CN103155722B - 用于将大基板分割成更小的基板的方法和用于可控地选择性地沉积密封材料的方法 - Google Patents

用于将大基板分割成更小的基板的方法和用于可控地选择性地沉积密封材料的方法 Download PDF

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CN103155722B
CN103155722B CN201180035981.8A CN201180035981A CN103155722B CN 103155722 B CN103155722 B CN 103155722B CN 201180035981 A CN201180035981 A CN 201180035981A CN 103155722 B CN103155722 B CN 103155722B
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CN103155722A (zh
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D·瑞德尔
S·利埃尔
R·科尔塔伽-卡伽拉
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Not Rec Yin Ai Greensboro Co Ltd
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Abstract

一种技术包括:通过分解过程从一个或更多个较大的基板形成多个较小的基板,根据该分解过程在较小的基板之间存在某一在变化范围内的可能变化尺寸;以及,在所述分解过程之前,为所述一个或更多个较大的基板提供一个或更多个检测标记,该检测标记的尺寸和位置被选择为使得,无论较小的基板具有在所述变化范围内的什么实际尺寸,在分解过程之后每一个较小的基板都包括所述一个或更多个检测标记中的至少一个的一部分,所述一部分具有与该较小的基板的一个或更多个边缘的至少一部分重合的一个或更多个边缘。

