CN104947111B - A kind of printed circuit board acidic etching solution cuprous ion oxidation unit - Google Patents
A kind of printed circuit board acidic etching solution cuprous ion oxidation unit Download PDFInfo
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- CN104947111B CN104947111B CN201510381421.8A CN201510381421A CN104947111B CN 104947111 B CN104947111 B CN 104947111B CN 201510381421 A CN201510381421 A CN 201510381421A CN 104947111 B CN104947111 B CN 104947111B
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- acidic etching
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Abstract
The present invention provides a kind of printed circuit board acidic etching solution cuprous ion oxidation unit, it includes shell, fixed disk, cover plate, jet pipe, injection disk, dispersion impeller and water inlet pipe, the fixed disk and the cover plate are separately positioned on the lower end and upper end of the shell, the jet pipe is connected and is contained in the shell with the injection disk, the jet pipe and the water inlet pipe are connected by the dispersion impeller, being provided centrally with through thereon of the cover plate, the air inlet of lower surface, the injection disk include the nozzle that be connected with the dispersion impeller and the stomata around nozzle setting；Said structure, acidic etching liquid is from the water inlet pipe flows into the nozzle and sprays into the jet pipe, oxidizing gas enters in the jet pipe under suction function from the air inlet, the oxidizing gas collects in the jet pipe with the acidic etching liquid and is sufficiently mixed and chemically reacts, so that the cuprous ion in acidic etching liquid is oxidized into bivalent cupric ion to realize the recycling of cuprous ion oxidation and oxidizing gas in acidic etching liquid regeneration treatment.
Description
Technical field
The invention belongs to circuit board acidic etching liquid technical field of regeneration, more particularly to a kind of it is used for printed circuit board (PCB)
The cuprous ion produced in acidic etching liquid is oxidized to the printed circuit board acidic etching solution cuprous ion oxidation of bivalent cupric ion
Device.
Background technology
Printed wiring board (pcb board) is also referred to as printed circuit board (PCB), and it is cut into certain size using insulation board as base material, and it is up to
Less with a conductive pattern, as substrate, and on substrate top, provided with hole, (such as component hole, firm hole, metal aperture are installed
Hole), it is real by the conductive pattern on substrate, pad and metallization via for replacing the chassis of conventional device electronic component
Electrical connection between existing component pin.Most basic as electronic product is also most crucial part, and printed wiring board is transported extensively
For each electronic product and large scale equipment and device.
Whole world printed circuit board (PCB) industry production value is accounted for more than a quarter of the electronic component industry gross output value at present, is each electricity
The maximum industry of proportion in subcomponent subdivision industry, industry size is up to 40,000,000,000 dollars.Simultaneously as it is in basic electronic industry
In unique status, have become most active industry in contemporary electronic element industry.As China's electronics industry annual growth is super
20% is crossed, has also driven printed circuit board (PCB) and related industry to develop, China has turned into printed circuit board (PCB) production the biggest in the world
The heart.
Etch process is essential important step during currently manufactured printed circuit board (PCB), in printed circuit board (PCB) production
During, generally with acid or alkaline etching process production circuit board, therefore, substantial amounts of this acid or alkalescence is produced every year
Etching solution.Wherein, acidic etching liquid has a techniques such as hydrochloric acid, hydrochloric acid+propylhomoserin sodium, hydrochloric acid+hydrogen peroxide, acidic etching waste liquid it is main
Composition is CuCl2、HCl、NH4Cl or NaCl etc., wherein copper content be 100~145g/L, acidity be 1~4N, density be 1.2~
1.4g/ml.These acidic etching liquids produced are wide because having the features such as lateral erosion is small, speed is easily controllable and is easy to regeneration
General application.In etching process, Cu2+With Cu effect generations Cu+, with the progress of etching reaction, Cu+Quantity is more and more, Cu2+
Reduce, etching solution etch capabilities decline quickly, to keep stable etch capabilities, need to add oxidant or drum air makes Cu+As early as possible
It is converted into Cu2+；Simultaneously as Cu in etching cylinder2+When concentration reaches during certain numerical value or etched that the solution of cylinder exceedes certain volume,
Need timely exclusive segment etching solution to ensure the normal operation of etching work procedure, the discharge etching solution is referred to as etching waste liquor.
