CN103153526A - Laser cutter and slitter with same - Google Patents
Laser cutter and slitter with same Download PDFInfo
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- CN103153526A CN103153526A CN2011800481788A CN201180048178A CN103153526A CN 103153526 A CN103153526 A CN 103153526A CN 2011800481788 A CN2011800481788 A CN 2011800481788A CN 201180048178 A CN201180048178 A CN 201180048178A CN 103153526 A CN103153526 A CN 103153526A
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- laser
- polarizing coating
- cutting
- cutting device
- laser oscillator
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Polarising Elements (AREA)
Abstract
This laser cutter (10) is a device for cutting a polarizing film (6) by applying a laser beam (L6) thereto. The laser cutter (10) is provided with: a laser beam oscillator (1) for oscillating a laser beam (L1); a bend mirror (3) for reflecting the laser beam, which is oscillated by the laser beam oscillator (1), to the polarizing film (6); and a condenser lens (5) disposed between the polarizing film (6) and the bend mirror (3) and condensing a laser beam (L6). A beam splitter (4) through which the laser beam (L3) is transmitted and by which the laser beam (L3) is reflected is provided between the bend mirror (3) and the condenser lens (5).
Description
Technical field
The present invention relates to laser cutting device and have the cutting cutter of this device.
Background technology
Polarizing coating is widely used in liquid crystal board etc.In the past, in the manufacturing procedure of polarizing coating, what carry out was the hemisect of the polarizing coating that only polarizing coating in the laminate that comprises polarizing coating cut, or the end cut of polarizing coating etc.The cutting of polarizing coating is to cut with cutter, but is difficult to produce because of material to be cut the foreign matter of film bits etc.Sneaking into because of this foreign matter makes yield rate reduce in polarizing coating.
In addition, utilize in recent years laser cutting.When cutting with laser, compare with the cutting with cutter, be difficult to produce because of material to be cut the foreign matter of film bits etc.Can suppress the decline of yield rate whereby.Therefore, this cutting method is useful, and is developed out various methods (for example patent documentation 1,2).
Patent documentation 1: Japan's publication communique " JP 2008-302376 communique (on December 18th, 2008 is open) "
Patent documentation 2: Japan's publication communique " JP 2009-22978 communique (on February 5th, 2009 is open) "
Yet, adopt the above-mentioned polarizing coating cutting method of utilizing laser in the past, have in cutting and relatively produce the such problem of unfavorable condition in mobile polarizing coating.That is, when using the low power output side of laser, the problem of existence is, because the power output of laser is unstable, therefore can not carry out suitable cutting.
Below illustrate it.When cutting was transmitted next polarizing coating, cutting was to carry out when transmitting polarizing coating with certain speed basically.For production efficiency is improved, described certain speed is for example the high-speed of 50m/s left and right.Thereby, from improving the viewpoint of yield rate, even during the acceleration in the front and back of certain speed or when deceleration, also can carry out the cutting of polarizing coating.
In the stage of the large certain speed of the transfer rate of polarizing coating, the energy of the time per unit of the part of illuminated laser reduces.Thereby be necessary to increase the power output of the necessary laser of cutting.On the other hand, in the little stage, the energy of the time per unit of the part of illuminated laser increases in the transfer rate of polarizing coating.As a result, might act on due to the heat of surplus on the cut surface of polarizing coating and cause the deteriorated of quality.Therefore, be necessary to suppress the power output of laser.
When using the low power output side of laser for the power output that suppresses laser, there is the vibration of the laser unsettled problem that can become.Therefore, power output after adjustment may can not be shone the energy that is enough to cut polarizing coating producing swing, and, even in the little stage, also require not bring with stable output the laser cutting device of cut surface quality badness ground cutting polarizing coating in transfer rate.
In patent documentation 2, and such problem disclosed explicitly the relative moving speed that makes between machined object and laser and strengthened, and the laser processing that the irradiation number of times of laser is reduced.According to this technology, the problem that can avoid the increase of output power of the laser that the unstable output because of laser oscillator causes to cause etch depth to become dark.Yet the problem that exists in this technology is, is necessary to make the relative moving speed between machined object and laser to strengthen, and is difficult to be applicable in the little situation of relative velocity.
