CN102832207A - Block bridge pile - Google Patents

Block bridge pile Download PDF

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Publication number
CN102832207A
CN102832207A CN2011101616996A CN201110161699A CN102832207A CN 102832207 A CN102832207 A CN 102832207A CN 2011101616996 A CN2011101616996 A CN 2011101616996A CN 201110161699 A CN201110161699 A CN 201110161699A CN 102832207 A CN102832207 A CN 102832207A
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CN
China
Prior art keywords
backlight unit
chip
diode chip
fixedly connected
bridge heap
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Pending
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CN2011101616996A
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Chinese (zh)
Inventor
林茂昌
陈怡璟
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Shanghai Jinke Semiconductor & Equipment Co ltd
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Shanghai Jinke Semiconductor & Equipment Co ltd
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Priority to CN2011101616996A priority Critical patent/CN102832207A/en
Publication of CN102832207A publication Critical patent/CN102832207A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

The invention relates to a block bridge pile, comprising a block package body as well as two support pieces, two connecting pieces and four diode chips which are arranged in the package body; the two connecting pieces are arranged on an upper layer, four diode chips are arranged in an intermediate layer, two support pieces are arranged in a lower layer; the package body is a block structure, two support pieces are located at opposite angles of the package body to form an alternating current input end; the block bridge pile further comprises two lead structures which are respectively fixedly connected with two connecting pieces, two lead structures are located at the other opposite angles of the package body, the two support pieces and the two lead structures form a positive output end, a negative output end and an alternating current input end of the bridge pile. When assembling, the block bridge pile takes up small space on the welding dies, makes the number of the bridge piles welded on the same welding die larger, thereby increasing the production efficiency and reducing the cost.

Description

Square formula bridge heap
Technical field
The present invention relates to rectistack, relate in particular to a kind of square formula bridge heap of AC-DC.
Background technology
The bridge architecture that bridge rectifier is made up of four rectifier diodes; It utilizes the unilateal conduction characteristic of diode that alternating current is carried out rectification; Because bridge rectifier must utilize efficient to double than halfwave rectifier to input sine wave; Be a kind of remarkable improvement, convert in the galvanic circuit so be widely used in alternating current to the diode halfwave rectifier.
Along with electronic product develops to miniaturization, what require that the profile of semi-conductor electronic device does is again little and thin.Present minimize bridge heap mainly is divided into two types, and one type is direct insertion bridge heap, and another kind is SMD bridge heap.
For direct insertion bridge heap, more typical at present structure has following several kinds:
1, Chinese patent ZL97247861.2 disclosed a kind of " the vertical full-wave bridge rectifier heap of single row " by name, it comprises by terminal pin A, B, C, D, unilateal conduction chip, plastic packaging shell and edge joint sheet E, F.At terminal pin and brace intersection clamping unilateal conduction chip or transition plate are arranged, packing weld tabs between unilateal conduction chip or transition plate and terminal pin, edge joint sheet, terminal pin and brace constitute unidirectional turning circuit through the unilateal conduction chip.Though it constitutes bridge rectifier, also has following shortcoming: 1) in this rectistack, directly extend in the plastic packaging shell, and the unilateal conduction chip is sandwiched between terminal pin and brace owing to terminal pin; Make chip concentrate on the middle part of plastic packaging shell; The skewness of its chip, thus the heat that produces when causing rectistack to use concentrates on the middle part of plastic packaging shell, makes heat be difficult to leave; Thereby cause chip to damage easily because of heat is excessive, shortened the useful life of rectistack greatly; 2) and brace includes three construction sections, it installs very trouble and time-consuming, and owing to can recognize in the above-mentioned rectistack structure; Its chip polarity is towards disunity, thereby its assembling difficulty, and it is unreliable to weld; Time-consuming taking a lot of work; Causing direct result is that assembling and soldering reliability descend, and qualification rate reduces, and cost rises.
