CN104152959A - Plating film manufacturing method - Google Patents
Plating film manufacturing method Download PDFInfo
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- CN104152959A CN104152959A CN201410199014.0A CN201410199014A CN104152959A CN 104152959 A CN104152959 A CN 104152959A CN 201410199014 A CN201410199014 A CN 201410199014A CN 104152959 A CN104152959 A CN 104152959A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention provides a plating film manufacturing method for forming a plating film on a workpiece. The workpiece comprises a main face and the other main face which is on the side opposite to the main face. A polarity reversing power supply is connected between the workpiece and an electrode arranged opposite to one main face of the workpiece. A direct-current power supply is connected between the workpiece and an electrode arranged opposite to the other main face of the workpiece. The plating processes of the one main face and the other main face of the workpiece are performed simultaneously.
Description
Technical field
The present invention relates to a kind of film-plating method.
Background technology
For example, as the joint portion of lead frame and sealing resin, the joint portion of metal member made and resin parts is in the time manufacturing or use, and heating etc. can cause peeling off between the two, and in addition, rheological parameters' change with time also can cause peeling off between the two.
For this reason, some have been proposed can improve the method for the bonding strength between metal member made and resin parts in prior art.For example, having proposed a kind of is the alligatoring face method of (also claiming " uneven surface ") by the surface treatment of metal member made.
As a kind of method that forms alligatoring face in metallic surface, for example, a kind of alligatoring calendering copper coin is disclosed in patent documentation 1, this alligatoring calendering copper coin is by calendering copper coin is inserted in the electrolytic solution that comprises gloss liquid, and adopts the asymmetric positive negative pulse stuffing of predetermined condition to carry out pulse electrolysis and be roughened (also claiming " roughening ").
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2008-223063 communique
But, in the disclosed alligatoring of patent documentation 1 calendering copper coin, all formed the plated film with alligatoring face on whole of calendering copper coin.
For example, using be lead frame etc. in the situation that, exist and only make a face and resin bonding, and make another face not with the form of resin gluing.In the time that the parts to such carry out resin sealing, exist not only a face side but also the situation of also having adhered to resin in another face side, now, if another face is alligatoring face, be difficult to accompanying resin to be removed, cause occurring the problem of productivity and decrease in yield.
In the disclosed alligatoring of patent documentation 1 calendering copper coin, for example, by adopt masking tape etc. to cover to that face side as alligatoring face not, and then carry out electroplating processes, also can only make a face is alligatoring face.
But, now, because attached masking tape, after electroplating processes, need to divest this masking tape, so, exist the problem that productivity declines.In addition, as lead frame etc., in the situation that thickness of workpiece is thinner, while divesting masking tape, can cause workpiece breakage, also exist the problem of decrease in yield etc.
The present invention proposes in view of above-mentioned the problems of the prior art, its object is to provide a kind of film-plating method, only adopt electroplating processes 1 time, just can on any one interarea of workpiece interarea, form the plated film with alligatoring face, and can on another interarea, form and there is even surface the plated film of (also claiming " shiny surface ").
Summary of the invention
In order to solve above-mentioned problem, the invention provides a kind of film-plating method that forms plated film on workpiece, described workpiece has an interarea and another interarea, and this another interarea is positioned at the opposition side of a described interarea, wherein:
Described workpiece and and the electrode of described interarea subtend configuration of described workpiece between be connected reversal of poles power supply; Described workpiece and and the electrode of described another interarea subtend configuration of described workpiece between be connected direct supply; And carry out a described interarea of described workpiece and the electroplating processes of described another interarea simultaneously.
According to the present invention, a kind of manufacture method of plated film can be provided, only adopt electroplating processes 1 time, just can on any one interarea of workpiece interarea, form the plated film with alligatoring face, and can on another interarea, form the plated film with even surface.
Brief description of the drawings
Fig. 1 is the explanatory view of the configuration example of the coating bath that uses in the film-plating method of embodiments of the present invention.
Fig. 2 is the explanatory view of QFN type lead frame.
Fig. 3 is the explanatory view of the current characteristics of the reversal of poles power supply of embodiments of the present invention.
