CN105088009A - Copper alloy frame strip and making method thereof - Google Patents
Copper alloy frame strip and making method thereof Download PDFInfo
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- CN105088009A CN105088009A CN201510441805.4A CN201510441805A CN105088009A CN 105088009 A CN105088009 A CN 105088009A CN 201510441805 A CN201510441805 A CN 201510441805A CN 105088009 A CN105088009 A CN 105088009A
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Abstract
The invention discloses a copper alloy frame strip. The copper alloy frame strip is composed of the following components including 6-7.8% of Ni, 0.15-0.2% of Si, 0.02-0.03% of Zr, 0.10-0.15% of Sn, 0.65-0.75% of Mg, 0.005-0.008% of Fe, 0.15-0.20% of Ag, 0.003-0.008% of P, 0.05-0.15% of Zn, 0.25-0.35% of Bi, 0.01-0.03% of Ti, 0.05-0.08% of Cr, 0.01-0.03% of In, 0.04-0.05% of B, 0.05-0.2% of rare earth elements and the balance Cu. The invention further discloses a making method of the copper alloy frame strip. By means of component optimization, rolling and refining of the heat processing regime, the obtained copper alloy strip is high in strength and electric conductivity, resistant to high-temperature softening temperature and excellent in corrosion resistance, and the requirements for frame strips used for large-scale and extremely-large-scale integrated circuits are met.
Description
Technical field
The present invention relates to copper alloy, particularly copper alloy framework band and preparation method thereof.
Background technology
Copper alloy frame material has high strength, high connductivity, low-thermal-expansion, platability and excellent processing characteristics etc., has huge market potential at the electronic applications such as unicircuit, semiconductor components and devices.Along with the development of large-scale integrated circuit and super large-scale integration, Electronic Packaging is to short, little, light, thin future development, and lead frame will to multioutlet, Small Distance future development.Therefore, copper alloy band obtains applying more widely.
Frame material not only will have high-performance, also requires the unrelieved stress of polar region.At present, frame material band mainly adopts founding, hot rolling, cold rolling, thermal treatment and the finishing technological process of production.After etching and processing is carried out in downstream, because band inside exists unrelieved stress, usually there is the metamorphism such as distortion, warpage in the strip product of high strength, causes the operations such as follow-up plating, encapsulation not carry out smoothly.
Along with electronics and IT products are to miniaturization, slimming, lightweight and intelligent direction development and unicircuit (IC) to extensive (LSI) and great scale (GSI) future development, the performance requriements of lead frame Cu alloy material is also more and more high, and corresponding to short, light, thin, high strength, the researchdevelopment of high precision direction.
Extensive and great scale integrated circuit manufacture has complex manufacturing technology, operating frequency superelevation, service rating super large, the large outstanding feature of Working environment exceedingly odious four, therefore very harsh to the requirement of its mechanical property, conductivity, heat conductivility, high temperature softening resistant performance, corrosion resisting property.At present, global development Copper Alloys for Lead Frame out reaches more than 120 and plants, and major families is Cu-Fe-P system, Cu-Ni-Si system, Cu-Cr-Zr system.The Cu-Fe-P system alloy with medium tenacity is first-generation lead frame copper alloy, there is good specific conductivity (being not less than 70%IACS), be that current circuit lead frame applies a wider Albatra metal-, but the integrated performance index such as its tensile strength (being not more than 550MPa) and high temperature resistance softening temperature (being not more than 400 DEG C) also can not meet the requirement of great scale integrated circuit high loading long-term stable operation far away.Cu-Cr-Zr system alloy has high strength & high electric-conduction and good heat-resistant stability, but Zr element is very easily oxidized, and such alloy quenching sensitive when prepared by band is strong, therefore its complex manufacturing, preparation cost are high, commercially and for being widely used.
Summary of the invention
The object of the invention is to by composition, rolling pattern and optimization of Heat Treatment Process provide a kind of there is high strength & high electric-conduction, high temperature resistance softening temperature and excellent corrosion resistance Multi-element copper alloy ribbon of material and preparation method, meet demand that is extensive and great scale integrated circuit lead frame band.
For reaching this object, the present invention by the following technical solutions:
One Albatra metal-frame strip material, consists of the following composition, Ni:6-7.8%; Si:0.15-0.2%; Zr:0.02-0.03%, Sn:0.10-0.15%, Mg:0.65-0.75%; Fe::0.005-0.008%; Ag:0.15-0.20%, P:0.003-0.008%, Zn:0.05-0.15%, Bi:0.25-0.35%, Ti:0.01-0.03%, Cr:0.05-0.08%, In:0.01-0.03%, B:0.04-0.05%, rare earth element: 0.05-0.2%, all the other are Cu.
