CN103947095A - Power converter - Google Patents
Power converter Download PDFInfo
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- CN103947095A CN103947095A CN201280055468.XA CN201280055468A CN103947095A CN 103947095 A CN103947095 A CN 103947095A CN 201280055468 A CN201280055468 A CN 201280055468A CN 103947095 A CN103947095 A CN 103947095A
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- Prior art keywords
- heat conduction
- base plate
- installation base
- heat
- semi
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Abstract
Provided is a power converter able to efficiently dissipate heat to a cooling body by isolating from the chassis a heat dissipation path for heat from a heat generating circuit component mounted on a substrate, and ensure insulation performance of a heat transfer member. The power converter is provided with a semiconductor power module (11) joined on one surface to a cooling body (3), a mounting substrate (23) on which is mounted a circuit component comprising a heat generating circuit component for driving the semiconductor power module, a heat transfer support member (33a) for supporting the mounting substrate via a heat transfer member (37), and a heat conduction path (33c) for transferring the heat from the mounting substrate to the cooling body via the heat transfer support member; and has the circuit component mounted on the mounting substrate as a surface-mounted connection-type circuit component (39).
Description
Technical field
The present invention relates to a kind of power conversion device, in this power conversion device, be built-in with power transfer with on the semi-conductor power module of thyristor to guarantee that the mode of predetermined distance is supported with installation base plate, described installation base plate is provided with the circuit elements device that comprises the heating circuit components and parts that drive above-mentioned thyristor.
Background technology
As this power conversion device, the known power changeable device that has patent documentation 1 to record.In this power conversion device, in housing, dispose water-cooling jacket, on this water-cooling jacket, dispose semi-conductor power module cooling so that this semi-conductor power module is carried out, described semi-conductor power module is built-in with the IGBT with thyristor as power transfer.In addition, in housing, a side contrary with water-cooling jacket at semi-conductor power module, to keep the mode of predetermined distance to dispose control circuit substrate, the heat that this control circuit substrate is produced conducts to the metal base plate of supporting control circuit substrate via radiating component, and further the heat that conducts to metal base plate is conducted to water-cooling jacket via the sidewall that supports the housing of this metal base plate.
Prior art document
Patent documentation
Patent documentation 1: No. 4657329 communique of Japan Patent
Summary of the invention
Invent technical problem to be solved
Yet in the conventional example of recording at above-mentioned patent documentation 1, the heat that control circuit substrate produces is dispelled the heat along the such path of control circuit substrate → radiating component → metal base plate → housing → water-cooling jacket.Therefore, there is following an open question:, owing to housing being used as to a part for thermally conductive pathways, thereby also require housing to there is good thermal conductivity, thereby material is restricted to the metal that pyroconductivity is higher, therefore in requiring the light-weighted power conversion device of miniaturization, cannot select the lighter materials such as resin, thereby be difficult to realize lightweight.
In addition, for housing, owing in most of the cases requiring waterproof and dustproof, therefore, between metal base plate and housing, between housing and water-cooling jacket, be generally coated with liquid sealant or sandwich rubber filler processed etc.Therefore also there is following an open question:, the pyroconductivity of liquid sealant or rubber filler processed is generally lower, these material clips can be caused in hot cooling path thermal resistance increase, thereby cause cooling effectiveness to decline.In order to solve this open question, also need to make the heating of not removing completely of substrate or mounting related components to dispel the heat by free convection from housing or case lid, in order to increase the surface area of housing or case lid, the outer deformation of housing or case lid is large, thereby makes the power conversion device maximization that becomes.
And, because the heat of control circuit substrate conducts heat via radiating component to metal base plate, therefore there is following an open question:, owing to being arranged on the impact of the lead-in wire of the circuit elements device on control circuit substrate and causing the decreasing insulating of radiating component.
Therefore, the an open question that the present invention is conceived to above-mentioned conventional example completes, its object is, providing a kind of can dispel the heat the heat that is installed on the heating circuit components and parts of substrate efficiently to cooling body, and can guarantee the power conversion device of the insulation property of heat conduction member.
The technical scheme that technical solution problem adopts
For achieving the above object, the first method of power conversion device involved in the present invention is, comprising: semi-conductor power module, and a face of this semi-conductor power module engages with cooling body; Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described semi-conductor power module; Heat conduction supporting member, this heat conduction supporting member supports described installation base plate by heat conduction member; And heat conduction path, this heat conduction path makes the heat of described installation base plate conduct to described cooling body via described heat conduction supporting member.And the circuit elements device being arranged on described installation base plate is that connecting-type circuit elements device is installed on surface.
According to this structure, the heating that is arranged on the heating circuit components and parts on installation base plate can be dispelled the heat to cooling body via heat conduction supporting member by heat conduction path, therefore can effectively to heating circuit components and parts, dispel the heat.
And, by the circuit elements device being arranged on installation base plate is made as to surface installation connecting-type circuit elements device, make can leadedly not wait jut outstanding to heat conduction member side, thereby can guarantee the insulating properties of heat conduction member.
In addition, the second method of power conversion device involved in the present invention is, described heat conduction supporting member consists of the higher metal material of pyroconductivity.
According to this structure, according to this structure, because heat conduction supporting member consists of metal materials such as the higher aluminium of pyroconductivity, aluminium alloy, copper, therefore can more effectively carry out the heat radiation to cooling body.
In addition, the Third Way of power conversion device involved in the present invention is, described heat conduction member by there is the insulator of heat conductivity and there is heat conductivity and have retractility elastomeric any one form.
According to this structure, because heat conduction member consists of insulator, therefore can between installation base plate and heat conduction supporting member, insulate reliably.In addition, because heat conduction member consists of the elastomer that has heat conductivity and have a retractility, thereby heat conduction member has retractility, therefore can make this heat conduction member contact with the surrounding that is arranged on heating element on installation base plate etc., thereby enlarge active surface, has improved radiating effect.
In addition, the cubic formula of power conversion device involved in the present invention is, described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.
According to this structure, described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.
