CN111020586A - Environment-friendly rack stripping solution for stripping copper and tin and copper and tin stripping method using environment-friendly rack stripping solution - Google Patents
Environment-friendly rack stripping solution for stripping copper and tin and copper and tin stripping method using environment-friendly rack stripping solution Download PDFInfo
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- CN111020586A CN111020586A CN201911419405.8A CN201911419405A CN111020586A CN 111020586 A CN111020586 A CN 111020586A CN 201911419405 A CN201911419405 A CN 201911419405A CN 111020586 A CN111020586 A CN 111020586A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
Abstract
The invention relates to an environment-friendly stripping rack liquid for stripping copper and tin and a copper and tin stripping method using the environment-friendly stripping rack liquid. According to the mass concentration meter, the stripping and hanging rack liquid comprises: 50-500g/L of sulfuric acid, 10-250g/L of hydrogen peroxide, 1-150g/L of a stripping and hanging rack additive and the balance of water. The rack stripping solution can not only simultaneously strip copper and strip tin, but also adjust the proportion of the rack stripping solution according to the thickness of a copper layer and a tin layer to obtain different copper stripping and tin stripping rates, thereby meeting the requirements of multiple processes. And the copper stripping and tin stripping rates of the rack stripping solution can reach more than 20 mu m/min, the performance is stable, the decomposition rate of hydrogen peroxide is low, and no harmful gas is generated due to the fact that the rack stripping solution does not contain raw materials such as nitric acid and the like, so that the environment-friendly requirement is met.
Description
Technical Field
The invention relates to the field of printed circuit board manufacturing, in particular to an environment-friendly rack stripping solution for stripping copper and tin and a copper and tin stripping method using the same.
Background
Printed Circuit Boards (PCBs) are important electronic components that carry electronic components and realize the functions of the whole device by using insulating and conductive materials as media. Electroplating is an important process step in the production process of the PCB, and generally, a PCB sample plate is lifted by a hook and then copper plating and tin plating operations are carried out. However, the lower edge portion of the hook, which follows the immersion of the PCB sample board in the plating solution, is plated with a copper layer and a tin layer. In order to keep the hooking seam of the hook consistent, after the copper plating operation and the tin plating operation are finished, the hanging rack needs to remove a copper layer and a tin layer on the surface of the hanging rack by using a rack stripping liquid. Therefore, the copper and tin stripping treatment after the electroplating process is a very important link.
Traditional PCB shells stores pylon liquid and is the nitric acid system, but the nitric acid type shells stores pylon liquid and only shells copper effectual, can not strip unnecessary copper and tin on the stores pylon simultaneously, greatly reduced the production efficiency of assembly line. Meanwhile, the main component of the nitric acid type stripping rack liquid is nitric acid, and the nitric acid can be decomposed to generate irritant gases such as nitric oxide, nitrogen dioxide and the like during chemical reaction, so that the surrounding environment is seriously influenced, and the health of operators is not facilitated. In addition, the waste liquid after the rack stripping treatment is not only easy to cause secondary pollution, but also increases the treatment cost.
In order to solve a series of problems caused by harm and deficiency of the nitric acid type stripping and hanging solution, a sulfuric acid-hydrogen peroxide system is widely researched. For example, CN108118341A discloses an environment-friendly tin-copper plating stripping solution and a stripping method thereof, wherein a stripping accelerator is added into a sulfuric acid-hydrogen peroxide solution system, so that the stripping solution has stable properties and a good stripping effect on a tin-copper plating layer. However, the stripping solution has neither high copper stripping nor high tin stripping rates. CN105239072A discloses a deplating solution for an electroplating hanger and a deplating solution method thereof, wherein the deplating solution comprises 50-280ml of sulfuric acid, 18-80ml of hydrogen peroxide, 30-100ml of an additive and the balance of water. However, the copper stripping rate of the stripping solution is only 4-8 μm/min, and the tin stripping effect is not good.
Although the sulfuric acid-hydrogen peroxide system is optimized to a certain extent in the prior art, the problems of slow copper stripping and tin stripping rates, high hydrogen peroxide decomposition rate and the like still exist. Therefore, it is desired to develop a sulfuric acid-hydrogen peroxide stripping solution with better performance to solve the above problems.
