CN104066806A - 粘合片及电子器件的制造方法 - Google Patents
粘合片及电子器件的制造方法 Download PDFInfo
- Publication number
- CN104066806A CN104066806A CN201280066931.0A CN201280066931A CN104066806A CN 104066806 A CN104066806 A CN 104066806A CN 201280066931 A CN201280066931 A CN 201280066931A CN 104066806 A CN104066806 A CN 104066806A
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- Prior art keywords
- adhesive sheet
- methyl
- hydrogenation
- mass parts
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 235000007586 terpenes Nutrition 0.000 claims abstract description 28
- 239000005011 phenolic resin Substances 0.000 claims abstract description 26
- 150000003505 terpenes Chemical class 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- 239000012948 isocyanate Substances 0.000 claims abstract description 21
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 238000005984 hydrogenation reaction Methods 0.000 claims description 34
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 25
- 229920001568 phenolic resin Polymers 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 24
- 238000005520 cutting process Methods 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 6
- 238000005805 hydroxylation reaction Methods 0.000 claims description 2
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
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- 239000000463 material Substances 0.000 description 19
- 239000000178 monomer Substances 0.000 description 16
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 10
- LDHQCZJRKDOVOX-UHFFFAOYSA-N 2-butenoic acid Chemical compound CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 6
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- 229920001228 polyisocyanate Polymers 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 5
- 229920000831 ionic polymer Polymers 0.000 description 5
- 239000002952 polymeric resin Substances 0.000 description 5
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 5