And electrolytic etching liquid regeneration method is often used in the waste and the pollution to environment of resource, industry in order to reduce
Processing, but the gas of oxidisability is produced certainly in electrolytic process Anodic, if without recycling, not only caused
Economic waste, causes the secondary pollution of environment again.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of printed circuit board acidic etching solution cuprous ion oxidation
Device, it is intended to which it can not only realize the operation of continuous and automatic, and can be prevented effectively from acidic etching liquid in regeneration process
The waste of the oxidant of middle addition and the oxidizing gas of itself generation caused by it can not recycle.
The present invention is achieved in that a kind of printed circuit board acidic etching solution cuprous ion oxidation unit, and it includes outer
Shell, fixed disk, cover plate, jet pipe, injection disk, dispersion impeller and water inlet pipe, the fixed disk and the cover plate are separately positioned on described
The opposite end of shell, the jet pipe is connected with the injection disk and both of which is contained in the shell, the jet pipe and institute
The one end for stating water inlet pipe is connected by the dispersion impeller, and another opposite end and the acidic etching liquid production line of the water inlet pipe connect
Connect；The cover plate is connected with the anode exhaust pipeline of acid reclaim electrolysis installation, the cover plate be provided centrally with run through its
The air inlet on upper and lower surface, the injection disk includes the nozzle being connected with the dispersion impeller and the gas set around the nozzle
Hole；The acidic etching liquid enters the dispersion impeller and the injection disk by the water inlet pipe and sprayed into the jet pipe, institute
State oxidizing gas and enter under the suction function that the stomata is produced from the air inlet in the jet pipe and acid lost with described
Carve the biochemical reaction of liquid hybrid concurrency and the cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion.
Further, foregoing shell is hollow columnar structures, and the shell axially has hollow two relative along it
Upper end, lower end and side；The fixed disk is fastened on the lower end, and the cover plate lid is located on the upper end, described solid
Price fixing, the cover plate and the side surround a receiving space with house the jet pipe, the injection disk and the dispersion impeller in
Wherein, the side offers perforate, the one of the water inlet pipe in its radial direction along the shell of position close to the upper end
End is stretched into the receiving space from the perforate and is connected with the dispersion impeller.
Further, the foregoing shell, fixed disk, the cover plate, the jet pipe, the injection disk, described scattered
Disk and the water inlet pipe are made of acid-alkali-corrosive-resisting material.
Further, foregoing fixed disk structure in the form of annular discs, its diameter is equal with the diameter of the lower end of the shell；Institute
Fixed disk is stated close to the position in its center of circle at equal intervals provided with four openings, four openings are around the center of circle of the fixed disk
Set.
Further, foregoing cover plate structure in the form of annular discs, the upper end of its diameter and the shell and the fixed disk
Diameter is equal；Diameter of the air inlet close to one end of the upper surface is less than its diameter close to described lower surface one end,
The air inlet is the tapered opening that a top is small, bottom is big.
Further, foregoing jet pipe is the hollow circuit cylinder tubular construction of four upper and lower openings, and the upper and lower of the jet pipe opens
The diameter of mouth is equal to the diameter of the opening of the fixed disk, and its axial length is less than the axial length of the shell, described
The lower open end of jet pipe is housed in the corresponding opening of the fixed disk, so that the jet pipe is fixed on by the fixed disk
On the shell.
Further, the lower end of foregoing printed circuit board acidic etching solution cuprous ion oxidation unit is fixed on a suction
Receive on cylinder, and the absorption cylinder is connected with the etching solution production line.
Further, foregoing injection disk is substantially in the form of annular discs, and the injection disk is more than the spray along its axial thickness
The axial width of pipe, the injection disk axially includes chassis, telophragma along it and taken over a business, the chassis, institute successively from the bottom to top
State telophragma and it is described take over a business diameter it is equal, and be sequentially overlapped together；The chassis axially corresponds to the jet pipe along it
Upper shed position is provided with accepting groove, and the telophragma is provided with a fluting around its center of circle, and the diameter of the fluting is smaller
In the diameter of the shell；Described to take over a business to be provided with four accepting holes at equal intervals close to the position in its center of circle, the nozzle is housed
In in the accepting hole and it is corresponding with the jet pipe connection, the stomata along it is described injection disk axially about the accepting hole
Around open up.
Further, foregoing nozzle is provided with bellmouth, the bellmouth and the jet pipe phase along its axial centre
Logical, the material of the nozzle is titanium or titanium alloy.