Summary of the invention
The present invention in view of above-mentioned in the past problem and do, its purpose is to provide the laser cutting device of the quality badness of can the be stable and cut surface that do not cause polarizing coating of the power output of laser beam.
Laser cutting device of the present invention for solving above-mentioned problem, is the laser cutting device that shines laser and cut to polarizing coating, it is characterized in that, comprising: the laser oscillator of oscillating laser; The speculum that the laser that laser oscillator is vibrated reflects to polarizing coating; And be disposed between polarizing coating and speculum, to the collector lens of described laser focusing, between described speculum and collector lens, be provided with the optical splitter of transmission and the described laser of reflection.
In laser cutting device of the present invention, be transmitted light and reverberation by optical splitter with the laser fork, and cut polarizing coating with transmitted light.Therefore no matter how large the power output of laser oscillator is, and the energy of the laser that shines polarizing coating is reduced.Its result is even the relative velocity between laser cutting device and polarizing coating hour also can use laser oscillator with high-output power.That is to say the stability of the advantage power output in the time of obtaining the high-output power side with laser oscillator.On the other hand, shine the energy of polarizing coating owing to being reduced by optical splitter, therefore the problem cut surface quality in the time of suppressing high-output power side with laser oscillator is deteriorated.
The effect of invention
As mentioned above, laser cutting device of the present invention comprises: the laser oscillator of oscillating laser; The speculum that will be reflected to polarizing coating by the laser of laser oscillator vibration; And be disposed between polarizing coating and speculum, and to the collector lens of described laser focusing, between above-mentioned speculum and collector lens, be provided with the optical splitter of transmission and the above-mentioned laser of reflection.
Therefore, even the relative velocity between laser cutting device and polarizing coating hour also can use laser oscillator with high-output power.That is to say the stability of the advantage power output in the time of obtaining the high-output power side with laser oscillator.On the other hand, expose to the energy of polarizing coating owing to lowering with optical splitter, therefore the deteriorated effect of the problem cut surface quality when receiving the high-output power side that can suppress with laser oscillator.
Description of drawings
Fig. 1 is the sectional view that laser cutting device of the present invention is shown.
Fig. 2 illustrates time t when transmitting polarizing coating and the curve map of the relation between power output w.
Fig. 3 is the sectional view that cutting cutter of the present invention is shown.
Fig. 4 is the top view that illustrates with the process of cutting cutter cutting polarizing coating of the present invention.
Fig. 5 illustrates the side view with the polarizing coating of comparative example 1 cutting with embodiment 1.
The specific embodiment
Illustrate that according to Fig. 1～Fig. 4 an example of the present invention is as follows.
[cutter sweep]
Fig. 1 is the sectional view that laser cutting device of the present invention is shown.Laser cutting device 10 comprises: laser oscillator 1, optical beam expander 2, speculum 3, optical splitter 4 and collector lens 5.
Laser oscillator 1 is the member of oscillating laser, does not do special restriction.For example, available CO
2Laser instrument (carbon dioxide laser), UV laser instrument, semiconductor laser, YAG laser instrument, EXIMA laser instrument etc.Especially high-output power and CO that the cutting of polarizing coating is fit to
2Laser instrument is comparatively desirable.
When the power output of laser oscillator 1 was hanged down, it is unstable that the power output of laser easily becomes.Therefore, power output is high for well.On the other hand, when power output is too high, because the thermal expansion of surplus etc. can produce the deteriorated of quality at the cut surface of polarizing coating.
The concrete power output of laser oscillator 1 is preferably the transfer rate of thickness according to polarizing coating 6, polarizing coating 6 and is appropriately adjusted by the transmission laser of optical splitter 4 described later and the ratio of reflector laser.From these points of view, the power output of laser oscillator 1 is that 30W is above, 400W is following for well.In addition, when the power output of laser oscillator 1 was low, power output was just unstable, specifically, when discontented 30W, just was in and became in unsettled tendency.
The frequency of the laser of irradiation should be done suitably change according to the power output of laser oscillator 1, the thickness of polarizing coating 6 and the transfer rate of polarizing coating etc., but more than general desirable 5kHz, below 100kHz.
As form preferably, laser cutting device 10 comprises optical beam expander 2.Optical beam expander 2 is laser to be widened into the member of collimated light beam, as long as use known optical beam expander just can.Utilize optical beam expander 2 diameter expansion of laser L1 can be for example 2 times～10 times left and right, form laser 2.In laser L6 is shone to polarizing coating 6, by the diameter of expansion of laser light, easily aim at the focus of laser L6.