Fig. 4 A, 4B are the SEM photos of the plated film that obtains in embodiments of the invention.
Fig. 5 A, 5B are the AFM photos of the plated film that obtains in embodiments of the invention.
Wherein, description of reference numerals is as follows:
12 workpiece,
121 1 interareas,
122 another interareas,
13,14 electrodes,
15 reversal of poles power supplys,
16 direct supplys.
Embodiment
Referring to accompanying drawing, embodiments of the present invention are described.Here it should be noted that, the present invention is not limited to following cited each embodiment.
In the present embodiment, the example of film-plating method of the present invention is described.
The film-plating method of present embodiment is the method that forms plated film on workpiece, and this workpiece has an interarea and another interarea, and this another interarea is positioned at the opposition side of this interarea.
First, workpiece and and the electrode of interarea subtend configuration of workpiece between be connected reversal of poles power supply, and workpiece and and the electrode of another interarea subtend configuration of described workpiece between be connected direct supply.Then, by reversal of poles power supply and direct supply to workpiece and each electrode application voltage, so that described workpiece interarea and another interarea are carried out to electroplating processes simultaneously.
Here,, with reference to accompanying drawing, the formation to carry out electroplating processes in the film-plating method of present embodiment time describes.
As shown in Figure 1, be provided with workpiece 12 in coating bath 11, it has an interarea 121 and another interarea 122.
Between the electrode 13 configuring with an interarea 121 subtends of workpiece 12 and workpiece 12, be connected reversal of poles power supply 15.In addition, between the electrode 14 configuring with another interarea 122 subtends of workpiece 12 and workpiece 12, be connected direct supply 16.
Workpiece 12 and electrode 13,14 are all immersed in the plating solution 17 in coating bath 11.
Below each parts are described.
As workpiece 12, it is not particularly limited.Although show the workpiece 12 of rectangular shape in Fig. 1, also without particular limitation to its shape, can adopt the workpiece 12 of different shape.But, be preferably and need on any one interarea of workpiece interarea, form the plated film with alligatoring face, and the various parts that form the plated film with even surface on another interarea that is positioned at opposition side to use be workpiece 12.For example, as mentioned above, as workpiece 12, be preferably use lead frame.
Especially, preferably any one the interarea side having interarea is carried out to resin sealing, making the lead frame of its form of exposing from resin use to another interarea side is workpiece 12.As such lead frame, for example, can list QFN (Quad Flat Non-leaded Package: quad flat non-pin package) type lead frame.QFN type lead frame 10 as shown in Figure 2, has lead-in wire 11 and chip mat (Die Pad) 12, and chip 13 has been installed on chip mat 12, and the chip mounting face side of lead frame 10 is sealed by resin 14.Now, as shown in Figure 2, also can be sealed by resin 14 lateral parts 101 of lead frame.
As mentioned above, QFN type lead frame is that its face side as chip carrying face is sealed by resin, the structure that another face side is exposed from resin., in a face side of such lead frame, need to have and the adherence of resin, and in another face side for this reason, need to have the adherence with scolder.According to the present invention, in a face side of lead frame, electroplate by implementing alligatoring, can improve and the adherence of resin, and in another face side, by being treated to level and smooth coated surface, can guarantee the adherence with scolder.In addition, if alligatoring is electroplated to the side that is carried out up to lead frame, can improve further the adherence with resin.
As the material of lead frame, generally can use copper alloy etc., still, during as product, in the case of having the face exposing from resin, while heating in manufacturing step etc., the part of exposing from resin forms oxide film, and this oxide film is peeled off sometimes.If occurred in manufacturing step to peel off, existed the problem that may pollute production line.
But, according to the film-plating method of present embodiment, can on any one interarea of workpiece 12, form level and smooth plated film.For this reason, the level and smooth plated film forming on copper alloy making wire frame can improve the adherence of oxide film and lead frame, accordingly, can prevent peeling off of oxide film.For example, if formed the Ni/Pd/Au layer as solder bonds layer in advance on copper alloy making wire frame, Ni layer can prevent the oxidation of lead frame, and can guarantee the good combination of scolder and lead frame.In the present embodiment, required level and smooth Ni layer can simultaneously obtain the alligatoring Ni layer higher with the adherence of resin and solder bonds time.