In addition, the 5th mode of power conversion device involved in the present invention is, is provided with the interval adjustment member of determining described elastomeric compression ratio between described installation base plate and described heat conduction supporting board.
According to this structure, can adjust member by interval and determine elastomeric compression ratio, thereby can easily elastomeric compression ratio be adjusted into setting.
In addition, the 6th mode of power conversion device involved in the present invention is, comprising: semi-conductor power module, and a face of this semi-conductor power module engages with cooling body; Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described semi-conductor power module; Heat conduction supporting member, this heat conduction supporting member supports described installation base plate by heat conduction member; And heat conduction path, this heat conduction path makes the heat of described installation base plate conduct to described cooling body via described heat conduction supporting member.And, be arranged on circuit elements device on described installation base plate and be and there is the circuit elements device that welding lead and this welding lead have been carried out welding, at least at the described heat conduction member position corresponding with the insertion position with described welding lead between described heat conduction supporting member, clamp and have electric insulation component.
According to this structure, the heating that is arranged on the heating circuit components and parts on installation base plate can be passed through heat conduction path, via heat conduction supporting member, to cooling body, dispels the heat, and therefore can effectively to heating circuit components and parts, dispel the heat.
And, even if the welding lead at circuit elements device projects in heat conduction member from installation base plate, insert and form perforate, and this perforate because of vibration etc. expand, and then form space and cause decreasing insulating in heat conduction member in the situation that, owing at least clamping and having electric insulation component in corresponding region, the insertion region of the welding lead with circuit elements device, thereby can utilize electric insulation component to make up the decline of the insulation property of heat conduction member, finally also can guarantee required insulation property.
In addition, the 7th mode of power conversion device involved in the present invention is, comprise: semi-conductor power module, is built-in with the thyristor that power transfer is used, and is formed with the cooling component contacting with cooling body on a face of this casing in the casing of this semi-conductor power module; Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described thyristor; And heat conduction supporting member, this heat conduction supporting member at least has the heat conduction supporting board described installation base plate being supported by heat conduction member, and be formed with the heat conduction path that is independent of the housing that surrounds described semi-conductor power module and described installation base plate both sides, and contact with described cooling body.And, be arranged on circuit elements device on described installation base plate and be and there is the circuit elements device that welding lead and this welding lead have been carried out welding, at least at the described heat conduction member position corresponding with the insertion position with described welding lead between described heat conduction supporting board, clamp and have electric insulation component.
According to this structure, identical with above-mentioned execution mode 1, the heating that is arranged on the heating circuit components and parts on installation base plate can be dispelled the heat to cooling body via the heat conduction supporting member that is independent of housing, therefore can effectively to heating circuit components and parts, dispel the heat.In this case, owing to forming a plurality of heat conduction paths that are independent of the housing that surrounds semi-conductor power module and each installation base plate both sides between installation base plate and cooling body, therefore can be in the situation that do not consider that the pyroconductivity of housing forms housing, thus design freedom can be improved.
And, even if the welding lead at circuit elements device projects in heat conduction member from installation base plate, insert and form perforate, and this perforate because of vibration etc. expand, and then form space and cause decreasing insulating in heat conduction member in the situation that, owing at least clamping and having electric insulation component on corresponding region, the insertion region of the welding lead with circuit elements device, thereby can utilize electric insulation component to make up the decline of the insulation property of heat conduction member, finally also can guarantee required insulation property.
In addition, power conversion device involved in the present invention the from all directions formula be, described electric insulation component be formed on the welding lead of described circuit elements device insert in relative region, region than in the wealthy scope of this welding lead insert district field width.
According to this structure, the welding lead that is greater than circuit elements device due to the formation scope of electric insulation component inserts scope, therefore the decline of the insulation property that cause because of welding lead insertion heat conduction member can be made up, thereby necessary insulation property can be guaranteed reliably.
In addition, the 9th mode of power conversion device involved in the present invention is, described heat conduction supporting member consists of the higher metal material of pyroconductivity.
According to this structure, because heat conduction supporting member consists of metal materials such as the higher aluminium of pyroconductivity, aluminium alloy, copper, therefore can more effectively carry out the heat radiation to cooling body.
In addition, the tenth mode of power conversion device involved in the present invention is, described heat conduction member by there is the insulator of heat conductivity and there is heat conductivity and have retractility elastomeric any one form.
According to this structure, if heat conduction member consists of insulator, can between installation base plate and heat conduction supporting member, insulate reliably.In addition, if heat conduction member consists of the elastomer that has heat conductivity and have a retractility, thereby heat conduction member has retractility, can make this heat conduction member contact with the surrounding that is arranged on heating element on installation base plate etc., thereby enlarge active surface, has improved radiating effect.
In addition, the 11 mode of power conversion device involved in the present invention is, described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.
According to this structure, owing to being mounted at elastomer under the state of substrate and heat conduction supporting board compression, elastomer is fixed, therefore can carry out more good contacting with the heating element being arranged on installation base plate, thereby improve radiating effect.
In addition, the 12 mode of power conversion device involved in the present invention is, is provided with the interval adjustment member of determining described elastomeric compression ratio between described installation base plate and described heat conduction supporting board.
According to this structure, can adjust member by interval and determine elastomeric compression ratio, thereby can easily elastomeric compression ratio be adjusted into setting.
Invention effect
According to the present invention, due to being installed, the heating of the installation base plate of the circuit elements device that comprises heating circuit components and parts to cooling body, dispels the heat by heat conduction path via heat conduction supporting board, therefore can suppress thermal resistance, carry out the heat that cooling effectiveness is higher cooling.
Than domestic and, by the circuit elements device being arranged on installation base plate is made as to surface installation connecting-type circuit elements device, can prevent reliably that lead-in wire from waiting thrust to insert heat conduction member, thereby can guarantee reliably the insulation property between heat conduction member and heat conduction supporting board.
In addition, even be configured to and there is welding lead in the situation that be installed on the circuit elements device of installation base plate, by sandwich electric insulation component between heat conduction member and heat conduction supporting board, even if cause the decreasing insulating of heat conduction member in the situation that the thrusts such as welding lead insert heat conduction member, also can utilize electric insulation component to make up the decline of these insulation property, thereby can guarantee required insulation property.