2, the disclosed single-row direct insertion full-wave rectification bridge heap of Chinese patent Granted publication CN2901580Y; It comprises insulation crust, be fixed on the inner framework of insulation crust, terminal pin, conductive chip and brace thereof constitutes; Framework is made up of left and right interchange input frame and left and right rectification output box; The both upper ends thereof that a left side exchanges input frame is respectively equipped with conductive chip; The right top that exchanges input frame extends to the interstitial site between the conductive chip that a left side exchanges input frame, and left and right rectification output box places the below on left and right interchange input frame top respectively, and the right input frame top that exchanges is respectively equipped with first and second weld fixation part that supplies the brace solid welding; The left and right rectification output box of its below is fixed with conductive chip; Conductive chip is connected with first and second weld fixation part through brace, and left and right rectification output box is respectively equipped with third and fourth weld fixation part, and is connected with the conductive chip that a left side exchanges on the input frame through brace.Though this patent has good heat dissipation effect, long service life, assembles advantage simply and easily; But because its conductive chip becomes parastate with terminal pin; On weld mold, put during assembling and take more space; Cause the bridge heap negligible amounts of same weld mold welding, make production effect to improve.And, need prepare bigger mould again in order to enhance productivity, cause the weld mold manufacturing cost to rise.The disclosed bridge built-up welding point of this patent is more in addition, occurs quality accident easily.
3, like the disclosed a kind of single-row direct insertion full-wave rectification bridge heap of Fig. 1; It comprises that two roughly become L shaped 2,3 and two straight wires 1 of lead-in wire; Two straight wires 1 are located at two and are roughly become L shaped lead-in wire 2,3 belows; Two straight wires 1 roughly become L shaped lead-in wire 2 with two, are welded with four conductive chips between 3; Though single-row direct insertion full-wave rectification bridge heap shown in Figure 1 has solved the many problems of solder joint, owing to its conductive chip with straight wire 1, roughly become the terminal pin of L shaped lead-in wire 2,3 to become parastate, on weld mold, put during assembling and take more space; Cause the bridge heap negligible amounts of same weld mold welding, make production effect to improve.And, need prepare bigger mould again in order to enhance productivity, cause the weld mold manufacturing cost to rise.
For SMD bridge heap, more typical at present structure has following several kinds:
1, the disclosed a kind of miniature semiconductor rectifier bridge of Chinese invention patent publication number; It comprises two diode crystal grain that have the N type altogether and the two diode crystal grain that have the P type altogether; Wherein altogether a p type island region of N type crystal grain together a corresponding N type fauna of P type crystal grain be connected to a terminal electrode of first group of lead frame; Altogether another p type island region of N type crystal grain then together another N type district of P type crystal grain be connected to the another terminal electrode of first group of lead frame; And the N type district of the common N type crystal grain p type island region of P type crystal grain together then is connected to the two-terminal electrode of second group of lead frame respectively, thereby constitutes a bridge rectifier, although this miniature rectifier structurally helps microminiaturization; But need to adopt the double diode chip of two kinds in the manufacturing; Promptly have N type double diode chip altogether and have P type double diode chip altogether, cause following problem easily: 1) acp chip is wide in variety, and complex process shape increases; 2) the chip qualification rate is relatively low; 3) owing to there are two chip kinds, uniformity is relatively poor; 4) chip of P type substrate relatively difficulty do.
2, the disclosed plate mini-type bridge heap of Chinese invention patent Granted publication CN2545706Y, it forms bridge rectifier by four rectifier diodes in a packaging body; Four rectifier diodes are made up of identical PN junction chip, spatially two and be listed in of four PN junction chips, two and be listed in down in addition; The p type island region of each PN junction chip and N type district arrange up and down; Wherein the p type island region of diagonal position PN junction chip is identical with orientation, N type district, adopts a connecting piece to connect between two PN junction chips repeatedly putting up and down respectively, and be listed in and be listed under two PN junction chips adopt another brace to be connected respectively; Two braces on the intermediate layer are as one group of electrode terminal; Two braces on the upper and lower are organized electrode terminal as another, and in packaging body, draw respectively, constitute miniature five layers of rectifier bridge pile structure with this.Because this patent adopts five-layer structure; Its thickness of product is generally about 2.5～2.7mm; The inner many accommodation spaces of electronic product have not only been taken; And, proposed higher requirement for simultaneously each layer parts installing and locating because the processing step that is arranged so that the production and processing of bridge heap of sandwich construction increases.
