JP4386929B2 - Tab用テープキャリアの製造方法 - Google Patents
Tab用テープキャリアの製造方法 Download PDFInfo
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- JP4386929B2 JP4386929B2 JP2007101287A JP2007101287A JP4386929B2 JP 4386929 B2 JP4386929 B2 JP 4386929B2 JP 2007101287 A JP2007101287 A JP 2007101287A JP 2007101287 A JP2007101287 A JP 2007101287A JP 4386929 B2 JP4386929 B2 JP 4386929B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000007639 printing Methods 0.000 claims description 79
- 238000007650 screen-printing Methods 0.000 claims description 57
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 30
- 238000001514 detection method Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000005022 packaging material Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
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- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Wire Bonding (AREA)
- Structure Of Printed Boards (AREA)
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Description
また、長尺状回路基板の搬送方向において印刷ステージの所定箇所に位置決めマークが位置することを検出することにより、その位置決めマークに対応する単位領域がスクリーン版の下方に位置することを検出することができる。それにより、長尺状回路基板の各単位領域をスクリーン版の下方により正確かつ容易に位置決めすることができる。
図1は本発明の一実施の形態に係るTAB用テープキャリアの上面図である。
以下、図1の実装部11についてさらに詳細に説明する。図2は図1のTAB用テープキャリア1の実装部11の拡大平面図である。
以下、セミアディティブ法を用いたTAB用テープキャリア1の製造方法を説明する。図3〜図5はTAB用テープキャリア1の製造方法を説明するための製造工程図である。
図6はロール・トゥー・ロール方式によるスクリーン印刷の方法を示す模式的断面図である。また、図7はスクリーン印刷時の長尺状回路基板10の位置決め方法を示す模式的平面図である。
本実施の形態に係るTAB用テープキャリア1の製造方法によれば、長尺状回路基板10の各印刷ブロック13がスクリーン印刷装置100のスクリーン版102の下方に正確に位置する状態でその印刷ブロック13の複数の実装部11にソルダレジストがスクリーン印刷される。
上記実施の形態では、本実施の形態では、図7に示すように、位置決めマークPM1の前端側の1辺が印刷ステージ101の前端縁に一致したときに長尺状回路基板10の各印刷ブロック13が印刷ステージ101に一致するように位置決めマークPM1が配置されるが、これに限定されない。
以下、請求項の各構成要素と実施の形態の各要素との対応の例について説明するが、本発明は下記の例に限定されない。
10 長尺状回路基板
11 実装部
12 配線パターン
13 印刷ブロック
30 長尺状基板
31 金属薄膜
32 めっきレジスト
33 導体層
34 無電解錫めっき層
100 スクリーン印刷装置
101 印刷ステージ
102 スクリーン版
103 スキージ
BIL ベース絶縁層
SOL ソルダレジスト
PM1,PM2 位置決めマーク
Claims (5)
- TAB用テープキャリアの製造方法であって、
長尺状の絶縁層上に配線パターンをそれぞれ含む複数の実装部を形成することにより長尺状回路基板を形成する工程と、
前記長尺状回路基板をロール・トゥー・ロール方式により搬送しつつ、前記長尺状回路基板の所定数の実装部を含む単位領域ごとに各実装部の配線パターンの所定領域にスクリーン印刷装置を用いてソルダレジストを形成する工程とを備え、
前記長尺状回路基板を形成する工程は、前記長尺状回路基板上の長手方向の少なくとも一方の側辺に沿う領域に各単位領域に対応する位置決めマークを形成する工程を含み、
前記ソルダレジストを形成する工程は、
前記長尺状回路基板の搬送中に位置決めマークを検出することにより、その位置決めマークに対応する単位領域が前記スクリーン印刷装置により印刷可能な領域に位置することを検出する工程と、
前記位置決めマークの検出に応答して前記長尺状回路基板の搬送を停止する工程と、
停止した前記長尺状回路基板における前記位置決めマークに対応する単位領域に前記スクリーン印刷装置によりソルダレジストをスクリーン印刷する工程と、
前記スクリーン印刷後に前記長尺状回路基板の搬送を再開する工程とを含み、
前記スクリーン印刷装置は、前記長尺状回路基板の前記絶縁層の裏面に設置される印刷ステージと、前記長尺状回路基板を挟んで前記印刷ステージに対向するように前記長尺状回路基板の前記複数の実装部側の面に設置されるスクリーン版とを備え、
前記スクリーン印刷装置により印刷可能な領域は、前記スクリーン版の下方の領域であり、
前記位置決めマークを形成する工程は、前記長尺状回路基板の搬送方向において前記印刷ステージの所定箇所に位置決めマークが位置する場合にその位置決めマークに対応する単位領域が前記スクリーン版の下方に位置するように各位置決めマークを設けることを含むことを特徴とするTAB用テープキャリアの製造方法。 - 前記位置決めマークを形成する工程は、各位置決めマークを前記長尺状回路基板の幅方向において各単位領域の少なくとも一方側に設けることを含むことを特徴とする請求項1記載のTAB用テープキャリアの製造方法。
- 前記印刷ステージの所定箇所は、前記印刷ステージの前端および後端の少なくとも一方であることを特徴とする請求項1または2記載のTAB用テープキャリアの製造方法。
- 前記検出する工程は、各位置決めマークを光学的に検出することを含むことを特徴とする請求項1〜3のいずれかに記載のTAB用テープキャリアの製造方法。
- 前記長尺状回路基板を形成する工程は、前記絶縁層上に導体層からなる配線パターンおよび位置決めマークを同時に形成することを含むことを特徴とする請求項1〜4のいずれかに記載のTAB用テープキャリアの製造方法。