Accompanying drawing explanation
Fig. 1 means the integrally-built cutaway view of the execution mode 1 of power conversion device involved in the present invention.
Fig. 2 means the amplification view of the major part of execution mode 1.
Fig. 3 means the cutaway view of an example of the control circuit unit that circuit elements device is installed.
Fig. 4 means the amplification view of the concrete structure under the state that installation base plate is installed.
Fig. 5 means the figure that installation base plate is installed on to the method for heat conduction supporting member.
Fig. 6 means the cutaway view that installation base plate is installed on to the state of heat conduction supporting member.
Fig. 7 means the cutaway view of the variation of heat conduction board.
Fig. 8 is the figure that the heat dissipation path of heating circuit components and parts is described.
Fig. 9 means the figure that power conversion device is applied to the state of up-down vibration or lateral shake.
Figure 10 means the cutaway view of another example of the control circuit unit that circuit elements device is installed.
Figure 11 means the cutaway view of variation of the cooling component of semiconductor module.
Embodiment
Below, utilize accompanying drawing, embodiments of the present invention are described.
Fig. 1 means the integrally-built cutaway view of power conversion device involved in the present invention.
In figure, label 1 is power conversion device, and this power conversion device 1 is accommodated in housing 2.Housing 2 is formed by synthetic resin material forming, and described housing 2 forms by clipping the lower case 2A and the upper body 2B that have the cooling body 3 of water cooled protective structure and cut apart up and down.
Lower case 2A is by there being end square tube body to form.The open upper part cooled body 3 of this lower case 2A covers, and film capacitor 4 has been taken in its inside.
Upper body 2B comprises the square tube body 2a that top and bottom are open and the lid 2b that seals the party cylindrical shell 2a upper end.And the lower end cooled body 3 of square tube body 2a seals.Though not shown, between the lower end and cooling body 3 of the party's cylindrical shell 2a, there is the encapsulant be coated with liquid sealant or accompany rubber filler processed etc.
The cooling water mouth 3a of cooling body 3 and discharge outlet 3b are towards housing 2 outer openings.These feed water inlets 3a for example provides source to be connected via flexible hose with not shown cooling water with discharge outlet 3b.This cooling body 3 is for example by forming pyroconductivity compared with high aluminium, aluminium alloy injection molding.And the lower surface of cooling body 3 is tabular surface, on the remainder except central portion 3c of upper surface, be formed with all groove 3d of square frame shape.In addition, form patchhole 3e on cooling body 3, this patchhole 3e inserts up and down for the positive and negative splicing ear 4a that is insulated covering that is held in the film capacitor 4 of lower case 2A.
Simultaneously known with reference to Fig. 2, power conversion device 1 comprises semi-conductor power module 11, and this semi-conductor power module 11 is built-in with the thyristor that igbt (IGBT) is for example used as forming for example inverter circuit that power transfer uses.In this semi-conductor power module 11, in flat rectangular-shaped insulating properties casing 12, be built-in with IGBT, on the lower surface of casing 12, be formed with metal cooling component 13.In casing 12 and cooling component 13, while observing from upper surface, on four angles, be formed with patchhole 15, this patchhole 15 is for inserting the hold-down screw 14 as fixed component.In addition, on the upper surface of casing 12, the outstanding substrate fixed part 16 that is formed with specified altitude on four positions of patchhole 15 inner sides.
In the upper end of this substrate fixed part 16, be fixed with drive circuit substrate 21, this drive circuit substrate 21 is provided with being built in drive circuit that the IGBT of semi-conductor power module 11 drives etc.In addition, the top of drive circuit substrate 21 keeps predetermined distance and is fixed with the control circuit substrate 22 as installation base plate, that described control circuit substrate 22 is provided with is that the IGBT of semi-conductor power module 11 controls to being built in, control circuit that comprise heating circuit components and parts etc., described heating circuit components and parts caloric value is relatively large, or heat generation density is larger.In addition, the top of control circuit substrate 22 keeps predetermined distance and is fixed with the power circuit substrate 23 as installation base plate, and that described power circuit substrate 23 is provided with is that the IGBT of semi-conductor power module 11 powers to being built in, power circuit that comprise heating circuit components and parts etc.
And, as shown in Figure 2, drive circuit substrate 21 is fixed in the following manner:, the external thread part 24a of joint screw 24 is inserted in the patchhole 21a being formed at substrate fixed part 16 relative positions, then this external thread part 24a and the internal thread part 16a that is formed at substrate fixed part 16 upper surfaces is screwed.
In addition, control circuit substrate 22 is fixed in the following manner:, the external thread part 25a of joint screw 25 is inserted in the patchhole 22a of the position relative with internal thread part 24b that is formed at joint screw 24 upper ends, then the internal thread part 24b of this external thread part 25a and joint screw 24 is screwed.
And, power circuit substrate 23 is fixed in the following manner:, hold-down screw 26 is inserted in the patchhole 23a of the position relative with internal thread part 25b that is formed at joint screw 25 upper ends, then this hold-down screw 26 is screwed with the internal thread part 25b of joint screw 25.
As shown in Figure 4, in the lower face side contacting with heat conduction member 35 described later of control circuit substrate 22, heating circuit components and parts 27a is installed, in the upper surface side of a side contrary to heat conduction member 35, surface is installed connecting-type circuit elements device 27b is installed.This surface is installed connecting-type circuit elements device 27b and is electrically connected to control circuit substrate 22 by being formed on the solder layer 28 of lower surface.Therefore, on surface, install in connecting-type circuit elements device 27b, do not exist as the lead-in wire connecting-type circuit vigour that hereinafter will illustrate and by being formed at the through hole of control circuit substrate 22, project to the welding lead as thrust of lower face side, therefore as described later, can prevent following problem:, when heat conduction member 35 being compressed with 5～30% compression ratio as described later, thrust can insert heat conduction member 35 and make to occur on heat conduction member 35 perforate, this perforate meeting expands because vibration waits, and then form space on the layer of heat conduction member, thereby cause insulation property to reduce.