Description

用于将大基板分割成更小的基板的方法和用于可控地选择性地沉积 密封材料的方法
技术领域
本发明涉及用于在制作电子设备(诸如电子地可控的显示设备)中检测基板的边缘的技术。
背景技术
电子消费品设备的制作典型地包括:在去除基板的周边部分之前处理基板的上表面,以便产生修剪的(trim)基板,将修剪的基板接合到例如带式载体封装体(tape carrier package,TCP),以及在修剪的基板的边缘部分处产生在修剪的基板与TCP的相对表面之间的封条(seal),以便保护位于更接近于修剪的基板的中心的元件。
已经通过参考图1中示出的种类的一组对准标记(也被用于制作过程中的其它步骤)控制密封材料的沉积的位置,来自动实现这些封条的提供。
发明内容
本发明人已经发现使用这种对准标记能够使得除需要密封材料的地方之外也沉积密封材料。
本发明的一个目的是,提供用于在制作电子设备中在修剪的基板的边缘处自动沉积密封材料的改进的技术,以及提供用于制作便于在修剪的基板的边缘处精确沉积密封材料的修剪的基板的技术。
本发明提供一种方法,其包括:通过分解过程从一个或更多个较大的基板形成多个较小的基板,根据该分解过程在较小的基板之间存在某一在变化范围内的可能变化尺寸;以及,在所述分解过程之前,为所述一个或更多个较大的基板提供一个或更多个检测标记,该检测标记的尺寸和位置被选择为使得,无论较小的基板具有在所述变化范围内的什么实际尺寸,在分解过程之后每一个较小的基板都包括所述一个或更多个检测标记中的至少一个的一部分,所述一部分具有与该较小的基板的一个或更多个边缘的至少一部分重合的一个或更多个边缘。
在一个实施例中,该方法还包括:通过根据去除过程去除各个较大的基板的边缘部分来从所述较大的基板形成所述较小的基板中的每一个,根据该去除过程在基板之间存在某一在变化范围内的在去除的边缘部分的尺寸方面的可能变化;以及,在所述去除过程之前,为每一个较大的基板提供一个或更多个检测标记,该检测标记的尺寸和位置被选择为使得,无论去除的边缘部分具有在所述变化范围内的什么实际尺寸,每一个检测标记的一部分都保持作为较小的基板的一部分并且具有与较小的基板的一个或更多个边缘的至少一部分重合的一个或更多个边缘。
在一个实施例中,检测标记的尺寸和位置被选择为使得,无论去除的边缘部分的在所述变化范围内的尺寸是什么尺寸,每一个检测标记的一部分都保持作为较小的基板的在所述较小的基板的拐角处的一部分,并且具有与较小的基板的限定所述拐角的一对边缘的至少一部分重合的一对边缘。
在一个实施例中,该方法还包括:将所述检测标记形成作为图案化的层的一部分,该图案化的层也限定用于电子器件的阵列的一层的导电元件。
在一个实施例中,该方法还包括:基于一个或更多个能检测的标记来控制在电子设备的基板的一个或更多个边缘处的密封材料的选择性沉积,每一个能检测的标记具有与基板的所述一个或更多个边缘中的至少一个的一部分重合的至少一个边缘。
在一个实施例中,每一个能检测的标记位于所述基板的拐角处,并且具有与所述基板的限定所述拐角的相应的一对边缘的一部分重合的一对边缘。
附图说明
在下面通过仅仅示例的方式参考附图提供了本发明的实施例的详细描述,在附图中:
图2示出密封材料的沉积以便提供修剪的基板的边缘部分与带式载体封装体之间的机械封条;
图3示出根据本发明实施例的在修剪的基板的拐角处提供检测标记;
图4示出根据本发明实施例的在未修剪的基板的拐角部分上提供新种类的检测标记的示例;以及
图5、图6和图7示出在修剪处理之后的基板,并且示出如何即使在基板修剪过程中存在一些变化图4的新的检测标记也具有与修剪的基板的拐角的边缘对准的部分。
具体实施方式
图2示出沉积树脂材料24以便在基板1与带式载体封装体10之间产生机械封条。衬底1是光学上透明的,并且在基板修剪处理之前,已经在它的正面上被设置有用来控制显示介质的操作的电子晶体管器件的阵列。电子晶体管器件的阵列和显示介质通常由块6指示,并且通过顶部包封(encapsulating)层26以及衬底1与顶部包封层26之间的边封(edge seal)28来保护。顶部包封层26和边封28为电子晶体管器件和显示介质提供环境保护以防止湿气和水汽进入。
在电子晶体管器件的阵列的一层处的导电元件(例如,电极、地址线)由通过光刻和刻蚀过程在衬底1上方的平坦化层上形成的图案化的Ti/Au双层限定。如上所述,在衬底1的周边部分被修剪掉之前形成该图案化的Ti/Au层。图案化的Ti/Au层还限定在电子晶体管器件中没有电子功能的标记。在图4中对于未修剪的基板的一个拐角部分示出这些标记。相同的一组标记也被提供在未修剪的基板的其它拐角部分中的每一个处。该标记包括:基准十字标线(fiducial cross)2;用于引导切掉衬底1的周边部分的处理的切割线9;以及方形标记4,下面解释其功能。
如上所述,在完成衬底1的上表面的处理之后(即在完成电子晶体管器件的阵列、显示介质、顶部包封层26和边封28等的形成之后),通过使用例如激光器、刀片或水喷射制作垂直的切口5、6来去除衬底1的周边部分。切割过程使用切割线9作为用于切口的引导标记。切割过程的性质使得垂直的切口5、6的实际位置可以在基板之间变化。例如,垂直的切口5、6可以正好与切割线9重合(如图4和图5所示),或者可以在可接受的公差范围内稍微偏离切割线9(如图6和图7所示)。
上述的方形标记4中的每一个被调整大小和定位为使得,在所述公差范围内无论在那里制作垂直的切口5、6,方形标记的部分7(该部分在下文中被称为拐角标记)都保持在修剪的基板1的各个拐角处,并且具有与修剪的基板1的限定各个拐角的两个边缘3对准的边缘。图2示出结果得到的在修剪的基板1的四个拐角中的每一个处提供上述的拐角标记7。
然后通过使用各向异性导电膜(ACF)接合物22将修剪的基板1的边缘部分的正面接合到带式载体封装体。接下来,沿着修剪的基板1的边缘3沉积树脂24以使得在修剪的基板1与带式载体封装体10之间提供机械封条,该机械封条用来保护ACF接合物22。通过使用在修剪的基板的拐角处的拐角标记7作为自动识别***通过其识别基板的边缘3的装置,来控制树脂沉积过程。光学检测器(未示出)检测拐角标记7,根据拐角标记7的外缘来识别基板的边缘3,并且将输入提供到用于调节树脂沉积针30的位置的控制器。光学检测器能够从修剪的基板1的后侧(背板)检测拐角标记7,因为衬底1由光学透明材料制成。
以上描述的技术有下列好处,即,即使在切割过程中存在一些变化和/或在基板的处理期间存在基板的一些失真也能够精确地检测修剪的基板的边缘的准确的位置。
为了便于检测拐角标记的自动化处理,采取以下手段:(i)方形标记全部具有相同的形状和尺寸;(ii)切割过程被设计为使得即使拐角标记7的尺寸存在一些变化,拐角标记7也全部具有方形或者矩形形状(这能够通过确保总是以彼此90度制作垂直的切口来实现);(iii)没有类似形状的标记被设置在基板上在形成拐角标记的方形标记附近;以及(iv)切割过程被设计为使得不存在拐角标记7的碎裂(chipping)。
我们已经针对将修剪的基板接合到TCP的示例描述了本发明的实施例,但是相同的实施例同样地适用于将修剪的基板接合到其它元件(诸如膜上芯片(COF)或者柔性印刷板(FPC))。
除了上面明确地提到的任何修改之外,对于本领域技术人员而言将明显的是可以在本发明范围内进行所描述的实施例的各种其它修改。

