CN103328665B - The manufacture method of copper alloy and copper alloy - Google Patents
The manufacture method of copper alloy and copper alloy Download PDFInfo
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- CN103328665B CN103328665B CN201180059926.2A CN201180059926A CN103328665B CN 103328665 B CN103328665 B CN 103328665B CN 201180059926 A CN201180059926 A CN 201180059926A CN 103328665 B CN103328665 B CN 103328665B
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 63
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 45
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 238000011282 treatment Methods 0.000 claims description 35
- 230000032683 aging Effects 0.000 claims description 30
- 238000002844 melting Methods 0.000 claims description 21
- 230000008018 melting Effects 0.000 claims description 21
- 238000002156 mixing Methods 0.000 claims description 17
- 238000005482 strain hardening Methods 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 4
- 235000019589 hardness Nutrition 0.000 description 56
- 239000000203 mixture Substances 0.000 description 39
- 230000008569 process Effects 0.000 description 39
- 238000003483 aging Methods 0.000 description 30
- 238000010438 heat treatment Methods 0.000 description 30
- 229910052759 nickel Inorganic materials 0.000 description 28
- 238000005266 casting Methods 0.000 description 26
- 230000006835 compression Effects 0.000 description 24
- 238000007906 compression Methods 0.000 description 24
- 229910000765 intermetallic Inorganic materials 0.000 description 23
- 239000000523 sample Substances 0.000 description 21
- 238000005097 cold rolling Methods 0.000 description 17
- 238000001556 precipitation Methods 0.000 description 17
- 239000006104 solid solution Substances 0.000 description 17
- 239000000956 alloy Substances 0.000 description 12
- 238000005098 hot rolling Methods 0.000 description 12
- 230000006698 induction Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000002003 electron diffraction Methods 0.000 description 4
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910019819 Cr—Si Inorganic materials 0.000 description 2
- 229910018098 Ni-Si Inorganic materials 0.000 description 2
- 229910000943 NiAl Inorganic materials 0.000 description 2
- 229910018529 Ni—Si Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910017870 Cu—Ni—Al Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- RZJQYRCNDBMIAG-UHFFFAOYSA-N [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] Chemical class [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] RZJQYRCNDBMIAG-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000002180 anti-stress Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical class [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Abstract
Even the invention provides the also excellent and copper alloy of high conductivity of high strength processibility, in addition, provide the manufacture method of copper alloy and this Albatra metal-that can control these characteristics.Comprise Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, the copper alloy of the FCC structure that remainder is made up of Cu and inevitable impurity, and be the L1 making to comprise Si in the parent phase of above-mentioned copper alloy
2the high strength copper alloy that the γ ' of structure separates out with below median size 100nm.
Description
Technical field
The present invention relates to the copper alloy with high strength & high electric-conduction of the lead frame, junctor, terminal component etc. being applicable to electric/electronic and manufacture the copper alloy manufacture method of this copper alloy.
Background technology
In the past, various terminal, junctor, rly. or the switch etc. such as lead frame as electronics needed electrical conductivity and elastic material, for the purposes paying attention to manufacturing cost, and the brass that application is cheap.In addition, on the other hand, for the purposes paying attention to the mechanical propertiess such as elasticity, application phosphor bronze.And then, for the purposes also paying attention to erosion resistance except elasticity, application German silver.
But present situation is, along with the lightweight of electronics class and parts thereof in recent years, thin-walled property and miniaturization, if use these materials, then required intensity fully cannot be met.
In recent years, various terminals etc. for electronics need electrical conductivity and elastic material, replacement phosphor bronze, brass etc. are in the past the solution strengthening type alloy of representative, and from the view point of high strength and high conductivity, the usage quantity of the copper alloy of age hardening type increases gradually.
The copper alloy of age hardening type is following copper alloy: by carrying out ageing treatment to by the supersaturated solid solution after solution treatment, minuteness particle is separated out equably and improves endurance or camber of spring limit equal strength characteristic, and solid solution element amount is reduced, contributes to the raising of electric conductivity.
Therefore, as the material of requirement meeting more and more stricter electronics class and the lightweight of parts thereof, the high strength of material, such as, the copper alloy of the age hardening types such as Cu-Ni-Si alloy (copper nisiloy) or beryllium copper is used.
In addition, carry out the high strength of lightweight, material, and as the copper alloy corresponding with electronics class, use Cu-Ni-Si alloy (copper nisiloy), to attempt the improvement based on manufacture method.Such as, Patent Document 1 discloses following Cu alloy material, Ni, the Si of 0.2 ~ 1.0 quality % containing 1.0 ~ 5.0 quality %, the Zn of 1.0 ~ 5.0 quality %, the Sn of 0.1 ~ 0.5 quality %, the P of 0.003 ~ 0.3 quality %, the Cu alloy material that remainder is made up of Cu and inevitable impurity, comprise following operation: the first cold rolling process, be cold-rolled to the thickness of 1.3 ~ 1.7 times of the final thickness of slab as object; First heat treatment step, behind heating materials to 700 ~ 900 after cold rolling by first DEG C, is cooled to less than 300 DEG C with the cooling rate of per minute more than 25 DEG C; Second cold rolling process, is cold-rolled to final thickness of slab by the material after the first thermal treatment; Second heat treatment step, heating materials to 400 ~ 500 DEG C after cold rolling by second, and keep 30 minutes ~ 10 hours; And to the material after the second thermal treatment while length direction applies tension force, with 400 ~ 550 DEG C of heating maintenances 10 seconds ~ 3 minutes.But manufacturing process is complicated, is difficult to the reduction realizing manufacturing cost.
Disclose and utilize this Cu-Ni-Si system (copper nisiloy) alloy, add the technology (with reference to patent documentation 2 ~ 4) that other metallic elements carry out improving.Such as, describing following copper alloy for electronic material in patent documentation 2, is that (wherein, the weight ratio of Ni and Si is 3≤Ni/Si≤5.5 containing Ni:1.0 ~ 4.5 quality %, Si:0.50 ~ 1.2 quality %, Cr:0.0030 ~ 0.3 quality %.), the copper alloy that remainder is made up of Cu and inevitable impurity, be more than 0.1 μm and the Cr-Si compound of less than 5 μm for dispersion size in the material, the Cr in this dispersed particle is 1 ~ 5 relative to the atomic percent ratio of Si, and its tamped density is 1 × 10
6individual/mm
2below.But, as the copper alloy of intensity improving Ni-Si series intermetallic compound, but there is restriction about high strength & high electric-conduction.
In addition, the copper alloy (with reference to patent documentation 5 ~ 7) of separating out the intermetallic compound different from Ni-Si system, Cr-Si system, Ni-P-Fe system Ni-P being added to Fe, Ni-Ti series intermetallic compound is disclosed.Such as, following copper alloy for electrical/electronic device is described in patent documentation 7, comprise: the Ni of 1 ~ 3mass% and the Ti of 0.2 ~ 1.4mass%, the ratio (Ni/Ti) of the quality percentage of described Ni and Ti is 2.2 ~ 4.7, comprise: one or both in Mg and Zr also adds up to 0.02 ~ 0.3mass%, and the Zn of 0.1 ~ 5mass%, the copper alloy that remainder is made up of Cu and inevitable impurity, contain by Ni, Ti, and the intermetallic compound that Mg is formed, by Ni, Ti, and the intermetallic compound that Zr is formed, with by Ni, Ti, Mg, and at least one intermetallic compound in the intermetallic compound of Zr formation, the distribution density of described intermetallic compound is 1 × 10
9~ 1 × 10
13individual/mm
2, tensile strength is more than 650MPa, and electric conductivity is more than 55%IACS, and keeps 1000 little stress relaxation rates constantly for less than 20% with 150 DEG C.