3, the disclosed a kind of slim welded type rectifier bridge heap of Chinese patent Granted publication CN201181702; The epoxy packages body inside of this rectifier bridge heap is made up of two bump contacted chips, four diode chip for backlight unit and two block frame support chips; On thickness direction; Brace, diode chip for backlight unit, frame supported sheet lay respectively at upper, middle and lower-ranking, and on top plan view, first brace is fixedly connected with the positive terminal of first, second diode chip for backlight unit; The negative pole end of second brace and the 3rd, the 4th diode chip for backlight unit is fixedly connected; The first frame supported sheet is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; The second frame supported sheet is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Pin on first brace is as cathode output end; Pin on second brace is as cathode output end, and the pin on the two block frame support chips is as ac input end.The shortcoming that this patent exists is: 1) structure of two bump contacted chips is inequality; The structure of two block frame support chips is inequality; And the structure of lead-in wire is also inequality, therefore need the part more than at least 5 kinds to assemble with crystal grain, and the part of developing more than 5 kinds needs the mould more than 5 kinds; Cause manufacturing cost higher, production management is complicated; 2) the one positive one negative placement of two crystal grain on the block frame support chip causes the crystal grain put procedure complicated, has increased the difficulty of technology.The pad of this patent is many, occurs the welding accident easily.
Summary of the invention
Technical problem to be solved by this invention is to pile existing problem and a kind of easy to assembly, good heat dissipation effect, square formula bridge heap that volume is little are provided to above-mentioned rectifier bridge.
Technical problem to be solved by this invention can realize through following technical scheme:
Square formula bridge heap comprises a packaging body and two support chips, two bump contacted chips, four diode chip for backlight unit of being arranged in the packaging body; On bridge heap thickness direction, two bump contacted chips are positioned at the upper strata, and four diode chip for backlight unit are positioned at the intermediate layer, and two support chips are positioned at lower floor; On the top plan view of bridge heap; On the top plan view of bridge heap, on the top plan view of bridge heap, be fixedly connected with two diode chip for backlight unit on each piece support chip; And each bump contacted chip respectively with two support chips on each diode chip for backlight unit be fixedly connected; It is characterized in that said packaging body is a square formula structure, the diagonal angle that said two support chips are positioned at packaging body constitutes ac input end; This square formula bridge heap also comprises two pin configurations that are fixedly connected with two bump contacted chips respectively, and two pin configurations are positioned at another diagonal angle of packaging body, and said two support chips and two pin configurations constitute positive and negative electrode output and the ac input end that bridge is piled.
In a preferred embodiment of the invention, the structure of said two bump contacted chips is identical, and the structure of two support chips is identical, and the structure of two pin configurations is identical.
In a preferred embodiment of the invention; Said two support chips are divided into first, second support chip; Two bump contacted chips are divided into first, second brace, and two each pin configurations are divided into first, second pin configuration, and four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit; Wherein said first pin configuration is the first column terminal pin, and the said first column terminal pin is fixedly connected with said first brace; Said second pin configuration is the second column terminal pin, and the said second column terminal pin is fixedly connected with said second brace; Described square formula bridge heap also comprises the 3rd column terminal pin and the 4th column terminal pin, and the 3rd column terminal pin is fixedly connected with the bottom surface of said first support chip, and the 4th column terminal pin is fixedly connected with the bottom surface of said second support chip; The 3rd column terminal pin and the 4th column terminal pin are positioned at a diagonal angle of packaging body, and the first column terminal pin and second column lead-in wire are positioned at another diagonal angle of packaging body; First, second, third and fourth column lead-in wire constitutes the positive and negative electrode output and the ac input end of bridge heap.
In a preferred embodiment of the invention, the positive terminal of first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first column terminal pin and the second column terminal pin are as the ac input end of bridge heap; The 3rd column terminal pin is as the cathode output end of bridge heap, and the 4th column terminal pin is as the cathode output end of bridge heap.
In a preferred embodiment of the invention, the negative pole end of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first column terminal pin and the second column terminal pin are as the ac input end of bridge heap; The 3rd column terminal pin is as the cathode output end of bridge heap, and the 4th column terminal pin is as the cathode output end of bridge heap.
In a preferred embodiment of the invention; The negative pole end of the positive terminal of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the negative pole end of the positive terminal of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first column terminal pin is as the cathode output end of bridge heap; The second column terminal pin is as the cathode output end of bridge heap, and the 3rd column terminal pin and the 4th column terminal pin are as the ac input end of bridge heap.
In a preferred embodiment of the invention; The positive terminal of the negative pole end of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the positive terminal of the negative pole end of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first column terminal pin is as the cathode output end of bridge heap; The second column terminal pin is as the cathode output end of bridge heap, and the 3rd column terminal pin and the 4th column terminal pin are as the ac input end of bridge heap.
