cuprous ions in the acid etching liquid are oxidized into bivalent copper ions to realize cuprous ion oxidation and the recycle of the oxidizing gas in regeneration treatment of the acid etching liquid.
Description
Technical field
The invention belongs to circuit card acidic etching liquid technical field of regeneration, particularly relating to a kind of printed circuit board acidic etching solution cuprous ion oxidation unit for the cuprous ion produced in the acidic etching liquid of printed circuit board (PCB) being oxidized to bivalent cupric ion.
Background technology
Printed circuit board (pcb board) also claims printed circuit board (PCB), it take insulcrete as base material, be cut into certain size, at least with a conductive pattern on it, as substrate, and hole (as open holess such as component hole, firm hole, metal aperture) is provided with on substrate top, be used for replacing the chassis of device electronic devices and components in the past, realize the electrical connection between component pin by the conductive pattern on substrate, pad and metallization via hole.As the parts that electronic product is substantially the most also most crucial, printed circuit board is widely used on each electronic product and main equipment and device.
Current global printed circuit board (PCB) industry production value accounts for more than 1/4th of the electronic component industry gross output value, and be the industry that in each electronic component segmentation industry, proportion is maximum, industry size reaches 40,000,000,000 dollars.Meanwhile, due to its unique status in basic electronic industry, most active industry in contemporary electronic element industry has been become.Along with China's electronic industry annual growth is more than 20%, also driven printed circuit board (PCB) and related industries development, China has become the printed circuit board (PCB) production center the biggest in the world.
Etch process manufactures requisite important step in printed circuit board (PCB) process at present, and in printed circuit board (PCB) production process, usual acid or alkali etching explained hereafter circuit card, therefore, will produce a large amount of this acidity or alkaline etching liquid every year.Wherein, acidic etching liquid has hydrochloric acid, hydrochloric acid+technique such as propylhomoserin sodium, hydrochloric acid+hydrogen peroxide, and the main component of acidic etching waste liquid is CuCl
2, HCl, NH
4cl or NaCl etc., wherein copper content is 100 ~ 145g/L, and acidity is 1 ~ 4N, and density is 1.2 ~ 1.4g/ml.Lateral erosion is little, speed is easy to control and be easy to the features such as regeneration because have for these acidic etching liquids produced, and is widely used.In etching process, Cu
2+cu is generated with Cu effect
+, along with the carrying out of etching reaction, Cu
+quantity gets more and more, Cu
2+reduce, etching solution etch capabilities declines very soon, for keeping stable etch capabilities, need add oxygenant or drum air make Cu
+be converted into Cu as early as possible
2+; Simultaneously as Cu in etching cylinder
2+when concentration reaches certain numerical value or when the solution of etching cylinder exceedes certain volume, need timely exclusive segment etching solution to ensure the normal operation of etching work procedure, this discharge etching solution is referred to as etching waste liquor.
And in order to the waste that reduces resource and the pollution to environment, the method process that electrolytically etching liquid regenerates often is used in industry, but the gas of oxidisability certainly will be produced at electrolytic process Anodic, if do not recycled, not only cause economic waste, cause again the secondary pollution of environment.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of printed circuit board acidic etching solution cuprous ion oxidation unit, be intended to the operation that it can not only realize continuous and automatic, and the oxidizing gas of the oxygenant that can effectively avoid acidic etching liquid to add in regeneration process and self generation is because recycling the waste caused.
The present invention realizes like this, a kind of printed circuit board acidic etching solution cuprous ion oxidation unit, it comprises shell, shaft collar, cover plate, jet pipe, injection dish, dispersion impeller and water inlet pipe, described shaft collar and described cover plate are separately positioned on the opposite end of described shell, described jet pipe is connected with described injection dish and both are all contained in described shell, one end of described jet pipe and described water inlet pipe is connected by described dispersion impeller, and another opposite end of described water inlet pipe is connected with acidic etching liquid production line; Described cover plate is connected with the anode exhaust pipeline of acid reclaim electrolyzer, and the center of described cover plate is provided with the inlet mouth running through its upper and lower surface, and described injection dish comprises the nozzle be connected with described dispersion impeller and the pore arranged around described nozzle; Described acidic etching liquid enters described dispersion impeller and described injection dish by described water inlet pipe and sprays in described jet pipe, and described oxidizing gas enters in described jet pipe from described inlet mouth, with the biochemical reaction of described acidic etching liquid hybrid concurrency, the cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion under the suction function that described pore produces.
