CN102832205B - In-line small bridge rectifier - Google Patents
In-line small bridge rectifier Download PDFInfo
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- CN102832205B CN102832205B CN201110161681.6A CN201110161681A CN102832205B CN 102832205 B CN102832205 B CN 102832205B CN 201110161681 A CN201110161681 A CN 201110161681A CN 102832205 B CN102832205 B CN 102832205B
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Abstract
The invention discloses an in-line small bridge rectifier. The in-line small bridge rectifier comprises a packaging body, two supporting sheets arranged in the packaging body, two connecting sheets, four diode chips, and four lead wires extended from the packaging body, wherein the whole packaging body is of a strip structure; the four diode chips are arranged in a row; the four lead wires are arranged in parallel in a row, extend from the packaging body and are parallel to the normal directions of the four diode chips; and the four lead wires are fixedly connected with the two supporting sheets and the two connecting sheets to form anode and cathode output ends and an alternating-current input end of the bridge rectifier. According to the in-line small bridge rectifier, the lead wires are configured to be parallel to the normal directions of the diode chips, so that smaller space is occupied on a welding mould during assembling, the number of bridge rectifiers welded on the same welding mould is increased, the production efficiency is improved, the cost is reduced, and meanwhile, an angular position is convenient to adjust.
Description
Technical field
The present invention relates to rectistack, particularly relate to a kind of inline-type minitype bridge rectifiers of AC-DC.
Background technology
The bridge architecture that bridge rectifier is made up of four rectifier diodes, it utilizes the unilateal conduction characteristic of diode to carry out rectification to alternating current, double than halfwave rectifier because bridge rectifier obtains utilization ratio to input sine wave, be that the one of diode halfwave rectifier is significantly improved, therefore be widely used in alternating current and convert in galvanic circuit.
Along with electronic product develops to miniaturization, require that the profile of semi-conductor electronic device is done not only little but also thin.Current minimize bridge heap is mainly divided into two classes, and a class is direct insertion bridge heap, and another kind is SMD bridge heap.
For direct insertion bridge heap, more typical structure has following several at present:
1, Chinese patent ZL97247861.2 disclosed a kind of " single rangement vertical full-wave bridge-type rectistack " by name, it comprises by terminal pin A, B, C, D, unilateal conduction chip, plastic shell and limit contact pin E, F.Have unilateal conduction chip or transition plate at terminal pin and brace intersection clamping, packing weld tabs between unilateal conduction chip or transition plate and terminal pin, limit contact pin, terminal pin and brace form one-way conduction circuit by unilateal conduction chip.Although it forms bridge rectifier, but also there is following shortcoming: 1) in this rectistack because terminal pin directly extends in plastic shell, and unilateal conduction chip is sandwiched between terminal pin and brace, chip is made to concentrate on the middle part of plastic shell, the skewness of its chip, thus the heat produced when causing rectistack to use concentrates on the middle part of plastic shell, makes heat be difficult to leave, thus easily cause chip to damage because heat is excessive, the useful life of rectistack is shortened greatly; 2) and brace includes three construction sections, its install very trouble and also time-consuming, and owing to can recognize in above-mentioned rectistack structure, its chip polarity is towards disunity, and thus its assembling is difficult, and it is unreliable to weld, time-consumingly to take a lot of work, cause direct result to be that assembling and soldering reliability decline, qualification rate reduces, cost increase.