Speculum 3 is members that the laser that laser oscillator 1 vibrates is reflected to polarizing coating 6.In laser cutting device 10, have a speculum 3, as long as but laser L2 can be made laser L3 to polarizing coating 6 reflection, have and a plurality ofly also have no relations.
The power output of the laser oscillator in general laser cutting device is described with Fig. 2.Fig. 2 is the curve map that the relation between the power output w of time t when transmitting polarizing coating and laser oscillator is shown.In the situation that cut when transmitting polarizing coating, at first, make polarizing coating accelerate (acceleration region), thereafter, be the certain speed (constant speed zone) that is suitable for cutting, polarizing coating is slowed down in (zone of slowing down), the cutting of polarizing coating finishes.
Speed because of polarizing coating in acceleration region and deceleration zone is little, if identical illuminate condition, the energy of the time per unit of polarizing coating is increased.Thereby, be necessary to reduce the power output of laser oscillator.Therefore, in the part in acceleration region and the zone of slowing down, the power output of laser oscillator is low, and the output of laser oscillator become unstable (unstable region).As a result, in acceleration region and deceleration zone, because the output of laser oscillator is unsettled, therefore may produce situation about not cutting off.Restriction as described above is arranged, adopt general laser cutting device, can not improve the power output of laser oscillator in acceleration region and deceleration zone.
On the other hand, in laser cutting device 10 of the present invention, between speculum 3 and collector lens 5, optical splitter 4 is arranged.Optical splitter 4 is members of transmission and the above-mentioned laser L3 of reflection, can use known optical splitter.Be as the laser L4 of transmitted light with as catoptrical laser L5 by optical splitter 4 with laser L3 fork.
The transmission laser of optical splitter 4 and the ratio of reflector laser, there is no particular limitation, appropriately adjusts but be preferably the power output according to above-mentioned laser oscillator 1, the thickness of polarizing coating 6 and the transfer rate of polarizing coating 6 etc.Generally, be more than 30W, when 400W is following in the power output of above-mentioned laser oscillator, the transmission laser of optical splitter and the ratio of reflector laser with 3: 7～7: 3 for well.Above-mentioned setting range, can use laser cutting device 10 suitably in the cutting of polarizing coating in this way.
In laser cutting device 10, laser L3 is transmitted light and reverberation by optical splitter 4 forks, and cuts polarizing coating 6 with transmitted light.Therefore, according to laser cutting device 10, no matter how large the power output of laser oscillator 1 is, and the energy of the laser L6 that exposes to polarizing coating 6 is lowered.That is to say, even laser oscillator 1 also can be used with high-output power in acceleration region and the zone of slowing down, and the stability exported of the advantage can obtain high-output power side with laser oscillator 1 time.On the other hand, be irradiated to the energy of polarizing coating because lowering with optical splitter 4, therefore the quality on the problem cut surface in the time of suppressing high-output power side with laser oscillator 1 is deteriorated.
Laser L4 is concentrated on polarizing coating 6 by collector lens 5.Collector lens 5 is not made particular determination, as long as just can with spherical lens, non-spherical lens etc.The optically focused diameter decision cutting width of reason laser L6 is therefore when the cutting polarizing coating, the optically focused diameter of laser L6 is that 5 μ m are above, 500 μ m are following for well, and is better more than 10 μ m, below 400 μ m.
As the polarizing coating 6 of the cutting object of laser cutting device 10, so long as just can with known polarizing coating.As the polarizing coating in the present invention, usually use the polarizing coating of long size, but the also polarizing coating of available short size or plate shape.So-called long size refers to that the length of the polarizing coating on cut direction is more than 10m, and so-called short size refers to above, the discontented 10m of 2m, and so-called plate shape refers to above, the discontented 2m of 10cm.