Further, aforesaid shell is hollow columnar structures, and described shell axially has two relative upper ends of hollow, lower end and side along it; Described shaft collar is fastened on described lower end, described cover plate lid is located on described upper end, described shaft collar, described cover plate and described side surround a receiving space to accommodate described jet pipe, described injection dish and described dispersion impeller in wherein, described side offers perforate in its position near described upper end along the radial direction of described shell, and one end of described water inlet pipe is stretched in described receiving space from described perforate and is connected with described dispersion impeller.
Further, aforesaid shell, described shaft collar, described cover plate, described jet pipe, described injection dish, described dispersion impeller and described water inlet pipe all adopt acid-alkali-corrosive-resisting material to make.
Further, aforesaid shaft collar structure in the form of annular discs, the equal diameters of the lower end of its diameter and described shell; Described shaft collar is equally spaced near the position in its center of circle is provided with four openings, and described four openings are arranged around the center of circle of described shaft collar.
Further, aforesaid cover plate structure in the form of annular discs, the upper end of its diameter and described shell and the equal diameters of described shaft collar; The diameter of described inlet mouth near one end of described upper surface is less than its diameter near described lower surface one end, and described inlet mouth is the tapered opening that a top is little, bottom is large.
Further, aforesaid jet pipe is the hollow circuit cylinder tubular construction of four upper and lower openings, the diameter of the upper and lower opening of described jet pipe equals the diameter of the opening of described shaft collar, and the length of its axis is less than the axial length of described shell, the lower open end of described jet pipe is housed in opening corresponding to described shaft collar, thus makes described jet pipe fixing on the housing by described shaft collar.
Further, the lower end of aforesaid printed circuit board acidic etching solution cuprous ion oxidation unit is fixed on one and absorbs on cylinder, and described absorption cylinder is connected with described etching solution production line.
Further, aforesaid injection dish is roughly in the form of annular discs, the thickness of its axis of described injection rim is greater than the axial width of described jet pipe, its axis of described injection rim comprises chassis, telophragma from the bottom to top successively and takes over a business, described chassis, described telophragma and described in the equal diameters of taking over a business, and to be superimposed successively; Described chassis is provided with accepting groove along the upper shed position of its axial corresponding described jet pipe, and described telophragma is provided with a fluting around its center of circle, the diameter of described fluting is slightly less than the diameter of described shell; Describedly take over a business equally spacedly near the position in its center of circle to be provided with four accepting holes, described nozzle to be contained in described accepting hole and connection corresponding with described jet pipe, and what described pore coiled along described injection axially offers around the surrounding of described accepting hole.
Further, aforesaid nozzle is provided with tapered hole along the centre of its axis, and described tapered hole communicates with described jet pipe, and the material of described nozzle is titanium or titanium alloy.
Further, aforesaid dispersion impeller is hollow cone shape structure, and the upper end diameter of described dispersion impeller is less than the diameter of its lower end, is axially provided with taper communicating aperture along it; The upper end of described dispersion impeller is connected with the lower end of described water inlet pipe, and the lower end of described dispersion impeller takes over a business to be connected with described, and the tapered hole of described four nozzles is communicated with described communicating aperture.
Further, aforesaid water inlet pipe is a bend pipe structure, it bending tube portion comprising horizontal tube section and be connected with described horizontal tube section; Described horizontal tube section is connected with the etching solution production line being provided with waste drains pump, and described bending tube portion is connected with the upper end of described dispersion impeller.
The present invention compared with prior art, beneficial effect is: the printed circuit board acidic etching solution cuprous ion oxidation unit that embodiment of the present invention provides, by arranging the water inlet pipe be connected with etching solution production line, the inlet mouth of the cover plate be connected with the anode exhaust pipeline of acid reclaim electrolyzer, and the injection dish with pore and nozzle arrangements be connected with described water inlet pipe and described inlet mouth respectively and nozzle structure, thus make acidic etching liquid under the effect of pumping, flow into described nozzle from described water inlet pipe and spray into described jet pipe, the oxidizing gas that the anode of described acid reclaim electrolyzer is produced because of electrolysis enters in described jet pipe from described inlet mouth under the suction function that described pore produces, described oxidizing gas and described acidic etching liquid collect and fully mix and chemical reaction occurs in described jet pipe, cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion, thus not only realize the oxidation of cuprous ion, and realize the recycling of oxidizing gas in acidic etching liquid manipulation of regeneration.