At first technical literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2007-070651
Patent documentation 2: Japanese Unexamined Patent Publication 2009-242921
Patent documentation 3: Japanese Unexamined Patent Publication 2010-090408
Patent documentation 4: Japanese Unexamined Patent Publication 2008-266787
Patent documentation 5: Japanese Unexamined Patent Publication 2007-126739
Patent documentation 6: Japanese Unexamined Patent Publication 2001-335864
Patent documentation 7: Japanese Unexamined Patent Publication 2006-336068
Summary of the invention
The problem that invention will solve
But no matter be which kind of copper alloy, its high strength & high electric-conduction had concurrently is all insufficient for nearest requirement.
Therefore, the present invention puts in view of the above problems and completes, and its object is to, even provide its processibility of high strength also excellent and the manufacture method of the copper alloy of high conductivity and such copper alloy.
In addition, its object is also, can the manufacture method of the also excellent and characteristic with high conductivity controls to its processibility of these high strength copper alloy and such copper alloy even provide.
Solve the method for problem
As the feature of the present invention of the means solved the problem, inventors have understood in order to the result obtaining high strength copper alloy and carry out studying, and for Cu-Ni-Al alloy, in the parent phase of FCC structure, utilize Ni
3al makes L1
2the mutually fine precipitation of γ ' of structure is effective.And then understand, by adding Si, can further high strength.
Therefore, copper alloy of the present invention comprises Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, and the copper alloy of the FCC structure that remainder is made up of Cu and inevitable impurity, is characterized in that, in the parent phase of above-mentioned copper alloy, utilize the Ni containing Si
3al, separates out L1 with below median size 100nm
2γ ' the phase of structure.
In addition, the feature of copper alloy of the present invention is also, comprises Ni:3.0 ~ 14.0 quality %, Al:0.5 ~ 4.0 quality %, Si:0.1 ~ 1.5 quality %, and electric conductivity is more than 8.5%IACS.
In addition, the feature of copper alloy of the present invention is also, cold-workability is 10 ~ 95%.
In addition, the feature of copper alloy of the present invention is also, as the scope represented by Al equivalent (quality %)=(Al quality %+1.19Si quality %) and Ni quality %, be positioned at the region A enclosed by (Al:2.0 quality %, Ni:3.0 quality %), (Al:4.0 quality %, Ni:9.5 quality %), (Al:1.5 quality %, Ni:14.0 quality %), (Al:0.5 quality %, Ni:5.0 quality %) these four points.
In addition, the feature of copper alloy of the present invention is also, comprises Ni:9.5 ~ 29.5 quality %, Al:1.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, and Vickers' hardness is more than 220Hv.
In addition, the feature of copper alloy of the present invention is also, as the scope represented by Al equivalent (quality %)=(Al quality %+1.19Si quality %) and Ni quality %, be positioned at the region B enclosed by (Al:4.0 quality %, Ni:9.5 quality %), (Al:7.0 quality %, Ni:16.0 quality %), (Al:2.5 quality %, Ni:29.5 quality %), (Al:1.5 quality %, Ni:14.0 quality %) these four points.
In addition, the feature of copper alloy of the present invention is also, comprises one or more the element selected from the group be made up of Co, Ti, Sn, Cr, Fe, Zr, Mg, Zn of 0.01 ~ 5.0 quality %, as Addition ofelements with total amount.
In addition, the feature of copper alloy of the present invention is also, comprises one or more the element selected from the group be made up of C, P and B of 0.001 ~ 0.5 quality %, as Addition ofelements with total amount.
The feature of the manufacture method of high strength copper alloy of the present invention is, carry out melting mixing integratedly and after carrying out hot-work and cold working, then, with 700 ~ 1020 DEG C, scope at 0.1 ~ 10 hour is heat-treated, afterwards, with 400 ~ 650 DEG C, carry out ageing treatment the scope of 0.1 ~ 48 hour.
In addition, the feature of the manufacture method of high strength copper alloy of the present invention is also, before or after above-mentioned ageing treatment, carries out the cold working that working modulus is 10 ~ 95%.
Invention effect
According to the copper alloy of the present invention as the means solved the problem, the result obtained by studying high conductivity shows, meets intensity, both electroconductibility at region A and region B.At region A, can obtain that electric conductivity is especially high, the high strength copper alloy of excellent in workability, region B can obtain the high strength copper alloy that intensity is high especially.
In addition, according to the manufacture method of copper alloy of the present invention, the result obtained by studying high conductivity shows, can be manufactured on the copper alloy that region A and region B meets intensity, both electroconductibility.
Accompanying drawing explanation
Fig. 1 is the crystalline structure L1 that upside represents based on the precipitate of electron diffraction
2, and downside represents the photo of the transmission electron microscope of the state of precipitate.
Embodiment
Below, based on accompanying drawing, the mode for implementing optimum of the present invention is described.In addition, those skilled in the art are by changing the present invention recorded in claim/revise, easily expect other embodiments, these change/revise and are contained in the scope of this claim, the following description is the example of the mode of optimum of the present invention, does not limit the scope of its claim.
Copper alloy of the present invention comprises Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, the copper alloy of the FCC structure that remainder is made up of Cu and inevitable impurity, in the parent phase of above-mentioned copper alloy, with below median size 100nm, utilize the Ni comprising Si
3al separates out L1
2γ ' the phase of structure.Such as utilize the arrangement architecture of electron diffraction picture can confirm above-mentioned L1
2structure.
Fig. 1 is the crystalline structure L1 that upside represents based on the precipitate of electron diffraction
2, and downside represents the photo of the transmission electron microscope of the state of precipitate.
In addition, this photo is the composition of Ni:12.3 quality %-Al:1.0 quality %-Si:0.3 quality %-Cu, implements solution treatment: the 500 DEG C of thermal treatments of 6 hours of 900 DEG C of 10 minutes-cold working 30%-ageing treatment.
As shown in Figure 1, in electron diffraction, there is the ordered phase of diffraction surfaces 110 for object.That is, γ ' is as intermetallic compound, be the atom be positioned on limit is Al and Si, the atom being positioned at the center of area be Ni by the FCC structure of ordering.
In addition, after carry out describe, but, known, in the photo of the downside of Fig. 1, L1
2the γ ' of structure separates out mutually imperceptibly.
These have the copper of the parent phase of FCC structure and have L1
2the γ ' of structure is FCC structure mutually, and therefore consistency is good, contributes to the raising of intensity, and by making γ ' separate out mutually, the solute element concentration of parent phase reduces, and also contributes to the raising of electric conductivity.
Copper alloy of the present invention is the copper alloy always keeping FCC structure.FCC structure is the structure that metallic element is the most closely piled up, and the parent phase alloy as high strength & high electric-conduction is suitable.Therefore, there is the copper of FCC structure, its excellent in workability, can easily be made into object shape.
Copper alloy of the present invention in order to meet high strength and high conductivity, and needs to comprise Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %.