Claims (11)

1.一种通过由一个或更多个引导标记引导的分解过程从一个或更多个较大的基板形成多个较小的基板的方法;其中该分解过程是一种根据该分解过程可能会稍微偏离引导标记和在较小的基板之间存在尺寸上的在变化范围内的某一可能变化的分解过程;以及,其中所述方法包括,在所述分解过程之前,为所述一个或更多个较大的基板提供一个或更多个作为也限定所述一个或更多个引导标记的图案化的层的一部分的检测标记,其中检测标记的尺寸和位置被选择为使得,即使分解过程偏离了一个或更多个引导标记以及无论较小的基板具有在所述变化范围内的什么实际尺寸,每一个检测标记的一部分都保持作为较小的基板的在所述较小的基板的拐角处的一部分,并且具有与较小的基板的限定所述拐角的一对边缘的至少一部分重合的一对边缘。
2.根据权利要求1所述的方法,包括将所述检测标记形成作为图案化的层的一部分,该图案化的层也限定用于电子器件的阵列的一层的导电元件。
3.根据权利要求2所述的方法,也包括将所述引导标记形成作为所述图案化的层的一部分,该图案化的层也限定用于电子器件的阵列的一层的导电元件。
4.根据权利要求1-3中任一项所述的方法,包括基于所述一个或更多个检测标记来控制在较小的基板的一个或更多个边缘处的密封材料的沉积。
5.一种沿着电子设备的基板的一个或更多个侧边控制密封材料的选择性沉积的方法,其中所述一个或更多个侧边在所述密封材料的沉积前形成,并且基于一个或更多个能检测的标记来进行所述控制,每一个能检测的标记具有与基板的所述一个或更多个侧边中的至少一个的一部分重合的至少一个侧边。
6.根据权利要求5所述的方法,其中每一个能检测的标记位于所述基板的拐角处,并且具有与所述基板的限定所述拐角的相应的一对边缘的一部分重合的一对边缘,其中所述拐角和所述基板的所述一对边缘在所述密封材料的沉积前形成。
7.根据权利要求5所述的方法,其中基于一个或更多个能检测的标记来控制密封材料的选择性沉积的步骤包括使用所述一个或更多个能检测的标记来调节用于沉积所述密封材料的器件的位置。
8.根据权利要求5所述的方法,包括沉积所述密封材料使得,该密封材料围绕所述一个或更多个侧边从基板的一个表面延伸到基板的相对的表面。
9.根据权利要求5所述的方法,其中沿着所述一个或更多个侧边沉积密封材料的步骤在基板和接合到该基板的封装体之间提供机械封条。
10.根据权利要求9所述的方法,其中所述封装体是使用各向异性导电膜接合物接合到所述基板的带式载体封装体。
11.根据权利要求5-10中任一项所述的方法,包括通过使用所述一个或更多个能检测的标记来识别基板的所述一个或更多个侧边的位置。
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