Similarly, in the lower face side contacting with heat conduction member 37 described later of power circuit substrate 23, heating circuit components and parts 39a is also installed, in the upper surface side of a side contrary to heat conduction member 37, surface is installed connecting-type circuit elements device 39b is installed.
In addition, control circuit substrate 22 and power circuit substrate 23 are supported, so that utilize heat conduction supporting member 32 and 33 to form the heat dissipation path of dispelling the heat to cooling body 3.These heat conduction supporting members 32 and 33 are formed by higher metal such as the aluminium of pyroconductivity, aluminium alloy, copper etc.
Heat conduction supporting member 32 consists of the heat conduction supporting board 32a on flat board and heat conduction support side board 32c, and from this heat conduction support side board of Fig. 2,32c is fixed on the right-hand member side on the long limit along semi-conductor power module 11 of this heat conduction supporting board 32a by hold-down screw 32b.And heat conduction support side board 32c is connected with the shared square frame shape base plate 34 being configured in all groove 3d of cooling body 3.
On heat conduction supporting board 32a, across tabular heat conduction member 35, utilize hold-down screw 36 to be fixed with control circuit substrate 22.Heat conduction member 35 consists of the elastomer with retractility, has the overall dimension identical with power circuit substrate 23.As this heat conduction member 35, thereby can use by sandwiching in silica gel inside the material that metal charge has improved thermal conductivity.
In addition, heat conduction support side board 32c as shown in Figure 2, by the outward flange with being disposed at the long side of the shared base plate 34 in all groove 3d of cooling body 3, link the link board 32d that is integrated and extends along top and the upper plate portion 32e extending to the left from the upper end of this links board 32d forms, the cross section of this heat conduction support side board 32c is against L font.Link board 32d extends upward by the right flank of the long side of semi-conductor power module 11.
Heat conduction supporting member 33 consists of the heat conduction supporting board 33a on flat board and heat conduction support side board 33c, and from this heat conduction support side board of Fig. 2,33c is fixed on the left end side on the long limit along semi-conductor power module 11 of this heat conduction supporting board 33a by hold-down screw 33b.And heat conduction support side board 33c and shared base plate 34 are connected.
On heat conduction supporting board 33a, across the heat conduction member 37 identical with above-mentioned heat conduction member 35, utilize hold-down screw 38 to be fixed with power circuit substrate 23.
In addition, heat conduction support side board 33c as shown in Figures 2 and 3, by the outward flange with being disposed at the long side of the shared base plate 34 in all groove 3d of cooling body 3, link the link board 33d that is integrated and extends upward and the upper plate portion 33e extending to the left from the upper end of this links board 33d forms, the cross section of this heat conduction support side board 33c is against L font.Link board 33d extends upward by the left surface of the long side of semi-conductor power module 11.
So, the linking part being connected with base plate 34 and upper plate portion 33e that form to link board 33d on flexure plane cylindraceous.Thus, by the linking part that links board 33d and base plate 34 and upper plate portion 33e is formed to flexure plane cylindraceous, the stress producing on the linking part that links board 33d and base plate 34 and upper plate portion 33e can be when up-down vibration or lateral shake are transmitted to power conversion device 1, relaxed concentrated, thereby the vibration resistance for up-down vibration or lateral shake etc. can be improved.
And, by the linking part that links board 33d and base plate 34 and upper plate portion 33e is formed to flexure plane cylindraceous, with by linking board 33d, compare with the situation that the linking part of base plate 34 and upper plate portion 33e forms the L font at right angle, can shortening heat conducting path.Thus, by shortening the heat conduction path from heat conduction supporting board 33a to cooling body 3, can realize efficient heat cooling.
In addition, as shown in Figures 4 and 5, in the lower face side of control circuit substrate 22 and power circuit substrate 23, heating circuit components and parts 39a is installed.
And, as shown in Figure 4 to control circuit substrate 22 and power circuit substrate 23, link with heat conduction member 35,37 and heat conduction supporting board 32a, 33a.For these control circuit substrates 22 and power circuit substrate 23, and heat conduction supporting board 32a and 33a between link, except reversed left to right, be in fact identical, therefore, take power circuit substrate 23 and heat conduction supporting board 33a describes as representative.
In the link of this power circuit substrate 23 and heat conduction supporting board 33a, as shown in Figure 4 and Figure 5, use the packing ring 40 as interval adjustment member with the heat conduction board management height H less than the thickness T of heat conduction member 37.This packing ring 40 is temporarily fixed on the outer circumferential side of the upper formed internal thread part 41 screwing togather for hold-down screw 38 of heat conduction supporting board 33a by bonding grade.Here, the heat conduction board management height H of packing ring 40 is set, made the compression ratio of heat conduction member 37 become 5～30% left and right.Thus, by by heat conduction member 37 boil down to 5～30% left and right, can reduce thermal resistance, bring into play efficient heat-conducting effect.
On the other hand, on heat conduction member 37, be formed with the patchhole 37a that can insert for joint screw 25 and the patchhole 37b that can insert for packing ring 40.
And, heat conduction member 37 is placed on heat conduction supporting board 33a, so that be temporarily fixed on the packing ring 40 of heat conduction supporting board 33a, be inserted in patchhole 37b, and it is upper that power circuit substrate 23 is placed on to this heat conduction supporting board 33a, so that heating circuit components and parts 39a and heat conduction member 37 join.
In this state, make hold-down screw 38 by the patchhole 23b of power circuit substrate 23, and then be screwed by the central opening of packing ring 40 and the internal thread part 41 of heat conduction supporting board 33a.Then, tighten hold-down screw 38, until the upper surface of the upper surface of heat conduction member 37 and packing ring 40 is basically identical.
Therefore, by the compression ratio with 5～30% left and right, heat conduction member 37 is compressed, can reduce thermal resistance, bring into play efficient heat-conducting effect.Now, because the compression ratio of heat conduction member 37 manages according to the height H of packing ring 40, therefore, can suitably carry out fastening, and can not occur fastening deficiency or fastening excessively.