As polarizing coating 6; structure as follows specifically: applying TAC(Triafol T on the two sides of polarizer film) film, COP(cyclic olefin polymer) film etc. is as diaphragm, by bonding agent, protective film is pressed on respect to laser cutting device 10 as on the TAC film of reverse side.Among polarizing coating 6, as the polarization element film that is positioned at the center, can enumerate diaphragm with TAC etc. and fit to film on film of polyvinyl alcohol film being dyeed and stretches with iodine etc. etc.Again, also can use partially polymerized materialization polyvinyl alcohol mesentery, ethene-vinyl acetate base co-polymer pastern to divide polyenoid (Port リ エ Application) alignment film of hydrophilic macromolecule film of saponification film, cellulose mesentery etc. etc., the processed thing of polyvinyl alcohol or dehydrochlorination handled thing of polychlorostyrene ethene etc. etc., replace above-mentioned polyvinyl alcohol film.
Include the gross thickness of polarizing coating 6 and diaphragm, be not particularly limited, but more than desirable 100 μ m, below 500 μ m.Again, the thickness of the polarization element film in polarizing coating 6 is more than being generally 10 μ m, below 50 μ m.In addition, in unchallenged scope, also can contain again other layers beyond above-mentioned 3 layers in the practicality of polarizing coating 6.
As said protection film, also available polyester film, PET (Port リ エ チ レ Application テ レ Off タ ラ ー ト) film etc.As for thickness and the width of said protection film, there is no particular limitation, but from the viewpoint as the diaphragm of polarizing coating, the preferred thickness that for example 5 μ m are above, 50 μ m are following, the diaphragm of the width that 200mm is above, 1500mm is following of using.
The cutting of the polarizing coating 6 that carries out with laser cutting device 10 is to carry out in mobile laser cutting device 10 or polarizing coating 6.Can form cut surface on polarizing coating 6 thus.Specifically, can cut in mobile polarizing coating with cutting cutter described later.In fixed laser cutter sweep 10 and the situation of cutting with the state that transmits polarizing coating 6, can carry out stable cutting, be therefore suitable.
The what is called to polarizing coating in the present invention " cutting " refers to polarizing coating " a cutting part at least " also comprised the processing that polarizing coating is formed prescribed depth.For example, the cutting of the end of polarizing coating, hemisect, sign processing etc. are also contained in the behavior of " cutting ".
[cutting cutter]
Secondly, cutting cutter 20 of the present invention is described.Fig. 3 is the sectional view that cutting cutter 20 of the present invention is shown.Cutting cutter 20 comprises laser cutting device 10, unreels section 11, transfer roller 12,12a, 12b, 12c, 12d, 12e, " 12～12f " slightly below 12f(), linear measure longimetry meter 14, and reeling end 13a, 13b.
Between transfer roller 12b and transfer roller 12c, dispose laser cutting device 10.Like this, as long as being disposed between the section of unreeling 11 and reeling end 13 in this wise, laser cutting device 10 just can.About the structure of laser cutting device 10 as above-mentioned.
Reeling end 13a, 13b are the members that batches the polarizing coating 6 of cut processing.Section 11 is same with unreeling, and is provided with the not shown whirligig that makes reeling end 13a, 13b rotation in the side of reeling end 13a, 13b, makes reeling end 13a, 13b rotation by whirligig, and batch polarizing coating 6 on direction of transfer.The tension force that polarizing coating 6 is applied and the transfer rate of polarizing coating can be set by whirligig.In addition, can suitably adjust the height of reeling end 13a, 13b and position in the horizontal direction.
According to cutting cutter 20, transmit polarizing coating 6 with unreeling section 11 and reeling end 13a.The transfer rate of polarizing coating is not particularly limited, as an example, more than desirable 1m/s, below 100m/s.
Fig. 4 is the top view that the cutting process of polarizing coating 6 is shown.As shown in Fig. 4 (a)～(c), along with polarizing coating 6 is transmitted, utilize laser cutting device 10 to form otch S on polarizing coating 6.In Fig. 4, laser cutting device 10 is set with around the end of cutting polarizing coating 6.This is the situation of the end of cutting polarizing coating 6.The setting position of laser cutting device 10 is not done special restriction, as long as can shine laser on polarizing coating 6.For example, if laser cutting device 10 is set with the middle body of Ear Mucosa Treated by He Ne Laser Irradiation to polarizing coating 6, polarizing coating 6 can be divided into 2.