Disclosure of Invention
In order to solve the technical problem, the invention provides an environment-friendly stripping rack liquid for stripping copper and tin, which comprises the following components in percentage by mass: 50-500g/L of sulfuric acid, 10-250g/L of hydrogen peroxide, 1-150g/L of a stripping and hanging rack additive and the balance of water. The rack stripping solution can not only simultaneously strip copper and strip tin, but also adjust the proportion of the rack stripping solution according to the thickness of a copper layer and a tin layer to obtain different copper stripping and tin stripping rates, thereby meeting the requirements of multiple processes. Moreover, the copper stripping and tin stripping rates of the rack stripping solution can reach more than 20 mu m/min, the performance is stable, the decomposition rate of hydrogen peroxide is low, and no harmful gas is generated due to the fact that the rack stripping solution does not contain raw materials such as nitric acid and the like, so that the environment-friendly requirement is met.
In order to achieve the purpose, the invention adopts the following technical scheme:
one of the purposes of the invention is to provide an environment-friendly stripping rack liquid for stripping copper and tin, which comprises the following components in percentage by mass: 50-500g/L of sulfuric acid, such as 50g/L, 100g/L, 150g/L, 200g/L, 250g/L, 300g/L, 350g/L, 400g/L, 450g/L or 500g/L, etc., 10-250g/L of hydrogen peroxide, such as 10g/L, 20g/L, 50g/L, 100g/L, 150g/L, 200g/L or 250g/L, etc., 1-150g/L of stripping rack additive, such as 1g/L, 5g/L, 10g/L, 20g/L, 35g/L, 50g/L, 70g/L, 100g/L, 120g/L or 150g/L, etc., and the balance of water, wherein the stripping rack additive comprises organic amine, any one or a mixture of at least two of the sulfonic acid group compound and the alcohol, and the above numerical ranges are not limited to the enumerated values, and other non-enumerated values within the ranges are also applicable.
According to the stripping rack liquid, the stripping rack additive with a specific ratio is added into a sulfuric acid-hydrogen peroxide system, so that the decomposition rate of hydrogen peroxide can be effectively controlled, the copper stripping and tin stripping rates can reach more than 20 mu m/min, the production efficiency is improved, and the production cost is reduced. In addition, the copper stripping liquid does not contain nitrate ions and other polluting ions, does not generate harmful gas, meets the requirement of environmental protection, and reduces the cost for treating waste liquid.
As a preferable technical solution of the present invention, the stripping and hanging rack liquid includes, in terms of mass concentration: 100-300g/L of sulfuric acid, 50-100g/L of hydrogen peroxide, 5-100g/L of a stripping and hanging rack additive and the balance of water;
wherein the stripping frame additive comprises any one or a mixture of at least two of an organic amine, a sulfonic compound, or an alcohol, typical but non-limiting examples of which are: a mixture of an organic amine and a sulfonic acid group compound, a mixture of a sulfonic acid group compound and an alcohol, or a mixture of an organic amine, a sulfonic acid group compound and an alcohol, and the like.
As a preferable technical solution of the present invention, the stripping and hanging rack liquid includes, in terms of mass concentration: 100-200g/L of sulfuric acid, 50-80g/L of hydrogen peroxide, 1-10g/L of organic amine, 10-20g/L of sulfonic acid group compound, 1-10g/L of alcohol and the balance of water.
As a preferred embodiment of the present invention, the organic amine comprises any one or a mixture of at least two of a monoamine, a diamine or a polyamine, and typical but non-limiting examples of the mixture are: mixtures of monoamines and diamines, mixtures of diamines and polyamines or mixtures of monoamines, diamines and polyamines, and the like.
As a preferred embodiment of the present invention, the organic amine comprises any one or a mixture of at least two of methylamine, ethylamine, aniline, benzylamine or triethylamine, and typical but non-limiting examples of the mixture are: mixtures of methylamine and ethylamine, mixtures of ethylamine and triethylamine, mixtures of aniline and benzylamine or mixtures of aniline, benzylamine and triethylamine, and the like.
As a preferred embodiment of the present invention, the sulfonic acid group compound includes any one or a mixture of at least two of alkyl sulfonic acid, alkyl sulfonate, aryl sulfonic acid or amine sulfonic acid, and typical but non-limiting examples of the mixture are: mixtures of alkyl sulfonic acids and alkyl sulfonates, mixtures of alkyl sulfonic acids and aryl sulfonic acids, mixtures of aryl sulfonic acids and sulfamic acids or mixtures of alkyl sulfonic acids and sulfamic acids, and the like.