Further, foregoing dispersion impeller is in hollow cone shape structure, and the upper end diameter of the dispersion impeller is less than its lower end
Diameter, axially arranged have taper intercommunicating pore along its；The upper end of the dispersion impeller is connected with the lower end of the water inlet pipe, described point
The lower end for dissipating disk takes over a business to be connected with described, and the bellmouth of four nozzles is connected with the intercommunicating pore.
Further, foregoing water inlet pipe is a bend pipe structure, and it includes horizontal tube section and is connected with the horizontal tube section
Bending pipe portion；The horizontal tube section is connected with being provided with the etching solution production line of waste drains pump, it is described bending pipe portion with it is described
The upper end connection of dispersion impeller.
Compared with prior art, beneficial effect is the present invention：The printed circuit board acidic that embodiment of the present invention is provided
Etching solution cuprous ion oxidation unit, by setting the water inlet pipe being connected with etching solution production line and acid reclaim electrolysis installation
The connection of anode exhaust pipeline cover plate air inlet, and be connected respectively with the water inlet pipe and the air inlet with gas
Hole and the injection disk and nozzle structure of nozzle arrangements, so that acidic etching liquid is flowed into the presence of pumping from the water inlet pipe
The nozzle is simultaneously sprayed into the jet pipe, makes the anode of the acid reclaim electrolysis installation because the oxidizing gas that electrolysis is produced exists
Enter under the suction function that the stomata is produced from the air inlet in the jet pipe, the oxidizing gas and the acid erosion
Carve liquid in the jet pipe to collect and be sufficiently mixed and chemically react, the cuprous ion in acidic etching liquid is oxidized to two
Valency copper ion, so as to not only realize the oxidation of cuprous ion, and realizes oxidizing gas in acidic etching liquid regeneration treatment
Recycling.
Brief description of the drawings
Fig. 1 is the stereo decomposing of printed circuit board acidic etching solution cuprous ion oxidation unit provided in an embodiment of the present invention
Schematic diagram.
Fig. 2 is the diagrammatic cross-section of the printed circuit board acidic etching solution cuprous ion oxidation unit in Fig. 1.
Fig. 3 is oxidation and the regeneration technology flow of the printed circuit board acidic etching solution cuprous ion oxidation unit in Fig. 1
Schematic diagram.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Refer to shown in Fig. 1 and Fig. 2, the printed circuit board acidic etching solution cuprous ion oxidation unit that the present invention is provided
100 are used to aoxidize the cuprous ion in acidic etching liquid, the printed circuit board acidic etching solution cuprous ion oxidation
Device 100 includes shell 1, fixed disk 2, cover plate 3, jet pipe 4, injection disk 5, dispersion impeller 6 and water inlet pipe 7.The fixed disk 2 and institute
State lower end 11 and upper end 10 that cover plate 3 is separately positioned on the shell 1.The jet pipe 4 is connected and both of which with the injection disk 5
It is contained in the shell 1, one end of the jet pipe 4 and the water inlet pipe 7 is connected by the dispersion impeller 6, the water inlet pipe 7
Another opposite end be connected with acidic etching liquid production line (not shown)；The anode of the cover plate 3 and acid reclaim electrolysis installation
Exhaust pipe connection (not shown).In the present embodiment, the shell 1, the fixed disk 2, the cover plate 3, the jet pipe
4th, the injection disk 5, the dispersion impeller 6 and the water inlet pipe 7 are made of acid-alkali-corrosive-resisting material.
The shell 1 be hollow columnar structures, the shell 1 along its axially have two hollow relative upper ends 10,
Lower end 11 and side 12.The fixed disk 2 is fastened on the lower end 11, and the lid of cover plate 3 is located on the upper end 10.It is described
Fixed disk 2, the cover plate 3 and the side 12 surround a receiving space 120 to house the jet pipe 4, the injection disk 5 and institute
Dispersion impeller 6 is stated in wherein.The side 12 offers perforate in its radial direction along the shell 1 of position close to the upper end 10
121, the perforate 121 is stretched into for one end of the water inlet pipe 7 and is connected in the receiving space 120 with the dispersion impeller 6.
The fixed disk 2 structure in the form of annular discs, its diameter is equal with the diameter of the lower end 11 of the shell 1.The fixation
Disk 2 is provided with four openings 20 at equal intervals close to the position in its center of circle, and four openings 20 surround the center of circle of the fixed disk 2
Set.It is appreciated that the fixed disk 2 is arranged on the lower end 11 of the shell 1 in which can also be integrally formed.