In addition, utilize the elasticity of heat conduction member 37 that the heating circuit components and parts 39a that is installed on power circuit substrate 23 lower face side is imbedded in heat conduction member 37.Therefore, can make between heating circuit components and parts 39a and heat conduction member 37 contact neither can deficiency can be inexcessive yet, thereby can make heat conduction member 37 contact well with power circuit substrate 23 and heat conduction supporting board 33a, thereby can reduce the thermal resistance between heat conduction member 37 and power circuit substrate 23 and heat conduction supporting board 33a.
In addition, because the upper surface side of the side contrary to heat conduction member 37 at power circuit substrate 23 is provided with surface installing type circuit elements device 39b, therefore do not exist picture to go between welding lead that passing through connecting-type circuit elements device be formed on the through hole on power circuit substrate 23 and project to lower face side.Thus, can there is not following problem: welding lead inserts heat conduction member 37 and causes perforate, because the impact of vibration etc. expands this perforate, and then form space on the layer of heat conduction member 37, thereby cause decreasing insulating.
Control circuit substrate 22 also links across heat conduction member 35 in the same manner as described above with heat conduction supporting board 32a.
In addition, as shown in Figures 2 and 3, in the shared base plate 34 of heat conduction supporting member 32 and 33, on the relative position of the patchhole 15 with inserting hold-down screw 14 of semi-conductor power module 11, be formed with fixed component patchhole 34a.And, at the upper surface of base plate 34 and be formed between the lower surface of cooling component 13 of semi-conductor power module 11, accompany elastic component 45.
Then, by making hold-down screw 14 insert semi-conductor power module 11 and the patchhole 15 of cooling component 13 and the fixed component patchhole 34a of base plate 34, and this hold-down screw 14 and the internal thread part 3f that is formed at cooling body 3 are screwed, semi-conductor power module 11 and base plate 34 are fixed on cooling body 3.
Then, the assemble method of the power conversion device 1 of above-mentioned execution mode is described.
First, in Fig. 5, as described above, make power circuit substrate 23 across the heat conduction supporting board 33a overlaid of heat conduction member 37 and heat conduction supporting member 33, under the state of the compression ratio compression heat conduction member 37 with 5～30% left and right, utilize 38 pairs of power circuit substrates 23 of hold-down screw, heat conduction member 37 and heat conduction supporting board 33a to be fixed, be pre-formed thus power circuit unit U3.Now, as described above, because the upper surface side at power circuit substrate 23 is provided with surface, connecting-type circuit elements device 39b is installed, does not therefore have the welding lead of the lower face side that projects to power circuit substrate 23.Thus, when the compression ratio with 5～30% left and right is compressed heat conduction member 37, can prevent reliably the reduction because of the insulation property of the following former thereby heat conduction member 37 that causes, owing to thering is the elongated thrust insertion heat conduction member 37 of conductivity, there is perforate, this perforate because of vibration etc. impact expand, and then form spatial portion on the layer of heat conduction member, thereby cause the reduction of the insulation property of heat conduction member 37.
Similarly, make control circuit substrate 22 across the heat conduction supporting board 32a overlaid of heat conduction member 35 and heat conduction supporting member 32, under the state of the compression ratio compression heat conduction member 35 with 5～30% left and right, utilize 36 pairs of control circuit substrates 22 of hold-down screw, heat conduction member 35 and heat conduction supporting board 32a to be fixed, be pre-formed thus control circuit unit U2.Now, as described above, because the upper surface side at control circuit substrate 22 is provided with surface, connecting-type circuit elements device 27b is installed, does not therefore have the welding lead of the lower face side that projects to control circuit substrate 22.Thus, when the compression ratio with 5～30% left and right is compressed heat conduction member 35, can prevent reliably the reduction because of the insulation property of the following former thereby heat conduction member 37 that causes, owing to thering is the elongated thrust insertion heat conduction member 35 of conductivity, there is perforate, this perforate because of vibration etc. impact expand, and then form spatial portion on the layer of heat conduction member, thereby cause the reduction of the insulation property of heat conduction member 37.
On the other hand, at the upper surface of heat conduction supporting member 32 and 33 shared base plate 34 and be formed between the lower surface of cooling component 13 of semi-conductor power module 11 and accompany under the state of elastic component 45, utilize hold-down screw 14, this base plate 34 is together fixed in all groove 3d of cooling body 3 with semi-conductor power module 11.
In addition, before semi-conductor power module 11 is fixed on to cooling body 3 or after fixing, drive circuit substrate 21 is placed on the substrate fixed part 16 of the upper surface that is formed at semi-conductor power module 11.Then, utilize four joint screws 24, from the top of drive circuit substrate 21, this drive circuit substrate 21 is fixed on to substrate fixed part 16.Then, with hold-down screw 32b, heat conduction supporting board 32a and heat conduction support side board 32c are connected.
Then, at the upper surface of joint screw 24, place the control circuit substrate 22 of control circuit unit U2, utilize four joint screws 25 to be fixed.Then, at the upper surface of joint screw 25, place the power circuit substrate 23 of power circuit unit U3, utilize four hold-down screws 26 to be fixed.Then, with hold-down screw 33b, heat conduction supporting board 33a and heat conduction support side board 33c are connected.
Afterwards, as shown in Figure 1, bus 50 is connected to the sub-11a of positive and negative direct-flow input end of semi-conductor power module 11, utilizes hold-down screw 51 to be connected running through the positive and negative splicing ear 4a of film capacitor 4 of cooling body 3 and the other end of this bus 50.And, the crimp type terminal 53 that is fixed on connecting line 52 front ends that external rectifier (not shown) connects is fixed on to the sub-11a of direct-flow input end of semi-conductor power module 11.