Further, Ni:6.3%; Si:0.175%; Zr:0.025%, Sn:0.13%, Mg:0.68%; Fe::0.007%; Ag:0.185%, P:0.005%, Zn:0.09%, Bi:0.28%, Ti:0.015%, Cr:0.06%, In:0.02%, B:0.045%, rare earth element: 0.13%, all the other are Cu.
Further, described rare earth element is one or more in erbium, lanthanum, cerium, iridium, neodymium.
further,the method of the copper alloy framework band described in preparation, is characterized in that, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 900-1000 DEG C that hot rolling starts temperature, finishing temperature is 650-750 DEG C, and strip plate after rolling quenches with the speed of cooling of 20-35 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 40-60% draft; Then the copper alloy cold rolling processing obtained, at 750-780 DEG C, is incubated 25-35min; Then the cold rolling processing of 50-55% draft is carried out, subsequently soaking time 45-60min at 480-550 DEG C of temperature; Carry out the cold rolling processing of 40-60% draft again, subsequently soaking time 2-3h at 450-470 DEG C of temperature; Carry out the cold rolling of 40-45% draft again and be worked into desired thickness, finally at 410-430 DEG C of condition annealing 0.5-1h;
(4) interrupted aging:
First step ageing treatment: 350-380 DEG C, insulation 1-2h, stove is as cold as 280-320 DEG C, carries out second stage ageing treatment, insulation 1-2h, stove is as cold as 220-260 DEG C, carries out third stage ageing treatment, insulation 3-4h, stove is as cold as 160-200 DEG C, carry out fourth stage ageing treatment, insulation 12-24h, cold-water quench obtains copper alloy framework band afterwards.
Further: comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 980 DEG C that hot rolling starts temperature, finishing temperature is 660 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 770 DEG C, is incubated 30min; Then the cold rolling processing of 54% draft is carried out, subsequently soaking time 50min at 510 DEG C of temperature; Carry out the cold rolling processing of 55% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 43% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.6h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1.2h, stove is as cold as 285 DEG C, carries out second stage ageing treatment, insulation 1.8h, stove is as cold as 230 DEG C, carries out third stage ageing treatment, insulation 3.5h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 16h, cold-water quench obtains copper alloy framework band afterwards.
Effect of the present invention is: what the present invention proposed is a kind of copper alloy framework band of many alloying elements, by the cooperation of the optimization to composition, rolling technology and heat treating regime, copper alloy framework band of the present invention gained finished product under above-mentioned technique tensile strength reaches 850-1050Mpa, specific conductivity reaches 75-85%IACS, unit elongation is not less than 8%, softening temperature is not less than 580 DEG C, the performance requirement of large-scale integrated circuit lead frame Cu alloy material can be met preferably.The frame material band produced, in the etching, encapsulation process of downstream client, does not have the distortion such as warpage, distortion, meets the etch process requirement of high performance frame frame material, has that technique is simple, low cost, can realize the feature of suitability for industrialized production.
Embodiment
Embodiment 1
Copper alloy framework band, consists of the following composition (mass percent), Ni:6.7%; Si:0.18%; Zr:0.026%, Sn:0.14%, Mg:0.69%; Fe::0.007%; Ag:0.175%, P:0.006%, Zn:0.12%, Bi:0.29%, Ti:0.015%, Cr:0.06%, In:0.016%, B:0.045%, rare earth element: 0.12%, all the other are Cu, and described rare earth element is lanthanum and cerium.
Prepare the method for above-mentioned copper alloy framework band, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 970 DEG C that hot rolling starts temperature, finishing temperature is 680 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 760 DEG C, is incubated 30min; Then the cold rolling processing of 52% draft is carried out, subsequently soaking time 55min at 490 DEG C of temperature; Carry out the cold rolling processing of 50% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 42% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.7h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1h, stove is as cold as 290 DEG C, carries out second stage ageing treatment, insulation 1.5h, stove is as cold as 235 DEG C, carries out third stage ageing treatment, insulation 3.6h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 18h, cold-water quench obtains copper alloy framework band afterwards.
Embodiment 2
Copper alloy framework band, consists of the following composition (mass percent): Ni:6.3%; Si:0.175%; Zr:0.025%, Sn:0.13%, Mg:0.68%; Fe::0.007%; Ag:0.185%, P:0.005%, Zn:0.09%, Bi:0.28%, Ti:0.015%, Cr:0.06%, In:0.02%, B:0.045%, rare earth element: 0.13%, all the other are Cu, and described rare earth element is iridium and neodymium.