The cover plate 3 structure in the form of annular discs, its diameter and the upper end 10 of the shell 1 and the diameter phase of the fixed disk 2
Deng.The cover plate 3 is provided centrally with the air inlet 30 through the upper and lower surface of the cover plate 3 so that from the acid reclaim
The gas of the anode exhaust pipeline discharge of electrolysis installation enters in the receiving space 120 from the air inlet 30.It is described enter
Diameter of the gas port 30 close to one end of the upper surface is less than its diameter close to described lower surface one end, so that the air inlet
Mouth 30 is the tapered opening that a top is small, bottom is big.
The jet pipe 4 is the hollow circuit cylinder tubular construction of four upper and lower openings.Diameter of upper and lower opening of the jet pipe 4 etc.
In the diameter of the opening 20 of the fixed disk 2, and its axial length is less than the axial length of the shell 1.The jet pipe 4
Lower open end is housed in the corresponding opening 20 of the fixed disk 2, so that the jet pipe 4 is fixed on by the fixed disk 2
On the shell 1, and then the jet pipe 4 can be avoided to be rocked when decoction is sprayed.The printed circuit board acidic erosion
The lower end for carving liquid cuprous ion oxidation unit 100 is fixed on an absorption cylinder (not shown), and the absorption cylinder and the erosion
Carve the connection of liquid production line.
The structure of the injection disk 5 is similar with the structure of the jet pipe 4, also substantially in the form of annular discs.The injection disk 5 along its
The thickness of axial direction is more than the axial width of the jet pipe 4.It is described injection disk 5 along its axially from the bottom to top successively include chassis 50,
Telophragma 51, take over a business 52 and four nozzles 53.The chassis 50, the telophragma 51 and it is described take over a business 52 diameter it is equal, and
It is sequentially overlapped together.Upper shed position of the chassis 50 along its axial direction correspondence jet pipe 4 is provided with accepting groove and (not marked
Number) to house the upper open end of the jet pipe 4 in wherein.The telophragma 51 is provided with a fluting around its center of circle and (not marked
Number), the diameter of the fluting is slightly less than the diameter of the shell 1.It is described to take over a business 52 to set at equal intervals close to the position in its center of circle
There are four accepting holes 520, the nozzle 53 is contained in the accepting hole 520 and connection corresponding with the jet pipe 4.The spray
Penetrate disk 5 along its axially about offered around the accepting hole 520 multiple stomatas 521 so as to for oxidizing gas enter.Institute
State nozzle 53 and its axial centre is provided with bellmouth 530.The bellmouth 530 is communicated with the jet pipe 4.In the present embodiment
In, the nozzle 53 is made up of use titanium or titanium alloy material.
The dispersion impeller 6 is in hollow cone shape structure, and the upper end diameter of the dispersion impeller 6 is less than the diameter of its lower end, edge
Its is axially arranged taper intercommunicating pore 600.The upper end of the dispersion impeller 6 is connected with the lower end of the water inlet pipe 7, the dispersion impeller
6 lower end takes over a business 52 to be connected with described, so that the bellmouth 530 of four nozzles 53 is connected with the intercommunicating pore 600.
The water inlet pipe 7 is a bend pipe structure, and it includes horizontal tube section 70 and the bending being connected with the horizontal tube section 70
Pipe portion 71.The horizontal tube section 70 is connected with being provided with the etching solution production line of waste drains pump, to make the waste liquid in pumping
In the presence of from the horizontal tube section 70 enter described device 100 in.The bending pipe portion 71 and the upper end of the dispersion impeller 6 connect
Connect.
It please engage shown in Fig. 3, the printed circuit board acidic etching solution cuprous ion oxidation unit 100 is to cuprous ion
When being aoxidized, the water inlet pipe 7 is connected with the etching solution production line, acidic etching liquid in the presence of pumping from it is described enter
Water pipe 7 enters in described device 100, and uniformly flows into the nozzle 53 in the presence of the dispersion impeller 6, passes through the spray
Mouth 53 is sprayed into the jet pipe 4.Meanwhile, because of air inlet 30 and the acidic etching liquid electrolytic regeneration equipment of the cover plate 3
Anode exhaust is connected with pipeline, during acidic etching liquid sprays, and is arranged on the stomata around the injection disk 5
521 produce negative pressure, and because of the sealing function of the shell 1, the negative pressure is collected at the air inlet 30, so that the acidity
The anode of electrolysis installation is regenerated because being electrolysed the oxidizing gas produced in the presence of negative pressure from described in the air inlet 30 entrance
In jet pipe 4, and the acidic etching liquid sprayed with the nozzle 53 collects and is sufficiently mixed in the jet pipe 4.Should due to entering
Gas in device 100 has oxidisability, therefore, and the gas mixes with acidic etching liquid in the jet pipe 4 and occurs chemistry
Reaction, so that the cuprous ion in acidic etching liquid is oxidized into bivalent cupric ion, its reaction equation is CuCl → (oxidation)
CuCl2, and then realize the oxidation of cuprous ion.And the acidic etching liquid flowed out from the jet pipe 4 finally flows into the absorption
In cylinder, and the liquid medicine absorbed in cylinder is circulated with the etching solution production line, and then reaches that supplement has etch capabilities
Bivalent cupric ion into etching solution production line, realize recycling of the oxidizing gas in acidic etching liquid regeneration treatment.
