CN104213170A - Copper plating method for high-order high-density circuit board - Google Patents
Copper plating method for high-order high-density circuit board Download PDFInfo
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- CN104213170A CN104213170A CN201410473175.4A CN201410473175A CN104213170A CN 104213170 A CN104213170 A CN 104213170A CN 201410473175 A CN201410473175 A CN 201410473175A CN 104213170 A CN104213170 A CN 104213170A
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Abstract
The invention relates to a copper plating method for a high-order high-density circuit board. The method comprises the following steps that S1, a plating solution is prepared, each liter of the plating solution comprises 180 g to 240 g of sulfuric acid, 70 g to 80 g of copper sulfate and the balance deionized water, and the sulfuric acid, the copper sulfate and the deionized water are mixed, evenly stirred and put in a plating tank for standby application; S2, preplating is carried out, wherein according to preplating, S21 burr removing, S22 drilling sewage removing, S23 cleaning liquid removing and S24 drying are included; S3, copper is plated, a to-be-plated circuit board is put into the plating tank, the temperature in the plating tank is controlled to 20 DEG C to 30 DEG C, the electroplating current is 1.2 A/dm<2> to 3 A/dm<2>, the electroplating time ranges from 20 minutes to 30 minutes, the circuit board is taken out and dried, and then the circuit board is put into the next working procedure. The copper plating method has the advantages that the process is simple, the cost is low, the electroplating qualified rate is high, and the copper plating qualified rate of the circuit board is greatly improved by adjusting the plating solution formula and corresponding process parameters.
Description
Technical field
The present invention relates to the copper-plating technique of circuit card, particularly high-order high-density circuit board copper plating method.
Background technology
The base materials such as the polyimide used in high-order high-density circuit card, polyester, be all the macromolecular material of good insulation preformance, its surface be made to become conductor, electroless plating is one of widely used technology.The hole of conductor (metallization) is the passage of connection between different layers, and the hole metallization quality of high-quality is the basic guarantee of product electric property.Through years of researches and exploitation, no matter electroless plating technology quite ripe (being electroless copper, chemical nickel plating or chemical plating metal alloy), the fundamental factor affecting electroless plating quality are grasped, i.e. coating and the chemical property of base material, chemical plating fluid composition and engineering controling parameters etc. corresponding with it.Because high-order high-density circuit card employs material as this kind of in Kapton, be again carry out electroless plating in micropore simultaneously, therefore must adjust the processing parameter of electroless plating, just likely obtain the coating of high-quality.
Mostly the design of electronic machine circuits all is at present based on printed circuit board (PCB) with being connected, along with the scientific-technical progress of electronic industry, printed board is to the future development of multiple stratification, densification, its aperture is inevitable constantly to be reduced, particularly high density interconnect wiring board (HDI plate) aperture reaches below 0.1mm, in micropore, plating solution is more difficult, the metallization quality of micropore is affected, cause conforming product rate can only remain on about 85% all the time, and cannot have and further promote, affect the economic benefit of manufacturing enterprise.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, a kind of high-order high-density circuit board copper plating method that technique is simple, cost is low and plating qualification rate is high is provided, by adjustment electroplate liquid formulation and corresponding processing parameter, circuit board copper plating qualification rate is increased substantially.
Object of the present invention is achieved through the following technical solutions: high-order high-density circuit board copper plating method, and it comprises the following steps:
S1, preparation plating solution: in described often liter of plating solution, the content of contained each component is: sulfuric acid: 180g ~ 240g; Copper sulfate: 70g ~ 80g; Surplus is deionized water, and mixing, stir, and it is for subsequent use to be placed in coating bath;
S2, treatment before plating:
S21, deburring: by clean for the burr removing on circuit card to be plated;
S22, desmearing: the scavenging solution that circuit board surface to be plated puts into Ultrasonic Cleaners is cleaned, scavenging period is 5min ~ 20min;
S23, removal scavenging solution: with deionized water rinsing circuit card 3min ~ 5min;
S24, oven dry: circuit card to be plated is put into dryer, temperature is arranged on 60 DEG C ~ 80 DEG C, and baking 5min ~ 10min, takes out;
S3, copper facing: circuit card to be plated is put into coating bath, in control coating bath, temperature is between 20 DEG C ~ 30 DEG C, and electroplating current is 1.2A/dm
2~ 3A/dm
2between, electroplating time is 20min ~ 30min, takes out, and dries, enters next step operation.
The agent of 3ml ~ 5ml bronzing is also added with in plating solution described in described step S1.
Each component concentration of often liter of scavenging solution in described step S22 in Ultrasonic Cleaners is: 350ml ~ 500mlPI adjusting agent and 35g ~ 45g additive, and scavenging solution is heated to 40 DEG C ~ 47 DEG C, keeps constant temperature.
Also comprise supplementation with copper photo etching in described step S3 copper facing process, interpolation speed is 100ml/KAH ~ 150ml/KAH.
