CN104517876A - 封装件运送器组件 - Google Patents
封装件运送器组件 Download PDFInfo
- Publication number
- CN104517876A CN104517876A CN201410520635.4A CN201410520635A CN104517876A CN 104517876 A CN104517876 A CN 104517876A CN 201410520635 A CN201410520635 A CN 201410520635A CN 104517876 A CN104517876 A CN 104517876A
- Authority
- CN
- China
- Prior art keywords
- packaging part
- housing
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- linear movement
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 128
- 230000002950 deficient Effects 0.000 description 11
- 230000000007 visual effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 210000004392 genitalia Anatomy 0.000 description 1
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0116847 | 2013-09-30 | ||
KR1020130116847A KR101864327B1 (ko) | 2013-09-30 | 2013-09-30 | 패키지 운반 어셈블리 |
JP2014-080279 | 2014-04-09 | ||
JP2014080279A JP6357340B2 (ja) | 2013-09-30 | 2014-04-09 | パッケージ運搬アセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104517876A true CN104517876A (zh) | 2015-04-15 |
CN104517876B CN104517876B (zh) | 2018-11-27 |
Family
ID=52792986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410520635.4A Active CN104517876B (zh) | 2013-09-30 | 2014-09-30 | 封装件运送器组件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104517876B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987291A (zh) * | 2017-05-31 | 2018-12-11 | 捷进科技有限公司 | 半导体制造装置和半导体器件的制造方法 |
CN116573397A (zh) * | 2023-07-12 | 2023-08-11 | 前海晶方云(深圳)测试设备有限公司 | 换装设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5882171A (en) * | 1996-10-01 | 1999-03-16 | Balzers Aktiengesellschaft | Transport and transfer apparatus |
US5999074A (en) * | 1997-02-05 | 1999-12-07 | Ullman Devices Corporation | Magnetic head for magnetic pick-up tool |
CN1399320A (zh) * | 2001-07-17 | 2003-02-26 | 先进自动器材有限公司 | 用于结合力控制的装置和方法 |
CN1631068A (zh) * | 2002-08-09 | 2005-06-22 | 西门子公司 | 吸持装置的选择运动用的装置和运送元件的装配头 |
CN1893009A (zh) * | 2005-07-07 | 2007-01-10 | 松下电器产业株式会社 | 元件安装装置和元件安装方法 |
JP2013038206A (ja) * | 2011-08-08 | 2013-02-21 | Panasonic Corp | 電子部品実装装置および電子部品実装方法ならびに下受けピンモジュールの配置変更方法 |
-
2014
- 2014-09-30 CN CN201410520635.4A patent/CN104517876B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5882171A (en) * | 1996-10-01 | 1999-03-16 | Balzers Aktiengesellschaft | Transport and transfer apparatus |
US5999074A (en) * | 1997-02-05 | 1999-12-07 | Ullman Devices Corporation | Magnetic head for magnetic pick-up tool |
CN1399320A (zh) * | 2001-07-17 | 2003-02-26 | 先进自动器材有限公司 | 用于结合力控制的装置和方法 |
CN1631068A (zh) * | 2002-08-09 | 2005-06-22 | 西门子公司 | 吸持装置的选择运动用的装置和运送元件的装配头 |
CN1893009A (zh) * | 2005-07-07 | 2007-01-10 | 松下电器产业株式会社 | 元件安装装置和元件安装方法 |
JP2013038206A (ja) * | 2011-08-08 | 2013-02-21 | Panasonic Corp | 電子部品実装装置および電子部品実装方法ならびに下受けピンモジュールの配置変更方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987291A (zh) * | 2017-05-31 | 2018-12-11 | 捷进科技有限公司 | 半导体制造装置和半导体器件的制造方法 |
CN108987291B (zh) * | 2017-05-31 | 2022-05-27 | 捷进科技有限公司 | 半导体制造装置和半导体器件的制造方法 |
CN116573397A (zh) * | 2023-07-12 | 2023-08-11 | 前海晶方云(深圳)测试设备有限公司 | 换装设备 |
CN116573397B (zh) * | 2023-07-12 | 2023-12-08 | 前海晶方云(深圳)测试设备有限公司 | 换装设备 |
Also Published As
Publication number | Publication date |
---|---|
CN104517876B (zh) | 2018-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co.,Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: Free format text: CORRECT: APPLICANT; FROM: SAMSUNG TAI KEWEI CO., LTD. TO: HANWHA TECHWIN CO., LTD. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Gyeongnam Changwon City, South Korea Patentee after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA TECHWIN Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190410 Address after: Gyeongnam Changwon City, South Korea Patentee after: Hanwha Precision Machinery Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA AEROSPACE Co.,Ltd. |