In a preferred embodiment of the invention; Said two support chips are divided into first, second support chip; Two bump contacted chips are divided into first, second brace, and two each pin configurations are divided into first, second pin configuration, and four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit; Wherein said first pin configuration comprises first chip lead-in wire, and the front of said first chip lead-in wire is fixedly connected with said first brace; Said second pin configuration comprises second chip lead-in wire, and the front of said second chip lead-in wire is fixedly connected with said second brace; Packaging body is all exposed with the bottom surface of first and second chip lead-in wire in the bottom surface of said first and second support chip, and the bottom surface of first and second support chip is positioned at a diagonal angle of packaging body, and the bottom surface of first and second chip lead-in wire is positioned at another diagonal angle of packaging body; Constitute the positive and negative electrode output and the ac input end of bridge heap.
In a preferred embodiment of the invention, the positive terminal of first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the bottom surface of the bottom surface of first chip lead-in wire and second chip lead-in wire is as the ac input end of bridge heap; The bottom surface of first support chip is as the cathode output end of bridge heap, and the bottom surface of second support chip is as the cathode output end of bridge heap.
In a preferred embodiment of the invention, the negative pole end of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the bottom surface of the bottom surface of first chip lead-in wire and second chip lead-in wire is as the ac input end of bridge heap; The bottom surface of first support chip is as the cathode output end of bridge heap, and the bottom surface of second support chip is as the cathode output end of bridge heap.
In a preferred embodiment of the invention; The negative pole end of the positive terminal of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the negative pole end of the positive terminal of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the bottom surface of first chip lead-in wire is as the cathode output end of bridge heap; The bottom surface of second chip lead-in wire is as the cathode output end of bridge heap, and the bottom surface of the bottom surface of first support chip and second support chip is as the ac input end of bridge heap.
In a preferred embodiment of the invention; The positive terminal of the negative pole end of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the positive terminal of the negative pole end of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the bottom surface of first chip lead-in wire is as the cathode output end of bridge heap; The bottom surface of second chip lead-in wire is as the cathode output end of bridge heap, and the bottom surface of the bottom surface of first support chip and second support chip is as the ac input end of bridge heap.
In a preferred embodiment of the invention; Said two support chips are divided into first, second support chip; Two bump contacted chips are divided into first, second brace, and two each pin configurations are divided into first, second pin configuration, and four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit; Wherein said first pin configuration comprises first chip lead-in wire, and the front of said first chip lead-in wire is fixedly connected with said first brace; Said second pin configuration comprises second chip lead-in wire, and the front of said second chip lead-in wire is fixedly connected with said second brace; Said first chip lead-in wire is provided with the first folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; Said second chip lead-in wire is provided with the second folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; Said first support chip is provided with the 3rd folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; Said second support chip is provided with the 4th folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; The 3rd folding type terminal pin and the 4th folding type terminal pin are positioned at a diagonal angle of packaging body; The first folding type terminal pin and the second folding type terminal pin are positioned at another diagonal angle of packaging body, constitute the positive and negative electrode output and the ac input end of bridge heap.
In a preferred embodiment of the invention, the positive terminal of first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin and the second folding type terminal pin are as the ac input end of bridge heap; The 3rd folding type terminal pin is as the cathode output end of bridge heap, and the 4th folding type terminal pin is as the cathode output end of bridge heap.
In a preferred embodiment of the invention, the negative pole end of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin and the second folding type terminal pin are as the ac input end of bridge heap; The 3rd folding type terminal pin is as the cathode output end of bridge heap, and the 4th folding type terminal pin is as the cathode output end of bridge heap.
In a preferred embodiment of the invention; The negative pole end of the positive terminal of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the negative pole end of the positive terminal of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin is as the cathode output end of bridge heap; The second folding type terminal pin is as the cathode output end of bridge heap, and the 3rd folding type terminal pin and the 4th folding type terminal pin are as the ac input end of bridge heap.
In a preferred embodiment of the invention; The positive terminal of the negative pole end of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the positive terminal of the negative pole end of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin is as the cathode output end of bridge heap; The second folding type terminal pin is as the cathode output end of bridge heap, and the 3rd folding type terminal pin and the 4th folding type terminal pin are as the ac input end of bridge heap.
The present invention is owing to be square formula structure with packaging body; Two support chips are positioned at a diagonal angle of packaging body; Two pin configurations are positioned at another diagonal angle of packaging body, on weld mold, put during assembling and take less space, make that the bridge heap quantity of same weld mold welding is more; Improve production efficiency, reduced cost; Moreover, can realize automated production because two support chips, two bump contacted chips, four diode chip for backlight unit, two pin configurations adopt the layering tiling, and reduced the thickness of bridge heap simultaneously, saved sizing material, make that the volume of bridge heap is littler, weight is lighter.The present invention directly is welded on diode chip for backlight unit on support chip and the brace, need not wire jumper, good heat dissipation effect simultaneously.The present invention also has an important characteristic, is exactly that the structure of two support chips is identical because the structure of said two bump contacted chips is identical; The structure of two pin configurations is identical; Therefore only need to produce three kinds of parts, just can be assembled into a bridge heap, saved die cost with crystal grain; Reduce cost, also simplified production management simultaneously.