Next, reversal of poles power supply 15 is described.Reversal of poles power supply 15 for example as shown in Figure 3, provides the sense of current to carry out the electric current of mutual reversion the opportunity of being scheduled to, that is, be the periodically variable power supply of current polarity.The electric current that reversal of poles power supply 15 provides as shown in Figure 3, is preferably pulsed current.Now, in the time carrying out the electric current supply of positive pulse, the surface of workpiece 12 is electroplated, in the time carrying out the electric current supply of negative pulse, the surperficial stripping of workpiece 12 is to plating solution.
The actual conditions of paired pulses electric current, that is, the size of electric current, positive pulse, negative pulse are not particularly limited conduction time separately, can select arbitrarily according to the kind of the desired shape of the plated film of film forming or plating solution etc.
Especially positive pulse current value (separating out side current value) is being made as to I
p, positive pulse side electrolysis time (separating out side electrolysis time) is made as to T
p, negative pulse current value (stripping side current value) is made as to I
r, and negative pulse side electrolysis time (stripping side electrolysis time) is made as to T
rtime, be preferably and select so that the Cratio shown in following formula 1 becomes the value based on plating solution moiety.Here it should be noted that, because the value of Cratio changes with the variation of the characteristic of the moiety of plating solution or the plated film of film forming, so, be not particularly limited.But in order to form plated film on the surface at workpiece 12, the supply ratio of the positive pulse electric current in the electric current of supplying with is preferably the supply ratio higher than negative pulse electric current., Cratio is preferably and is at least greater than 1.
Cratio=(I
p× T
p)/(I
r× T
r) (formula 1)
Next, direct supply 16 is described.Direct supply 16 is power supplys of the electric current that provides certain between electrode 14 and workpiece 12.Now, the size of the electric current that direct supply 16 is provided is not particularly limited, and can select arbitrarily according to the kind of the desired shape of the plated film of film forming or plating solution etc.In the time that direct supply 16 is connected with electrode 14 and workpiece 12, for workpiece 12 relative with electrode 14 (that is, and " subtend ", below identical.) another interarea 122 on form plated film, the direct supply 16 preferably mode taking workpiece 12 as negative electrode connects.
Kind to plating solution 17 is not particularly limited, and can use various plating solutions according to the plated film that will form.As the metal of separating out plated film, for example, can list Cu, Ni etc.Like this, as plating solution, for example, be preferably and can use electrolytic copper plating bath or electrolytic nickel plating solution.Concrete moiety to these plating solutions is not particularly limited.In addition, also can add in advance the various added ingredientss such as brightening agent (Brightener), leveling agent (Leveler), polymkeric substance.
In addition, as shown in Figure 1, in the situation that having connected reversal of poles power supply 15, direct supply 16 and carried out electroplating, according to the film-plating method of present embodiment, as mentioned above, on 2 interareas 121,122 that can have at workpiece 12, form plated film.Now, the plated film of any one face in 2 interareas that workpiece 12 has can be alligatoring face, and the plated film of another face can be even surface.The face as alligatoring face, even surface in 2 interareas 121,122 of workpiece 12 changes with the variation of moiety or the plating condition etc. of plating solution.
About this point, first, to provide galvanic current between workpiece and electrode in the situation that, to use the situation that forms the plating solution of alligatoring face by this galvanic current to describe as example.Now, on another interarea 122 of the workpiece 12 that electrodes 14 in 2 interareas of workpiece 12, that connect with direct supply 16 are relative, separated out the plated film (alligatoring plated film) with alligatoring face.Meanwhile, on an interarea 121 of the relative workpiece 12 of the electrode 13 connecting with reversal of poles power supply 15, separated out the plated film (level and smooth plated film) with even surface.
First, on another interarea 122 of workpiece 12, form the plated film with alligatoring face and be owing to having connected direct supply 16 between another interarea 122 of workpiece 12 and electrode corresponding thereto 14, and formed plated film according to the characteristic of used plating solution.