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JP2007101287A JP4386929B2 (ja) | 2007-04-09 | 2007-04-09 | Tab用テープキャリアの製造方法 |
TW097112341A TWI425579B (zh) | 2007-04-09 | 2008-04-03 | 捲帶式自動接合(tab)用膠帶載體之製造方法 |
US12/062,573 US8037597B2 (en) | 2007-04-09 | 2008-04-04 | Manufacturing method of tape carrier for TAB |
KR1020080032560A KR101427428B1 (ko) | 2007-04-09 | 2008-04-08 | Tab용 테이프 캐리어의 제조 방법 |
CN200810096361.5A CN101286458B (zh) | 2007-04-09 | 2008-04-09 | Tab用带状载体的制造方法 |
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JP2007101287A JP4386929B2 (ja) | 2007-04-09 | 2007-04-09 | Tab用テープキャリアの製造方法 |
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JP (1) | JP4386929B2 (ja) |
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WO2007141852A1 (ja) * | 2006-06-07 | 2007-12-13 | Integrated Solutions Co., Ltd. | 露光方法および露光装置 |
KR101457939B1 (ko) | 2009-11-02 | 2014-11-10 | 엘지이노텍 주식회사 | 탭 테이프 및 그 제조방법 |
GB2481189B (en) * | 2010-06-04 | 2014-11-26 | Plastic Logic Ltd | Edge Detection in Reduced Substrates |
WO2014142389A1 (en) * | 2013-03-12 | 2014-09-18 | Samsung Techwin Co., Ltd. | Automatic carrier tape feeding apparatus |
KR101833312B1 (ko) * | 2013-05-06 | 2018-03-02 | 해성디에스 주식회사 | 리드 프레임 제조 방법 |
JP6901318B2 (ja) * | 2017-05-19 | 2021-07-14 | 株式会社三井ハイテック | リードフレームの製造方法および製造装置 |
CN110515273B (zh) * | 2019-08-26 | 2023-07-14 | 江苏上达半导体有限公司 | 一种cof卷带的生产及搬送方法 |
CN110797323A (zh) * | 2019-11-08 | 2020-02-14 | 江苏上达电子有限公司 | 一种cof卷带及其制造方法 |
US11973054B2 (en) * | 2021-05-06 | 2024-04-30 | Stroke Precision Advanced Engineering Co., Ltd. | Method for transferring electronic device |
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US600824A (en) * | 1898-03-15 | And marshall c | ||
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JPS5648198A (en) * | 1979-09-26 | 1981-05-01 | Matsushita Electric Ind Co Ltd | Method of manufacturing flexible printed circuit board |
JPH01256138A (ja) | 1988-04-06 | 1989-10-12 | Casio Comput Co Ltd | キャリアテープおよびその使用方法 |
US4980219A (en) * | 1988-04-06 | 1990-12-25 | Casio Computer Co., Ltd. | Carrier tape for bonding IC devices and method of using the same |
US5198857A (en) * | 1990-03-30 | 1993-03-30 | Ushio Denski Kabushiki Kaisha | Film exposure apparatus and method of exposure using the same |
JP2886675B2 (ja) | 1990-03-30 | 1999-04-26 | ウシオ電機株式会社 | フィルム露光装置およびフィルム露光方法 |
JP3536728B2 (ja) * | 1998-07-31 | 2004-06-14 | セイコーエプソン株式会社 | 半導体装置及びテープキャリア並びにそれらの製造方法、回路基板、電子機器並びにテープキャリア製造装置 |
JP3628273B2 (ja) | 2001-03-30 | 2005-03-09 | 三井金属鉱業株式会社 | 多条電子部品実装用フィルムキャリアテープの製造方法 |
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JP2007073863A (ja) | 2005-09-09 | 2007-03-22 | Seiko Epson Corp | 半導体装置の製造方法及びフレキシブル回路基板 |
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CN101286458B (zh) | 2011-06-08 |
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US20080244901A1 (en) | 2008-10-09 |
CN101286458A (zh) | 2008-10-15 |
TWI425579B (zh) | 2014-02-01 |
US8037597B2 (en) | 2011-10-18 |
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