Description of drawings
Fig. 1 is the internal structure sketch map of existing single-row direct insertion full-wave rectification bridge heap.
Fig. 2 is the internal structure sketch map of the embodiment of the invention 1.
Fig. 3 is the internal structure sketch map of the embodiment of the invention 2.
Fig. 4 is the internal structure sketch map of the embodiment of the invention 3.
Fig. 5 is the internal structure sketch map of the embodiment of the invention 4.
Fig. 6 is the internal structure sketch map of the embodiment of the invention 5.
Fig. 7 is the internal structure sketch map of the embodiment of the invention 6.
Fig. 8 is the internal structure sketch map of the embodiment of the invention 7.
Fig. 9 is the internal structure sketch map of the embodiment of the invention 8.
Figure 10 is the internal structure sketch map of the embodiment of the invention 9.
Figure 11 is the internal structure sketch map of the embodiment of the invention 10.
Figure 12 is the internal structure sketch map of the embodiment of the invention 11.
Figure 13 is the internal structure sketch map of the embodiment of the invention 12.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with concrete accompanying drawing and embodiment, further set forth the present invention.
Embodiment 1
Referring to Fig. 2; Square formula bridge shown in figure heap comprises a packaging body 100 and is arranged on two support chips 210,220 in the packaging body 100,310,320, four diode chip for backlight unit 510,520,530,540 of two bump contacted chips and by four columns lead-in wires 610,620,630,640 that extend out in the envelope shape body 100.Two bump contacted chips, 310,320 structures are identical, roughly become L shaped shape.The structure of two support chips 210,220 is also identical, becomes rectangular configuration.The structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at the upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at the intermediate layer, and two support chips 210,220 are positioned at lower floor.Four columns lead-in wire 610,620,630,640 is parallel by extending out in the envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.The stiff end that four columns lead-in wire 610,620,630,640 is positioned at packaging body 100 is provided with ailhead.
On the top plan view of bridge heap, 100 one-tenth square shapes of whole packaging body structure, two support chips 210,220 are positioned at a diagonal position of packaging body 100; Four column lead-in wires 610,620,630,640 are arranged in the position, four angles of packaging body 100.
Support chip 210 is fixedly connected with the positive terminal of diode chip for backlight unit 510 and the positive terminal of diode chip for backlight unit 520.Support chip 220 is fixedly connected with the negative pole end of diode chip for backlight unit 530 and the negative pole end of diode chip for backlight unit 540.
One end of brace 310 is fixedly connected with the negative pole end of diode chip for backlight unit 510, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the negative pole end of diode chip for backlight unit 520, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540.
The go between ailhead of 610 stiff ends of column is fixedly connected with the breakover point of brace 310; The ailhead of 620 stiff ends of going between is fixedly connected with brace 320; Column lead-in wire 610,620 constitutes the ac input end of bridge heap; The go between ailhead of 630 stiff ends of column is fixedly connected the cathode output end as the bridge heap with support chip 210, the go between ailhead of 640 stiff ends of column is fixedly connected the cathode output end of piling as bridge with support chip 220.Be positioned at a diagonal angle of packaging body 100 as the lead-in wire 630,640 of positive and negative electrode output, lay respectively at another diagonal angle of packaging body 100 as the lead-in wire 610,620 of ac input end.
Embodiment 2
Referring to Fig. 3; Square formula bridge shown in figure heap comprises a packaging body 100 and is arranged on two support chips 210,220 in the packaging body 100,310,320, four diode chip for backlight unit 510,520,530,540 of two bump contacted chips and by four columns lead-in wires 610,620,630,640 that extend out in the envelope shape body 100.Two bump contacted chips, 310,320 structures are identical, roughly become L shaped shape.The structure of two support chips 210,220 is also identical, becomes rectangular configuration.The structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at the upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at the intermediate layer, and two support chips 210,220 are positioned at lower floor.Four columns lead-in wire 610,620,630,640 is parallel by extending out in the envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.The stiff end that four columns lead-in wire 610,620,630,640 is positioned at packaging body 100 is provided with ailhead.