- 239000013638 trimer Substances 0.000 description 5
- MWKAGZWJHCTVJY-UHFFFAOYSA-N 3-hydroxyoctadecan-2-one Chemical class CCCCCCCCCCCCCCCC(O)C(C)=O MWKAGZWJHCTVJY-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical class CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
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- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- YHQGMYUVUMAZJR-UHFFFAOYSA-N α-terpinene Chemical compound CC(C)C1=CC=C(C)CC1 YHQGMYUVUMAZJR-UHFFFAOYSA-N 0.000 description 4
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 2
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 2
- GQVMHMFBVWSSPF-SOYUKNQTSA-N (4E,6E)-2,6-dimethylocta-2,4,6-triene Chemical compound C\C=C(/C)\C=C\C=C(C)C GQVMHMFBVWSSPF-SOYUKNQTSA-N 0.000 description 2
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 2
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 241001050985 Disco Species 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- WSTYNZDAOAEEKG-UHFFFAOYSA-N Mayol Natural products CC1=C(O)C(=O)C=C2C(CCC3(C4CC(C(CC4(CCC33C)C)=O)C)C)(C)C3=CC=C21 WSTYNZDAOAEEKG-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 150000008062 acetophenones Chemical class 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 2
- VYBREYKSZAROCT-UHFFFAOYSA-N alpha-myrcene Natural products CC(=C)CCCC(=C)C=C VYBREYKSZAROCT-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229930006722 beta-pinene Natural products 0.000 description 2
- NYVPYOCCTPDTKV-UHFFFAOYSA-N carbamic acid;isocyanic acid Chemical group N=C=O.NC(O)=O NYVPYOCCTPDTKV-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- GQVMHMFBVWSSPF-UHFFFAOYSA-N cis-alloocimene Natural products CC=C(C)C=CC=C(C)C GQVMHMFBVWSSPF-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- 229920006037 cross link polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