2, single in-line full wave rectifier bridge stack disclosed in Chinese patent Authorization Notice No. CN2901580Y, it comprises insulation crust, be fixed on the framework of insulation crust inside, terminal pin, conductive chip and brace thereof are formed, framework is by a left side, right interchange input frame and a left side, right rectification output box is formed, the both upper ends thereof of left interchange input frame is respectively equipped with conductive chip, the top of right interchange input frame extends to the interstitial site between the conductive chip of left interchange input frame, left, right rectification output box is placed in a left side respectively, the below on right interchange input frame top, right interchange input frame top is respectively equipped with for brace solid welding first, two weld fixation parts, a left side below it, right rectification output box is fixed with conductive chip, conductive chip is by brace and first, two weld fixation parts connect, left, right rectification output box is respectively equipped with the 3rd, four weld fixation parts, and be connected with the conductive chip on left interchange input frame by brace.Although this patent has good heat dissipation effect, long service life, assembles advantage simply and easily, but because its conductive chip becomes parastate with terminal pin, put on weld mold during assembling and take more space, the bridge heap negligible amounts causing same weld mold to weld, makes production effect to improve.And in order to enhance productivity, need again to prepare larger mould, cause weld mold manufacturing cost to rise.Disclosed in this patent another, bridge heap solder joint is more, easily occurs quality accident.
3, a kind of single in-line full wave rectifier bridge stack disclosed in Fig. 1, it comprises the lead-in wire 2 that two roughly become L shape, 3 and two straight wires 1, two straight wires 1 are located at the lead-in wire 2 that two roughly become L shape, below 3, two straight wires 1 roughly become the lead-in wire 2 of L shape with two, four conductive chips are welded with between 3, although the single in-line full wave rectifier bridge stack shown in Fig. 1 solves the many problems of solder joint, but due to its conductive chip and straight wire 1, roughly become the lead-in wire 2 of L shape, the terminal pin of 3 becomes parastate, put on weld mold during assembling and take more space, the bridge heap negligible amounts causing same weld mold to weld, production effect cannot be improved.And in order to enhance productivity, need again to prepare larger mould, cause weld mold manufacturing cost to rise.
For SMD bridge heap, more typical structure has following several at present:
1, a kind of miniature semiconductor rectifier bridge disclosed in Chinese invention patent publication number CN 1197989, it comprises two diode crystal grain of N-type altogether and has two diode crystal grain of P type altogether, wherein altogether a corresponding N-type region system of a p type island region of N-type crystal grain P type crystal grain is together connected to a terminal electrode of first group of lead frame, altogether another p type island region of N-type crystal grain then together another N-type region of P type crystal grain be connected to the another terminal electrode of first group of lead frame, and altogether the p type island region of the N-type region of N-type crystal grain P type crystal grain together is then connected to the two-terminal electrode of second group of lead frame respectively, thus form a bridge rectifier, although this miniature rectifier is structurally conducive to microminiaturization, but manufacture needs the double diode chip of employing two kinds, i.e. N-type double diode chip and altogether P type double diode chip altogether, easily cause following problem: 1) acp chip is wide in variety, complex process shape increases, 2) chip yield is relatively low, 3) owing to there are two chip kinds, uniformity is poor, 4) chip of P type substrate relatively difficulty do.
2, sheet type miniature bridge stack disclosed in Chinese invention patent Authorization Notice No. CN2545706Y, it is in a packaging body, bridge rectifier is formed by four rectifier diodes, four rectifier diodes are made up of identical PN junction chip, four PN junction chips spatially two and be listed in, another two and be listed in down, p type island region and the N-type region of each PN junction chip are arranged up and down, wherein the p type island region of diagonal position PN junction chip is identical with N-type region orientation, a connecting piece is adopted to connect respectively between two the PN junction chips repeatedly put up and down, and be listed in and two PN junction chips under being listed in adopt another brace to be connected respectively, two braces on intermediate layer are as one group of electrode terminal, two braces on the upper and lower organize electrode terminal as another, and draw in packaging body respectively, miniature five layers of rectifier bridge stack structure are formed with this.Because this patent adopts five-layer structure, the thickness of its product is generally at about 2.5 ~ 2.7mm, not only occupy the accommodation space that electronic product is inner many, and be arranged so that the processing step of bridge heap production and processing increases due to sandwich construction, location is installed to each layer parts simultaneously and proposes higher requirement.