Accompanying drawing explanation
Fig. 1 is the perspective exploded view of the printed circuit board acidic etching solution cuprous ion oxidation unit that the embodiment of the present invention provides.
Fig. 2 is the diagrammatic cross-section of the printed circuit board acidic etching solution cuprous ion oxidation unit in Fig. 1.
Fig. 3 is oxidation and the reclaiming process schematic flow sheet of printed circuit board acidic etching solution cuprous ion oxidation unit in Fig. 1.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to shown in Fig. 1 and Fig. 2, printed circuit board acidic etching solution cuprous ion oxidation unit 100 provided by the invention is for being oxidized the cuprous ion in acidic etching liquid, and described printed circuit board acidic etching solution cuprous ion oxidation unit 100 comprises shell 1, shaft collar 2, cover plate 3, jet pipe 4, injection dish 5, dispersion impeller 6 and water inlet pipe 7.Described shaft collar 2 and described cover plate 3 are separately positioned on lower end 11 and the upper end 10 of described shell 1.Described jet pipe 4 is connected with described injection dish 5 and both are all contained in described shell 1, one end of described jet pipe 4 and described water inlet pipe 7 is connected by described dispersion impeller 6, and another opposite end of described water inlet pipe 7 is connected with acidic etching liquid production line (not shown); Described cover plate 3 is connected with the anode exhaust pipeline (not shown) of acid reclaim electrolyzer.In the present embodiment, described shell 1, described shaft collar 2, described cover plate 3, described jet pipe 4, described injection dish 5, described dispersion impeller 6 and described water inlet pipe 7 all adopt acid-alkali-corrosive-resisting material to make.
Described shell 1 is hollow columnar structures, and described shell 1 axially has two relative upper ends 10 of hollow, lower end 11 and side 12 along it.Described shaft collar 2 is fastened on described lower end 11, and described cover plate 3 lid is located on described upper end 10.Described shaft collar 2, described cover plate 3 and described side 12 surround a receiving space 120 to accommodate described jet pipe 4, described injection dish 5 and described dispersion impeller 6 in wherein.Described side 12 offers perforate 121 in its position near described upper end 10 along the radial direction of described shell 1, and described perforate 121 is stretched in described receiving space 120 for one end of described water inlet pipe 7 and is connected with described dispersion impeller 6.
Described shaft collar 2 structure in the form of annular discs, the equal diameters of the lower end 11 of its diameter and described shell 1.Described shaft collar 2 is equally spaced near the position in its center of circle is provided with four openings 20, and described four openings 20 are arranged around the center of circle of described shaft collar 2.Be appreciated that described shaft collar 2 can also be arranged on the lower end 11 of described shell 1 one-body moldedly.
Described cover plate 3 structure in the form of annular discs, the upper end 10 of its diameter and described shell 1 and the equal diameters of described shaft collar 2.The center of described cover plate 3 is provided with the inlet mouth 30 on the upper and lower surface running through described cover plate 3 to make to enter in described receiving space 120 from the anode exhaust pipeline expellant gas of described acid reclaim electrolyzer from described inlet mouth 30.The diameter of described inlet mouth 30 near one end of described upper surface is less than its diameter near described lower surface one end, thus makes described inlet mouth 30 be the tapered opening that a top is little, bottom is large.
Described jet pipe 4 is the hollow circuit cylinder tubular construction of four upper and lower openings.The diameter of the upper and lower opening of described jet pipe 4 equals the diameter of the opening 20 of described shaft collar 2, and the length of its axis is less than the axial length of described shell 1.The lower open end of described jet pipe 4 is housed in the opening 20 of described shaft collar 2 correspondence, thus described jet pipe 4 is fixed on described shell 1 by described shaft collar 2, and then described jet pipe 4 can be avoided to occur rocking when ejection liquid.The lower end of described printed circuit board acidic etching solution cuprous ion oxidation unit 100 is fixed on one and absorbs on cylinder (not shown), and described absorption cylinder is connected with described etching solution production line.