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- 229940087305 limonene Drugs 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- 238000006116 polymerization reaction Methods 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
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- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- DUXYWXYOBMKGIN-UHFFFAOYSA-N trimyristin Chemical compound CCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCC DUXYWXYOBMKGIN-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OGLDWXZKYODSOB-UHFFFAOYSA-N α-phellandrene Chemical compound CC(C)C1CC=C(C)C=C1 OGLDWXZKYODSOB-UHFFFAOYSA-N 0.000 description 2
- IHPKGUQCSIINRJ-UHFFFAOYSA-N β-ocimene Natural products CC(C)=CCC=C(C)C=C IHPKGUQCSIINRJ-UHFFFAOYSA-N 0.000 description 2
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- NDVASEGYNIMXJL-NXEZZACHSA-N (+)-sabinene Natural products C=C1CC[C@@]2(C(C)C)[C@@H]1C2 NDVASEGYNIMXJL-NXEZZACHSA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- NQBWNECTZUOWID-UHFFFAOYSA-N (E)-cinnamyl (E)-cinnamate Natural products C=1C=CC=CC=1C=CC(=O)OCC=CC1=CC=CC=C1 NQBWNECTZUOWID-UHFFFAOYSA-N 0.000 description 1
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- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical class O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
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- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
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- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
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- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
- C08G18/792—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Abstract
本发明的主要目的在于提供切割时芯片不飞散、可容易拾取、不易发生粘合剂残留的粘合片。所述粘合片通过在基材上层叠光固化型粘合剂层而成,该光固化型粘合剂含有(甲基)丙烯酸酯共聚物、光聚合性化合物、多官能异氰酸酯固化剂、光聚合引发剂及增粘树脂,所述增粘树脂是完全或部分氢化的萜烯酚树脂。
Description
技术领域
本发明涉及粘合片及使用该粘合片的电子器件的制造方法。
背景技术
半导体晶圆或基板在贴合粘合片后,进行切断成元件小片(切割)、粘合片的拉伸(扩展)、自粘合片剥离元件小片(拾取)等各步骤。希望在这些步骤中所使用的粘合片(切割胶带)对在切割步骤中被切断的元件小片(芯片)具有充分的粘合力,并且在拾取步骤时粘合力减小至没有粘合剂残留的程度。