And, utilize hold-down screw 56 that bus 55 is connected with the three-phase alternating current lead-out terminal 11b of semi-conductor power module 11, and at the middle part of this bus 55 configuration current sensor 57.Then, the other end of bus 55 is fixed and be connected in to the crimp type terminal 59 that utilizes hold-down screw 60 to make to be fixed on the front end of the motor cable 58 being connected with outside threephase motor (not shown).
Afterwards, lower case 2A and upper body 2B are fixed on to lower surface and the upper surface of cooling body 3 across encapsulant, thereby complete the assembling of power conversion device 1.
Under this state, from external rectifier (not shown), providing the galvanic while, make to be arranged on power circuit on power circuit substrate 23, be arranged on control circuit on control circuit substrate 22 in operate condition, by control circuit, via the drive circuit being arranged in drive circuit substrate 21, signal, for example pulse-width signal are offered to semi-conductor power module 11.Thus, to being built in the IGBT of semi-conductor power module 11, control, and direct current is converted to alternating current.From three-phase alternating current lead-out terminal 11b, via bus 55, the alternating current conversion is offered to motor cable 58, thereby threephase motor (not shown) is driven to control.
Now, the IGBT that is built in semi-conductor power module 11 can generate heat.Because the cooling component 13 being formed on semi-conductor power module 11 directly contacts with the central portion 3c of cooling body 3, therefore utilize the cooling water that cooling body 3 provides to carry out cooling to the heat of this generation.
On the other hand, be installed in the control circuit of control circuit substrate 22 and power circuit substrate 23 and power circuit and include heating circuit components and parts 27a and 39a, these heating circuit components and parts 27a and 39a can produce heating.Now, heating circuit components and parts 27a and 39a are installed on the lower face side of control circuit substrate 22 and power circuit substrate 23.
And, in the lower face side of these control circuit substrates 22 and power circuit substrate 23, higher and there is heat conduction supporting board 32a and the 33a that flexible heat conduction member 35 and 37 is provided with heat conduction supporting member 32 and 33 across pyroconductivity.
Therefore, the contact area of heating circuit components and parts 27a and 39a and heat conduction member 35 and 37 becomes large and mutual close contact, thereby the thermal resistance of heating circuit components and parts 27a and 39a and heat conduction member 35 and 37 diminishes.Therefore, can efficiently the heating of heating circuit components and parts 27a and 39a be conducted to heat conduction member 35 and 37.And, because the compression ratio with 5～30% left and right is compressed heat conduction member 35 and 37, heat conduction member 35 and 37 pyroconductivities own are improved, therefore, as shown in Figure 8, the heat that is transmitted to heat conduction member 35 and 37 can be transmitted to efficiently to heat conduction supporting board 32a and the 33a of heat conduction supporting member 32 and 33.
And owing to linking and having heat conduction support side board 32c and 33c on heat conduction supporting board 32a and 33a, therefore, the heat that conducts to heat conduction supporting board 32a and 33a can conduct to shared base plate 34 by heat conduction support side board 32c and 33c.In all groove 3d due to this base plate 34 and cooling body 3, directly contact, the heat that therefore conduction is come dispels the heat to cooling body 3.
And the heat that is transmitted to base plate 34 starts to conduct to via elastic component 45 cooling component 13 of semi-conductor power module 11 from the upper surface side of base plate 34, and conducts to the central portion 3c of cooling body 3 and dispel the heat via this cooling component 13.
Thus, according to above-mentioned execution mode, owing to being directly conducted to heat conduction member 35 and 37 and without the larger control circuit substrate 22 of thermal resistance and power circuit substrate 23 by being installed on the heating circuit components and parts 27a of control circuit substrate 22 and power circuit substrate 23 and the heating of 39a, therefore, can dispel the heat efficiently.
So the heat that conducts to heat conduction member 35 and 37 conducts to heat conduction supporting board 32a and 33a, and then conduct to heat conduction support side board 32c and 33c.Now, heat conduction support side board 32c and 33c arrange along the long limit of semi-conductor power module 11.
Therefore, heat-conducting area can be increased, and wider heat dissipation path can be guaranteed.And, due to the bend of heat conduction support side board 32c and 33c is made as to bend cylindraceous, therefore, compare with the situation that bend is made as to L font, can shorten to the heat conduction distance of cooling body 3.
In addition, because heat conduction support side board 32c and the 33c of heat conduction supporting member 32 and 33 realizes integrated by shared base plate 34, therefore, between heat conduction support side board 32c and 33c and base plate 34, there is not the seam between components and parts, thereby can suppress thermal resistance.
And, owing to not comprising housing 2 from control circuit substrate 22 and the power circuit substrate 23 of heating circuit components and parts 27a and 39a is installed to the heat dissipation path of cooling body 3, therefore do not need to use the metals such as aluminium with high conductivity, and can utilize synthetic resin to form housing 2, thereby can realize lightweight.
And, due to heat dissipation path and do not rely on housing 2, can in power conversion device 1, form heat dissipation path separately, therefore, the power conversion device 1 consisting of semi-conductor power module 11, drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 can be applied to housing 2 and the cooling body 3 of various different modes.
In addition,, owing to being fixed with metal heat conduction supporting board 32a and 33a on control circuit substrate 22 and power circuit substrate 23, therefore, can improve the rigidity of control circuit substrate 22 and power circuit substrate 23.Therefore, even in the situation that as the situation that power conversion device 1 is used as the motor drive circuit that drives Vehicle Driving Cycle with motor, power conversion device 1 is applied to up-down vibration or lateral shake effect as shown in Figure 9, also can utilize heat conduction supporting member 32 and 33 to improve rigidity.Therefore, can provide the less power conversion device 1 of impact that is subject to up-down vibration or lateral shake etc.
And, due to control circuit substrate 22 and power circuit substrate 23 with surface is installed in upper surface side heat conduction member 35 and 37 contrary sides connecting-type circuit elements device 27b and 39b is installed, on these surfaces, install and on connecting-type circuit elements device 27b and 39b, do not have the elongated protrusion thing to the heat conduction member 35 of lower face side and 37 side-prominent welding leads etc. with conductivity, therefore can prevent reliably the decline of the insulation property that the metal charge conducting because of heat conduction member 35 and 37 causes.
