CN103906372A - 具有内埋元件的电路板及其制作方法 - Google Patents
具有内埋元件的电路板及其制作方法 Download PDFInfo
- Publication number
- CN103906372A CN103906372A CN201210577714.XA CN201210577714A CN103906372A CN 103906372 A CN103906372 A CN 103906372A CN 201210577714 A CN201210577714 A CN 201210577714A CN 103906372 A CN103906372 A CN 103906372A
- Authority
- CN
- China
- Prior art keywords
- insulating barrier
- conductive
- conducting wire
- layer
- wire layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000004888 barrier function Effects 0.000 claims description 91
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- 239000011889 copper foil Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000000084 colloidal system Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
双面覆铜基板 | 10 |
导电盲孔 | 11 |
基底层 | 12 |
第一铜箔层 | 13 |
第二铜箔层 | 14 |
第一表面 | 121 |
第二表面 | 122 |
填充通孔 | 102 |
第一导电线路层 | 132 |
第二导电线路层 | 142 |
多层基板 | 20 |
电性连接垫 | 143 |
导电膏 | 15 |
电子元件 | 16 |
电极 | 162 |
双面线路板 | 17 |
第二绝缘层 | 21 |
第三导电线路层 | 22 |
第三绝缘层 | 23 |
第四导电线路层 | 24 |
具有内埋元件的电路板 | 100 |
第一导电孔 | 25 |
第二导电孔 | 26 |
开口 | 211 |
第三表面 | 212 |
第四表面 | 213 |
盲孔 | 32 |
通孔 | 34 |
电镀铜层 | 33 |
导电通孔 | 35 |
基底材料层 | 123 |
第一绝缘层 | 124 |
Claims (8)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210577714.XA CN103906372B (zh) | 2012-12-27 | 2012-12-27 | 具有内埋元件的电路板及其制作方法 |
TW102101270A TWI466607B (zh) | 2012-12-27 | 2013-01-14 | 具有內埋元件的電路板及其製作方法 |
US14/109,913 US9089082B2 (en) | 2012-12-27 | 2013-12-17 | Printed circuit board with embedded component and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210577714.XA CN103906372B (zh) | 2012-12-27 | 2012-12-27 | 具有内埋元件的电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103906372A true CN103906372A (zh) | 2014-07-02 |
CN103906372B CN103906372B (zh) | 2017-03-01 |
Family
ID=50997451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210577714.XA Active CN103906372B (zh) | 2012-12-27 | 2012-12-27 | 具有内埋元件的电路板及其制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9089082B2 (zh) |
CN (1) | CN103906372B (zh) |
TW (1) | TWI466607B (zh) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105376926A (zh) * | 2014-08-11 | 2016-03-02 | 三星电机株式会社 | 印刷电路板及其制造方法 |
CN107949166A (zh) * | 2017-11-30 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | 埋置元件电路板的制作方法及埋置元件电路板 |
CN108323002A (zh) * | 2017-01-16 | 2018-07-24 | 中兴通讯股份有限公司 | 一种印制电路板及方法 |
CN108617089A (zh) * | 2016-12-10 | 2018-10-02 | 宏启胜精密电子(秦皇岛)有限公司 | 内埋元件柔性电路板及其制造方法 |
CN110310937A (zh) * | 2018-03-20 | 2019-10-08 | 欣兴电子股份有限公司 | 内埋式元件结构及其制造方法 |
CN110571229A (zh) * | 2018-06-05 | 2019-12-13 | 深南电路股份有限公司 | 一种埋入式光感模组及其制造方法 |
CN110831354A (zh) * | 2019-11-15 | 2020-02-21 | 莆田市涵江区依吨多层电路有限公司 | 一种基于盲钻和元器件内压的多层板生产方法 |
CN111356283A (zh) * | 2020-04-09 | 2020-06-30 | Oppo广东移动通信有限公司 | 电路板及电子设备 |
CN111354687A (zh) * | 2018-12-21 | 2020-06-30 | 深南电路股份有限公司 | 一种封装结构及封装结构的制备方法 |
CN113133191A (zh) * | 2020-01-15 | 2021-07-16 | 鹏鼎控股(深圳)股份有限公司 | 内埋透明电路板及其制作方法 |
CN113141727A (zh) * | 2020-01-17 | 2021-07-20 | 庆鼎精密电子(淮安)有限公司 | 具有内埋电子元件的电路板及其制造方法 |
CN113747653A (zh) * | 2020-05-27 | 2021-12-03 | 庆鼎精密电子(淮安)有限公司 | 嵌埋元件的软硬结合电路板及其制作方法 |
WO2022007271A1 (zh) * | 2019-07-07 | 2022-01-13 | 深南电路股份有限公司 | 线路板及其制作方法 |