作为粘合片,有在对紫外线及/或电子射线等活性光线具有透过性的基材上,涂布在紫外线等作用下进行聚合固化反应的粘合剂层而成的粘合片。该粘合片采用在切割步骤后,对粘合剂层照射紫外线等,使粘合剂层聚合固化来降低粘合力后,拾取被切断的芯片的方法。
作为这样的粘合片,专利文献1及专利文献2中公开了藉由在基材面上,例如涂布能经由活性光线而三维网状化且含有在分子内具有光聚合性不饱和双键的化合物(多官能性低聚物)而成的粘合剂的粘合片。
现有技术文献
专利文献
专利文献1:日本特开昭60-196956号公报
专利文献2:日本特开昭60-223139号公报
发明内容
发明所要解决的课题
在半导体晶圆或基板的加工步骤中,为了使切割步骤所切断的元件小片(芯片)不飞散,有在粘合片的粘合剂中含有增粘树脂的情况,但存在照射活性光线时,增粘树脂发挥不良影响,引起粘合剂的固化障碍,有拾取步骤时无法剥离或发生粘合剂残留的情况。还存在增粘树脂会经时地渗出至半导体晶圆或基板表面的情况。
因此,本发明的主要目的在于提供切割时芯片不飞散、可容易拾取、不易发生粘合剂残留的粘合片。
用于解决课题的手段
本发明者们提供粘合片,其为在基材上层叠光固化型粘合剂层而成的粘合片,其中,光固化型粘合剂含有(甲基)丙烯酸酯共聚物、光聚合性化合物、多官能异氰酸酯固化剂、光聚合引发剂及增粘树脂,该增粘树脂是完全或部分氢化的萜烯酚树脂。
在本发明的一个方案中,前述完全或部分氢化的萜烯酚树脂的羟值为50~250。另外,前述完全或部分氢化的萜烯酚树脂的氢化率为30~100%。
另外,在本发明的一个方案中,前述光固化型粘合剂含有100质量份的(甲基)丙烯酸酯共聚物、5~200质量份的光聚合性化合物、0.5~20质量份的多官能异氰酸酯固化剂、0.1~20质量份的光聚合引发剂及0.5~100质量份的完全或部分氢化的萜烯酚树脂。
另外,在本发明的一个方案中,前述光固化型粘合剂是具有羟基的(甲基)丙烯酸酯共聚物、具有羟基的光聚合引发剂与完全或部分氢化的萜烯酚树脂通过使用异氰酸酯固化剂化学键合而成。
进而,本发明还提供一种电子器件的制造方法,其为使用权利要求1~5所述的前述粘合片的电子器件的制造方法,其包括:在粘合于环框上的前述粘合片上粘贴半导体晶圆或基板的粘贴步骤;切割前述半导体晶圆或前述基板而形成半导体芯片或半导体器件的切割步骤;对前述粘合片照射活性光线的光照射步骤;拉伸粘合片以扩大前述半导体芯片或前述半导体器件彼此的间隔的扩展步骤;以及自前述粘合片拾取前述半导体芯片或前述半导体器件的拾取步骤。
发明效果
依照本发明,能够提供切割时芯片不飞散、可容易拾取、不易发生粘合剂残留的粘合片。
具体实施方式
以下,说明用于实施本发明的优选实施方式。应予说明,以下说明的实施方式表示本发明的代表性实施方式的一个例子,本发明的范围不应由此被狭义地解释。
1.粘合片
本发明的粘合片的特征为:在基材上层叠光固化型粘合剂层(以下也简称为“粘合剂层”)而成,光固化型粘合剂含有(甲基)丙烯酸酯共聚物、光聚合性化合物、多官能异氰酸酯固化剂、光聚合引发剂及增粘树脂,该增粘树脂是完全或部分氢化的萜烯酚树脂。
(1-1)(甲基)丙烯酸酯共聚物
(甲基)丙烯酸酯共聚物是仅(甲基)丙烯酸酯单体的聚合物,或(甲基)丙烯酸酯单体与乙烯基化合物单体的共聚物。应予说明,所谓的(甲基)丙烯酸酯是丙烯酸酯及甲基丙烯酸酯的总称。(甲基)丙烯酸等含有(甲基)的化合物等也同样是在名称中具有“甲基”的化合物与不具有“甲基”的化合物的总称。
作为(甲基)丙烯酸酯的单体,可举出例如:(甲基)丙烯酸丁酯、(甲基)丙烯酸2-丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸十三酯、(甲基)丙烯酸肉豆蔻酯、(甲基)丙烯酸鲸蜡酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸环己酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸二环戊烯基酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丁氧基甲酯及(甲基)丙烯酸乙氧基正丙酯。
作为能够与(甲基)丙烯酸酯单体共聚的乙烯基化合物单体,可举出具有羟基、羧基、环氧基、酰胺基、氨基、羟甲基、磺酸基、氨基磺酸基或(亚)磷酸酯基这个官能团组中的一种以上的含官能团单体。
作为具有羟基的单体,有例如:(甲基)丙烯酸2-羟基乙酯、(甲基)丙烯酸2-羟基丙酯、(甲基)丙烯酸4-羟基丁酯。
作为具有羧基的单体,有例如:(甲基)丙烯酸、巴豆酸、马来酸、马来酸酐、衣康酸、富马酸、丙烯酰胺-N-乙醇酸及肉桂酸。