Ni and Al makes in the Cu of parent phase, separates out Ni
3the intermetallic compound of Al, and form γ ' phase.And then Al and Si, coordinates with Ni and forms Ni
3(Al, Si) intermetallic compound, therefore, altogether, to both Al and Si needs be the amount coordinated with this, and, not Ni
3al, Ni
3the independent of Si is, but at L1
2among type, while the limit of FCC structure mixes existence, form a Ni
3(Al, Si) intermetallic compound.
In copper alloy of the present invention, there is L1
2the γ ' of structure as intermetallic compound, be the atom be positioned on limit be Al and Si, be positioned at the atom of the center of area be Ni by the FCC structure of ordering.
These have the copper of the parent phase of FCC structure and have L1
2the γ ' of structure is FCC structure mutually, and therefore, consistency is good, contributes to the raising of intensity, and, by making γ ' separate out mutually, the solute element concentration of parent phase being reduced, also contributing to improving electric conductivity.
And then, if be described in detail, then L1
2the γ ' of structure belongs to GCP (Geometricallyclosepacking mutually, geometry is tightly packed) phase, due to its close-packed structure, there is ductility, and then, because consistency is high, so, become γ+γ ' tissue, γ ' as micro organization in this γ+γ ' tissue separates out mutually, thereby, it is possible to the copper alloy that the processibility obtaining having toughness is high.
This γ ' is separate out imperceptibly with spherical in the γ phase of main body at the copper as parent phase.Because γ ' is spherical mutually, so can not stress concentration be there is in γ ' phase with the interface between γ phase, and the copper alloy that the processibility that can obtain having toughness is high.
And then, by the median size of γ ' phase being controlled, for less, intensity to be improved further.By making the median size of γ ' phase little, the anchoring of dislocation point carrying out movement increases, and can obtain high tensile strength.
And then γ ' is intermetallic compound mutually, and the hardness of himself is higher, and tensile strength is also higher.Therefore, by hinder dislocation γ ' mutually in movement, can make contributions to the hardness of copper alloy, tensile strength.
In addition, generally, the solute element concentration of solid solution in copper is higher, then specific conductivity more reduces, but compared with the solid solution condition that γ is single-phase, make by heat-treating at low temperatures γ ' separate out mutually, thus the solute element concentration of parent phase is reduced, therefore, the precipitation of γ ' phase also contributes to the raising of electric conductivity.In addition, for the electric conductivity of γ ' phase, compared with pure Cu, its electric conductivity is low, therefore, correspondingly makes electronics move reduction with the ratio of this γ ' shared volume mutually, but, by making the area fraction of γ ' phase appropriate, high electric conductivity can be maintained.
Therefore, when making copper alloy, do not damage the ductility such as cold-workability significantly as having, and comparatively large and improve the second-phase of the effect of specific conductivity to the contribution of the mechanical characteristics such as hardness, tensile strength, and γ ' is applicable mutually.At this moment, the area fraction of preferred γ ' phase is 5 ~ 40%.
This area fraction can be obtained by the area of each metallographic comparing certain cross section of copper alloy.In addition, usually, for area fraction and volume fraction, if will based on two solids of Cavaglieri (Cavalieri) principle, with the area equation of otch when cutting with certain parallel plane plane, then two three-dimensional volumes be equal.Therefore, regard this area fraction as volume fraction also to have no relations.
In addition, metalloscope, electron microscope (SEM, TEM), EPMA (x-ray analysis equipment) etc. can be utilized to measure area fraction.
In addition, preferably the median size of this γ ' phase is below 100nm.Although the smaller the better, due to based on heat treated alligatoring, by actual precipitation size control finer than 1nm be difficult, if at more than 1nm and at below 100nm, sufficient intensity can obtained.
Electron microscope can be utilized to carry out structure observation, therefrom measured the diameter of multiple γ ' phase by image analysis, and it is averaged, thus obtain the median size of γ ' phase.
At this moment, due to added Ni, Al, Si, Ni is separated out sometimes
3ni beyond the γ ' phase of the intermetallic compound of Al
2(Al, Si), NiAl, Ni
5si
2deng intermetallic compound.
But, with Ni
3(Al, Si) compares, Ni
2the amount that (Al, Si) separates out is few, and the impact brought the mechanical properties of copper alloy, electrical properties is little.
Separate out the intermetallic compound of the β phase represented by NiAl.This β phase is the B2 structure of BCC ordered structure, and the compositing range carrying out separating out is narrow, even if separate out, with Ni
3(Al, Si) compares, and its amount is also few, and the impact brought the mechanical properties of copper alloy, electrical properties is also less.
In addition, Ni is separated out sometimes
5si
2intermetallic compound.With Ni
3(Al, Si) compares, this Ni
5si
2the amount separated out is also few, and the impact brought the mechanical properties of copper alloy, electrical properties is little.
But, due to these Ni
3the γ ' of (Al, Si) mutually beyond intermetallic compound separate out respectively a lot, thus impact is brought on the mechanical properties of copper alloy, electrical properties, but, also can not more than Ni
3(Al, Si) bring impact.But, on the precipitate that these are whole basis altogether, obtain copper alloy of the present invention.
Si has the effect of the solute element concentration reduced in matrix, has the volume fraction of increase γ ' phase and provides the effect of electric conductivity.Therefore, because γ ' is Ni mutually
3the intermetallic compound of (Al, Si), thus, with Ni
3the monomer of Al compares, and intensity, electric conductivity are excellent.For the amount ratio of Al and Si, preferably, in the scope of Al/Si=1 ~ 5.This is because, if Al/Si ratio is less than 1, then except γ ' phase, also separate out other compounds reduction of ductility, electric conductivity being brought to impact, if be greater than 5, then the volume fraction of γ ' phase is insufficient, and the reduction of the solute element concentration in matrix is also insufficient, can not bring the raising of intensity and electric conductivity fully.
Therefore, by being set as the scope of Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, and γ ' is separated out mutually, thus the compositing area of high strength & high electric-conduction and excellent in workability can be obtained.
In addition, copper alloy of the present invention is the compositing range comprising Ni:3.0 ~ 14.0 quality %, Al:0.5 ~ 4.0 quality %, Si:0.1 ~ 1.5 quality %, and electric conductivity is more than 8.5%IACS.
By being set as this compositing range, the γ ' of below 100nm is separated out mutually, thus electric conductivity can be made to be more than 8.5%IACS.
Because electric conductivity is more than 8.5%IACS, thus, as the copper alloy with high conductivity, the lead frame of electronics etc., junctor, terminal component etc. can be applicable to.
In addition, copper alloy of the present invention by being set as this compositing range, and makes the γ ' of below 100nm separate out mutually, thus cold-workability can be made further to be 10 ~ 95%.
For cold-workability, when being in the rolling that temperature 20 DEG C is implemented, utilize and do not carry out annealing and the decrement that can carry out the maximum ga(u)ge of roll forming defines crack-free, when wire drawing, utilize and do not carry out annealing and the maximum relative reduction in area that can carry out wire drawing defines crack-free.
The Ni of γ ' phase
3(Al, Si) intermetallic compound processibility compared with pure Cu is low, thus cannot with this Ni
3shared by (Al, Si) intermetallic compound, the ratio of volume measures increase working modulus accordingly.