The structure of described injection dish 5 and the similar of described jet pipe 4, also roughly in the form of annular discs.Described injection dish 5 is greater than the axial width of described jet pipe 4 along the thickness of its axis.Described injection dish 5 axially comprises chassis 50, telophragma 51 from the bottom to top successively along it, takes over a business 52 and four nozzles 53.Described chassis 50, described telophragma 51 and described in take over a business 52 equal diameters, and to be superimposed successively.Described chassis 50 is provided with accepting groove (non-label) with the upper open end of accommodating described jet pipe 4 in wherein along the upper shed position of its axial corresponding described jet pipe 4.Described telophragma 51 is provided with a fluting (non-label) around its center of circle, the diameter of described fluting is slightly less than the diameter of described shell 1.Describedly take over a business 52 equally spacedly near the position in its center of circle to be provided with four accepting holes 520, described nozzle 53 to be contained in described accepting hole 520 and with the corresponding connection of described jet pipe 4.Described injection dish 5 axially offers multiple pore 521 to enter for oxidizing gas around the surrounding of described accepting hole 520 along it.Described nozzle 53 is provided with tapered hole 530 along the centre of its axis.Described tapered hole 530 communicates with described jet pipe 4.In the present embodiment, described nozzle 53 is made for adopting titanium or titanium alloy material.
Described dispersion impeller 6 is in hollow cone shape structure, and the upper end diameter of described dispersion impeller 6 is less than the diameter of its lower end, is axially provided with taper communicating aperture 600 along it.The upper end of described dispersion impeller 6 is connected with the lower end of described water inlet pipe 7, and the lower end of described dispersion impeller 6 takes over a business 52 to be connected with described, thus the tapered hole 530 of described four nozzles 53 is communicated with described communicating aperture 600.
Described water inlet pipe 7 is a bend pipe structure, it bending tube portion 71 comprising horizontal tube section 70 and be connected with described horizontal tube section 70.Described horizontal tube section 70 is connected with the etching solution production line being provided with waste drains pump, to make described waste liquid enter in described device 100 from described horizontal tube section 70 under the effect of pumping.Described bending tube portion 71 is connected with the upper end of described dispersion impeller 6.
Please shown in index map 3, described printed circuit board acidic etching solution cuprous ion oxidation unit 100 is when being oxidized cuprous ion, described water inlet pipe 7 is connected with described etching solution production line, acidic etching liquid enters in described device 100 from described water inlet pipe 7 under the effect of pumping, and described nozzle 53 is flowed into uniformly under the effect of described dispersion impeller 6, sprayed in described jet pipe 4 by described nozzle 53.Simultaneously, because the inlet mouth 30 of described cover plate 3 is connected with pipeline with the anode exhaust of described acidic etching liquid electrolytic regeneration equipment, in the process that acidic etching liquid sprays, the described pore 521 be arranged on around described injection dish 5 produces negative pressure, because of the sealing function of described shell 1, described negative pressure collects in described inlet mouth 30 place, thus the oxidizing gas making the anode of described acid reclaim electrolyzer produce because of electrolysis enters in described jet pipe 4 from described inlet mouth 30 under the effect of negative pressure, and collect in described jet pipe 4 with the acidic etching liquid that described nozzle 53 sprays and fully mix.Because the gas entered in this device 100 has oxidisability, therefore, this gas mixes with acidic etching liquid and chemical reaction occurs in described jet pipe 4, thus the cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion, and its reaction formula is CuCl → (oxidation) CuCl
2, and then realize the oxidation of cuprous ion.And the acidic etching liquid flowed out from described jet pipe 4 finally flows in described absorption cylinder, and liquid medicine in described absorption cylinder and described etching solution production line circulate, and then reach the bivalent cupric ion that supplements and there is etch capabilities in etching solution production line, realize the recycling of oxidizing gas in acidic etching liquid manipulation of regeneration.