作为具有环氧基的单体,有例如:烯丙基缩水甘油醚及(甲基)丙烯酸缩水甘油醚。
作为具有酰胺基的单体,有例如:(甲基)丙烯酰胺。
作为具有氨基的单体,有例如:(甲基)丙烯酸N,N-二甲基氨基乙酯。
作为具有羟甲基的单体,有例如:N-羟甲基丙烯酰胺。
其中,为了防止对粘附体的污染,优选含有具有能与异氰酸酯固化剂反应的羟基的单体。
(1-2)光聚合性化合物
作为光聚合性化合物,可使用例如:三羟甲基丙烷三丙烯酸酯、四羟甲基甲烷四丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇单羟基五丙烯酸酯、二季戊四醇六丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、三聚氰酸三乙基丙烯酸酯、市售的丙烯酸酯类低聚物等。
作为光聚合性化合物,除了上述丙烯酸酯类化合物,还可使用氨基甲酸酯丙烯酸酯低聚物。氨基甲酸酯丙烯酸酯低聚物通过使末端异氰酸酯氨基甲酸酯预聚物与具有羟基的(甲基)丙烯酸酯反应而得,所述末端异氰酸酯氨基甲酸酯预聚物通过使聚酯型或聚醚型等多羟基化合物与多元异氰酸酯化合物反应而得。
多元异氰酸酯化合物可以使用例如:2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、1,3-二甲苯二异氰酸酯、1,4-二甲苯二异氰酸酯、二苯基甲烷-4,4-二异氰酸酯、三甲基六亚甲基二异氰酸酯、六亚甲基二异氰酸酯、异佛尔酮二异氰酸酯等。另外,具有羟基的(甲基)丙烯酸酯可以使用例如:(甲基)丙烯酸-2-羟基乙酯、(甲基)丙烯酸-2-羟基丙酯、聚乙二醇(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、缩水甘油二(甲基)丙烯酸酯、二季戊四醇单羟基五丙烯酸酯等。
作为光聚合性化合物,从紫外线等照射后的粘合剂固化良好方面考虑,优选具有4个以上乙烯基的氨基甲酸酯丙烯酸酯低聚物。
光聚合性化合物的掺合量,相对于100质量份的(甲基)丙烯酸酯共聚物,优选为5质量份以上200质量份以下,更优选为20质量份以上120质量份以下。若减少光聚合性化合物的掺合量,则放射线照射后的粘合片的剥离性降低,容易发生半导体芯片的拾取不良。另一方面,若增加光聚合性化合物的掺合量,则由于切割时的粘合剂的拨起而容易发生拾取不良,同时因反应残渣而产生微小的粘合剂残留,成为污染的原因。
(1-3)多官能异氰酸酯固化剂
多官能异氰酸酯固化剂为具有2个以上异氰酸酯基的多官能异氰酸酯固化剂,例如可以使用芳香族多异氰酸酯、脂肪族多异氰酸酯、脂环族多异氰酸酯、它们的二聚物或三聚物、加成物等。
作为芳香族多异氰酸酯,有例如:1,3-亚苯基二异氰酸酯、4,4’-二苯基二异氰酸酯、1,4-亚苯基二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、4,4’-甲苯胺二异氰酸酯、2,4,6-三异氰酸酯基甲苯、1,3,5-三异氰酸酯基苯、联茴香胺二异氰酸酯、4,4’-二苯基醚二异氰酸酯、4,4’,4”-三苯基甲烷三异氰酸酯、ω,ω’-二异氰酸酯-1,3-二甲基苯、ω,ω’-二异氰酸酯-1,4-二甲基苯、ω,ω’-二异氰酸酯-1,4-二乙基苯、1,4-四甲基苯二甲基二异氰酸酯及1,3-四甲基苯二甲基二异氰酸酯。
作为脂肪族多异氰酸酯,有例如:三亚甲基二异氰酸酯、四亚甲基二异氰酸酯、六亚甲基二异氰酸酯、五亚甲基二异氰酸酯、1,2-亚丙基二异氰酸酯、2,3-亚丁基二异氰酸酯、1,3-亚丁基二异氰酸酯、十二亚甲基二异氰酸酯及2,4,4-三甲基六亚甲基二异氰酸酯。
作为脂环族多异氰酸酯,有例如:3-异氰酸甲酯基-3,5,5-三甲基环己基异氰酸酯、1,3-环戊烷二异氰酸酯、1,3-环己烷二异氰酸酯、1,4-环己烷二异氰酸酯、甲基-2,4-环己烷二异氰酸酯、甲基-2,6-环己烷二异氰酸酯、4,4’-亚甲基-双(环己基异氰酸酯)、1,4-双(异氰酸甲酯基)环己烷及1,4-双(异氰酸甲酯基)环己烷。
作为二聚物或三聚物、加成物,有例如:二苯基甲烷二异氰酸酯的二聚物、六亚甲基二异氰酸酯的三聚物、三羟甲基丙烷与甲苯二异氰酸酯的加成物、三羟甲基丙烷与六亚甲基二异氰酸酯的加成物。
上述多异氰酸酯中,优选具有3个以上异氰酸酯基的多异氰酸酯,特别优选六亚甲基二异氰酸酯的三聚物、三羟甲基丙烷与甲苯二异氰酸酯的加成物、三羟甲基丙烷与六亚甲基二异氰酸酯的加成物。