On the top plan view of bridge heap, 100 one-tenth square shapes of whole packaging body structure, two support chips 210,220 are positioned at a diagonal position of packaging body 100; Four column lead-in wires 610,620,630,640 are arranged in the position, four angles of packaging body 100.
Support chip 210 is fixedly connected with the negative pole end of diode chip for backlight unit 510 and the negative pole end of diode chip for backlight unit 520.Support chip 220 is fixedly connected with the positive terminal of diode chip for backlight unit 530 and the positive terminal of diode chip for backlight unit 540.
One end of brace 310 is fixedly connected with the positive terminal of diode chip for backlight unit 510, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the positive terminal of diode chip for backlight unit 520, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540.
The go between ailhead of 610 stiff ends of column is fixedly connected with the breakover point of brace 310; The ailhead of 620 stiff ends of going between is fixedly connected with brace 320; Column lead-in wire 610,620 constitutes the ac input end of bridge heap; The go between ailhead of 630 stiff ends of column is fixedly connected the cathode output end as the bridge heap with support chip 210, the go between ailhead of 640 stiff ends of column is fixedly connected the cathode output end of piling as bridge with support chip 220.Be positioned at a diagonal angle of packaging body 100 as the lead-in wire 630,640 of positive and negative electrode output, lay respectively at another diagonal angle of packaging body 100 as the lead-in wire 610,620 of ac input end.
Embodiment 3
Referring to Fig. 4; Square formula bridge shown in figure heap comprises a packaging body 100 and is arranged on two support chips 210,220 in the packaging body 100,310,320, four diode chip for backlight unit 510,520,530,540 of two bump contacted chips and by four columns lead-in wires 610,620,630,640 that extend out in the envelope shape body 100.Two bump contacted chips, 310,320 structures are identical, roughly become L shaped shape.The structure of two support chips 210,220 is also identical, becomes rectangular configuration.The structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at the upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at the intermediate layer, and two support chips 210,220 are positioned at lower floor.Four columns lead-in wire 610,620,630,640 is parallel by extending out in the envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.The stiff end that four columns lead-in wire 610,620,630,640 is positioned at packaging body 100 is provided with ailhead.
On the top plan view of bridge heap, 100 one-tenth square shapes of whole packaging body structure, two support chips 210,220 are positioned at a diagonal position of packaging body 100; Four column lead-in wires 610,620,630,640 are arranged in the position, four angles of packaging body 100.
Support chip 210 is fixedly connected with the positive terminal of diode chip for backlight unit 510 and the negative pole end of diode chip for backlight unit 520.Support chip 220 is fixedly connected with the positive terminal of diode chip for backlight unit 530 and the negative pole end of diode chip for backlight unit 540.
One end of brace 310 is fixedly connected with the negative pole end of diode chip for backlight unit 510, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the positive terminal of diode chip for backlight unit 520, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540.
The go between ailhead of 610 stiff ends of column is fixedly connected the cathode output end that constitutes the bridge heap with the breakover point of brace 310, the ailhead of 620 stiff ends that go between is fixedly connected the cathode output end that the formation bridge is piled with brace 320; The go between ailhead of 630 stiff ends of column is fixedly connected with support chip 210, and the go between ailhead of 640 stiff ends of column is fixedly connected with support chip 220, and column lead-in wire 630,540 is as the ac input ends of bridge heap.Lay respectively at another diagonal angle of packaging body 100 as the lead-in wire 630,640 of ac input end, be positioned at another diagonal angle of packaging body 100 as the lead-in wire 620,610 of positive and negative electrode output.
Embodiment 4
Referring to Fig. 5; Square formula bridge shown in figure heap comprises a packaging body 100 and is arranged on two support chips 210,220 in the packaging body 100,310,320, four diode chip for backlight unit 510,520,530,540 of two bump contacted chips and by four columns lead-in wires 610,620,630,640 that extend out in the envelope shape body 100.Two bump contacted chips, 310,320 structures are identical, roughly become L shaped shape.The structure of two support chips 210,220 is also identical, becomes rectangular configuration.The structure of four lead-in wires 610,620,630,640 is also identical.
On bridge heap thickness direction, two bump contacted chips 310,320 are positioned at the upper strata, and four diode chip for backlight unit 510,520,530,540 are positioned at the intermediate layer, and two support chips 210,220 are positioned at lower floor.Four columns lead-in wire 610,620,630,640 is parallel by extending out in the envelope shape body 100 and parallel with the normal direction of four diode chip for backlight unit 510,520,530,540.The stiff end that four columns lead-in wire 610,620,630,640 is positioned at packaging body 100 is provided with ailhead.