3, a kind of thin soldering type commutation bridge stack disclosed in Chinese patent Authorization Notice No. CN201181702, the epoxy packages body inside of this rectifier bridge stack is made up of two bump contacted chips, four diode chip for backlight unit and two block frame support chips, in a thickness direction, brace, diode chip for backlight unit, frame supported sheet lay respectively at upper, middle and lower-ranking, in top plan view, the first brace is fixedly connected with the positive terminal of first, second diode chip for backlight unit; The negative pole end of the second brace and the 3rd, the 4th diode chip for backlight unit is fixedly connected with; First frame supported sheet is fixedly connected with the positive terminal of the 4th diode chip for backlight unit with the negative pole end of the first diode chip for backlight unit, second frame supported sheet is fixedly connected with the positive terminal of the 3rd diode chip for backlight unit with the negative pole end of the second diode chip for backlight unit, pin on first brace is as cathode output end, pin on second brace is as cathode output end, and the pin on two block frame support chips is as ac input end.The shortcoming that this patent exists is: 1) structure of two bump contacted chips is not identical, the structure of two block frame support chips is not identical, and the structure of lead-in wire is not identical yet, therefore the part of more than at least 5 kinds is needed could to assemble with crystal grain, and the part developing more than 5 kinds needs the mould of more than 5 kinds, cause manufacturing cost higher, production management is complicated; 2) the positive negative placement of two crystal grain one on a block frame support chip, causes crystal grain put procedure complicated, adds the difficulty of technique.
Summary of the invention
Technical problem to be solved by this invention is to provide for the problem existing for above-mentioned rectifier bridge stack a kind of easy to assembly, good heat dissipation effect, volume are little, position, angle is easy to adjust inline-type minitype bridge rectifiers.
Technical problem to be solved by this invention can be achieved through the following technical solutions:
Inline-type minitype bridge rectifiers, comprises a packaging body and is arranged on two pieces of support chips in packaging body, two bump contacted chips, four diode chip for backlight unit and by four lead-in wires extended out in described envelope shape body, on bridge heap thickness direction, two bump contacted chips are positioned at upper strata, and four diode chip for backlight unit are positioned at intermediate layer, and two pieces of support chips are positioned at lower floor, in the top plan view of bridge heap, each block support chip is fixedly connected with two diode chip for backlight unit, and each bump contacted chip is fixedly connected with each diode chip for backlight unit on two pieces of support chips respectively, it is characterized in that, whole packaging body structure into strips, described four diode chip for backlight unit layouts in a row, described four lead-in wires are parallel in a row by extending out in described envelope shape body and be arrangeding in parallel with the normal direction of four diode chip for backlight unit, described four lead-in wires are fixedly connected with two bump contacted chips with two pieces of support chips respectively and form bridge and just piling, cathode output end and ac input end.
In a preferred embodiment of the invention, described two pieces of support chips lay respectively at the two ends in described packaging body, two that are fixedly connected with two pieces of support chips go between and lay respectively at the two ends of described packaging body simultaneously, and other two lead-in wires be fixedly connected with described two bump contacted chips are respectively positioned at the centre of packaging body.
In a preferred embodiment of the invention, described two pieces of support chips are disposed immediately in the centre in described packaging body, two that are fixedly connected with two pieces of support chips go between and lay respectively at the centre of described packaging body simultaneously, and other two lead-in wires be fixedly connected with described two bump contacted chips respectively lay respectively at the two ends of packaging body.
In a preferred embodiment of the invention, two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, third, fourth lead-in wire, four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, wherein the positive terminal of first, second diode chip for backlight unit is fixedly connected with the first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the second support chip; First brace is fixedly connected with the positive terminal of the 3rd diode chip for backlight unit with the negative pole end of the first diode chip for backlight unit, second brace is fixedly connected with the positive terminal of the 4th diode chip for backlight unit with the negative pole end of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with the first brace, second lead-in wire is fixedly connected with the second brace, first and second lead-in wire is as ac input end, 3rd lead-in wire is fixedly connected with formation cathode output end with the first support chip, and the 4th lead-in wire is fixedly connected with as cathode output end with the second support chip.