多官能异氰酸酯固化剂的掺合比,相对于100质量份的(甲基)丙烯酸酯共聚物,优选为0.5质量份以上20质量份以下,更优选为1.0质量份以上10质量份以下。多官能异氰酸酯固化剂若为0.5质量份以上,则由于粘合力并不太强,因此可抑制拾取不良的产生,进而藉由具有羟基的光聚合引发剂与完全或部分氢化的萜烯酚树脂的化学键合,可抑制光聚合引发剂与完全或部分氢化的萜烯酚树脂向粘合剂表面的渗出所造成的污染,多官能异氰酸酯固化剂若为20质量份以下,则粘合力不降低,在切割时维持半导体芯片的保持性。
(1-4)光聚合引发剂
光聚合引发剂使用本偶姻、本偶姻烷基醚类、苯乙酮类、蒽醌类、噻吨酮类、缩酮类、二苯甲酮类或呫吨酮类等。
作为本偶姻,有例如:本偶姻、本偶姻甲基醚、本偶姻乙基醚、本偶姻丙基醚等。
作为苯乙酮类,有例如:本偶姻烷基醚类、苯乙酮、2,2-二甲氧基-2-苯乙酮、2,2-二乙氧基-2-苯乙酮、1,1-二氯苯乙酮等。
作为蒽醌类,有2-甲基蒽醌、2-乙基蒽醌、2-叔丁基蒽醌、1-氯蒽醌等。
作为噻吨酮类,有例如:2,4-二甲基噻吨酮、2,4-二异丙基噻吨酮、2-氯噻吨酮、2,4-二异丙基噻吨酮等。
作为缩酮类,有例如:苯乙酮二甲基缩酮、苯偶酰二甲基缩酮、苯偶酰二苯基硫化物、四甲基秋兰姆单硫化物、偶氮二异丁腈、联苄、联乙酰、β-氯蒽醌等。
其中,为了防止对粘附体的污染,优选具有能与异氰酸酯固化剂反应的羟基的2-羟基-1-{4-[4-(2-羟基-2-甲基-丙酰基)-苄基]-苯基}-2-甲基-丙-1-酮(BASF Japan CORPORATION制,产品名IRGACURE127)等。
光聚合引发剂的掺合量,相对于100质量份的(甲基)丙烯酸酯聚合物,优选为0.1质量份以上20质量份以下。掺合量若过少,则放射线照射后的粘合片的剥离性降低,容易发生半导体芯片的拾取不良。另一方面,掺合量若过多,则光聚合引发剂渗出至粘合剂表面,成为污染的原因。
光聚合引发剂中,视需要也可组合并用1种或2种以上现有公知的光聚合促进剂。光聚合促进剂可使用苯甲酸类或叔胺等。作为叔胺,可举出三乙胺、四乙基五胺、二甲基氨基醚等。
(1-5)增粘树脂
作为增粘树脂,优选将萜烯酚树脂完全或部分氢化的萜烯酚树脂。
萜烯酚树脂例如可藉由使1摩尔的萜烯化合物与0.1~50摩尔的酚类反应而制造。
作为萜烯化合物,可举出月桂烯、别罗勒烯、罗勒烯、α-蒎烯、β-蒎烯、双戊烯、柠檬烯、α-水芹烯、α-萜品烯、γ-萜品烯、萜品二烯、1,8-桉树脑、1,4-桉树脑、α-萜品醇、β-萜品醇、γ-萜品醇、莰烯、三环萜、桧烯、对二烯(paramenthadiene)类、蒈烯类等。这些化合物中,本发明特别优选使用α-蒎烯、β-蒎烯、柠檬烯、月桂烯、别罗勒烯、α-萜品烯。
作为酚类,可举出苯酚、甲酚、二甲苯酚、儿茶酚、间苯二酚、氢醌、双酚A等,但不限于此。
萜烯酚树脂的酚类的比率是25~50摩尔%左右,但不限于此。
完全或部分氢化的萜烯酚树脂的羟值优选为50~250。这是因为羟值低于50时,与异氰酸酯类固化剂的反应不充分,渗出至粘合剂表面,成为污染的原因,若大于250则粘度上升,发生与(甲基)丙烯酸酯共聚物等的混合不均,从而拾取特性不稳定。
氢化的方法没有特别限制,可举出例如:使用钯、钌、铑等贵金属或将它们负载在活性炭、活性氧化铝、硅藻土等载体上而得的产品作为催化剂而进行氢化的方法。另外,氢化率可藉由溴值测定、碘值测定等来测定。
完全或部分氢化的萜烯酚树脂的氢化率优选为30%以上,更优选为70%以上。这是因为低于30%时,由活性光线的照射所引发的光聚合性化合物的反应障碍导致粘合力没有充分降低,拾取性降低。
完全或部分氢化的萜烯酚树脂的掺合比,相对于100质量份的(甲基)丙烯酸酯共聚物,优选为0.5质量份以上100质量份以下,更优选为1.0质量份以上50质量份以下。完全或部分氢化的萜烯酚树脂若为0.5质量份以上,则由于粘合力并不太低,所以在切割时能够维持半导体芯片的保持性,若为100质量份以下,则可抑制拾取不良的发生。
粘合剂层的厚度优选为3μm以上100μm以下,特别优选为5μm以上20μm以下。粘合剂层若过厚,则粘合力变得过高,拾取性降低。另外,粘合剂层若过薄,则粘合力变得过低,切割时的芯片保持性降低,在环框与片之间有发生剥离的情况。
粘合剂中,也可添加防老化剂、填充剂、紫外线吸收剂及光稳定剂等各种添加剂。
(2)基材
作为基材的材料,可举出例如:聚氯乙烯、聚对苯二甲酸乙二醇酯、乙烯-醋酸乙烯共聚物、乙烯-丙烯酸-丙烯酸酯膜、乙烯-丙烯酸乙酯共聚物、聚乙烯、聚丙烯、丙烯类共聚物、乙烯-丙烯酸共聚物,及乙烯-(甲基)丙烯酸共聚物或乙烯-(甲基)丙烯酸-(甲基)丙烯酸酯共聚物等经金属离子进行交联而得的离子键聚合物树脂等。基材可为这些树脂的混合物或共聚物,也可为由这些树脂所成的膜或片的层叠体。