On the top plan view of bridge heap, 100 one-tenth square shapes of whole packaging body structure, two support chips 210,220 are positioned at a diagonal position of packaging body 100; Four column lead-in wires 610,620,630,640 are arranged in the position, four angles of packaging body 100.
Support chip 210 is fixedly connected with the negative pole end of diode chip for backlight unit 510 and the positive terminal of diode chip for backlight unit 520.Support chip 220 is fixedly connected with the negative pole end of diode chip for backlight unit 530 and the positive terminal of diode chip for backlight unit 540.
One end of brace 310 is fixedly connected with the positive terminal of diode chip for backlight unit 510, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530; One end of brace 320 is fixedly connected with the negative pole end of diode chip for backlight unit 520, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540.
The go between ailhead of 610 stiff ends of column is fixedly connected the cathode output end that constitutes the bridge heap with the breakover point of brace 310, the ailhead of 620 stiff ends that go between is fixedly connected the cathode output end that the formation bridge is piled with brace 320; The go between ailhead of 630 stiff ends of column is fixedly connected with support chip 210, and the go between ailhead of 640 stiff ends of column is fixedly connected with support chip 220, and column lead-in wire 630,540 is as the ac input ends of bridge heap.Lay respectively at another diagonal angle of packaging body 100 as the lead-in wire 630,640 of ac input end, be positioned at another diagonal angle of packaging body 100 as the lead-in wire 620,610 of positive and negative electrode output.
Embodiment 5
Referring to Fig. 6; Square shape bridge shown in figure heap comprises a packaging body 100a and is arranged on two support chip 210a in the packaging body 100a, 220a, two bump contacted chip 310a, 320a, four diode chip for backlight unit 510a, 520a, 530a, 540a and two chips lead-in wire 610a, 620a.Two bump contacted chip 310a, 320a structure are identical, roughly become L shaped shape.The structure of two support chip 210a, 220a is also identical, becomes rectangular configuration.The structure of two chips lead-in wire 610a, 620a is also identical, becomes rectangular configuration.
On bridge heap thickness direction; Two bump contacted chip 310a, 320a are positioned at the upper strata; Four diode chip for backlight unit 510a, 520a, 530a, 540a are positioned at the intermediate layer, and two support chip 210a, 220a and two chip lead-in wire 610a, 620a are positioned at lower floor and in the same plane.
On the top plan view of bridge heap, whole packaging body 100a becomes square shape structure, and two support chip 210a, 220a are positioned at the diagonal position of packaging body 100a, and two chip lead-in wire 610a, 620a are positioned at another diagonal position of packaging body 100a.
The front of support chip 210a is fixedly connected with the positive terminal of diode chip for backlight unit 510a and the positive terminal of diode chip for backlight unit 520a.The front of support chip 220a is fixedly connected with the negative pole end of diode chip for backlight unit 530a and the negative pole end of diode chip for backlight unit 540a.
The end of brace 310a is fixedly connected with the negative pole end of diode chip for backlight unit 510a, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530a; The end of brace 320a is fixedly connected with the positive terminal of diode chip for backlight unit 520a, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540a.
The front of chip lead-in wire 610a is fixedly connected with the breakover point of brace 310a; The front of chip lead-in wire 620a is fixedly connected with the breakover point of brace 320a; Chip lead-in wire 610a, 620a expose packaging body 100; Constitute the ac input end of bridge heap, the cathode output end of packaging body 100 as the bridge heap exposed in the bottom surface of support chip 210a, and the cathode output end of packaging body 100 as the bridge heap exposed in the bottom surface of support chip 220a.Be positioned at the diagonal angle of packaging body 100a as support chip 210a, the 220a of positive and negative electrode output, as the chip lead-in wire 610a of ac input end, another diagonal angle that 620a lays respectively at packaging body 100a.
Embodiment 6
Referring to Fig. 7; Square shape bridge shown in figure heap comprises a packaging body 100a and is arranged on two support chip 210a in the packaging body 100a, 220a, two bump contacted chip 310a, 320a, four diode chip for backlight unit 510a, 520a, 530a, 540a and two chips lead-in wire 610a, 620a.Two bump contacted chip 310a, 320a structure are identical, roughly become L shaped shape.The structure of two support chip 210a, 220a is also identical, becomes rectangular configuration.The structure of two chips lead-in wire 610a, 620a is also identical, becomes rectangular configuration.