The situation that forms the plated film with even surface on an interarea 121 of workpiece 12 describes.First, between interarea 121 of workpiece 12 and electrode corresponding thereto 13, connect reversal of poles power supply 15, in the time carrying out the supply of positive pulse electric current, the characteristic according to plating solution on the interarea of workpiece has formed alligatoring face.In addition, in the case of making the reversal of poles of electric current and providing pulsed current, at the protuberance that has formed the alligatoring face forming on workpiece interarea, electric current can be concentrated, and utilizes this characteristic to carry out anode electrolysis, and protuberance can be by optimum solvation.Like this, just can form the plated film with even surface.
Next, in the situation that providing galvanic current between workpiece and electrode, to using the situation that forms the plating solution of even surface by this galvanic current to describe.Now, on another interarea 122 of the workpiece 12 that electrode 14 in 2 interareas of workpiece 12, that connect with direct supply 16 is relative, can separate out the plated film (level and smooth plated film) with even surface.In addition, on an interarea 121 of the relative workpiece 12 of the electrode 13 connecting with reversal of poles power supply 15, can separate out the plated film (alligatoring plated film) with alligatoring face.
On another interarea 122 of workpiece 12, forming the plated film with even surface is owing to having connected direct supply 16 between another interarea 122 at workpiece 12 and electrode corresponding thereto 14, and has formed plated film according to the characteristic of used plating solution.
The situation that forms the plated film with alligatoring face on an interarea 121 of workpiece 12 is described.First, between interarea 121 of workpiece 12 and electrode corresponding thereto 13, connect reversal of poles power supply 15, by the positive pulse electric current that has exceeded the suitable current value that can obtain level and smooth plated film is provided, in a part for workpiece interarea, can form the poor plated film of adherence.In addition, in the case of making the reversal of poles of electric current and providing negative pulse electric current, by the poor plated film of the adherence forming on workpiece interarea is carried out to anode electrolysis, can only make the poor part of adherence dissolve.By repeatedly processing like this, can form alligatoring face.Like this, just can form surface irregularity and there is the plated film of alligatoring face.
In addition, here it should be noted that, although the situation that forms plated film on 2 interareas 121,122 of workpiece 12 is illustrated,, in the film-plating method of present embodiment, also can side by side also form plated film in side surface of workpiece part with workpiece interarea.Side plated film is to make by form plated film on the interarea of workpiece 12 time its part turn around mode in the past to form.
The plated film that the lateral parts of workpiece 12 is separated out is especially preferably and comprises alligatoring plated film.Its reason is, comprised alligatoring plated film at the plated film of the lateral parts of workpiece 12, can further improve the adherence with resin.For this reason, on the lateral parts of workpiece, be preferably and form alligatoring plated film.Now, on the lateral parts of workpiece, also can mixedly form alligatoring plated film and level and smooth plated film.
As mentioned above, according to the film-plating method of present embodiment, by only carrying out electroplating processes 1 time, just can on any one interarea of workpiece interarea, form the plated film with alligatoring face, and can on another interarea, form the plated film with even surface.
Like this, the plated film with alligatoring face forming on any one interarea of the interarea of workpiece 12 can improve bonding action when with resin-bonded.In addition, because an interarea in the surface of workpiece 12 is the plated film with even surface, so, in the time being provided with the interarea side of the plated film with alligatoring face and resin-bonded, even if there is the interarea side of plated film of even surface, resin is turned around over and adheres to, and also can easily remove this resin.
[embodiment]
In the present embodiment, on workpiece surface, manufactured plated film according to following order.
As shown in Figure 1, by connect reversal of poles power supply 15 between workpiece 12 and electrode 13, and connect direct supply 16 between workpiece 12 and electrode 14, carried out the manufacture of plated film.