The present invention has the following advantages: technique team of the present invention operator quality level requirement is lower, technique is simple, cost is low, copper-plated qualification rate brings up to 96% by original 86%, improve 10% than originally, and made copper-plating technique under the prerequisite that ensure that qualification rate, reduce production cost, this has saved cost for enterprise produces, and creates good economic benefit.
Embodiment
Below in conjunction with embodiment, the present invention will be further described, but protection scope of the present invention is not limited to the following stated.
[embodiment 1]:
High-order high-density circuit board copper plating method, it comprises the following steps:
S1, preparation plating solution: in described often liter of plating solution, the content of contained each component is: sulfuric acid: 180g; Copper sulfate: 80g; Surplus is deionized water, and mixing, stir, and it is for subsequent use to be placed in coating bath;
S2, treatment before plating:
S21, deburring: by clean for the burr removing on circuit card to be plated;
S22, desmearing: the scavenging solution that circuit board surface to be plated puts into Ultrasonic Cleaners is cleaned, scavenging period is 5min;
S23, removal scavenging solution: with deionized water rinsing circuit card 5min;
S24, oven dry: circuit card to be plated is put into dryer, temperature is arranged on 80 DEG C, and baking 5min, takes out;
S3, copper facing: circuit card to be plated is put into coating bath, controlling temperature in coating bath is 30 DEG C, and electroplating current is 1.2A/dm
2, electroplating time is 30min, takes out, and dries, enters next step operation.
The agent of 5ml bronzing is also added with in plating solution described in described step S1.
Each component concentration of often liter of scavenging solution in described step S22 in Ultrasonic Cleaners is: 500mlPI adjusting agent and 35g additive, and scavenging solution is heated to 47 DEG C, keeps constant temperature.
Also comprise supplementation with copper photo etching in described step S3 copper facing process, interpolation speed is 100ml/KAH.
[embodiment 2]:
High-order high-density circuit board copper plating method, it comprises the following steps:
S1, preparation plating solution: in described often liter of plating solution, the content of contained each component is: sulfuric acid: 210g; Copper sulfate: 75g; Surplus is deionized water, and mixing, stir, and it is for subsequent use to be placed in coating bath;
S2, treatment before plating:
S21, deburring: by clean for the burr removing on circuit card to be plated;
S22, desmearing: the scavenging solution that circuit board surface to be plated puts into Ultrasonic Cleaners is cleaned, scavenging period is 5min ~ 20min;
S23, removal scavenging solution: with deionized water rinsing circuit card 4min;
S24, oven dry: circuit card to be plated is put into dryer, temperature is arranged on 70 DEG C, and baking 8min, takes out;
S3, copper facing: circuit card to be plated is put into coating bath, in control coating bath, temperature is at 25 DEG C, and electroplating current is 2.1A/dm
2, electroplating time is 25min, takes out, and dries, enters next step operation.
The agent of 4ml bronzing is also added with in plating solution described in described step S1.
Each component concentration of often liter of scavenging solution in described step S22 in Ultrasonic Cleaners is: 420mlPI adjusting agent and 40g additive, and scavenging solution is heated to 44 DEG C, keeps constant temperature.
Also comprise supplementation with copper photo etching in described step S3 copper facing process, interpolation speed is 120ml/KAH.
[embodiment 3]:
High-order high-density circuit board copper plating method, it comprises the following steps:
S1, preparation plating solution: in described often liter of plating solution, the content of contained each component is: sulfuric acid: 220g; Copper sulfate: 72g; Surplus is deionized water, and mixing, stir, and it is for subsequent use to be placed in coating bath;
S2, treatment before plating:
S21, deburring: by clean for the burr removing on circuit card to be plated;
S22, desmearing: the scavenging solution that circuit board surface to be plated puts into Ultrasonic Cleaners is cleaned, scavenging period is 13min;
S23, removal scavenging solution: with deionized water rinsing circuit card 4min;
S24, oven dry: circuit card to be plated is put into dryer, temperature is arranged on 70 DEG C, and baking 8min, takes out;
S3, copper facing: circuit card to be plated is put into coating bath, in control coating bath, temperature is at 26 DEG C, and electroplating current is 2A/dm
2between, electroplating time is 26min, takes out, and dries, enters next step operation.
The agent of 4ml bronzing is also added with in plating solution described in described step S1.
Each component concentration of often liter of scavenging solution in described step S22 in Ultrasonic Cleaners is: 430mlPI adjusting agent and 40g additive, and scavenging solution is heated to 43 DEG C, keeps constant temperature.
Also comprise supplementation with copper photo etching in described step S3 copper facing process, interpolation speed is 130ml/KAH.
