CN104743351A - 加工室 - Google Patents
加工室 Download PDFInfo
- Publication number
- CN104743351A CN104743351A CN201310740516.5A CN201310740516A CN104743351A CN 104743351 A CN104743351 A CN 104743351A CN 201310740516 A CN201310740516 A CN 201310740516A CN 104743351 A CN104743351 A CN 104743351A
- Authority
- CN
- China
- Prior art keywords
- processing
- valve
- sealing
- discharging
- communicated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Details (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power-Operated Mechanisms For Wings (AREA)
- Vacuum Packaging (AREA)
- Sealing Using Fluids, Sealing Without Contact, And Removal Of Oil (AREA)
Abstract
Description
Claims (8)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310740516.5A CN104743351B (zh) | 2013-12-30 | 2013-12-30 | 加工室 |
TW103100981A TWI595531B (zh) | 2013-12-30 | 2014-01-10 | 加工室 |
US14/522,059 US10283386B2 (en) | 2013-12-30 | 2014-10-23 | Processing room |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310740516.5A CN104743351B (zh) | 2013-12-30 | 2013-12-30 | 加工室 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104743351A true CN104743351A (zh) | 2015-07-01 |
CN104743351B CN104743351B (zh) | 2016-09-07 |
Family
ID=53481272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310740516.5A Active CN104743351B (zh) | 2013-12-30 | 2013-12-30 | 加工室 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10283386B2 (zh) |
CN (1) | CN104743351B (zh) |
TW (1) | TWI595531B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0839226A (ja) * | 1994-07-29 | 1996-02-13 | Ube Ind Ltd | 酸化物流出防止方法および酸化物除去装置 |
CN2387062Y (zh) * | 1999-09-13 | 2000-07-12 | 王志平 | 金属超微粉真空包装箱 |
JP2006143474A (ja) * | 1992-10-06 | 2006-06-08 | Unaxis Balzers Ag | 工作物の移送装置及び処理方法 |
CN1995783A (zh) * | 2006-12-26 | 2007-07-11 | 陈长清 | 一种闸板式连续真空/压力进、出料加工的密封装置 |
CN101113788A (zh) * | 2007-06-18 | 2008-01-30 | 陈长清 | 一种连续式真空/压力进、出料加工的密封装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037129A (ja) * | 1983-08-10 | 1985-02-26 | Hitachi Ltd | 半導体製造装置 |
JP2638955B2 (ja) * | 1988-07-14 | 1997-08-06 | 日本精工株式会社 | 無塵室用作動装置 |
EP1027481A1 (en) * | 1997-09-30 | 2000-08-16 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
WO2001003167A1 (fr) * | 1999-07-02 | 2001-01-11 | Tokyo Electron Limited | Installation, procede et dispositif de fabrication de semi-conducteurs |
TWI234417B (en) * | 2001-07-10 | 2005-06-11 | Tokyo Electron Ltd | Plasma procesor and plasma processing method |
US6846380B2 (en) * | 2002-06-13 | 2005-01-25 | The Boc Group, Inc. | Substrate processing apparatus and related systems and methods |
US7896967B2 (en) * | 2006-02-06 | 2011-03-01 | Tokyo Electron Limited | Gas supply system, substrate processing apparatus and gas supply method |
NL1036164A1 (nl) * | 2007-11-15 | 2009-05-18 | Asml Netherlands Bv | Substrate processing apparatus and device manufacturing method. |
US7988535B2 (en) * | 2008-04-18 | 2011-08-02 | Applied Materials, Inc. | Platen exhaust for chemical mechanical polishing system |
US8070408B2 (en) * | 2008-08-27 | 2011-12-06 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
JP2011202270A (ja) * | 2010-03-03 | 2011-10-13 | Canon Anelva Corp | 真空処理装置及び真空処理方法 |
JP5574799B2 (ja) * | 2010-04-23 | 2014-08-20 | キヤノン株式会社 | 露光装置、それを用いたデバイスの製造方法、並びに気体供給装置 |
JP2012015374A (ja) * | 2010-07-01 | 2012-01-19 | Toshiba Corp | マスフローコントローラシステム、プラズマ処理装置、流量制御方法、及び半導体装置の製造方法 |
JP5806827B2 (ja) * | 2011-03-18 | 2015-11-10 | 東京エレクトロン株式会社 | ゲートバルブ装置及び基板処理装置並びにその基板処理方法 |
JP6003011B2 (ja) * | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5835195B2 (ja) * | 2012-11-29 | 2015-12-24 | 東京エレクトロン株式会社 | 乾燥処理用の高圧容器の製造方法及び基板処理装置の製造方法 |
JP6245643B2 (ja) * | 2013-03-28 | 2017-12-13 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
-
2013
- 2013-12-30 CN CN201310740516.5A patent/CN104743351B/zh active Active
-
2014
- 2014-01-10 TW TW103100981A patent/TWI595531B/zh active
- 2014-10-23 US US14/522,059 patent/US10283386B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006143474A (ja) * | 1992-10-06 | 2006-06-08 | Unaxis Balzers Ag | 工作物の移送装置及び処理方法 |
JPH0839226A (ja) * | 1994-07-29 | 1996-02-13 | Ube Ind Ltd | 酸化物流出防止方法および酸化物除去装置 |
CN2387062Y (zh) * | 1999-09-13 | 2000-07-12 | 王志平 | 金属超微粉真空包装箱 |
CN1995783A (zh) * | 2006-12-26 | 2007-07-11 | 陈长清 | 一种闸板式连续真空/压力进、出料加工的密封装置 |
CN101113788A (zh) * | 2007-06-18 | 2008-01-30 | 陈长清 | 一种连续式真空/压力进、出料加工的密封装置 |
Also Published As
Publication number | Publication date |
---|---|
US10283386B2 (en) | 2019-05-07 |
TWI595531B (zh) | 2017-08-11 |
TW201526070A (zh) | 2015-07-01 |
CN104743351B (zh) | 2016-09-07 |
US20150184886A1 (en) | 2015-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180809 Address after: 518109 Zone A and Zone 1 of Foxconn Science Park Zone D1 Plastic Mould Factory, No.2 East Ring Road, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN JINGJIANG YUNCHUANG TECHNOLOGY Co.,Ltd. Address before: 516100 twelve village section of gate village group of Xia Liao village, Longxi Town, Boluo County, Huizhou, Guangdong Patentee before: JI ZHUN PRECISION INDUSTRY (HUI ZHOU) Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 518109, 1st Floor, Building B3, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Fulian Jingjiang Technology Co.,Ltd. Address before: 518109 Zone A and Zone 1 of Foxconn Science Park Zone D1 Plastic Mould Factory, No.2 East Ring Road, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN JINGJIANG YUNCHUANG TECHNOLOGY Co.,Ltd. |
|
CP03 | Change of name, title or address |