Now, as workpiece 12, used the metal sheet being formed by copper alloy (C194).In addition, as the moiety of plating solution, the copper sulfate that comprises 200g/L, the sulfuric acid of 100g/L, the chlorine of 50ppm, brightening agent (Rohm & Hass Co. system, the trade(brand)name: MICROFILL of 2ml/L have been used
tMeVF BRIGHTER), leveling agent (Rohm & Hass Co. system, the trade(brand)name: MICROFILL of 10ml/L
tMeVF LEVELER) and polymkeric substance (Rohm & Hass Co. system, the trade(brand)name: MICROFILL of 20ml/L
tMeVF C2) plating solution.
After having manufactured under these conditions plated film, can confirm, the plated film that interarea 121 sides relative with electrode 13 of workpiece 12 form is alligatoring face, and the plated film that another interarea 122 sides relative with electrode 14 of workpiece 12 form is even surface.
To formed plated film, adopt SEM (Jeol Ltd.'s system, model: JSM-5600LV) to carry out surface observation.Observation photo based on SEM is shown in Fig. 4 A, 4B.Here it should be noted that, the observation of SEM is to carry out at the central part of each interarea.
Fig. 4 A shows the observation photo of the plated film of interarea 121 sides of workpiece 12, therefrom can confirm, and on its surface, has formed subparticle, is alligatoring face.In addition, Fig. 4 B shows the observation photo of the plated film of another interarea 122 sides of workpiece 12, therefrom can confirm, different from the plated film of interarea 121 sides of the workpiece 12 shown in Fig. 4 A, is even surface.
Next,, to formed plated film, adopt AFM (Seiko Instruments Inc. system, model: Nano Navi Nanocute) to observe, and observations and roughness measurement result are represented.Observation photo based on AFM is shown in Fig. 5 A, 5B.In addition, roughness measurement result is shown in Table 1.
[table 1]
| ? | Sa(nm) | P-V(nm) | S?ratio |
| Alligatoring face | 342.9 | 2213 | 2.244 |
| Even surface | 53.24 | 435.3 | 1.089 |
Fig. 5 A shows the observation photo of the plated film of interarea 121 sides of workpiece 12, and Fig. 5 B shows the observation photo of the plated film of another interarea 122 sides of workpiece 12.Also can confirm from the photo shown in Fig. 5 A, 5B, the plated film of interarea 121 sides is alligatoring face, and the plated film of another interarea 122 sides is even surface.
In addition, from table 1, also can confirm another interarea 122 sides of the workpiece 12 that arithmetic average roughness Sa, the maximum height P-V of interarea 121 sides of the workpiece 12 illustrating as alligatoring surfacing and surface-area rate S ratio illustrate than the level and smooth surfacing of the conduct in this table large.
In addition, in the situation that using as lead frame, the part of carrying out gold thread bonding (Wire Bonding) of lead frame surface is implemented silver-plated, does not generate oxide film because silver-plated, so, the especially easily problem of the adherence of generation and resin.For this reason, also carried out the mensuration of roughness to implementing again test portion surface after silver-plated on the plated film that formed in the present embodiment.
Now, silver-platedly use the plating solution that comprises silver cyanide (silver cyanide), and undertaken by the pulse power.
In addition, in order to compare, the roughness direct silver-plated on the surface of workpiece 12 is also measured.Here it should be noted that, in the case silver-plated is to have carried out film forming under the condition identical with the condition silver-plated implemented on having the plated film of alligatoring face.
Here it should be noted that, adopt laser microscope (Olympus Corporation system, model: OLS4000) to carry out the mensuration of roughness.The results are shown in table 2.
[table 2]
| ? | Sa(nm) | ? | S?ratio |
| Silver-plated on alligatoring face | 423 | ? | 1.324 |
| Silver-plated on even surface | 101 | ? | 1.015 |
As shown in table 2, by comparing knownly to having formed silver-plated situation and directly carried out silver-plated situation on alligatoring face on the surface of workpiece 12 that does not form plated film, on alligatoring face, form silver-plated in the situation that, surface is also very coarse.
In other words, can confirm, though in the case of formed after the plated film with alligatoring face, carry out again silver-plated, be subject to the impact of the shape of the plated film with alligatoring face, silver-plated surface similarly can be for alligatoring face., can confirm for this reason, form after the plated film with alligatoring face, even in the situation that forming again other plated film, also can similarly keep the adherence with resin.