Prepare the method for above-mentioned copper alloy framework band, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 980 DEG C that hot rolling starts temperature, finishing temperature is 660 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 770 DEG C, is incubated 30min; Then the cold rolling processing of 54% draft is carried out, subsequently soaking time 50min at 510 DEG C of temperature; Carry out the cold rolling processing of 55% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 43% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.6h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1.2h, stove is as cold as 285 DEG C, carries out second stage ageing treatment, insulation 1.8h, stove is as cold as 230 DEG C, carries out third stage ageing treatment, insulation 3.5h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 16h, cold-water quench obtains copper alloy framework band afterwards.
Copper alloy framework band of the present invention gained finished product under above-mentioned technique tensile strength reaches 850-1050Mpa, specific conductivity reaches 75-85%IACS, unit elongation is not less than 8%, softening temperature is not less than 580 DEG C, the performance requirement of large-scale integrated circuit lead frame Cu alloy material can be met preferably.
Claims (5)
1. an Albatra metal-frame strip material, is characterized in that: consist of the following composition, Ni:6-7.8%; Si:0.15-0.2%; Zr:0.02-0.03%, Sn:0.10-0.15%, Mg:0.65-0.75%; Fe:0.005-0.008%; Ag:0.15-0.20%, P:0.003-0.008%, Zn:0.05-0.15%, Bi:0.25-0.35%, Ti:0.01-0.03%, Cr:0.05-0.08%, In:0.01-0.03%, B:0.04-0.05%, rare earth element: 0.05-0.2%, all the other are Cu.
2. copper alloy framework band as claimed in claim 1, is characterized in that: Ni:6.3%; Si:0.175%; Zr:0.025%, Sn:0.13%, Mg:0.68%; Fe:0.007%; Ag:0.185%, P:0.005%, Zn:0.09%, Bi:0.28%, Ti:0.015%, Cr:0.06%, In:0.02%, B:0.045%, rare earth element: 0.13%, all the other are Cu.
3. copper alloy framework band as claimed in claim 1, is characterized in that: described rare earth element is one or more in erbium, lanthanum, cerium, iridium, neodymium.
4. the method for the copper alloy framework band of preparation as described in claim 1-3, is characterized in that, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 900-1000 DEG C that hot rolling starts temperature, finishing temperature is 650-750 DEG C, and strip plate after rolling quenches with the speed of cooling of 20-35 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 40-60% draft; Then the copper alloy cold rolling processing obtained, at 750-780 DEG C, is incubated 25-35min; Then the cold rolling processing of 50-55% draft is carried out, subsequently soaking time 45-60min at 480-550 DEG C of temperature; Carry out the cold rolling processing of 40-60% draft again, subsequently soaking time 2-3h at 450-470 DEG C of temperature; Carry out the cold rolling of 40-45% draft again and be worked into desired thickness, finally at 410-430 DEG C of condition annealing 0.5-1h;
(4) interrupted aging:
First step ageing treatment: 350-380 DEG C, insulation 1-2h, stove is as cold as 280-320 DEG C, carries out second stage ageing treatment, insulation 1-2h, stove is as cold as 220-260 DEG C, carries out third stage ageing treatment, insulation 3-4h, stove is as cold as 160-200 DEG C, carry out fourth stage ageing treatment, insulation 12-24h, cold-water quench obtains copper alloy framework band afterwards.
5. method as claimed in claim 4, is characterized in that: comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 980 DEG C that hot rolling starts temperature, finishing temperature is 660 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 770 DEG C, is incubated 30min; Then the cold rolling processing of 54% draft is carried out, subsequently soaking time 50min at 510 DEG C of temperature; Carry out the cold rolling processing of 55% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 43% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.6h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1.2h, stove is as cold as 285 DEG C, carries out second stage ageing treatment, insulation 1.8h, stove is as cold as 230 DEG C, carries out third stage ageing treatment, insulation 3.5h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 16h, cold-water quench obtains copper alloy framework band afterwards.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105349819A (en) * | 2015-11-26 | 2016-02-24 | 山西春雷铜材有限责任公司 | Method for preparing high-strength high-conductivity copper alloy plate and strip |
| CN112322917A (en) * | 2020-10-16 | 2021-02-05 | 山西春雷铜材有限责任公司 | Preparation method of Cu-Cr-Si-Ti copper alloy plate strip |
| CN113308622A (en) * | 2021-04-14 | 2021-08-27 | 安徽金池新材料有限公司 | High-strength high-conductivity copper-nickel-silicon alloy material and preparation method thereof |
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