In a preferred embodiment of the invention, two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, third, fourth lead-in wire, four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, wherein the negative pole end of first, second diode chip for backlight unit is fixedly connected with the first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the second support chip; First brace is fixedly connected with the negative pole end of the 3rd diode chip for backlight unit with the positive terminal of the first diode chip for backlight unit, second brace is fixedly connected with the negative pole end of the 4th diode chip for backlight unit with the positive terminal of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with the first brace, second lead-in wire is fixedly connected with the second brace, first and second lead-in wire is as ac input end, 3rd lead-in wire is fixedly connected with formation cathode output end with the first support chip, and the 4th lead-in wire is fixedly connected with as cathode output end with the second support chip.
In a preferred embodiment of the invention, two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, third, fourth lead-in wire, four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, wherein the positive terminal of the first diode chip for backlight unit is fixedly connected with the first support chip with the negative pole end of the second diode chip for backlight unit, and the positive terminal of the 3rd diode chip for backlight unit is fixedly connected with the second support chip with the negative pole end of the 4th diode chip for backlight unit; First brace is fixedly connected with the negative pole end of the 3rd diode chip for backlight unit with the negative pole end of the first diode chip for backlight unit, second brace is fixedly connected with the positive terminal of the 4th diode chip for backlight unit with the positive terminal of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with as cathode output end with the first brace, second lead-in wire is fixedly connected with as cathode output end with the second brace, and third and fourth lead-in wire is as ac input end.
In a preferred embodiment of the invention, two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, third, fourth lead-in wire, four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, wherein the negative pole end of the first diode chip for backlight unit is fixedly connected with the first support chip with the positive terminal of the second diode chip for backlight unit, and the negative pole end of the 3rd diode chip for backlight unit is fixedly connected with the second support chip with the positive terminal of the 4th diode chip for backlight unit; First brace is fixedly connected with the positive terminal of the 3rd diode chip for backlight unit with the positive terminal of the first diode chip for backlight unit, second brace is fixedly connected with the negative pole end of the 4th diode chip for backlight unit with the negative pole end of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with as cathode output end with the first brace, second lead-in wire is fixedly connected with as cathode output end with the second brace, and third and fourth lead-in wire is as ac input end.
In a preferred embodiment of the invention, the structure of described two bump contacted chips is identical, and the structure of two pieces of support chips is identical, and the structure of four lead-in wires is identical.
The present invention, due to lead-in wire is arranged to the normal direction parallel direction with diode chip for backlight unit, puts during assembling and takies less space on weld mold, and the bridge heap quantity that same weld mold is welded is more, improves production efficiency, reduces cost; Spacing simultaneously between four lead-in wires can adjust as required, makes position, angle easy to adjust, need not increase accessory in addition.Moreover due to two pieces of support chips, two bump contacted chips, four diode chip for backlight unit employing layering tilings, can realize automated production, reduce the thickness of bridge heap, save sizing material, the volume making bridge pile is less, and weight is lighter simultaneously.Diode chip for backlight unit is directly welded on support chip and brace by the present invention, need not wire jumper, simultaneously good heat dissipation effect.The present invention also has an important feature, be exactly because the structure of described two bump contacted chips is identical, the structure of two pieces of support chips is identical, the structure of four lead-in wires is identical, therefore only need production three kinds of parts, just can be assembled into a bridge with crystal grain and pile, save die cost, reduce cost, also simplify production management simultaneously.
Accompanying drawing explanation
Fig. 1 is the internal structure schematic diagram of existing single in-line full wave rectifier bridge stack.
Fig. 2 is the structural representation of the embodiment of the present invention 1.
Fig. 3 is the structural representation of the embodiment of the present invention 2.
Fig. 4 is the structural representation of the embodiment of the present invention 3.
Fig. 5 is the structural representation of the embodiment of the present invention 4.
Fig. 6 is the structural representation of the embodiment of the present invention 5.
Fig. 7 is the structural representation of the embodiment of the present invention 6.