The printed circuit board acidic etching solution cuprous ion oxidation unit that embodiment of the present invention provides, by arranging the water inlet pipe 7 be connected with etching solution production line, the inlet mouth 30 of the cover plate 3 be connected with the anode exhaust pipeline of acid reclaim electrolyzer, and the injection dish 5 with pore 521 and nozzle 53 structure be connected with described water inlet pipe 7 and described inlet mouth 30 respectively and jet pipe 4 structure, thus make acidic etching liquid under the effect of pumping, flow into described nozzle 53 from described water inlet pipe 7 and spray into described jet pipe 4, the oxidizing gas that the anode of described acid reclaim electrolyzer is produced because of electrolysis enters in described jet pipe 4 from described inlet mouth 30 under the suction function that described pore 521 produces, described oxidizing gas and described acidic etching liquid collect and fully mix and chemical reaction occurs in described jet pipe 4, cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion, thus not only realize the oxidation of cuprous ion, and realize the recycling of oxidizing gas in acidic etching liquid manipulation of regeneration.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a printed circuit board acidic etching solution cuprous ion oxidation unit, comprise shell, shaft collar, cover plate, jet pipe, injection dish, dispersion impeller and water inlet pipe, described shaft collar and described cover plate are separately positioned on the opposite end of described shell, described jet pipe is connected with described injection dish and both are all contained in described shell, one end of described jet pipe and described water inlet pipe is connected by described dispersion impeller, and another opposite end of described water inlet pipe is connected with acidic etching liquid production line; Described cover plate is connected with the anode exhaust pipeline of acid reclaim electrolyzer, and the center of described cover plate is provided with the inlet mouth running through its upper and lower surface, and described injection dish comprises the nozzle be connected with described dispersion impeller and the pore arranged around described nozzle; Described acidic etching liquid enters described dispersion impeller and described injection dish by described water inlet pipe and sprays in described jet pipe, and described oxidizing gas enters in described jet pipe from described inlet mouth, with the biochemical reaction of described acidic etching liquid hybrid concurrency, the cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion under the suction function that described pore produces.
2. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 1, it is characterized in that, described shell is hollow columnar structures, and described shell axially has two relative upper ends of hollow, lower end and side along it; Described shaft collar is fastened on described lower end, described cover plate lid is located on described upper end, described shaft collar, described cover plate and described side surround a receiving space to accommodate described jet pipe, described injection dish and described dispersion impeller in wherein, described side offers perforate in its position near described upper end along the radial direction of described shell, and one end of described water inlet pipe is stretched in described receiving space from described perforate and is connected with described dispersion impeller.
3. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 2, it is characterized in that, described shell, described shaft collar, described cover plate, described jet pipe, described injection dish, described dispersion impeller and described water inlet pipe all adopt acid-alkali-corrosive-resisting material to make.
4. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 3, is characterized in that, described shaft collar structure in the form of annular discs, the equal diameters of the lower end of its diameter and described shell; Described shaft collar is equally spaced near the position in its center of circle is provided with four openings, and described four openings are arranged around the center of circle of described shaft collar.
5. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 4, is characterized in that, described cover plate structure in the form of annular discs, the upper end of its diameter and described shell and the equal diameters of described shaft collar; The diameter of described inlet mouth near one end of described upper surface is less than its diameter near described lower surface one end, and described inlet mouth is the tapered opening that a top is little, bottom is large.
6. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 5, it is characterized in that, described jet pipe is the hollow circuit cylinder tubular construction of four upper and lower openings, the diameter of the upper and lower opening of described jet pipe equals the diameter of the opening of described shaft collar, and the length of its axis is less than the axial length of described shell, the lower open end of described jet pipe is housed in opening corresponding to described shaft collar, thus makes described jet pipe fixing on the housing by described shaft collar.
7. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 6, it is characterized in that, the lower end of described printed circuit board acidic etching solution cuprous ion oxidation unit is fixed on one and absorbs on cylinder, and described absorption cylinder is connected with described etching solution production line;
Described injection dish is roughly in the form of annular discs, the thickness of its axis of described injection rim is greater than the axial width of described jet pipe, its axis of described injection rim comprises chassis, telophragma from the bottom to top successively and takes over a business, described chassis, described telophragma and described in the equal diameters of taking over a business, and to be superimposed successively; Described chassis is provided with accepting groove along the upper shed position of its axial corresponding described jet pipe, and described telophragma is provided with a fluting around its center of circle, the diameter of described fluting is slightly less than the diameter of described shell; Describedly take over a business equally spacedly near the position in its center of circle to be provided with four accepting holes, described nozzle to be contained in described accepting hole and connection corresponding with described jet pipe, and what described pore coiled along described injection axially offers around the surrounding of described accepting hole.
8. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 7, it is characterized in that, described nozzle is provided with tapered hole along the centre of its axis, and described tapered hole communicates with described jet pipe, and the material of described nozzle is titanium or titanium alloy.
9. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 8, it is characterized in that, described dispersion impeller is hollow cone shape structure, and the upper end diameter of described dispersion impeller is less than the diameter of its lower end, is axially provided with taper communicating aperture along it; The upper end of described dispersion impeller is connected with the lower end of described water inlet pipe, and the lower end of described dispersion impeller takes over a business to be connected with described, and the tapered hole of described four nozzles is communicated with described communicating aperture.
10. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 9, it is characterized in that, described water inlet pipe is a bend pipe structure, it bending tube portion comprising horizontal tube section and be connected with described horizontal tube section; Described horizontal tube section is connected with the etching solution production line being provided with waste drains pump, and described bending tube portion is connected with the upper end of described dispersion impeller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381421.8A CN104947111B (en) | 2015-07-02 | 2015-07-02 | A kind of printed circuit board acidic etching solution cuprous ion oxidation unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381421.8A CN104947111B (en) | 2015-07-02 | 2015-07-02 | A kind of printed circuit board acidic etching solution cuprous ion oxidation unit |
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| CN104947111A true CN104947111A (en) | 2015-09-30 |
| CN104947111B CN104947111B (en) | 2017-09-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115287659A (en) * | 2022-08-04 | 2022-11-04 | 深圳天华机器设备有限公司 | Etching liquid medicine regeneration device and regeneration process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06146022A (en) * | 1992-11-02 | 1994-05-27 | Tsurumi Soda Co Ltd | Etching treatment device |
| RU2142024C1 (en) * | 1998-07-29 | 1999-11-27 | Акционерное общество открытого типа "Научно-исследовательский технологический институт" (АО "НИТИ-ТЕСАР") | Apparatus for regenerating etching solution |
| CN103975096A (en) * | 2011-10-08 | 2014-08-06 | 克里斯托夫·赫克里 | Etching device for the electrolytic etching of copper |
| CN104630825A (en) * | 2015-01-20 | 2015-05-20 | 昆山美源达环保科技有限公司 | Device and process for electrolytically extracting copper in acidic etching liquid |
| CN204999974U (en) * | 2015-07-02 | 2016-01-27 | 深圳市洁驰科技有限公司 | Acid etching solution cuprous ion oxidation unit of printed circuit board |
-
2015
- 2015-07-02 CN CN201510381421.8A patent/CN104947111B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06146022A (en) * | 1992-11-02 | 1994-05-27 | Tsurumi Soda Co Ltd | Etching treatment device |
| RU2142024C1 (en) * | 1998-07-29 | 1999-11-27 | Акционерное общество открытого типа "Научно-исследовательский технологический институт" (АО "НИТИ-ТЕСАР") | Apparatus for regenerating etching solution |
| CN103975096A (en) * | 2011-10-08 | 2014-08-06 | 克里斯托夫·赫克里 | Etching device for the electrolytic etching of copper |
| CN104630825A (en) * | 2015-01-20 | 2015-05-20 | 昆山美源达环保科技有限公司 | Device and process for electrolytically extracting copper in acidic etching liquid |
| CN204999974U (en) * | 2015-07-02 | 2016-01-27 | 深圳市洁驰科技有限公司 | Acid etching solution cuprous ion oxidation unit of printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115287659A (en) * | 2022-08-04 | 2022-11-04 | 深圳天华机器设备有限公司 | Etching liquid medicine regeneration device and regeneration process |
| CN115287659B (en) * | 2022-08-04 | 2024-03-29 | 深圳天华机器设备股份有限公司 | Etching liquid regeneration device and regeneration process |
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| Publication number | Publication date |
|---|---|
| CN104947111B (en) | 2017-09-22 |
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Denomination of invention: Oxidation device of cuprous ions in acid etching liquid for printed circuit board Effective date of registration: 20180625 Granted publication date: 20170922 Pledgee: Bank of Beijing Limited by Share Ltd Shenzhen branch Pledgor: ShenZhen JeCh Technology Co., Ltd. Registration number: 2017990000696 |
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