The printed circuit board acidic etching solution cuprous ion oxidation unit that embodiment of the present invention is provided, by setting and erosion
Carve water inlet pipe 7, the air inlet for the cover plate 3 being connected with the anode exhaust pipeline of acid reclaim electrolysis installation of liquid production line connection
30, and be connected respectively with the water inlet pipe 7 and the air inlet 30 have stomata 521 and the structure of nozzle 53 injection disk 5 and
The structure of jet pipe 4, so that acidic etching liquid flows into the nozzle 53 from the water inlet pipe 7 in the presence of pumping and sprayed into described
In jet pipe 4, make what the anode of the acid reclaim electrolysis installation was produced by oxidizing gas that electrolysis is produced in the stomata 521
Enter under suction function from the air inlet 30 in the jet pipe 4, the oxidizing gas is with the acidic etching liquid described
Collect in jet pipe 4 and be sufficiently mixed and chemically react, the cuprous ion in acidic etching liquid is oxidized to bivalent cupric ion,
So as to not only realize the oxidation of cuprous ion, and realize recovery profit of the oxidizing gas in acidic etching liquid regeneration treatment
With.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of printed circuit board acidic etching solution cuprous ion oxidation unit, including shell, fixed disk, cover plate, jet pipe, injection
Disk, dispersion impeller and water inlet pipe, the fixed disk and the cover plate are separately positioned on the opposite end of the shell, the jet pipe with
The injection disk is connected and both of which is contained in the shell, and one end of the jet pipe and the water inlet pipe passes through described disperse
Disk is connected, and another opposite end of the water inlet pipe is connected with acidic etching liquid production line；The cover plate is set with acid reclaim electrolysis
Standby anode exhaust pipeline connection, being provided centrally with through thereon of the cover plate, the air inlet of lower surface, the injection disk
Including the nozzle being connected with the dispersion impeller and the stomata set around the nozzle；The acidic etching liquid passes through the water inlet
Pipe enters the dispersion impeller and the injection disk and sprayed into the jet pipe, and oxidizing gas is made in the negative pressure that the stomata is produced
Enter acid etching under from the air inlet in the jet pipe with the biochemical reaction of the acidic etching liquid hybrid concurrency
Cuprous ion in liquid is oxidized to bivalent cupric ion.
2. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 1, it is characterised in that described outer
Shell is hollow columnar structures, and the shell axially has hollow two relative upper ends, lower end and side along it；The fixation
Disk is fastened on the lower end, and the cover plate lid is located on the upper end, and the fixed disk, the cover plate and the side are surrounded
One receiving space is to house the jet pipe, the injection disk and the dispersion impeller in wherein, and the side is in it on described
Radial direction of the position at end along the shell offers perforate, and the receiving space is stretched into one end of the water inlet pipe from the perforate
It is interior to be connected with the dispersion impeller.
3. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 2, it is characterised in that described outer
Shell, the fixed disk, the cover plate, the jet pipe, the injection disk, the dispersion impeller and the water inlet pipe use acid and alkali-resistance
Corrosivity material is made.
4. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 3, it is characterised in that described solid
Price fixing structure in the form of annular discs, its diameter is equal with the diameter of the lower end of the shell；Position of the fixed disk close to its center of circle
At equal intervals provided with four openings, four openings are set around the center of circle of the fixed disk.
5. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 4, it is characterised in that the lid
Plate structure in the form of annular discs, its diameter is equal with the upper end of the shell and the diameter of the fixed disk；The air inlet is close to institute
The diameter for stating one end of cover plate upper surface is less than its diameter close to described cover plate lower surface one end, and the air inlet is a top
The big tapered opening in small, bottom.
6. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 5, it is characterised in that the spray
The hollow circuit cylinder tubular construction of Guan Weisi root upper and lower openings, the diameter of the upper and lower opening of the jet pipe is equal to opening for the fixed disk
Mouthful diameter, and its axial length is less than the axial length of the shell, and the lower open end of the jet pipe is housed in described solid
In the corresponding opening of price fixing, so that the jet pipe is fixed on the housing by the fixed disk.
7. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 6, it is characterised in that the print
The lower end of printed circuit board acidic etching liquid cuprous ion oxidation unit be fixed on one absorb cylinder on, and it is described absorption cylinder with it is described
Acidic etching liquid production line is connected；
The injection disk is substantially in the form of annular discs, and the injection disk is less than the axial width of the jet pipe, institute along its axial thickness
State injection disk axially includes chassis, telophragma along it and takes over a business, the chassis, the telophragma and the top successively from the bottom to top
The diameter of disk is equal, and is sequentially overlapped together；Upper shed position of the chassis along its axial direction correspondence jet pipe is provided with
Accepting groove, the telophragma is provided with a fluting around its center of circle, and the diameter of the fluting is slightly less than the diameter of the shell；
It is described take over a business close to its center of circle position at equal intervals provided with four accepting holes, the nozzle be contained in the accepting hole and with
The corresponding connection of the jet pipe, the stomata is along the injection disk axially about being opened up around the accepting hole.
8. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 7, it is characterised in that the spray
Mouth is provided with bellmouth along its axial centre, and the bellmouth is communicated with the jet pipe, and the material of the nozzle is titanium or titanium
Alloy.
9. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 8, it is characterised in that described point
It is in hollow cone shape structure to dissipate disk, and the upper end diameter of the dispersion impeller is less than the diameter of its lower end, axially arranged has taper along its
Intercommunicating pore；The upper end of the dispersion impeller is connected with the lower end of the water inlet pipe, and the lower end of the dispersion impeller takes over a business to be connected with described,
The bellmouth of four nozzles is connected with the intercommunicating pore.
10. printed circuit board acidic etching solution cuprous ion oxidation unit as claimed in claim 9, it is characterised in that described
Water inlet pipe is a bend pipe structure, and it includes horizontal tube section and the bending pipe portion being connected with the horizontal tube section；The horizontal tube section
It is connected with the acidic etching liquid production line for being provided with waste drains pump, the bending pipe portion is connected with the upper end of the dispersion impeller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381421.8A CN104947111B (en) | 2015-07-02 | 2015-07-02 | A kind of printed circuit board acidic etching solution cuprous ion oxidation unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381421.8A CN104947111B (en) | 2015-07-02 | 2015-07-02 | A kind of printed circuit board acidic etching solution cuprous ion oxidation unit |
Publications (2)
| Publication Number | Publication Date |
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| CN104947111A CN104947111A (en) | 2015-09-30 |
| CN104947111B true CN104947111B (en) | 2017-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510381421.8A Active CN104947111B (en) | 2015-07-02 | 2015-07-02 | A kind of printed circuit board acidic etching solution cuprous ion oxidation unit |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115287659B (en) * | 2022-08-04 | 2024-03-29 | 深圳天华机器设备股份有限公司 | Etching liquid regeneration device and regeneration process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2700982B2 (en) * | 1992-11-02 | 1998-01-21 | 鶴見曹達株式会社 | Etching equipment |
| RU2142024C1 (en) * | 1998-07-29 | 1999-11-27 | Акционерное общество открытого типа "Научно-исследовательский технологический институт" (АО "НИТИ-ТЕСАР") | Apparatus for regenerating etching solution |
| DE112011105722A5 (en) * | 2011-10-08 | 2014-06-26 | Christoph Herkle | Etching device for the electrolytic etching of copper |
| CN104630825A (en) * | 2015-01-20 | 2015-05-20 | 昆山美源达环保科技有限公司 | Device and process for electrolytically extracting copper in acidic etching liquid |
| CN204999974U (en) * | 2015-07-02 | 2016-01-27 | 深圳市洁驰科技有限公司 | Acid etching solution cuprous ion oxidation unit of printed circuit board |
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- 2015-07-02 CN CN201510381421.8A patent/CN104947111B/en active Active
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| CN104947111A (en) | 2015-09-30 |
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