Therefore, by being set to the compositing range comprising Ni:3.0 ~ 14.0 quality %, Al:0.5 ~ 4.0 quality %, Si:0.1 ~ 1.5 quality %, can the amount of precipitation of control γ ' phase, maintain electric conductivity higher constant, and make cold-workability be 10 ~ 95%.
If cold-workability is less than 10%, then there is the problem that can not make the material with object shape.If cold-workability is more than 95%, then there is the problem that the burden of equipment is large.Therefore, preferred cold-workability is the scope of 10 ~ 95%, further preferably, is that 20 ~ 90% meetings are better.
By making cold-workability be 10 ~ 95%, thus as having the copper alloy of high strength, be applicable to the lead frame of electronics etc., junctor, terminal component etc.
And then, Ni and Al in copper alloy of the present invention, the addition of Si, at the Ni represented by Al equivalent (quality %)=(Al quality %+1.19Si quality %) and Ni quality % in Al isometric(al) drawing, be positioned at the region A enclosed by (Al:2.0 quality %, Ni:3.0 quality %), (Al:4.0 quality %, Ni:9.5 quality %), (Al:1.5 quality %, Ni:14.0 quality %), (Al:0.5 quality %, Ni:5.0 quality %) these four points.
Copper alloy of the present invention by being positioned at the scope of this region A and the volume fraction making γ ' separate out mutually is 5 ~ 20%, thus can obtain high electric conductivity and high cold-workability.
In the scope of this region A, the electric conductivity of roughly 10 ~ 25%IACS can be obtained, in addition, the cold-workability of 10 ~ 95% can be obtained, therefore, as contactor material, even if to be touched, situation about rubbing is more, also can reduce wear.
Therefore, as the copper alloy with high electric conductivity and high cold-workability, the lead frame of electronics etc., junctor, terminal component etc. can be applicable to.
And then, in copper alloy of the present invention, comprise Ni:9.5 ~ 29.5 quality %, Al:1.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, and Vickers' hardness is in the scope of 220 ~ 450Hv.
Owing to adding a large amount of Ni, improve volume, area that γ ' is shared mutually, thus can Vickers' hardness be improved.
In this case, the volume fraction separated out mutually by making γ ' is 20 ~ 40%, can make contributions to the intensity represented by the Vickers' hardness of copper.
As described above, preferably the median size of γ ' phase is at this moment below 100nm.Although the smaller the better, actual precipitation is difficult to carry out completely equably, if more than 1nm and below 100nm, then can obtain sufficient intensity, be more preferably below 30nm.
In addition, for the electric conductivity of copper alloy of the present invention under this compositing range, the electric conductivity of roughly 7 ~ 15%IACS can be obtained, therefore, by having high Vickers' hardness simultaneously, even if be applied to the lead frame, junctor, terminal component etc. of electronics etc., wearing and tearing also can be made few, weather resistance is good, resistance to long-time use.
In addition, in copper alloy of the present invention, at the Ni represented by Al equivalent (quality %)=(Al quality %+1.19Si quality %) and Ni quality % in Al isometric(al) drawing, be positioned at the region B enclosed by (Al:4.0 quality %, Ni:9.5 quality %), (Al:7.0 quality %, Ni:16.0 quality %), (Al:2.5 quality %, Ni:29.5 quality %), (Al:1.5 quality %, Ni:14.0 quality %) these four points.
Copper alloy of the present invention by making to be positioned at the scope of this region B and the volume fraction making γ ' separate out mutually is 25 ~ 40%, thus can obtain the high intensity that represented by Vickers' hardness further.This is because γ ' is intermetallic compound mutually, highly very high reason.But, if the area ratio of γ ' phase increases, then there is electric conductivity and reduce such shortcoming.
Therefore, by being positioned at the scope of this region B, thus while obtaining high electric conductivity, high Vickers' hardness can be obtained in the lump.
Thereby, it is possible to be widely used in the lead frame, junctor, terminal component etc. of electronics etc.
In addition, copper alloy of the present invention also comprises one or more the element selected from the group be made up of Co, Ti, Sn, Cr, Fe, Zr, Mg, Zn of 0.01 ~ 5.0 quality % with total amount, as Addition ofelements.
Co, Ti, Cr and Zr make γ ' stablize mutually, and promote to separate out, so contribute to the raising of intensity, in addition, also have the effect of the solute element concentration reduced in Cu, therefore also contribute to the raising of electric conductivity.
Sn, Mg and Zn are effective to improving anti-stress relaxation properties, and, due to solid solution and contribute to the raising of intensity in Cu.
For Fe, by disperseing the particulate of Fe in Cu, thus effective to the miniaturization of crystal grain, contribute to the raising of intensity and the raising of thermotolerance.
For the addition of Addition ofelements, make to comprise one or more Addition ofelements selected by 0.01 ~ 5.0 quality % with total amount.If the total amount of one or more selected Addition ofelements is less than 0.01 quality %, then there is the problem being helpless to the raising of the electric conductivity of copper alloy, the raising of intensity and so on.In addition, if the total amount of Addition ofelements is more than 5.0 quality %, although then contribute to the raising of electric conductivity, the raising of intensity, there is the problem that the mechanical characteristicies such as electrical specification and Vickers' hardness such as electric conductivity cannot be controlled in suitable scope and so on.
In copper alloy of the present invention, one or more the element selected from the group be made up of C, P and B of 0.001 ~ 0.5 quality % can also be comprised with total amount, as Addition ofelements.
Can think that C is effective to the miniaturization of crystal grain, contribute to the raising of intensity.In addition, the solid solubility of the solute element in Cu is reduced, thus contributes to the raising of electric conductivity.
P is used as reductor, there is the effect of the impurity concentration reducing Cu, contribute to the raising of electric conductivity.
B has the effect suppressing crystal grain-growth, and therefore, by miniaturization, the raising for intensity is effective.Thermotolerance can be improved.
For addition, make to comprise one or more Addition ofelements selected by 0.001 ~ 0.5 quality % with total amount.If Addition ofelements is less than 0.001 quality % with total amount, then there is the problem being helpless to the raising of the electric conductivity of copper alloy, the raising of intensity and so on.In addition, if Addition ofelements with total amount more than 0.5 quality %, then contribute to the raising of electric conductivity, the raising of intensity, but, there is the problem that the mechanical characteristicies such as electrical specification and Vickers' hardness such as electric conductivity cannot be controlled in suitable scope and so on.
In addition, in the manufacture method of copper alloy of the present invention, carry out melting mixing integratedly and after casting, by hot-work such as forge hots, and as required by the cold working such as cold rolling, cold drawn, be shaped to the shapes such as sheet material, wire rod, tubing.Then, with 700 ~ 1020 DEG C, the scope at 0.1 ~ 10 hour is heat-treated, and afterwards, with 400 ~ 650 DEG C, carries out ageing treatment the scope of 0.1 ~ 48 hour.
The manufacture method of copper alloy of the present invention comprises following operation: Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality % and Cu are carried out melting mixing by (a) integratedly, and forms the operation of copper alloy sample material as ingot casting; By hot-work and undertaken by cold working as required shaping after, (b) carries out the operation of following solution treatment: by above-mentioned copper alloy sample material with the temperature range of 700 DEG C ~ 1020 DEG C, the scope at 0.1 ~ 10 hour is heat-treated; And (c) carries out the operation of following ageing treatment: by the copper alloy sample material after solution treatment, with the temperature range of 400 DEG C ~ 650 DEG C, the scope at 0.1 ~ 48 hour heats.