Fig. 8 is the structural representation of the embodiment of the present invention 7.
Fig. 9 is the structural representation of the embodiment of the present invention 8.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete drawings and Examples, setting forth the present invention further.
Embodiment 1
See Fig. 2, inline-type minitype bridge rectifiers shown in figure, comprise a packaging body 100 and be arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100, two bump contacted chip 310,320 structures are identical, become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
Bridge heap top plan view on, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the two ends of packaging body 100, between leave one section of room; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the positive terminal of diode chip for backlight unit 520 with the positive terminal of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the negative pole end of diode chip for backlight unit 540 with the negative pole end of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the negative pole end of diode chip for backlight unit 510, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the negative pole end of diode chip for backlight unit 520, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320, lead-in wire 610,620 forms the ac input end of bridge heap, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210 cathode output end piled as bridge, and the ailhead of 640 stiff ends that go between is fixedly connected with support chip 220 cathode output end piled as bridge.Lead-in wire 610,620 as ac input end lays respectively at packaging body 100 centre position, and the lead-in wire 630,640 as positive and negative electrode output is positioned at the two ends of packaging body 100.
Embodiment 2
See Fig. 3, inline-type minitype bridge rectifiers shown in figure, comprise a packaging body 100 and be arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100, two bump contacted chip 310,320 structures are identical, become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
Bridge heap top plan view on, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the two ends of packaging body 100, between leave one section of room; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the negative pole end of diode chip for backlight unit 520 with the negative pole end of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the positive terminal of diode chip for backlight unit 540 with the positive terminal of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the positive terminal of diode chip for backlight unit 510, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the positive terminal of diode chip for backlight unit 520, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320, lead-in wire 610,620 forms the ac input end of bridge heap, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210 cathode output end piled as bridge, and the ailhead of 640 stiff ends that go between is fixedly connected with support chip 220 cathode output end piled as bridge.Lead-in wire 610,620 as ac input end lays respectively at packaging body 100 centre position, and the lead-in wire 630,640 as positive and negative electrode output is positioned at the two ends of packaging body 100.
Embodiment 3
See Fig. 4, inline-type minitype bridge rectifiers shown in figure, comprise a packaging body 100 and be arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100, two bump contacted chip 310,320 structures are identical, become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
Bridge heap top plan view on, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the two ends of packaging body 100, between leave one section of room; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the positive terminal of diode chip for backlight unit 520 with the negative pole end of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the positive terminal of diode chip for backlight unit 540 with the negative pole end of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the positive terminal of diode chip for backlight unit 510, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the negative pole end of diode chip for backlight unit 520, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310 cathode output end piled as bridge, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320 cathode output end piled as bridge, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210, the ailhead of 640 stiff ends of going between is fixedly connected with support chip 220, and lead-in wire 630,640 forms the ac input end of bridges heap.Lead-in wire 630,640 as ac input end lays respectively at the two ends of packaging body 100, and the lead-in wire 610,620 as positive and negative electrode output is positioned at the centre position of packaging body 100.
Embodiment 4
See Fig. 5, inline-type minitype bridge rectifiers shown in figure, comprise a packaging body 100 and be arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100, two bump contacted chip 310,320 structures are identical, become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
Bridge heap top plan view on, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the two ends of packaging body 100, between leave one section of room; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the negative pole end of diode chip for backlight unit 520 with the positive terminal of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the negative pole end of diode chip for backlight unit 540 with the positive terminal of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the negative pole end of diode chip for backlight unit 510, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the positive terminal of diode chip for backlight unit 520, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310 cathode output end piled as bridge, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320 cathode output end piled as bridge, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210, the ailhead of 640 stiff ends of going between is fixedly connected with support chip 220, and lead-in wire 630,640 forms the ac input end of bridges heap.Lead-in wire 630,640 as ac input end lays respectively at the two ends of packaging body 100, and the lead-in wire 620,610 as positive and negative electrode output is positioned at the centre position of packaging body 100.