CN114007344A (zh) * | 2020-07-28 | 2022-02-01 | 庆鼎精密电子(淮安)有限公司 | 内埋元件电路板的制作方法以及内埋元件电路板 |
CN114430624A (zh) * | 2020-10-29 | 2022-05-03 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制作方法以及电路板 |
CN114501854A (zh) * | 2020-10-27 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | 内埋元件的电路板的制作方法及内埋元件的电路板 |
US11602054B2 (en) | 2020-07-07 | 2023-03-07 | Shennan Circuits Co., Ltd. | Circuit board and method for manufacturing the same |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201545614A (zh) * | 2014-05-02 | 2015-12-01 | R&D Circuits Inc | 製備殼體以接收用於嵌入式元件印刷電路板之元件的結構和方法 |
TWI513379B (zh) * | 2014-07-02 | 2015-12-11 | Nan Ya Printed Circuit Board | 內埋元件的基板結構與其製造方法 |
US10170403B2 (en) * | 2014-12-17 | 2019-01-01 | Kinsus Interconnect Technology Corp. | Ameliorated compound carrier board structure of flip-chip chip-scale package |
TWI586237B (zh) * | 2014-12-18 | 2017-06-01 | 欣興電子股份有限公司 | 線路板及其製作方法 |
KR101666757B1 (ko) * | 2015-07-13 | 2016-10-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 |
DE102016119825A1 (de) * | 2016-10-18 | 2018-04-19 | HELLA GmbH & Co. KGaA | Leiterplatte |
CN109803481B (zh) * | 2017-11-17 | 2021-07-06 | 英业达科技有限公司 | 多层印刷电路板及制作多层印刷电路板的方法 |
CN110798974B (zh) * | 2018-08-01 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | 埋嵌式基板及其制作方法,及具有该埋嵌式基板的电路板 |
JP6669209B2 (ja) * | 2018-08-06 | 2020-03-18 | 株式会社オートネットワーク技術研究所 | 配線部材 |
CN112770495B (zh) * | 2019-10-21 | 2022-05-27 | 宏启胜精密电子(秦皇岛)有限公司 | 全向内埋模组及制作方法、封装结构及制作方法 |
CN114143980A (zh) * | 2020-09-04 | 2022-03-04 | 庆鼎精密电子(淮安)有限公司 | 线路板连接结构及其制作方法 |
CN114340219A (zh) * | 2020-09-30 | 2022-04-12 | 庆鼎精密电子(淮安)有限公司 | 线路板及其制作方法 |
CN115226325A (zh) * | 2021-04-14 | 2022-10-21 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制作方法以及电路板 |
CN114698234B (zh) * | 2022-03-30 | 2024-05-31 | 深圳市信维通信股份有限公司 | 一种多层lcp材料基板组合方法 |
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JP2001332860A (ja) * | 2000-05-18 | 2001-11-30 | Hitachi Cable Ltd | 多層配線基板、半導体装置、電子装置及びそれらの製造方法 |
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TW200610118A (en) * | 2004-09-09 | 2006-03-16 | Phoenix Prec Technology Corp | Semiconductor device embedded structure and method for fabricating the same |
TW200618208A (en) * | 2004-11-19 | 2006-06-01 | Ind Tech Res Inst | Structure of an electronic package and method for fabricating the same |
TW200922429A (en) * | 2007-11-14 | 2009-05-16 | Advanced Semiconductor Eng | Structure and manufacturing method of (with embedded component) multilayer circuit board |
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JP2006073763A (ja) * | 2004-09-01 | 2006-03-16 | Denso Corp | 多層基板の製造方法 |
JP4016039B2 (ja) * | 2005-06-02 | 2007-12-05 | 新光電気工業株式会社 | 配線基板および配線基板の製造方法 |
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2012
- 2012-12-27 CN CN201210577714.XA patent/CN103906372B/zh active Active
-
2013
- 2013-01-14 TW TW102101270A patent/TWI466607B/zh active
- 2013-12-17 US US14/109,913 patent/US9089082B2/en active Active
Patent Citations (5)
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JP2001332860A (ja) * | 2000-05-18 | 2001-11-30 | Hitachi Cable Ltd | 多層配線基板、半導体装置、電子装置及びそれらの製造方法 |