In the operation of the formation copper alloy sample material of (a), as the raw material of copper alloy, can further using total amount add 0.01 ~ 5.0 quality % from by one or more the element selected the group that Co, Ti, Sn, Cr, Fe, Zr, Mg, Zn are formed as Addition ofelements.And then, as the raw material of copper alloy, can also with total amount add 0.001 ~ 0.5 quality % from by one or more the element selected the group that C, P and B are formed.
For melting mixing, in order to prevent Al, Si from reducing due to oxidation, such as, use the reductors such as calcium boride, or use argon gas or nitrogen etc. to carry out foaming process, or carry out in a vacuum melting in vacuum vessel.As the method for carrying out melting, be not particularly limited, use the known devices such as high-frequency melting stove, be heated to the temperature of more than the melting point of copper alloy raw material.
In the operation of solution treatment of carrying out (b), to copper alloy sample material with the temperature range of 700 DEG C ~ 1020 DEG C, the scope at 0.1 ~ 10 hour is heat-treated.Thereby, it is possible to obtain added alloying element can not in the parent phase of Cu segregation and the sosoloid of as one man homogenizing.Heating means are not particularly limited, carry out according to known method.
In this solution treatment, by making Ni, Al, Si etc. disperse equably, thus can, by ageing treatment described later, the γ ' of the fine median size with below 100nm be separated out mutually.
In the operation of ageing treatment of carrying out (c), by copper alloy sample material, with 400 ~ 650 DEG C, carry out ageing treatment the scope of 0.1 ~ 48 hour.If lower than 400 DEG C, and/or less than 0.1 hour, then γ ' cannot be made to separate out mutually.If more than 650 DEG C and/or more than 48 hours, then γ ' grows up mutually, median size, more than 100nm, produces the problem that can not get desired electric conductivity and working modulus and so on.Therefore, in order to obtain desired electric conductivity and hardness, such ageing treatment is necessary prerequisite.
In addition, the feature of the manufacture method of high strength copper alloy of the present invention is also, before or after above-mentioned ageing treatment, carries out the cold working of 10 ~ 95%.
In the manufacture method of high strength copper alloy of the present invention, except above-mentioned manufacturing process, (d) also, before or after carrying out above-mentioned ageing treatment to above-mentioned copper alloy sample material, is provided with the cold worked operation of carrying out 10 ~ 95%.
By carrying out cold working before carrying out ageing treatment to copper alloy sample material, forming the lattice imperfection such as crystal boundary, dislocation, accumulation defect, and making its crystal grain miniaturization or work hardening, and, by the Ni after making it
3the γ ' of (Al, Si) disperses and separates out in a large number mutually, and the median size of γ ' phase can be made to be below 100nm, and, the temperature of ageing treatment can be reduced, and the time of shortening.Cold worked method is had no particular limits, utilizes the known method such as rolling based on roller to carry out.
In addition, by carrying out cold working after carrying out ageing treatment to copper alloy sample material, dislocation, accumulation defect etc. can be imported and make its work hardening, so can high strength be carried out.
At this moment, the scope being 10 ~ 95% with working modulus is carried out.If working modulus is less than 10%, then the importing of defect is few, can not obtain the effect of sufficient above-mentioned processing.If working modulus is more than 95%, then the load of processing units is increased and become problem.
After these operations, in order to give elasticity, also low temperature aging process can be carried out with the scope of 100 ~ 400 DEG C.For the method for low temperature aging process, be not particularly limited, can carry out according to known method.
By the copper alloy that such manufacture method obtains, can at the L1 suppressing to separate out in copper alloy
2while the alligatoring of the γ ' phase of structure, the fine γ ' of substantial amount is separated out mutually, therefore, it is possible to easily control the mechanical characteristicies such as electrical specification, cold-workability, Vickers' hardness such as electric conductivity.
Embodiment
(copper alloy No.1 ~ 57)
In the scope of copper alloy of the present invention, the copper alloy sample material of the composition of embodiment 1 ~ 57 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).
(composition of embodiment 1 ~ 57)
Table 1-1
| Alloy No. | Ni (quality %) | Al (quality %) | Si (quality %) |
| 1 | 3 | 1．8 | 0．5 |
| 2 | 5 | 2．5 | 0.1 |
| 3 | 5 | 1．3 | 0.7 |
| 4 | 5 | 0．3 | 0．7 |
| 5 | 7．5 | 2．8 | 0．75 |
| 6 | 7．5 | 1．8 | 0．5 |
| 7 | 7．5 | 0．8 | 0．5 |
| 8 | 9．5 | 3．7 | 0．1 |
| 9 | 10 | 2．5 | 1 |
| 10 | 10 | 2．8 | 0．7 |
| 11 | 10 | 2．3 | 0．5 |
| 12 | 10 | 1．9 | 0．3 |
| 13 | 10 | 1．4 | 0．2 |
| 14 | 10 | 0．9 | 0．2 |
| 15 | 14 | 1．4 | 0．3 |
| 16 | 13 | 2．8 | 0．2 |
| 17 | 13 | 2．5 | 0．5 |
| 18 | 13 | 2 | 1 |
| 19 | 13 | 2 | 0．75 |
| 20 | 13 | 1．8 | 0．2 |
| 21 | 13 | 1．5 | 0．5 |
| 22 | 13 | 1 | 1 |
| 23 | 13 | 1 | 0．7 |
| 24 | 15 | 4．4 | 0．5 |
| 25 | 15 | 3．4 | 0．1 |
| 26 | 15 | 1．7 | 0．7 |
| 27 | 16 | 6．2 | 0．7 |
| 28 | 17.5 | 5．1 | 0．75 |
| 29 | 17．5 | 4．4 | 0．5 |
| 30 | 17．5 | 3．4 | 0．5 |
Table 1-2
| Alloy No. | Ni (quality %) | Al (quality %) | Si (quality %) |
| 31 | 17．5 | 1．8 | 1 |
| 32 | 20 | 3．8 | 1 |
| 33 | 20 | 3．2 | 0．7 |
| 34 | 20 | 2．4 | 0．5 |
| 35 | 20 | 2．1 | 0．3 |
| 36 | 22．5 | 4．3 | 0．2 |
| 37 | 22．5 | 3．8 | 0．2 |
| 38 | 22．5 | 3．1 | 0．3 |
| 39 | 22．5 | 2．4 | 0．5 |
| 40 | 22．5 | 1．9 | 0．5 |
| 41 | 25 | 3．4 | 0．5 |
| 42 | 25 | 2.4 | 0．5 |
| 43 | 25 | 1．9 | 0．5 |
| 44 | 29．5 | 1．9 | 0．5 |
| 45 | 3 | 0．5 | 0．4 |
| 46 | 5 | 3．5 | 0．4 |
| 47 | 5 | 5．0 | 0．8 |
| 48 | 10 | 3．2 | 1．5 |
| 49 | 10 | 7．0 | 0．1 |
| 50 | 15 | 0．9 | 0．1 |
| 51 | 20 | 0．7 | 0．3 |
| 52 | 25 | 0．5 | 0．4 |
| 53 | 25 | 4．0 | 0．8 |
| 54 | 25 | 5．0 | 0．8 |
| 55 | 25 | 6．0 | 0．8 |
| 56 | 29．5 | 0．9 | 0．1 |
| 57 | 29．5 | 5．0 | 0．8 |
Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, the electric conductivity under various composition, processibility, Vickers' hardness.