The C194 copper alloy using in the present embodiment is when for lead frame etc., and in air, heated or rheological parameters' change with time can cause forming from the teeth outwards copper oxide, exists the situation that oxide film is peeled off.So, confirm suppressing peeling off also of this oxide film.
Particularly, the test portion that has formed plated film on two interareas in the present embodiment has been carried out to the heating of 15 minutes in air and at the temperature of 300 DEG C.After heating, carry out coolingly, and on the plated film of two interareas, attach adhesive tape (Sumitomo 3M Co., Ltd. system, trade(brand)name: Scotch (registered trademark) MendingTape810), then peeled off, accordingly, confirmed whether having there is stripping.Adopt such method, that is, if there is stripping, be labeled as "×", if there is not stripping, be labeled as "○", respectively alligatoring face and even surface are evaluated.Evaluation result is shown in Table 3.In table 3, the evaluation of the test portion to present embodiment is illustrated as " having formed the test portion of plated film ".Here it should be noted that, the test portion that has carried out evaluating is here to implement above-mentioned silver-plated front test portion,, has only formed copper-plated test portion that is.
In addition, in order to compare, to forming the workpiece before plated film, that is, tabular copper alloy has also carried out same test.In table, be illustrated as " without plated film ".Experimental result is shown in Table 3.
[table 3]
As shown in table 3, for not forming the test portion of plated film, there is the stripping of oxide film.But, for having formed the test portion of plated film, no matter be alligatoring face or even surface, all confirmed and can suppress stripping.
The present invention is not limited to above-mentioned embodiment, only otherwise depart from the technical scope that claims are recorded, can carry out various changes or append etc.
Claims (8)
1. on workpiece, form a film-plating method for plated film, described workpiece has an interarea and another interarea, and this another interarea is positioned at the opposition side of a described interarea, wherein:
Described workpiece and and the electrode of described interarea subtend configuration of described workpiece between be connected reversal of poles power supply;
Described workpiece and and the electrode of described another interarea subtend configuration of described workpiece between be connected direct supply; And
Carry out a described interarea of described workpiece and the electroplating processes of described another interarea simultaneously.
2. film-plating method as claimed in claim 1, wherein:
The mode of described direct supply taking described workpiece as negative electrode connects.
3. film-plating method as claimed in claim 1 or 2, wherein:
Lateral parts at described workpiece also forms plated film.
4. film-plating method as claimed in claim 1 or 2, wherein:
Described workpiece is lead frame.
5. film-plating method as claimed in claim 1 or 2, wherein:
With the plating solution that forms alligatoring face by galvanic current;
On a described interarea of described workpiece, separate out level and smooth plated film; And
On described another interarea of described workpiece, separate out alligatoring plated film.
6. film-plating method as claimed in claim 1 or 2, wherein:
With the plating solution that forms even surface by galvanic current;
On a described interarea of described workpiece, separate out alligatoring plated film; And
On described another interarea of described workpiece, separate out level and smooth plated film.
7. film-plating method as claimed in claim 1 or 2, wherein:
Lateral parts at described workpiece forms alligatoring plated film.