基材膜的原材料优选使用离子键聚合物树脂。离子键聚合物树脂中,若使用将具有乙烯单元、甲基丙烯酸单元及(甲基)丙烯酸烷基酯单元的共聚物经Na+、K+、Zn2+等金属离子进行交联而得的离子键聚合物树脂,则切削屑抑制效果显著,故而优选使用。
基材可为由上述材料所成的单层或多层的膜或片,也可为层叠由不同材料所成的膜等而得的基材。基材的厚度为50~200μm,优选为70~150μm。
优选对基材实施抗静电处理。作为抗静电处理,有在基材中掺合抗静电剂的处理、在基材表面上涂布抗静电剂的处理、利用电晕放电的处理。
作为抗静电剂,可使用例如:季铵盐单体等。作为季铵盐单体,可举出例如:二甲基氨基乙基(甲基)丙烯酸酯季盐化物、二乙基氨基乙基(甲基)丙烯酸酯季盐化物、甲基乙基氨基乙基(甲基)丙烯酸酯季盐化物、对二甲基氨基苯乙烯季盐化物及对二乙基氨基苯乙烯季盐化物。其中,优选为二甲基氨基乙基甲基丙烯酸酯季盐化物。
2.电子器件的制造方法
依顺序说明本发明的电子器件的制造方法的具体步骤。
(2-1)粘贴步骤
首先,于粘贴步骤中,将粘合片粘贴于半导体晶圆(或基板)与环框上。晶圆可为硅晶圆及氮化镓晶圆、碳化硅晶圆、蓝宝石晶圆等目前广泛使用的晶圆。基板可为以树脂密封了芯片的封装基板、LED封装基板等广泛使用的基板。
(2-2)切割步骤
于切割步骤中,将硅晶圆等切割而形成半导体芯片或半导体器件。
(2-3)光照射步骤
于光照射步骤中,自基材侧,对光固化型粘合剂层照射紫外线等活性光线。作为紫外线的光源,可使用低压水银灯、高压水银灯、超高压水银灯、金属卤化物灯。另外,还可使用电子射线代替紫外线,电子射线的光源可使用α射线、β射线、γ射线。
藉由光照射,粘合剂层被三维网状化而固化,粘合剂层的粘合力降低。此时,如上所述,即使将本发明的粘合片加温,也不会出现过度地粘合于晶圆等情况,故藉由紫外线等的照射而得到粘合力的充分降低。
(2-4)扩展步骤/拾取步骤
于扩展步骤/拾取步骤中,为了扩大半导体芯片或半导体器件彼此的间隔而将粘合片拉伸,以针销等顶起芯片或器件。然后,以真空筒夹或空气镊子等吸附芯片或器件,自粘合片的粘合剂层剥离而拾取。此时,本发明的粘合片由于藉由紫外线等的照射而得到粘合力的充分降低,故芯片或器件与粘合剂层之间的剥离变容易,得到良好的拾取性,也不发生粘合剂残留等不良。
实施例
<实施例1>
依照“表1”中所示的配比来调制光固化型粘合剂。将此光固化型粘合剂涂布于聚对苯二甲酸乙二酯制的隔离膜上,并且涂布使干燥后的粘合层的厚度成为20μm。将该粘合层层叠在基材膜上,于40℃下熟化7日,得到粘合片。
基材膜为以乙烯-甲基丙烯酸-甲基丙烯酸烷基酯共聚物的Zn盐作为主体的离子键聚合物树脂,使用经T模头挤出MFR值为1.0g/10分钟(JIS K7210,210℃)、熔点86℃、含有Zn2+离子的材料(DUPONT-MITSUI POLYCHEMICALS CORPORATION制,编号:HM1855)而成膜为100μm的基材膜。
[光固化型粘合剂]
[(甲基)丙烯酸酯共聚物]
A-1:综研化学株式会社制SK-Dyne1496;96%的丙烯酸-2-乙基己酯、4%的丙烯酸-2-羟基乙酯的共聚物,藉由溶液聚合而得。
A-2:日本ZEON CORPORATION制丙烯酸橡胶AR53L;42%的丙烯酸乙酯、22%的丙烯酸丁酯、36%的丙烯酸甲氧基乙酯的共聚物,藉由乳液聚合而得。
[光聚合性化合物]
B-1:根上工业株式会社制UN-905;使异佛尔酮二异氰酸酯的三聚物与以二季戊四醇五丙烯酸酯作为主成分的丙烯酸酯反应而得的光聚合性化合物,乙烯基数为15个。
B-2:新中村化学株式会社制A-TMPT;三羟甲基丙烷三丙烯酸酯,乙烯基数为3个。
[多官能异氰酸酯固化剂]
C-1:日本聚氨酯株式会社制Coronate L-45E;2,4-甲苯二异氰酸酯与三羟甲基丙烷的加成物。
[光聚合引发剂]
D-1:BASF Japan CORPORATION制IRGACURE127;2-羟基-1-{4-[4-(2-羟基-2-甲基-丙酰基)-苄基]-苯基}-2-甲基-丙-1-酮。
D-2:BASF Japan CORPORATION制IRGACURE651;苯偶酰二甲基缩酮。
[增粘树脂]
使1摩尔的α-蒎烯(Yasuhara Chemical(株)制α-蒎烯,纯度95%)与0.5摩尔的苯酚(关东化学(株)制苯酚,纯度99%)反应,并且使用GPC测定的数均分子量600、重均分子量800的萜烯酚树脂,得到E-1的部分氢化的萜烯酚树脂。
E-1:羟值120、氢化率75%的本公司合成品
以下,改变α-蒎烯与苯酚的摩尔比率进行反应,并且使用所得的萜烯酚树脂,得到完全或部分氢化的萜烯酚树脂。