(result of electric conductivity, processibility, Vickers' hardness)
Table 2-1
| Alloy No. | Electric conductivity | Processibility | Hardness |
| 1 | 20．8 | ○ | 170 |
| 2 | 17．5 | ○ | 240 |
| 3 | 22．5 | ○ | 225 |
| 4 | 25．3 | ○ | 178 |
| 5 | 14．8 | ○ | 290 |
| 6 | 17．9 | ○ | 285 |
| 7 | 20．7 | ○ | 255 |
| 8 | 13．7 | × | 300 |
| 9 | 13．6 | × | 307 |
| 10 | 14．4 | ○ | 312 |
| 11 | 15．0 | ○ | 318 |
| 12 | 15．8 | ○ | 302 |
| 13 | 17．2 | ○ | 270 |
| 14 | 17．8 | ○ | 217 |
| 15 | 14．8 | ○ | 285 |
| 16 | 12．6 | ○ | 351 |
| 17 | 12．7 | ○ | 369 |
| 18 | 14．1 | ○ | 392 |
| 19 | 13．1 | ○ | 381 |
| 20 | 14．5 | ○ | 331 |
| 21 | 14．5 | ○ | 355 |
| 22 | 15．7 | ○ | 350 |
| 23 | 14．2 | ○ | 295 |
| 24 | 10．8 | × | 390 |
| 25 | 12．5 | ○ | 395 |
| 26 | 14．1 | ○ | 348 |
| 27 | 6．8 | × | 365 |
| 28 | 8．2 | × | 385 |
| 29 | 9．2 | × | 400 |
| 30 | 11．3 | △ | 390 |
Table 2-2
| Alloy No. | Electric conductivity | Processibility | Hardness |
| 31 | 13．3 | ○ | 345 |
| 32 | 9．2 | × | 393 |
| 33 | 10．5 | △ | 352 |
| 34 | 12．2 | △ | 320 |
| 35 | 12．8 | △ | 305 |
| 36 | 8．0 | × | 340 |
| 37 | 8．5 | × | 335 |
| 38 | 9．8 | △ | 325 |
| 39 | 11．2 | △ | 318 |
| 40 | 11．5 | △ | 307 |
| 41 | 7．8 | × | 320 |
| 42 | 9．1 | × | 308 |
| 43 | 10．0 | × | 285 |
| 44 | 6．9 | × | 260 |
| 45 | 35．0 | ○ | 150 |
| 46 | 14．1 | ○ | 265 |
| 47 | 10．1 | ○ | 180 |
| 48 | 13．3 | ○ | 260 |
| 49 | 6．2 | ○ | 220 |
| 50 | 14．8 | ○ | 145 |
| 51 | 13．6 | ○ | 140 |
| 52 | 11．5 | ○ | 130 |
| 53 | 6．8 | ○ | 330 |
| 54 | 6．2 | ○ | 385 |
| 55 | 5．9 | ○ | 345 |
| 56 | 7．3 | ○ | 120 |
| 57 | 5．2 | ○ | 320 |
According to table 2-1, table 2-2, in the scope of copper alloy of the present invention, the mechanical characteristicies such as the electrical specifications such as electric conductivity, cold-workability, Vickers' hardness can be controlled.
Afterwards, through the manufacture heat-treat condition operation shown in table 3, make to separate out L1 in the parent phase of FCC structure
2γ ' the phase of structure.
(manufacturing condition)
Table 3
In table 4, use the copper alloy of the composition of No.16 ~ 23 as copper alloy, illustrate the electric conductivity under each manufacturing condition in table 3 and Vickers' hardness.
(electric conductivity under manufacturing condition and the result of Vickers' hardness)
Known according to this table 4, except heat treatment process condition 1,5,12,13, whole electric conductivitys is at more than 8.5%IACS, and whole Vickers' hardnesses is at more than 220Hv.
(copper alloy No.58 ~ 70)
Then, with the addition of Addition ofelements.By the copper alloy sample material of the composition of embodiment 58 ~ 70, put into integratedly in high-frequency induction calciner, make it melt, and melting mixing.Be made into casting ingot casting (as-cast).
(composition of Addition ofelements)
Table 5-1
| Alloy No. | Ni (quality %) | Al (quality %) | Si (quality %) | Cu (quality %) |
| 58 | 6 | 1.2 | 0．64 | Remainder |
| 59 | 13 | 1．2 | 0．5 | Remainder |
| 60 | 13 | 1 | 1 | Remainder |
| 61 | 13 | 2 | 1 | Remainder |
| 62 | 13 | 1 | 1 | Remainder |
| 63 | 13 | 1 | 1 | Remainder |
| 64 | 13 | 1 | 1 | Remainder |
| 65 | 13 | 2 | 1 | Remainder |
| 66 | 13 | 2 | 1 | Remainder |
| 67 | 13 | 2 | 1 | Remainder |
| 68 | 13 | 1 | 1 | Remainder |
| 69 | 13 | 2 | 1 | Remainder |
| 70 | 13 | 2 | 1 | Remainder |
Table 5-2
Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 6, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.71 ~ 76)
Then, with the addition of Sn as Addition ofelements.
The copper alloy sample material of the composition of embodiment 71 ~ 76 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 71 ~ 76 is illustrated in following table 7.
Table 7
*71~73Ni13Al2Si1
*74~76Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 8, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS.
In addition, if the heat treatment process condition of the necessary ageing treatment beyond processing condition 1,5,6,7,8,12,13, then whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.77 ~ 82)
Then, with the addition of Ti as Addition ofelements.
The copper alloy sample material of the composition of embodiment 77 ~ 82 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 77 ~ 82 is represented in following table 9.
Table 9
*77~79Ni13Al2Si1
*79~82Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 10, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.83 ~ 88)
Then, with the addition of Zr as Addition ofelements.
The copper alloy sample material of the composition of embodiment 83 ~ 88 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 83 ~ 88 is represented in following table 11.
Table 11
*83~85Ni13Al2Si1
*86~88Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 12, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.89 ~ 94)
Then, with the addition of Cr as Addition ofelements.
The copper alloy sample material of the composition of embodiment 89 ~ 94 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 89 ~ 94 is represented in following table 13.
Table 13
*89~91Ni13Al2Si1
*92~94Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 14, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.95 ~ 100)
Then, with the addition of Fe as Addition ofelements.
The copper alloy sample material of the composition of embodiment 95 ~ 100 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 95 ~ 100 is represented in following table 15.
Table 15
*95~97Ni13Al2Si1
*98~100Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 16, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.101 ~ 106)
Then, with the addition of P as Addition ofelements.
The copper alloy sample material of the composition of embodiment 101 ~ 106 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 101 ~ 106 is represented in following table 17.
Table 17
*101~103Ni13Al2Si1
*104~106Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 18, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.107 ~ 112)
Then, with the addition of Zn as Addition ofelements.
The copper alloy sample material of the composition of embodiment 107 ~ 112 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 107 ~ 112 is represented in following table 19.
Table 19
*107~109Ni13Al2Si1
*110~112Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 20, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.113 ~ 118)
Then, with the addition of Mg as Addition ofelements.