Embodiment 5
See Fig. 6, inline-type minitype bridge rectifiers shown in figure, comprises a packaging body 100 and is arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100.Two bump contacted chip 310,320 structures are identical, and become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, and the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
In the top plan view of bridge heap, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the centre position of packaging body 100; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the positive terminal of diode chip for backlight unit 520 with the positive terminal of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the negative pole end of diode chip for backlight unit 540 with the negative pole end of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the negative pole end of diode chip for backlight unit 510, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the negative pole end of diode chip for backlight unit 520, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320, lead-in wire 610,620 forms the ac input end of bridge heap, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210 cathode output end piled as bridge, and the ailhead of 640 stiff ends that go between is fixedly connected with support chip 220 cathode output end piled as bridge.Lead-in wire 610,620 as ac input end lays respectively at the two ends of packaging body 100, and the lead-in wire 630,640 as positive and negative electrode output is positioned at the centre position of packaging body 100.
Embodiment 6
See Fig. 7, inline-type minitype bridge rectifiers shown in figure, comprises a packaging body 100 and is arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100.Two bump contacted chip 310,320 structures are identical, and become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, and the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
In the top plan view of bridge heap, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the centre position of packaging body 100; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the negative pole end of diode chip for backlight unit 520 with the negative pole end of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the positive terminal of diode chip for backlight unit 540 with the positive terminal of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the positive terminal of diode chip for backlight unit 510, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the positive terminal of diode chip for backlight unit 520, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320, lead-in wire 610,620 forms the ac input end of bridge heap, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210 cathode output end piled as bridge, and the ailhead of 640 stiff ends that go between is fixedly connected with support chip 220 cathode output end piled as bridge.Lead-in wire 610,620 as ac input end lays respectively at the two ends of packaging body 100, and the lead-in wire 640,630 as positive and negative electrode output is positioned at the centre position of packaging body 100.
Embodiment 7
See Fig. 8, inline-type minitype bridge rectifiers shown in figure, comprises a packaging body 100 and is arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100.Two bump contacted chip 310,320 structures are identical, and become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, and the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
In the top plan view of bridge heap, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the centre position of packaging body 100; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the positive terminal of diode chip for backlight unit 520 with the negative pole end of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the positive terminal of diode chip for backlight unit 540 with the negative pole end of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the positive terminal of diode chip for backlight unit 510, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the negative pole end of diode chip for backlight unit 520, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310 cathode output end piled as bridge, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320 cathode output end piled as bridge, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210, the ailhead of 640 stiff ends of going between is fixedly connected with support chip 220, and lead-in wire 630,640 forms the ac input end of bridges heap.Lead-in wire 630,640 as ac input end lays respectively at the centre position of packaging body 100, and the lead-in wire 610,620 as positive and negative electrode output is positioned at the end positions of packaging body 100.
Embodiment 8
See Fig. 9, inline-type minitype bridge rectifiers shown in figure, comprises a packaging body 100 and is arranged on two pieces of support chips 210,220, two bump contacted chip, 310,320, four diode chip for backlight unit 510,520,530,540 and four lead-in wire 610,620,630,640 in packaging body 100.Two bump contacted chip 310,320 structures are identical, and become meander-like, the structure of two pieces of support chips 210,220 is also identical, orthogonal structure, and the structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at intermediate layer, and two pieces of support chips 210,220 are positioned at lower floor.Four lead-in wires 610,620,630,640 parallel by extend out in envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.Four 610,620,630,640 stiff ends being positioned at packaging body 100 that go between are provided with ailhead.
In the top plan view of bridge heap, whole packaging body 100 structure into strips, two pieces of support chips 210,220 are positioned at the centre position of packaging body 100; Four lead-in wire 610,620,630,640 layouts in a row.
Support chip 210 is fixedly connected with the negative pole end of diode chip for backlight unit 520 with the positive terminal of diode chip for backlight unit 510.Support chip 220 is fixedly connected with the negative pole end of diode chip for backlight unit 540 with the positive terminal of diode chip for backlight unit 530.