E-2:羟值5、氢化率75%的本公司合成品
E-3:羟值250、氢化率75%的本公司合成品
E-4:羟值3、氢化率75%的本公司合成品
E-5:羟值300、氢化率75%的本公司合成品
E-6:羟值120、氢化率30%的本公司合成品
E-7:羟值120、氢化率20%的本公司合成品
E-8:羟值120、氢化率0%的本公司合成品
E-9:羟值120、氢化率100%的本公司合成品
将所得的粘合片粘贴在形成有虚拟(dummy)电路图案的直径为8英寸、厚度为0.1mm的硅晶圆与环框上,进行切割。然后,进行光照射、扩展、拾取各步骤。
切割步骤的条件如下。
切割装置:DISCO CORPORATION制DAD341
切割刀:DISCO CORPORATION制NBC-ZH205O-27HEEE
切割刀形状:外径55.56mm,刃宽35μm,内径19.05mm
切割刀旋转数:40,000rpm
切割刀输送速度:50mm/秒
切割尺寸:10mm见方
对粘合片的切入量:40μm
切削水温度:25℃
切削水量:1.0升/分钟
光照射步骤的条件如下。
紫外线照射:高压水银灯,照射量为150mJ/cm2
扩展与拾取步骤的条件如下。
拾取装置:Canon Machinery CORPORATION制CAP-300II
扩展量:8mm
针销形状:250μmR
针销数:5根
针销顶起高度:0.3mm
于切割步骤及扩展与拾取步骤中,进行以下的评价。
(1)芯片保持性
芯片保持性基于切割步骤后半导体芯片保持在粘合片上的半导体芯片残存率,按以下的基准来评价。
优(◎):芯片飞散低于5%
良(○):芯片飞散为5%以上且低于10%
差(×):芯片飞散为10%以上
(2)拾取性
拾取性基于拾取步骤中半导体芯片可拾取的比率,按以下基准来评价。
优(◎):芯片的拾取成功率为95%以上
良(○):芯片的拾取成功率为80%以上且低于95%
差(×):芯片的拾取成功率低于80%
(3)污染性
将粘合片粘贴于硅制镜面晶圆上,20分钟后用高压水银灯以150mJ/cm2照射紫外线后,剥离粘合片。用颗粒计数器来测定在硅制镜面晶圆的粘贴面上所残留的0.28μm以上的粒子数。
优(◎):颗粒少于500个
良(○):颗粒少于2000个
差(×):颗粒为2000个以上
Claims (6)
1.一种粘合片,其为在基材上层叠光固化型粘合剂层而成的粘合片,其中,所述光固化型粘合剂含有(甲基)丙烯酸酯共聚物、光聚合性化合物、多官能异氰酸酯固化剂、光聚合引发剂及增粘树脂,所述增粘树脂是完全或部分氢化的萜烯酚树脂。
2.如权利要求1所述的粘合片,其中,所述完全或部分氢化的萜烯酚树脂的羟值为50~250。
3.如权利要求1或2所述的粘合片,其中,所述完全或部分氢化的萜烯酚树脂的氢化率为30~100%。
4.如权利要求1至3中任一项所述的粘合片,其中,所述光固化型粘合剂含有100质量份的(甲基)丙烯酸酯共聚物、5~200质量份的光聚合性化合物、0.5~20质量份的多官能异氰酸酯固化剂、0.1~20质量份的光聚合引发剂及0.5~100质量份的完全或部分氢化的萜烯酚树脂。
5.如权利要求1至4中任一项所述的粘合片,其中,所述光固化型粘合剂是具有羟基的(甲基)丙烯酸酯共聚物、具有羟基的光聚合引发剂与完全或部分氢化的萜烯酚树脂通过使用异氰酸酯固化剂化学键合而成。
6.一种电子器件的制造方法,其为使用权利要求1至5中任一项所述的粘合片的电子器件的制造方法,其包括:
在粘合于环框上的所述粘合片上粘贴半导体晶圆或基板的粘贴步骤,
切割所述半导体晶圆或所述基板以制成半导体芯片或半导体器件的切割步骤,
对所述粘合片照射活性光线的光照射步骤,
拉伸粘合片以扩大所述半导体芯片或所述半导体器件彼此间隔的扩展步骤,以及
从所述粘合片拾取所述半导体芯片或所述半导体器件的拾取步骤。
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TWI583767B (zh) | 2017-05-21 |
WO2013105455A1 (ja) | 2013-07-18 |
JPWO2013105455A1 (ja) | 2015-05-11 |
KR102032006B1 (ko) | 2019-10-14 |
JP6031047B2 (ja) | 2016-11-24 |
KR20140123951A (ko) | 2014-10-23 |
TW201343849A (zh) | 2013-11-01 |
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