The copper alloy sample material of the composition of embodiment 113 ~ 118 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 113 ~ 118 is represented in following table 21.
Table 21
*113~115Ni13Al2Si1
*116~118Ni13Al1Sil
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 22, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.119 ~ 122)
Then, with the addition of B as Addition ofelements.
The copper alloy sample material of the composition of embodiment 119 ~ 122 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 119 ~ 122 is represented in following table 23.
Table 23
*119/120Ni13Al2Si1
*121/122Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 24, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
(copper alloy No.123 ~ 128)
Then, with the addition of Co as Addition ofelements.
The copper alloy sample material of the composition of embodiment 123 ~ 128 is put in high-frequency induction calciner integratedly, makes it melt, and melting mixing.Be made into casting ingot casting (as-cast).Afterwards, make to separate out L1 in the parent phase of the Cu of FCC structure
2γ ' the phase of structure.
The composition of embodiment 123 ~ 128 is represented at following table 25.
Table 25
*123~125Ni13Al2Si1
*126~128Ni13Al1Si1
For heat-treat condition, representatively manufacturing condition is hot rolling (900 DEG C, compression ratio 90%)-solid solution (900 DEG C, 10 minutes)-cold rolling (20 DEG C, compression ratio 30%)-Precipitation process (500 DEG C, 18 hours).
Illustrate at this moment, electric conductivity under various composition and Vickers' hardness.
Known according to table 26, as the manufacturing condition of manufacture method of the present invention, if the heat treatment process condition of the necessary ageing treatment beyond heat treatment process condition 1,5,12,13, then whole electric conductivitys is more than 8.5%IACS, and whole Vickers' hardnesses is more than 220Hv.
(result of electric conductivity and Vickers' hardness)
Therefore, copper alloy of the present invention is the composition of regulation, and the copper alloy obtained by the manufacture method of regulation, can suppress the L1 separated out in copper alloy
2while the alligatoring of the γ ' phase of structure, the fine γ ' of substantial amount is separated out mutually, therefore knownly can easily control the mechanical characteristicies such as the electrical specifications such as electric conductivity, cold-workability, Vickers' hardness.
Claims (16)
1. a high strength copper alloy, it comprises Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, and the copper alloy of the FCC structure that remainder is made up of Cu and inevitable impurity, is characterized in that,
In the parent phase of described copper alloy, utilize Ni
3the L1 of (Al, Si)
2structure, separates out the γ ' phase of FCC structure,
Further, electric conductivity is more than 8.5%IACS, and Vickers' hardness is more than 220Hv.
2. high strength copper alloy according to claim 1, is characterized in that,
Described high strength copper alloy comprises Ni:3.0 ~ 14.0 quality %, Al:0.5 ~ 4.0 quality %, Si:0.1 ~ 1.5 quality %,
Further, electric conductivity is 10 ~ 25%IACS.
3. high strength copper alloy according to claim 2, is characterized in that,
Cold-workability is the scope of 10 ~ 95%.
4. high strength copper alloy according to claim 1, is characterized in that,
Described high strength copper alloy comprises Ni:9.5 ~ 29.5 quality %, Al:1.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %,
Further, Vickers' hardness is 220 ~ 450Hv, and electric conductivity is 8.5 ~ 15%IACS.
5. high strength copper alloy according to claim 2, is characterized in that,
Described high strength copper alloy also comprises one or more the element selected from the group be made up of Co, Ti, Sn, Cr, Fe, Zr, Mg, Zn of 0.01 ~ 5.0 quality % with total amount, as Addition ofelements.
6. high strength copper alloy according to claim 2, is characterized in that,
Described high strength copper alloy also comprises one or more the element selected from the group be made up of C, P and B of 0.001 ~ 0.5 quality % with total amount, as Addition ofelements.
7. high strength copper alloy according to claim 2, is characterized in that,
Described γ ' phase is separated out with below median size 100nm.
8. high strength copper alloy according to claim 2, is characterized in that,
Described γ ' is spherical mutually, and the area fraction of γ ' phase is 5 ~ 20%.
9. high strength copper alloy according to claim 4, is characterized in that,
Described high strength copper alloy also comprises one or more the element selected from the group be made up of Co, Ti, Sn, Cr, Fe, Zr, Mg, Zn of 0.01 ~ 5.0 quality % with total amount, as Addition ofelements.
10. high strength copper alloy according to claim 4, is characterized in that,
Described high strength copper alloy also comprises one or more the element selected from the group be made up of C, P and B of 0.001 ~ 0.5 quality % with total amount, as Addition ofelements.
11. high strength copper alloys according to claim 4, is characterized in that,
Described γ ' phase is separated out with below median size 100nm.
12. high strength copper alloys according to claim 4, is characterized in that,
Described γ ' is spherical mutually, and the area fraction of γ ' phase is 25 ~ 40%.
The manufacture method of 13. 1 kinds of high strength copper alloys, this high strength copper alloy comprises Ni:3.0 ~ 29.5 quality %, Al:0.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %, the copper alloy of the FCC structure that remainder is made up of Cu and inevitable impurity
The method is characterized in that,
Carry out integratedly melting mixing copper alloy raw material and after carrying out hot-work and cold working,
Then, with 700 ~ 1020 DEG C, the scope at 0.1 ~ 10 hour is heat-treated,
Afterwards, with 400 ~ 650 DEG C, carry out ageing treatment the scope of 0.1 ~ 48 hour,
Further, in the parent phase of described copper alloy, Ni is utilized
3the L1 of (Al, Si)
2structure, separates out the γ ' phase of FCC structure,
Further, electric conductivity is more than 8.5%IACS, and Vickers' hardness is more than 220Hv.
The manufacture method of 14. high strength copper alloys according to claim 13, is characterized in that,
Before or after described ageing treatment, carry out the cold working that working modulus is 10 ~ 95%.
The manufacture method of 15. high strength copper alloys according to claim 14, is characterized in that,
Described high strength copper alloy comprises Ni:3.0 ~ 14.0 quality %, Al:0.5 ~ 4.0 quality %, Si:0.1 ~ 1.5 quality %,
Further, electric conductivity is 10 ~ 25%IACS.
The manufacture method of 16. high strength copper alloys according to claim 14, is characterized in that,
Described high strength copper alloy comprises Ni:9.5 ~ 29.5 quality %, Al:1.5 ~ 7.0 quality %, Si:0.1 ~ 1.5 quality %,
Further, Vickers' hardness is 220 ~ 450Hv, and electric conductivity is 8.5 ~ 15%IACS.