One end of brace 310 is fixedly connected with the negative pole end of diode chip for backlight unit 510, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the positive terminal of diode chip for backlight unit 520, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540.
The ailhead of 610 stiff ends of going between is fixedly connected with brace 310 cathode output end piled as bridge, the ailhead of 620 stiff ends of going between is fixedly connected with brace 320 cathode output end piled as bridge, the ailhead of 630 stiff ends of going between is fixedly connected with support chip 210, the ailhead of 640 stiff ends of going between is fixedly connected with support chip 220, and lead-in wire 630,640 forms the ac input end of bridges heap.Lead-in wire 630,640 as ac input end lays respectively at the centre position of packaging body 100, and the lead-in wire 620,610 as positive and negative electrode output is positioned at the end positions of packaging body 100.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (8)
1. inline-type minitype bridge rectifiers, comprises a packaging body and is arranged on two pieces of support chips in packaging body, two bump contacted chips, four diode chip for backlight unit and by four lead-in wires extended out in described envelope shape body, on bridge heap thickness direction, two bump contacted chips are positioned at upper strata, and four diode chip for backlight unit are positioned at intermediate layer, and two pieces of support chips are positioned at lower floor, in the top plan view of bridge heap, each block support chip is fixedly connected with two diode chip for backlight unit, and each bump contacted chip is fixedly connected with each diode chip for backlight unit on two pieces of support chips respectively, it is characterized in that, whole packaging body structure into strips, described four diode chip for backlight unit layouts in a row, described four lead-in wires are parallel in a row by extending out in described envelope shape body and be arrangeding in parallel with the normal direction of four diode chip for backlight unit, described four lead-in wires are fixedly connected with two bump contacted chips with two pieces of support chips respectively and form bridge and just piling, cathode output end and ac input end.
2. inline-type minitype bridge rectifiers as claimed in claim 1, it is characterized in that, described two pieces of support chips lay respectively at the two ends in described packaging body, two that are fixedly connected with two pieces of support chips go between and lay respectively at the two ends of described packaging body simultaneously, and other two lead-in wires be fixedly connected with described two bump contacted chips are respectively positioned at the centre of packaging body.
3. inline-type minitype bridge rectifiers as claimed in claim 1, it is characterized in that, described two pieces of support chips are disposed immediately in the centre in described packaging body, two that are fixedly connected with two pieces of support chips go between and lay respectively at the centre of described packaging body simultaneously, and other two lead-in wires be fixedly connected with described two bump contacted chips respectively lay respectively at the two ends of packaging body.
4. the inline-type minitype bridge rectifiers as described in claim 1 or 2 or 3, it is characterized in that, described two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, third, fourth lead-in wire, four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, wherein the positive terminal of first, second diode chip for backlight unit is fixedly connected with the first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the second support chip; First brace is fixedly connected with the positive terminal of the 3rd diode chip for backlight unit with the negative pole end of the first diode chip for backlight unit, second brace is fixedly connected with the positive terminal of the 4th diode chip for backlight unit with the negative pole end of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with the first brace, second lead-in wire is fixedly connected with the second brace, first and second lead-in wire is as ac input end, 3rd lead-in wire is fixedly connected with formation cathode output end with the first support chip, and the 4th lead-in wire is fixedly connected with as cathode output end with the second support chip.
5. the inline-type minitype bridge rectifiers as described in claim 1 or 2 or 3, it is characterized in that, described two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, third, fourth lead-in wire, four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, wherein the negative pole end of first, second diode chip for backlight unit is fixedly connected with the first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the second support chip; First brace is fixedly connected with the negative pole end of the 3rd diode chip for backlight unit with the positive terminal of the first diode chip for backlight unit, second brace is fixedly connected with the negative pole end of the 4th diode chip for backlight unit with the positive terminal of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with the first brace, second lead-in wire is fixedly connected with the second brace, first and second lead-in wire is as ac input end, 3rd lead-in wire is fixedly connected with formation cathode output end with the first support chip, and the 4th lead-in wire is fixedly connected with as cathode output end with the second support chip.