As a preferred embodiment of the present invention, the sulfonic acid group compound includes any one or a mixture of at least two of cyclohexane sodium sulfonate, sulfamic acid, p-toluenesulfonic acid, cyclopropane sulfonic acid or 3- (cyclohexylamine) -1-propane sulfonic acid, and typical but non-limiting examples of the mixture are: a mixture of sodium cyclohexane sulfonate and cyclopropane sulfonic acid, a mixture of sodium cyclohexane sulfonate and 3- (cyclohexylamine) -1-propane sulfonic acid, a mixture of sodium cyclohexane sulfonate and sulfamic acid, a mixture of p-toluene sulfonic acid and cyclopropane sulfonic acid or a mixture of cyclopropane sulfonic acid and 3- (cyclohexylamine) -1-propane sulfonic acid, and the like.
As a preferred embodiment of the invention, the alcohol comprises any one or a mixture of at least two of a monohydric alcohol, a dihydric alcohol or a polyhydric alcohol, typical but non-limiting examples of which are: mixtures of monohydric alcohols and dihydric alcohols, mixtures of dihydric alcohols and polyhydric alcohols, or mixtures of monohydric alcohols, dihydric alcohols, and polyhydric alcohols, and the like.
As a preferred embodiment of the present invention, the alcohol comprises any one or a mixture of at least two of ethanol, propanol, n-butanol, ethylene glycol or 1, 4-butanediol, and typical but non-limiting examples of the mixture are: a mixture of ethanol and propanol, a mixture of propanol and n-butanol, a mixture of ethylene glycol and 1, 4-butanediol, a mixture of ethanol and ethylene glycol or a mixture of ethanol, propanol and n-butanol, etc.
The second purpose of the invention is to provide a copper and tin stripping method by utilizing the rack stripping solution, which completely immerses the electroplating rack with copper and tin in a cleaning tank filled with the rack stripping solution to carry out copper and tin stripping treatment.
Preferably, the reaction temperature for stripping copper and tin is 35-40 ℃, for example 35 ℃, 36 ℃, 37 ℃, 38 ℃, 39 ℃ or 40 ℃, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) the environment-friendly copper and tin stripping rack solution provided by the invention can simultaneously carry out copper stripping and tin stripping treatment, and the copper stripping and tin stripping rates can reach more than 20 mu m/min;
(2) the rack stripping solution can adjust the proportion of the rack stripping solution according to the thicknesses of a copper layer and a tin layer to obtain different copper stripping and tin stripping rates, and meets the requirements of multiple processes;
(3) the liquid stripping rack has the advantages of high speed of stripping copper and tin, low decomposition rate of hydrogen peroxide and stable performance, and can improve the production efficiency and reduce the production cost and the waste liquid treatment cost;
(4) the stripping rack liquid does not contain raw materials such as nitric acid and the like, does not generate harmful gas, and meets the requirement of environmental protection.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The invention relates to an environment-friendly stripping rack liquid for stripping copper and tin, which comprises the following components in percentage by mass: 50-500g/L of sulfuric acid, 10-250g/L of hydrogen peroxide, 1-150g/L of a stripping frame additive and the balance of water, wherein the stripping frame additive comprises any one or a mixture of at least two of organic amine, a sulfonic compound or alcohol. The copper stripping and tin stripping rates of the rack stripping solution can reach more than 20 mu m/min, the performance is stable, the decomposition rate of hydrogen peroxide is low, and no harmful gas is generated due to the fact that the rack stripping solution does not contain raw materials such as nitric acid and the like, so that the environment-friendly requirement is met.
To facilitate understanding of the invention, the following examples are set forth:
example 1
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 300g/L of sulfuric acid, 100g/L of hydrogen peroxide, 80g/L of sulfamic acid and the balance of water.
And completely soaking the electroplating rack coated with the copper layer and the tin layer in the rack stripping solution, wherein the reaction temperature for stripping copper and tin is 38 ℃.
Example 2
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 100g/L of sulfuric acid, 80g/L of hydrogen peroxide, 100g/L of 1, 4-butanediol and the balance of water.
And completely soaking the electroplating hanger coated with the copper layer and the tin layer in the hanger stripping solution, wherein the reaction temperature for stripping copper and tin is 35 ℃.
Example 3
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 200g/L of sulfuric acid, 50g/L of hydrogen peroxide, 20g/L of benzylamine and the balance of water.