In addition, in the above-described embodiment, to being installed in the side mounting surface contrary with heat conduction member 35 and 37 that the control circuit substrate 22 of heating circuit components and parts 27a and 39a and power circuit substrate 23 are installed, the situation of connecting-type circuit elements device 27b and 39b is illustrated.But the present invention is not limited to said structure, also can as shown in Figure 10, in a side contrary with heat conduction member 35 and 37 of control circuit substrate 22 and power circuit substrate 23, lead-in wire connecting-type circuit elements device 46 be installed.In this case, the heat conduction member 35 relative with the outstanding outburst area that is formed on the welding lead 46a on lead-in wire connecting-type circuit elements device 46 and 37 and heat conduction supporting board 32a and 33a between configure electric insulation component 47.Preferably this electric insulation component 47 is formed on than in the wide region of the outburst area of welding lead 46a.
In the structure of Figure 10, the welding lead 46a of lead-in wire connecting-type circuit elements device 46 is outstanding to lower face side by the through hole being formed on control circuit substrate 22 and power circuit substrate 23, and this lead-in wire connecting-type circuit elements device 46 is arranged on control circuit substrate 22 and power circuit substrate 23 and upper surfaces heat conduction member 35 and 37 contrary sides.And welding lead 46a welds and is fixed on the lower face side of control circuit substrate 22 and power circuit substrate 23.
As illustrated in above-mentioned execution mode, when utilizing hold-down screw 36 and the 38 pairs of control circuit substrates 22 and power circuit substrate 23 to compress with heat conduction supporting board 32a and 33a, as shown in figure 10, these welding leads 46a can insert in heat conduction member 35 and 37, thereby form perforate on heat conduction member 35 and 37, this perforate because of vibration etc. impact expand, and then heat conduction member 35 and 37 layer on form space, thereby cause decreasing insulating.
Yet, as mentioned above, the corresponding heat conduction member 35 of outburst area of welding lead 46a and 37 and heat conduction supporting board 32a and 33a between dispose electric insulation component 47.Thus, utilize electric insulation component 47, the amount that the insulation resistance of the heat conduction member 35 that causes because of welding lead 46a and 37 declines can be filled up, thereby required insulation property between control circuit substrate 22 and power circuit substrate 23 and heat conduction supporting board 32a and 33a can be guaranteed.
In addition, in the above-described embodiment, in control circuit unit U2 and power circuit unit U3, heat conduction member 35 and 37 the profile situation identical with power circuit substrate 23 with control circuit substrate 22 are illustrated.But the present invention is not limited to said structure, also can as shown in Figure 6, only heat conduction member 35 and 37 be arranged to the position that heating circuit components and parts 27a and 39a exist.
In addition, in the above-described embodiment, the situation that cooling component 13 and the cooling body 3 of semi-conductor power module 11 are joined is illustrated, but is not limited to this, also can adopt the structure shown in Figure 11.; the cooling component 13 being formed on semi-conductor power module 11 possesses the cooling fins 61 directly contacting with the cooling water that flows through cooling body 3; and correspondingly, the central portion at cooling body 3 forms the immersion portion 62 that cooling fins 61 is immersed in cooling water path.And, between the perisporium 63 that comprises immersion portion 62 and cooling component 13, configure the containment members 66 such as O shape ring.
In this case, owing to forming cooling fins 61 in the cooling component 13 at semi-conductor power module 11, and utilize immersion portion 62 that this cooling fins 61 is immersed in cooling water, therefore can to semi-conductor power module 11, carry out cooling more efficiently.
In addition in the above-described embodiment, the heat conduction supporting board 32a of split formation heat conduction supporting member 32 and 33 and the situation of 33a and heat conduction support side board 32c and 33c are illustrated.But the present invention is not limited to said structure, also heat conduction supporting board 32a and 33a and heat conduction support side board 32c and 33c can be configured to one.In this case, owing to can not forming seam between heat conduction supporting board 32a and 33a and heat conduction support side board 32c and 32c, therefore, thereby can reduce thermal resistance, more effectively dispel the heat.
And, in the above-described embodiment, to power conversion device of the present invention being applied to the situation of electric automobile, being illustrated, but being not limited to this, the present invention is also applicable to the rolling stock that travels on track, also applicable to electro-motive vehicle arbitrarily.In addition the actuator of the motor in driving other industries equipment etc., as power conversion device, is not limited to electro-motive vehicle, in the situation that also can be applied power conversion device of the present invention.
Industrial practicality
According to the present invention, a kind of power conversion device can be provided, this power conversion device can make the heat that carries the heating circuit components and parts on substrate to cooling body, dispel the heat efficiently, and can guarantee the insulation property of heat conduction member.
Label declaration
1 ... power conversion device, 2 ... housing, 3 ... cooling body, 4 ... film capacitor, 5 ... storage battery incorporating section, 11 ... semi-conductor power module, 12 ... casing, 13 ... radiating component, 21 ... drive circuit substrate, 22 ... control circuit substrate, 23 ... power circuit substrate, 24, 25 ... joint screw, 27a ... heating circuit components and parts, 27b ... connecting-type circuit elements device is installed on surface, 32 ... heat conduction supporting member, 32a ... heat conduction supporting board, 32b ... hold-down screw, 32c ... heat conduction support side board, 33 ... heat conduction supporting member, 33a ... heat conduction supporting board, 33b ... hold-down screw, 33c ... heat conduction support side board, 34 ... base plate, 35, 37 ... heat conduction member, 39a ... heat conduction circuit elements device, 39b ... connecting-type circuit elements device is installed on surface, 40 ... packing ring (interval adjustment member), 61 ... cooling fins.
Claims (12)
1. a power conversion device, is characterized in that, comprising:
Semi-conductor power module, a face of this semi-conductor power module engages with cooling body;
Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described semi-conductor power module;
Heat conduction supporting member, this heat conduction supporting member supports described installation base plate by heat conduction member; And
Heat conduction path, this heat conduction path makes the heat of described installation base plate conduct to described cooling body via described heat conduction supporting member,
The circuit elements device being arranged on described installation base plate is that connecting-type circuit elements device is installed on surface.