Because cutting cutter 20 of the present invention is provided with laser cutting device 10, therefore even when making polarizing coating 6 acceleration or deceleration, in the transfer rate of polarizing coating hour, also can use laser oscillator 1 with high-output power.As a result, the stability that the advantage in the time of obtaining high-output power side with laser oscillator 1 is exported.On the other hand, owing to lowering the energy that is irradiated on polarizing coating with optical splitter 4, therefore the quality on the cut surface of the problem polarizing coating in the time of suppressing high-output power side with laser oscillator 1 is deteriorated.
In addition, comprise following form in the present invention.
In laser cutting device of the present invention, the power output of above-mentioned laser oscillator be 30W above, below 400W, the transmission laser of above-mentioned optical splitter and the ratio of reflector laser be 3: 7～7: 3 for well.
The power output of above-mentioned laser oscillator is more than 30W, when 400W is following, if the ratio of the transmission laser of optical splitter and reflector laser is in above-mentioned scope, can be used in suitably in the cutting of polarizing coating so.
Again, in laser cutting device of the present invention, above-mentioned laser oscillator is CO
2Laser oscillator is for well.
CO
2Laser oscillator is high-output power, can be fit to the cutting of polarizing coating.
Again, cutting cutter of the present invention comprises the section that unreels that polarizing coating is unreeled and the reeling end that batches polarizing coating, disposes above-mentioned laser cutting device between section and reeling end above-mentioned unreeling.
Cutting cutter of the present invention is because comprising laser cutting device, therefore even hour also can use laser oscillator with high-output power in the transfer rate of polarizing coating.The stability of the advantage power output in the time of as a result, obtaining high-output power side with laser oscillator.On the other hand, because lowering the energy that shines on polarizing coating by optical splitter, therefore the quality on the cut surface of the problem polarizing coating in the time of suppressing high-output power side with laser oscillator is deteriorated.
In addition, the present invention does not limit each above-mentioned example, can carry out various changes in the scope shown in claim, the technological means that discloses respectively in the different example of relevant appropriate combination and the example that obtains is also included in the technical scope of the present invention.
Embodiment
[embodiment 1]
Implement the cutting of polarizing coating with the described cutting cutter 20 of Fig. 3.The structure of polarizing coating 6 is; press the order close to the collector lens 5 of laser cutting device 10; lamination PET film (38 μ m), adhesive linkage (22 μ m; adhesive linkage is peeled off together with protective layer), TAC film (80 μ m), polyvinyl alcohol film (30 μ m) and COP(cyclic olefin polymer) film (70 μ m) is as diaphragm, and on the COP film across adhesive linkage lamination PET film (38 μ m) as barrier film.
At first, utilize the whirligig unreel section 11 and reeling end 13a, make polarizing coating 6 from the static state of polarizing coating 6, after 5 seconds, accelerate to 50m/s.Make its accelerate to 50m/s during, implement the cutting of polarizing coating 6 with following condition.
Laser oscillator: CO
2Laser instrument
More than the power output of laser oscillator: 20W, below 280W
Optical maser wavelength: 9.4 μ m
Laser frequency: 20kHz
The optically focused diameter of L6: 54 μ m
Transmitted light and catoptrical ratio: 5: 5
[comparative example 1]
What optical splitter 4 had been removed in use from the laser cutting device 10 of cutting cutter 20 relatively implements the cutting of polarizing coating 6 with cutter sweep.The structure of polarizing coating 6 is identical with embodiment 1.Make similarly to Example 1 polarizing coating 6 accelerate to 50m/s.Again, the condition of cutting is as follows.
Laser oscillator: CO
2Laser instrument
More than the power output of laser oscillator: 10W, below 140W
Optical maser wavelength: 9.4 μ m
Laser frequency: 20kHz
The optically focused diameter of L6: 54 μ m
Fig. 5 illustrates the side view with the polarizing coating 6 of comparative example 1 cutting by embodiment 1.(a) of Fig. 5 is the polarizing coating 6 of embodiment 1, and Fig. 5 (b) is the polarizing coating 6 of comparative example 1.By both results as seen, the polarizing coating 6 of comparative example 1 produces distortion because of thermal expansion on its cross section.But also observe the block that generates because of thermal expansion on uppermost PET film.On the other hand, the polarizing coating 6 of embodiment 1 is different from comparative example 1, does not produce distortion on cut surface.And, do not generate block on uppermost PET film.According to cutting cutter of the present invention (laser cutting device), even the such transfer rate of 50m/s also can suppress the quality badness on the cut surface of polarizing coating, demonstrate significantly superiority of the present invention.