8. film-plating method as claimed in claim 1 or 2, wherein:
Mixedly form alligatoring plated film and level and smooth plated film at the lateral parts of described workpiece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013102470A JP6093646B2 (en) | 2013-05-14 | 2013-05-14 | Manufacturing method of plating film |
| JP2013-102470 | 2013-05-14 |
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| Publication Number | Publication Date |
|---|---|
| CN104152959A true CN104152959A (en) | 2014-11-19 |
| CN104152959B CN104152959B (en) | 2018-11-13 |
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| CN201410199014.0A Active CN104152959B (en) | 2013-05-14 | 2014-05-09 | Film-plating method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6093646B2 (en) |
| KR (1) | KR102102263B1 (en) |
| CN (1) | CN104152959B (en) |
| MY (1) | MY194185A (en) |
| TW (1) | TWI627315B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109468670A (en) * | 2018-11-16 | 2019-03-15 | 中山品高电子材料有限公司 | The method of lead frame copper electroplating layer |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6685112B2 (en) * | 2015-11-18 | 2020-04-22 | 株式会社三井ハイテック | Lead frame, lead frame package, and manufacturing method thereof |
| JP6621681B2 (en) * | 2016-02-17 | 2019-12-18 | 株式会社三井ハイテック | Lead frame, manufacturing method thereof, and semiconductor package |
| JP6905031B2 (en) * | 2016-02-17 | 2021-07-21 | 株式会社三井ハイテック | Lead frame and semiconductor package |
| JP6782116B2 (en) * | 2016-08-02 | 2020-11-11 | 古河電気工業株式会社 | Silver coating material |
| CN112331566A (en) * | 2020-11-02 | 2021-02-05 | 昆山一鼎工业科技有限公司 | Manufacturing equipment and manufacturing method for surface roughness of lead frame |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2587889Y (en) * | 2002-12-11 | 2003-11-26 | 吕明 | Electric deposition equipment for making high-porosity metal strip material |
| JP2005097721A (en) * | 2003-08-27 | 2005-04-14 | Yamaha Corp | Apparatus and method for plating both sides |
| CN2712947Y (en) * | 2004-07-20 | 2005-07-27 | 戴其金 | Plating bath with double anode |
| CN102337578A (en) * | 2010-07-19 | 2012-02-01 | 北大方正集团有限公司 | Double-sided plating tank, sheet and plating method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6179988B1 (en) * | 1997-08-29 | 2001-01-30 | Electrocopper Products Limited | Process for making copper wire |
| JP3690603B2 (en) * | 2002-11-28 | 2005-08-31 | 株式会社中央製作所 | Current control method for continuous plating |
| JP4981488B2 (en) * | 2007-03-09 | 2012-07-18 | 古河電気工業株式会社 | Roughened rolled copper plate and method for producing the same |
| KR20100066988A (en) * | 2008-12-10 | 2010-06-18 | 삼성테크윈 주식회사 | Uniform pating method for pcb |
| KR100950442B1 (en) * | 2009-05-13 | 2010-04-02 | 주식회사 모아기술 | Method for antibious surface treatment of aluminum matter using high frequency pluse |
-
2013
- 2013-05-14 JP JP2013102470A patent/JP6093646B2/en active Active
-
2014
- 2014-05-06 TW TW103116038A patent/TWI627315B/en active
- 2014-05-09 CN CN201410199014.0A patent/CN104152959B/en active Active
- 2014-05-12 MY MYPI2014001378A patent/MY194185A/en unknown
- 2014-05-13 KR KR1020140057115A patent/KR102102263B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2587889Y (en) * | 2002-12-11 | 2003-11-26 | 吕明 | Electric deposition equipment for making high-porosity metal strip material |
| JP2005097721A (en) * | 2003-08-27 | 2005-04-14 | Yamaha Corp | Apparatus and method for plating both sides |
| CN2712947Y (en) * | 2004-07-20 | 2005-07-27 | 戴其金 | Plating bath with double anode |
| CN102337578A (en) * | 2010-07-19 | 2012-02-01 | 北大方正集团有限公司 | Double-sided plating tank, sheet and plating method |
Non-Patent Citations (1)
| Title |
|---|
| 向国朴 等，: ""反向脉冲电流对镀层表面粗糙度的影响"", 《电镀与环保》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109468670A (en) * | 2018-11-16 | 2019-03-15 | 中山品高电子材料有限公司 | The method of lead frame copper electroplating layer |
| CN109468670B (en) * | 2018-11-16 | 2021-03-26 | 中山品高电子材料有限公司 | Method for electroplating copper layer on lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI627315B (en) | 2018-06-21 |
| KR102102263B1 (en) | 2020-04-20 |
| MY194185A (en) | 2022-11-17 |
| TW201500599A (en) | 2015-01-01 |
| JP6093646B2 (en) | 2017-03-08 |
| KR20140135108A (en) | 2014-11-25 |
| CN104152959B (en) | 2018-11-13 |
| JP2014221941A (en) | 2014-11-27 |
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