2. power conversion device as claimed in claim 1, is characterized in that,
Described heat conduction supporting member consists of the higher metal material of pyroconductivity.
3. power conversion device as claimed in claim 1 or 2, is characterized in that,
Described heat conduction member by have heat conductivity insulator and there is heat conductivity and have retractility elastomeric any one form.
4. power conversion device as claimed in claim 1 or 2, is characterized in that,
Described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.
5. power conversion device as claimed in claim 4, is characterized in that,
Between described installation base plate and described heat conduction supporting board, be provided with the interval adjustment member of determining described elastomeric compression ratio.
6. a power conversion device, is characterized in that, comprising:
Semi-conductor power module, a face of this semi-conductor power module engages with cooling body;
Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described semi-conductor power module;
Heat conduction supporting member, this heat conduction supporting member supports described installation base plate by heat conduction member; And
Heat conduction path, this heat conduction path makes the heat of described installation base plate conduct to described cooling body via described heat conduction supporting member,
Be arranged on circuit elements device on described installation base plate and be and there is the circuit elements device that welding lead and this welding lead have been carried out welding, at least at the described heat conduction member position corresponding with the insertion position with described welding lead between described heat conduction supporting member, clamp and have electric insulation component.
7. a power conversion device, is characterized in that, comprising:
Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing;
Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described thyristor; And
Heat conduction supporting member, this heat conduction supporting member at least has the heat conduction supporting board described installation base plate being supported by heat conduction member, and be formed with the heat conduction path that is independent of the housing that surrounds described semi-conductor power module and described installation base plate both sides, and contact with described cooling body
Be arranged on circuit elements device on described installation base plate and be and there is the circuit elements device that welding lead and this welding lead have been carried out welding, at least at the described heat conduction member position corresponding with the insertion position with described welding lead between described heat conduction supporting board, clamp and have electric insulation component.
8. the power conversion device as described in claim 6 or 7, is characterized in that,
Described electric insulation component be formed on the welding lead of described circuit elements device insert in relative region, region than in the wealthy scope of this welding lead insert district field width.
9. the power conversion device as described in claim 6 or 7, is characterized in that,
Described heat conduction supporting member consists of the higher metal material of pyroconductivity.
10. the power conversion device as described in claim 6 or 7, is characterized in that,
Described heat conduction member by have heat conductivity insulator and there is heat conductivity and have retractility elastomeric any one form.
11. power conversion devices as described in claim 6 or 7, is characterized in that,
Described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.
12. power conversion devices as claimed in claim 11, is characterized in that,
Between described installation base plate and described heat conduction supporting board, be provided with the interval adjustment member of determining described elastomeric compression ratio.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011266234 | 2011-12-05 | ||
| JP2011-266234 | 2011-12-05 | ||
| PCT/JP2012/007307 WO2013084416A1 (en) | 2011-12-05 | 2012-11-14 | Power converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103947095A true CN103947095A (en) | 2014-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280055468.XA Pending CN103947095A (en) | 2011-12-05 | 2012-11-14 | Power converter |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2013084416A1 (en) |
| CN (1) | CN103947095A (en) |
| WO (1) | WO2013084416A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518814A (en) * | 2019-09-19 | 2019-11-29 | 江西精骏电控技术有限公司 | A kind of two-sided cooling structure for vehicle-mounted inverter |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10074841B2 (en) | 2013-05-15 | 2018-09-11 | Kureha Corporation | Structure for non-aqueous electrolyte secondary battery, non-aqueous electrolyte secondary battery, and method for manufacturing same structure |
| US9649058B2 (en) | 2013-12-16 | 2017-05-16 | Medtronic Minimed, Inc. | Methods and systems for improving the reliability of orthogonally redundant sensors |
| JP7208550B2 (en) * | 2021-03-30 | 2023-01-19 | ダイキン工業株式会社 | Electrical equipment and refrigeration equipment |
| JP7183373B1 (en) | 2021-11-15 | 2022-12-05 | 三菱電機株式会社 | power converter |
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| JP2000174180A (en) * | 1998-12-02 | 2000-06-23 | Shibafu Engineering Kk | Semiconductor device |
| JP2004282804A (en) * | 2003-03-12 | 2004-10-07 | Toshiba Corp | Inverter device |
| JP2005032912A (en) * | 2003-07-10 | 2005-02-03 | Hitachi Industrial Equipment Systems Co Ltd | Power conversion apparatus |
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| JP2009240023A (en) * | 2008-03-26 | 2009-10-15 | Nidec Shibaura Corp | Motor controller, brushless motor, and power tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5157431B2 (en) * | 2007-12-27 | 2013-03-06 | 株式会社デンソー | Power converter |
-
2012
- 2012-11-14 CN CN201280055468.XA patent/CN103947095A/en active Pending
- 2012-11-14 JP JP2013548066A patent/JPWO2013084416A1/en active Pending
- 2012-11-14 WO PCT/JP2012/007307 patent/WO2013084416A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174180A (en) * | 1998-12-02 | 2000-06-23 | Shibafu Engineering Kk | Semiconductor device |
| JP2004282804A (en) * | 2003-03-12 | 2004-10-07 | Toshiba Corp | Inverter device |
| JP2005032912A (en) * | 2003-07-10 | 2005-02-03 | Hitachi Industrial Equipment Systems Co Ltd | Power conversion apparatus |
| JP2008532912A (en) * | 2005-03-14 | 2008-08-21 | エボニック デグサ ゲーエムベーハー | Method for producing coated carbon particles and use of the carbon particles in anode materials for lithium ion batteries |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110518814A (en) * | 2019-09-19 | 2019-11-29 | 江西精骏电控技术有限公司 | A kind of two-sided cooling structure for vehicle-mounted inverter |
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| Publication number | Publication date |
|---|---|
| JPWO2013084416A1 (en) | 2015-04-27 |
| WO2013084416A1 (en) | 2013-06-13 |
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