[embodiment 4]:
High-order high-density circuit board copper plating method, it comprises the following steps:
S1, preparation plating solution: in described often liter of plating solution, the content of contained each component is: sulfuric acid: 240g; Copper sulfate: 70g; Surplus is deionized water, and mixing, stir, and it is for subsequent use to be placed in coating bath;
S2, treatment before plating:
S21, deburring: by clean for the burr removing on circuit card to be plated;
S22, desmearing: the scavenging solution that circuit board surface to be plated puts into Ultrasonic Cleaners is cleaned, scavenging period is 20min;
S23, removal scavenging solution: with deionized water rinsing circuit card 3min;
S24, oven dry: circuit card to be plated is put into dryer, temperature is arranged on 60 DEG C, and baking 10min, takes out;
S3, copper facing: circuit card to be plated is put into coating bath, in control coating bath, temperature is at 20 DEG C, and electroplating current is 3A/dm
2, electroplating time is 20min, takes out, and dries, enters next step operation.
The agent of 3ml bronzing is also added with in plating solution described in described step S1.
Each component concentration of often liter of scavenging solution in described step S22 in Ultrasonic Cleaners is: 350ml adjusting agent and 45g additive, and scavenging solution is heated to 40 DEG C, keeps constant temperature.
Also comprise supplementation with copper photo etching in described step S3 copper facing process, interpolation speed is 150ml/KAH.
Do backlight level experiment according to the various embodiments described above, detected result is as shown in the table:
Because backlight progression shows that more greatly its heavy copper mass is better, at present, best solution composition and the processing parameter of the electroless copper research obtained are applied in actual production, the qualification rate of product brings up to 96% by original 86%, 10% was improve than originally, this has saved cost for enterprise produces, and creates good economic benefit.
Claims (4)
1. high-order high-density circuit board copper plating method, is characterized in that: it comprises the following steps:
S1, preparation plating solution: in described often liter of plating solution, the content of contained each component is: sulfuric acid: 180g ~ 240g; Copper sulfate: 70g ~ 80g; Surplus is deionized water, and mixing, stir, and it is for subsequent use to be placed in coating bath;
S2, treatment before plating:
S21, deburring: by clean for the burr removing on circuit card to be plated;
S22, desmearing: the scavenging solution that circuit board surface to be plated puts into Ultrasonic Cleaners is cleaned, scavenging period is 5min ~ 20min;
S23, removal scavenging solution: with deionized water rinsing circuit card 3min ~ 5min;
S24, oven dry: circuit card to be plated is put into dryer, temperature is arranged on 60 DEG C ~ 80 DEG C, and baking 5min ~ 10min, takes out;
S3, copper facing: circuit card to be plated is put into coating bath, in control coating bath, temperature is between 20 DEG C ~ 30 DEG C, and electroplating current is 1.2A/dm
2~ 3A/dm
2between, electroplating time is 20min ~ 30min, takes out, and dries, enters next step operation.
2. high-order high-density circuit board copper plating method according to claim 1, is characterized in that: be also added with the agent of 3ml ~ 5ml bronzing in the plating solution described in described step S1.
3. high-order high-density circuit board copper plating method according to claim 1, it is characterized in that: each component concentration of often liter of scavenging solution in described step S22 in Ultrasonic Cleaners is: 350ml ~ 500mlPI adjusting agent and 35g ~ 45g additive, and scavenging solution is heated to 40 DEG C ~ 47 DEG C, keep constant temperature.
4. high-order high-density circuit board copper plating method according to claim 1, is characterized in that: also comprise supplementation with copper photo etching in described step S3 copper facing process, interpolation speed is 100 ml/KAH ~ 150ml/KAH.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473175.4A CN104213170A (en) | 2014-09-16 | 2014-09-16 | Copper plating method for high-order high-density circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473175.4A CN104213170A (en) | 2014-09-16 | 2014-09-16 | Copper plating method for high-order high-density circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105887144A (en) * | 2016-06-21 | 2016-08-24 | 广东光华科技股份有限公司 | Electric copper plating liquid and electric copper plating process thereof |
| CN108823616A (en) * | 2018-08-10 | 2018-11-16 | 四川海英电子科技有限公司 | A kind of technique of high-order high-density circuit board copper plating |
| CN110029375A (en) * | 2019-05-14 | 2019-07-19 | 四川海英电子科技有限公司 | The circulation copper electroplating method of high-order high-density circuit board |
| CN112680755A (en) * | 2020-12-15 | 2021-04-20 | 深圳市瀚鼎电路电子有限公司 | In-hole copper plating method for circuit board hole plugging |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105887144A (en) * | 2016-06-21 | 2016-08-24 | 广东光华科技股份有限公司 | Electric copper plating liquid and electric copper plating process thereof |
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| CN108823616A (en) * | 2018-08-10 | 2018-11-16 | 四川海英电子科技有限公司 | A kind of technique of high-order high-density circuit board copper plating |
| CN110029375A (en) * | 2019-05-14 | 2019-07-19 | 四川海英电子科技有限公司 | The circulation copper electroplating method of high-order high-density circuit board |
| CN112680755A (en) * | 2020-12-15 | 2021-04-20 | 深圳市瀚鼎电路电子有限公司 | In-hole copper plating method for circuit board hole plugging |
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Application publication date: 20141217 |
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