CN1551717A (zh) * | 2003-04-25 | 2004-12-01 | ���µ�����ҵ��ʽ���� | 多层印刷线路板和利用该多层印刷线路板的集成电路 |
TW200610118A (en) * | 2004-09-09 | 2006-03-16 | Phoenix Prec Technology Corp | Semiconductor device embedded structure and method for fabricating the same |
TW200618208A (en) * | 2004-11-19 | 2006-06-01 | Ind Tech Res Inst | Structure of an electronic package and method for fabricating the same |
TW200922429A (en) * | 2007-11-14 | 2009-05-16 | Advanced Semiconductor Eng | Structure and manufacturing method of (with embedded component) multilayer circuit board |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105376926A (zh) * | 2014-08-11 | 2016-03-02 | 三星电机株式会社 | 印刷电路板及其制造方法 |
CN108617089B (zh) * | 2016-12-10 | 2020-12-22 | 宏启胜精密电子(秦皇岛)有限公司 | 内埋元件柔性电路板及其制造方法 |
CN108617089A (zh) * | 2016-12-10 | 2018-10-02 | 宏启胜精密电子(秦皇岛)有限公司 | 内埋元件柔性电路板及其制造方法 |
CN108323002A (zh) * | 2017-01-16 | 2018-07-24 | 中兴通讯股份有限公司 | 一种印制电路板及方法 |
CN108323002B (zh) * | 2017-01-16 | 2022-10-28 | 中兴通讯股份有限公司 | 一种印制电路板及方法 |
CN107949166A (zh) * | 2017-11-30 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | 埋置元件电路板的制作方法及埋置元件电路板 |
CN107949166B (zh) * | 2017-11-30 | 2020-04-14 | 广州兴森快捷电路科技有限公司 | 埋置元件电路板的制作方法及埋置元件电路板 |
CN110310937A (zh) * | 2018-03-20 | 2019-10-08 | 欣兴电子股份有限公司 | 内埋式元件结构及其制造方法 |
CN110571229A (zh) * | 2018-06-05 | 2019-12-13 | 深南电路股份有限公司 | 一种埋入式光感模组及其制造方法 |
CN111354687A (zh) * | 2018-12-21 | 2020-06-30 | 深南电路股份有限公司 | 一种封装结构及封装结构的制备方法 |
CN111354687B (zh) * | 2018-12-21 | 2023-12-15 | 深南电路股份有限公司 | 一种封装结构及封装结构的制备方法 |
WO2022007271A1 (zh) * | 2019-07-07 | 2022-01-13 | 深南电路股份有限公司 | 线路板及其制作方法 |
CN110831354A (zh) * | 2019-11-15 | 2020-02-21 | 莆田市涵江区依吨多层电路有限公司 | 一种基于盲钻和元器件内压的多层板生产方法 |
CN113133191B (zh) * | 2020-01-15 | 2022-06-24 | 鹏鼎控股(深圳)股份有限公司 | 内埋透明电路板及其制作方法 |
CN113133191A (zh) * | 2020-01-15 | 2021-07-16 | 鹏鼎控股(深圳)股份有限公司 | 内埋透明电路板及其制作方法 |
CN113141727A (zh) * | 2020-01-17 | 2021-07-20 | 庆鼎精密电子(淮安)有限公司 | 具有内埋电子元件的电路板及其制造方法 |
CN111356283A (zh) * | 2020-04-09 | 2020-06-30 | Oppo广东移动通信有限公司 | 电路板及电子设备 |
CN113747653A (zh) * | 2020-05-27 | 2021-12-03 | 庆鼎精密电子(淮安)有限公司 | 嵌埋元件的软硬结合电路板及其制作方法 |
CN113747653B (zh) * | 2020-05-27 | 2023-10-10 | 庆鼎精密电子(淮安)有限公司 | 嵌埋元件的软硬结合电路板及其制作方法 |
US11602054B2 (en) | 2020-07-07 | 2023-03-07 | Shennan Circuits Co., Ltd. | Circuit board and method for manufacturing the same |
CN114007344A (zh) * | 2020-07-28 | 2022-02-01 | 庆鼎精密电子(淮安)有限公司 | 内埋元件电路板的制作方法以及内埋元件电路板 |
CN114007344B (zh) * | 2020-07-28 | 2024-04-12 | 庆鼎精密电子(淮安)有限公司 | 内埋元件电路板的制作方法以及内埋元件电路板 |
CN114501854A (zh) * | 2020-10-27 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | 内埋元件的电路板的制作方法及内埋元件的电路板 |
CN114501854B (zh) * | 2020-10-27 | 2024-03-29 | 鹏鼎控股(深圳)股份有限公司 | 内埋元件的电路板的制作方法及内埋元件的电路板 |
CN114430624A (zh) * | 2020-10-29 | 2022-05-03 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制作方法以及电路板 |
CN114430624B (zh) * | 2020-10-29 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制作方法以及电路板 |
Also Published As
Publication number | Publication date |
---|---|
TWI466607B (zh) | 2014-12-21 |
CN103906372B (zh) | 2017-03-01 |
US9089082B2 (en) | 2015-07-21 |
TW201427510A (zh) | 2014-07-01 |
US20140182892A1 (en) | 2014-07-03 |
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