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| JP2010276607 | 2010-12-13 | ||
| JP2010-276607 | 2010-12-13 | ||
| PCT/JP2011/078786 WO2012081573A1 (en) | 2010-12-13 | 2011-12-13 | Copper alloy and method for producing copper alloy |
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| CN103328665B true CN103328665B (en) | 2016-04-13 |
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| EP (1) | EP2653574B1 (en) |
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| TWI515313B (en) * | 2010-12-13 | 2016-01-01 | 日本精線股份有限公司 | A copper alloy fine wire and copper alloy spring and a method of making the same |
| JP5916964B2 (en) * | 2014-03-25 | 2016-05-11 | 古河電気工業株式会社 | Copper alloy sheet, connector, and method for producing copper alloy sheet |
| CN104532055A (en) * | 2014-11-21 | 2015-04-22 | 华南理工大学 | High nickel-content deformable aluminum white copper alloy material, and preparation method thereof |
| CN104711451B (en) * | 2015-01-30 | 2017-04-12 | 湖南科技大学 | High temperature oxidation and heat resistant copper-nickel-based alloy |
| JP5925936B1 (en) * | 2015-04-22 | 2016-05-25 | 日本碍子株式会社 | Copper alloy |
| EP3085799B1 (en) * | 2015-04-22 | 2018-01-17 | NGK Insulators, Ltd. | Copper alloy and method for manufacturing the same |
| CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
| CN105088008A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Microalloyed copper alloy frame strip and manufacturing method thereof |
| CN105316523A (en) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | Durable resistance alloy for milling machine regulator |
| DE102016006824A1 (en) | 2016-06-03 | 2017-12-07 | Wieland-Werke Ag | Copper alloy and its uses |
| CN108463568B (en) * | 2016-12-02 | 2020-11-10 | 古河电气工业株式会社 | Copper alloy wire rod and method for manufacturing copper alloy wire rod |
| KR102648370B1 (en) * | 2017-02-04 | 2024-03-15 | 마테리온 코포레이션 | Copper-nickel-tin alloy |
| JP6869119B2 (en) * | 2017-06-14 | 2021-05-12 | Ｄｏｗａメタルテック株式会社 | Cu-Ni-Al-based copper alloy plate material, manufacturing method, and conductive spring member |
| KR102450302B1 (en) * | 2017-06-22 | 2022-09-30 | 니폰 세이센 가부시키가이샤 | Copper alloy ultrafine wire for spring and manufacturing method thereof |
| CN107653384A (en) * | 2017-08-31 | 2018-02-02 | 宋宏婷 | A kind of preparation method of in-situ preparation nickel aluminide enhancing Cu-base composites |
| JP7202121B2 (en) | 2018-09-27 | 2023-01-11 | Ｄｏｗａメタルテック株式会社 | Cu-Ni-Al-based copper alloy plate material, manufacturing method thereof, and conductive spring member |
| JP7181768B2 (en) * | 2018-11-13 | 2022-12-01 | Ｄｏｗａメタルテック株式会社 | High Young's Modulus Cu--Ni--Al Copper Alloy Plate Material, Manufacturing Method Thereof, and Conductive Spring Member |
| CN110551917B (en) * | 2019-09-29 | 2021-07-09 | 广东和润新材料股份有限公司 | High-conductivity corrosion-resistant copper strip and preparation method thereof |
| CN115094266B (en) * | 2022-07-05 | 2023-06-27 | 中南大学 | High-strength conductive elastic copper alloy and preparation method thereof |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2851353A (en) * | 1953-07-15 | 1958-09-09 | Ibm | Copper-base alloys |
| GB2051127B (en) * | 1979-04-30 | 1983-01-26 | Delta Enfield Metals | Precipitation hardening copper alloys |
| US4378332A (en) * | 1981-06-15 | 1983-03-29 | Ford Motor Company | Aluminum hardened copper alloy |
| US4692192A (en) * | 1984-10-30 | 1987-09-08 | Ngk Insulators, Ltd. | Electroconductive spring material |
| JPH0238653B2 (en) * | 1986-01-27 | 1990-08-31 | Kobe Steel Ltd | PURASUCHITSUKUKANAGATAYODOGOKINOYOBISONOSEIZOHOHO |
| JPS63210247A (en) * | 1987-02-27 | 1988-08-31 | Sumitomo Metal Mining Co Ltd | High strength copper alloy |
| JPS63266033A (en) * | 1987-04-23 | 1988-11-02 | Mitsubishi Electric Corp | Copper alloy |
| JPH02179839A (en) * | 1988-12-29 | 1990-07-12 | Kobe Steel Ltd | High strength copper alloy having excellent impact resistance |
| JPH03126829A (en) * | 1989-10-06 | 1991-05-30 | Sumitomo Metal Mining Co Ltd | Non-pyrophoric copper alloy for tool |
| JPH03173730A (en) * | 1989-12-01 | 1991-07-29 | Sumitomo Metal Mining Co Ltd | Nonpyrophoric copper alloy for tool |
| JPH07116540B2 (en) * | 1990-08-03 | 1995-12-13 | 株式会社日立製作所 | Mold material for plastic molding |
| JPH05105978A (en) * | 1991-08-13 | 1993-04-27 | Mitsubishi Materials Corp | Precipitation strengthened type cu alloy excellent in strength at high temperature |
| JPH07268512A (en) * | 1994-03-30 | 1995-10-17 | Mitsubishi Materials Corp | Heat resisting copper alloy having excellent thermal conductivity, high-temperature hardness and oxidation resistance and firing mold consisting of such heat resisting copper alloy |
| JP3383615B2 (en) * | 1999-08-05 | 2003-03-04 | 日鉱金属株式会社 | Copper alloy for electronic materials and manufacturing method thereof |
| JP3465108B2 (en) | 2000-05-25 | 2003-11-10 | 株式会社神戸製鋼所 | Copper alloy for electric and electronic parts |
| JP4728704B2 (en) | 2005-06-01 | 2011-07-20 | 古河電気工業株式会社 | Copper alloy for electrical and electronic equipment |
| CN101166840B (en) * | 2005-02-28 | 2012-07-18 | 古河电气工业株式会社 | Copper alloy |
| JP4501818B2 (en) | 2005-09-02 | 2010-07-14 | 日立電線株式会社 | Copper alloy material and method for producing the same |
| JP4408275B2 (en) * | 2005-09-29 | 2010-02-03 | 日鉱金属株式会社 | Cu-Ni-Si alloy with excellent strength and bending workability |
| JP2007126739A (en) | 2005-11-07 | 2007-05-24 | Nikko Kinzoku Kk | Copper alloy for electronic material |
| JP2008266787A (en) | 2007-03-28 | 2008-11-06 | Furukawa Electric Co Ltd:The | Copper alloy material and its manufacturing method |
| JP4440313B2 (en) | 2008-03-31 | 2010-03-24 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr alloy for electronic materials |
| JP5225787B2 (en) * | 2008-05-29 | 2013-07-03 | Ｊｘ日鉱日石金属株式会社 | Cu-Ni-Si alloy plate or strip for electronic materials |
| JP5261122B2 (en) | 2008-10-03 | 2013-08-14 | Ｄｏｗａメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
| TWI515313B (en) * | 2010-12-13 | 2016-01-01 | 日本精線股份有限公司 | A copper alloy fine wire and copper alloy spring and a method of making the same |
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- 2011-12-13 US US13/993,642 patent/US20130333812A1/en not_active Abandoned
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| EP2653574A1 (en) | 2013-10-23 |
| EP2653574B1 (en) | 2017-05-31 |
| EP2653574A4 (en) | 2014-09-10 |
| KR101576715B1 (en) | 2015-12-10 |
| KR20130089661A (en) | 2013-08-12 |
| WO2012081573A1 (en) | 2012-06-21 |
| JPWO2012081573A1 (en) | 2014-05-22 |
| JP5743165B2 (en) | 2015-07-01 |
| US20130333812A1 (en) | 2013-12-19 |
| CN103328665A (en) | 2013-09-25 |
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