6. the inline-type minitype bridge rectifiers as described in claim 1 or 2 or 3, it is characterized in that, described two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, 3rd, 4th lead-in wire, four diode chip for backlight unit are divided into first, second, 3rd, 4th diode chip for backlight unit, wherein the positive terminal of the first diode chip for backlight unit is fixedly connected with the first support chip with the negative pole end of the second diode chip for backlight unit, the positive terminal of the 3rd diode chip for backlight unit is fixedly connected with the second support chip with the negative pole end of the 4th diode chip for backlight unit, first brace is fixedly connected with the negative pole end of the 3rd diode chip for backlight unit with the negative pole end of the first diode chip for backlight unit, second brace is fixedly connected with the positive terminal of the 4th diode chip for backlight unit with the positive terminal of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with as cathode output end with the first brace, second lead-in wire is fixedly connected with as cathode output end with the second brace, and third and fourth lead-in wire is as ac input end.
7. the inline-type minitype bridge rectifiers as described in claim 1 or 2 or 3, it is characterized in that, described two pieces of support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace, four lead-in wires are divided into first, second, 3rd, 4th lead-in wire, four diode chip for backlight unit are divided into first, second, 3rd, 4th diode chip for backlight unit, wherein the negative pole end of the first diode chip for backlight unit is fixedly connected with the first support chip with the positive terminal of the second diode chip for backlight unit, the negative pole end of the 3rd diode chip for backlight unit is fixedly connected with the second support chip with the positive terminal of the 4th diode chip for backlight unit, first brace is fixedly connected with the positive terminal of the 3rd diode chip for backlight unit with the positive terminal of the first diode chip for backlight unit, second brace is fixedly connected with the negative pole end of the 4th diode chip for backlight unit with the negative pole end of the second diode chip for backlight unit, wherein the first lead-in wire is fixedly connected with as cathode output end with the first brace, second lead-in wire is fixedly connected with as cathode output end with the second brace, and third and fourth lead-in wire is as ac input end.
8. the inline-type minitype bridge rectifiers as described in claim 1 or 2 or 3, is characterized in that, the structure of described two bump contacted chips is identical, and the structure of two pieces of support chips is identical, and the structure of four lead-in wires is identical.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110161681.6A CN102832205B (en) | 2011-06-15 | 2011-06-15 | In-line small bridge rectifier |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110161681.6A CN102832205B (en) | 2011-06-15 | 2011-06-15 | In-line small bridge rectifier |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2095512U (en) * | 1991-07-03 | 1992-02-05 | 旭兴科技股份有限公司 | Unilateral lead wire bridge type rectrifier apparatus with improved structure |
| CN201523329U (en) * | 2009-11-02 | 2010-07-07 | 绍兴科盛电子有限公司 | Direct-plug type double diode small current rectification module |
| CN202084543U (en) * | 2011-06-15 | 2011-12-21 | 上海金克半导体设备有限公司 | Inline-type minitype bridge rectifiers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE59009756D1 (en) * | 1989-04-06 | 1995-11-16 | Siemens Ag | Manufacture of highly heat-resistant relief structures. |
| JP3467605B2 (en) * | 1994-05-02 | 2003-11-17 | 株式会社指月電機製作所 | Composite module using foil frame diode |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2095512U (en) * | 1991-07-03 | 1992-02-05 | 旭兴科技股份有限公司 | Unilateral lead wire bridge type rectrifier apparatus with improved structure |
| CN201523329U (en) * | 2009-11-02 | 2010-07-07 | 绍兴科盛电子有限公司 | Direct-plug type double diode small current rectification module |
| CN202084543U (en) * | 2011-06-15 | 2011-12-21 | 上海金克半导体设备有限公司 | Inline-type minitype bridge rectifiers |
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