And, whether the cut surface of polarizing coating 6 is well tested.Test method is, peels off barrier film from the polarizing coating that cuts, and across adhesive linkage, the COP face attached on glass plate.If produce distortion on the COP film, bubble is sneaked between COP film and glass plate.Polarizing coating 6 after the cutting of embodiment 1 and comparative example 1 is tested, after attaching, do not observed bubble on the polarizing coating 6 of embodiment 1 and sneak into, but observe sneaking into of bubble after attaching on the polarizing coating 6 of comparative example 1.This is the result that causes because of the deformation state that plays the COP film of the 4th layer from above among polarizing coating 6.Also prove superiority of the present invention from this result.
Industrial utilizability
Laser cutting device of the present invention is to can be used as the device that cuts suitably polarizing coating.Therefore, the present invention can be used in the field of using polarizing coating widely.
The explanation of symbol
1 laser oscillator 2 optical beam expander 3 speculum 4 optical splitters
5 collector lens 6 polarizing coating 10 laser cutting devices 11 unreel section
12,12a, 12b, 12c, 12d, 12e, 12f transfer roller 13a, 13b reeling end
14 linear measure longimetry meter 20 cutting cutter L1～L6 laser S otch.
Claims (4)
1. a laser cutting device, be the laser cutting device that polarizing coating is shone laser and cuts, it is characterized in that,
Comprise:
The laser oscillator of oscillating laser;
Will be by the laser reflection of the laser oscillator vibration speculum to polarizing coating; And
Be disposed at collector lens between polarizing coating and speculum, that described laser is carried out optically focused,
Between described speculum and collector lens, be provided with the optical splitter of transmission and the described laser of reflection.
2. laser cutting device as claimed in claim 1, is characterized in that,
The power output of described laser oscillator is more than 30W, below 400W,
The ratio that the laser of described optical splitter is carried out transmission and reflection is 3: 7～7: 3.
3. laser cutting device as claimed in claim 1, is characterized in that,
Described laser oscillator is CO
2Laser oscillator.
4. a cutting cutter, is characterized in that,
Comprise the section that unreels that polarizing coating is unreeled and the reeling end that batches polarizing coating,
Unreel between section and reeling end described, be provided with the described laser cutting device of any one in claim 1～3.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010226778A JP5800486B2 (en) | 2010-10-06 | 2010-10-06 | Laser cutting apparatus, slitter machine equipped with the same, and laser cutting method |
| JP2010-226778 | 2010-10-06 | ||
| PCT/JP2011/071924 WO2012046587A1 (en) | 2010-10-06 | 2011-09-26 | Laser cutter and slitter with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103153526A true CN103153526A (en) | 2013-06-12 |
| CN103153526B CN103153526B (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180048178.8A Active CN103153526B (en) | 2010-10-06 | 2011-09-26 | Laser cutting device and there is the cutting cutter of this device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5800486B2 (en) |
| KR (2) | KR20170045376A (en) |
| CN (1) | CN103153526B (en) |
| TW (1) | TWI501829B (en) |
| WO (1) | WO2012046587A1 (en) |
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| CN112277389A (en) * | 2019-07-25 | 2021-01-29 | 林紫绮 | Paper tube manufacturing method for increasing stiffness of tube and paper tube structure thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6020884B2 (en) * | 2012-05-31 | 2016-11-02 | 住友化学株式会社 | Laser processing method |
| KR101817388B1 (en) | 2014-09-30 | 2018-01-10 | 주식회사 엘지화학 | Cutting method for the polarizing plate, polarizing plate cut usuing the same |
| CN111386172B (en) * | 2017-11-27 | 2022-06-17 | 日东电工株式会社 | Laser processing method for plastic film and plastic film |
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| WO2012046587A1 (en) | 2012-04-12 |
| JP2012076143A (en) | 2012-04-19 |
| KR20130106847A (en) | 2013-09-30 |
| CN103153526B (en) | 2016-01-20 |
| KR20170045376A (en) | 2017-04-26 |
| JP5800486B2 (en) | 2015-10-28 |
| TWI501829B (en) | 2015-10-01 |
| TW201221262A (en) | 2012-06-01 |
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