And completely soaking the electroplating hanger coated with the copper layer and the tin layer in the hanger stripping solution, wherein the reaction temperature for stripping copper and tin is 40 ℃.
Example 4
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 400g/L of sulfuric acid, 250g/L of hydrogen peroxide, 15g/L of ethylene glycol, 80g/L of 1, 4-butanediol and the balance of water.
And completely soaking the electroplating hanger coated with the copper layer and the tin layer in the hanger stripping solution, wherein the reaction temperature for stripping copper and tin is 40 ℃.
Example 5
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 500g/L of sulfuric acid, 150g/L of hydrogen peroxide, 10g/L of methylamine, 30g/L of cyclopropane sulfonic acid and the balance of water.
And completely soaking the electroplating hanger coated with the copper layer and the tin layer in the hanger stripping solution, wherein the reaction temperature for stripping copper and tin is 35 ℃.
Example 6
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 100g/L of sulfuric acid, 50g/L of hydrogen peroxide, 10g/L of aniline, 10g/L of sulfamic acid, 10g/L of ethanol and the balance of water.
And completely soaking the electroplating rack coated with the copper layer and the tin layer in the rack stripping solution, wherein the reaction temperature for stripping copper and tin is 36 ℃.
Example 7
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 200g/L of sulfuric acid, 80g/L of hydrogen peroxide, 1g/L of triethylamine, 20g/L of 3- (cyclohexylamine) -1-propanesulfonic acid, 1g/L of n-butyl alcohol and the balance of water.
And completely soaking the electroplating rack coated with the copper layer and the tin layer in the rack stripping solution, wherein the reaction temperature for stripping copper and tin is 39 ℃.
Example 8
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 150g/L of sulfuric acid, 70g/L of hydrogen peroxide, 5g/L of ethylamine, 15g/L of cyclohexane sodium sulfonate, 5g/L of 1, 4-butanediol and the balance of water.
And completely soaking the electroplating rack coated with the copper layer and the tin layer in the rack stripping solution, wherein the reaction temperature for stripping copper and tin is 37 ℃.
Example 9
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 170g/L sulfuric acid, 50g/L hydrogen peroxide, 8g/L methylamine, 13g/L cyclopropane sulfonic acid, 7g/L ethylene glycol and the balance of water.
And completely soaking the electroplating hanger coated with the copper layer and the tin layer in the hanger stripping solution, wherein the reaction temperature for stripping copper and tin is 35 ℃.
Comparative example 1
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 500g/L of sulfuric acid, 80g/L of hydrogen peroxide and the balance of water.
And completely soaking the electroplating rack coated with the copper layer and the tin layer in the rack stripping solution, wherein the reaction temperature for stripping copper and tin is 37 ℃.
Comparative example 2
The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin, according to the quality concentration meter, it includes to shell stores pylon liquid to shell: 200g/L of sulfuric acid, 50g/L of hydrogen peroxide, 80g/L of thiourea and the balance of water.
And completely soaking the electroplating rack coated with the copper layer and the tin layer in the rack stripping solution, wherein the reaction temperature for stripping copper and tin is 37 ℃.
The results of the performance tests of the above examples and comparative examples are shown in table 1:
TABLE 1
| Name (R) | Rate of stripping copper | Rate of stripping tin |
| Example 1 | 25.39μm/min | 20.08μm/min |
| Example 2 | 21.16μm/min | 25.52μm/min |
| Example 3 | 22.31μm/min | 20.76μm/min |
| Example 4 | 24.09μm/min | 23.14μm/min |
| Example 5 | 23.05μm/min | 21.19μm/min |
| Example 6 | 25.67μm/min | 26.94μm/min |
| Example 7 | 26.64μm/min | 26.55μm/min |
| Example 8 | 27.11μm/min | 25.63μm/min |
| Example 9 | 26.88μm/min | 27.22μm/min |
| Comparative example 1 | 17.08μm/min | 18.44μm/min |
| Comparative example 2 | 17.39μm/min | 16.75μm/min |
As can be seen from table 1: examples 1 to 9, the copper stripping and tin stripping rates of the environmentally friendly copper and tin stripping rack liquid of the invention can reach more than 20 μm/min, but the copper stripping and tin stripping rates of comparative examples 1 and 2 are lower than 20 μm/min; the stripping solutions of examples 6 to 9 all adopt stripping frame additives consisting of organic amine, sulfonic acid compound and alcohol, and the comprehensive rate of copper stripping and tin stripping is faster than that of examples 1 to 5. The copper stripping and tin stripping rate of the rack stripping solution can reach more than 20 mu m/min, the performance is stable, the decomposition rate of hydrogen peroxide is low, and no harmful gas is generated due to the fact that the rack stripping solution does not contain raw materials such as nitric acid and the like, so that the rack stripping solution meets the requirement of environmental protection.
The applicant states that the present invention is illustrated by the above examples to show the detailed process equipment and process flow of the present invention, but the present invention is not limited to the above detailed process equipment and process flow, i.e. it does not mean that the present invention must rely on the above detailed process equipment and process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The utility model provides a shell stores pylon liquid is shelled to environment-friendly of copper tin which characterized in that, according to the mass concentration meter, it includes to shell stores pylon liquid: 50-500g/L of sulfuric acid, 10-250g/L of hydrogen peroxide, 1-150g/L of a stripping and hanging rack additive and the balance of water;
wherein, the stripping rack additive comprises any one or a mixture of at least two of organic amine, sulfonic compound or alcohol.
2. A rack stripping solution as claimed in claim 1, wherein the rack stripping solution comprises, in terms of mass concentration: 100-300g/L of sulfuric acid, 50-100g/L of hydrogen peroxide, 5-100g/L of a stripping and hanging rack additive and the balance of water;
wherein, the stripping rack additive comprises any one or a mixture of at least two of organic amine, sulfonic compound or alcohol.
3. A rack stripping solution as claimed in claim 1 or 2, characterized in that the rack stripping solution comprises, in terms of mass concentration: 100-200g/L of sulfuric acid, 50-80g/L of hydrogen peroxide, 1-10g/L of organic amine, 10-20g/L of sulfonic acid group compound, 1-10g/L of alcohol and the balance of water.
4. A rack stripping solution as claimed in claim 3, wherein the organic amine comprises any one or a mixture of at least two of a monoamine, a diamine or a polyamine.
5. The stripping solution according to claim 3 or 4, wherein the organic amine comprises any one of methylamine, ethylamine, aniline, benzylamine or triethylamine or a mixture of at least two thereof.
6. A rack stripping solution as claimed in claim 3, wherein the sulfonic acid group compound comprises any one or a mixture of at least two of alkyl sulfonic acid, alkyl sulfonate, aryl sulfonic acid or sulfamic acid.
7. A rack stripping solution as claimed in claim 3 or 6, wherein the sulfonic acid group compound comprises any one or a mixture of at least two of cyclohexane sodium sulfonate, sulfamic acid, p-toluenesulfonic acid, cyclopropane sulfonic acid or 3- (cyclohexylamine) -1-propane sulfonic acid.
8. A rack stripping solution as claimed in claim 3, wherein the alcohol comprises any one or a mixture of at least two of a monohydric alcohol, a dihydric alcohol or a polyhydric alcohol.
9. The stripping solution according to claim 3 or 8, wherein the alcohol comprises any one or a mixture of at least two of ethanol, propanol, n-butanol, ethylene glycol or 1, 4-butanediol.
10. A method for stripping copper and tin by using the stripping rack liquid as defined in any one of claims 1 to 9, characterized in that the electroplating rack with copper and tin is completely soaked in a cleaning tank filled with the stripping rack liquid to carry out copper and tin stripping treatment;
preferably, the reaction temperature of stripping copper and tin is 35-40 ℃.
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| CN113355674A (en) * | 2021-07-12 | 2021-09-07 | 广东恒锦通科技有限公司 | Stripping and hanging frame stabilizing agent |
| CN114351145A (en) * | 2021-12-30 | 2022-04-15 | 华南理工大学 | Tin and copper stripping liquid additive for hanger and preparation method and application thereof |
| CN114351145B (en) * | 2021-12-30 | 2023-02-03 | 华南理工大学 | Tin and copper stripping liquid additive for hanger and preparation method and application thereof |
| CN114457334A (en) * | 2022-01-27 | 2022-05-10 | 沪士电子股份有限公司 | Stripping and hanging groove and using method thereof |
| CN115110080A (en) * | 2022-06-24 | 2022-09-27 | 华南理工大学 | Environment-friendly hanger tin-stripping copper stripping liquid and preparation method and application thereof |
| CN115110080B (en) * | 2022-06-24 | 2024-03-15 | 华南理工大学 | Environment-friendly hanger tin-copper stripping liquid and preparation method and application thereof |
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Application publication date: 20200417 |