On bridge heap thickness direction; Two bump contacted chip 310a, 320a are positioned at the upper strata; Four diode chip for backlight unit 510a, 520a, 530a, 540a are positioned at the intermediate layer, and two support chip 210a, 220a and two chip lead-in wire 610a, 620a are positioned at lower floor and in the same plane.
On the top plan view of bridge heap, whole packaging body 100a becomes square shape structure, and two support chip 210a, 220a are positioned at the diagonal position of packaging body 100a, and two chip lead-in wire 610a, 620a are positioned at another diagonal position of packaging body 100a.
The front of support chip 210a is fixedly connected with the negative pole end of diode chip for backlight unit 510a and the negative pole end of diode chip for backlight unit 520a.The front of support chip 220a is fixedly connected with the positive terminal of diode chip for backlight unit 530a and the positive terminal of diode chip for backlight unit 540a.
The end of brace 310a is fixedly connected with the positive terminal of diode chip for backlight unit 510a, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530a; The end of brace 320a is fixedly connected with the positive terminal of diode chip for backlight unit 520a, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540a.
The front of chip lead-in wire 610a is fixedly connected with the breakover point of brace 310a; The front of chip lead-in wire 620a is fixedly connected with the breakover point of brace 320a; Chip lead-in wire 610a, 620a expose packaging body 100; Constitute the ac input end of bridge heap, the cathode output end of packaging body 100 as the bridge heap exposed in the bottom surface of support chip 210a, and the cathode output end of packaging body 100 as the bridge heap exposed in the bottom surface of support chip 220a.Be positioned at the diagonal angle of packaging body 100a as support chip 220a, the 210a of positive and negative electrode output, as the chip lead-in wire 610a of ac input end, another diagonal angle that 620a lays respectively at packaging body 100a.
Embodiment 7
Referring to Fig. 8; Square shape bridge shown in figure heap comprises a packaging body 100a and is arranged on two support chip 210a in the packaging body 100a, 220a, two bump contacted chip 310a, 320a, four diode chip for backlight unit 510a, 520a, 530a, 540a and two chips lead-in wire 610a, 620a.Two bump contacted chip 310a, 320a structure are identical, roughly become L shaped shape.The structure of two support chip 210a, 220a is also identical, becomes rectangular configuration.The structure of two chips lead-in wire 610a, 620a is also identical, becomes rectangular configuration.
On bridge heap thickness direction; Two bump contacted chip 310a, 320a are positioned at the upper strata; Four diode chip for backlight unit 510a, 520a, 530a, 540a are positioned at the intermediate layer, and two support chip 210a, 220a and two chip lead-in wire 610a, 620a are positioned at lower floor and in the same plane.
On the top plan view of bridge heap, whole packaging body 100a becomes square shape structure, and two support chip 210a, 220a are positioned at the diagonal position of packaging body 100a, and two chip lead-in wire 610a, 620a are positioned at another diagonal position of packaging body 100a.
The front of support chip 210a is fixedly connected with the positive terminal of diode chip for backlight unit 510a and the negative pole end of diode chip for backlight unit 520a.The front of support chip 220a is fixedly connected with the positive terminal of diode chip for backlight unit 530a and the negative pole end of diode chip for backlight unit 540a.
The end of brace 310a is fixedly connected with the negative pole end of diode chip for backlight unit 510a, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530a; The end of brace 320a is fixedly connected with the positive terminal of diode chip for backlight unit 520a, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540a.
The front of chip lead-in wire 610a is fixedly connected with the breakover point of brace 310a; The cathode output end that packaging body 100a constitutes the bridge heap is exposed in the bottom surface of chip lead-in wire 610a; The front of chip lead-in wire 620a is fixedly connected with the breakover point of brace 320a, and the cathode output end that packaging body 100a constitutes the bridge heap is exposed in the bottom surface of chip lead-in wire 620a.The ac input end that packaging body 100 constitutes the bridge heap is exposed in the bottom surface of support chip 210a, 220a.Be positioned at the diagonal angle of packaging body 100a as the support chip 220a of ac input end, the bottom surface of 210a, as the chip lead-in wire 620a of positive and negative electrode output, another diagonal angle that 610a lays respectively at packaging body 100a.
Embodiment 8
Referring to Fig. 9; Square shape bridge shown in figure heap comprises a packaging body 100a and is arranged on two support chip 210a in the packaging body 100a, 220a, two bump contacted chip 310a, 320a, four diode chip for backlight unit 510a, 520a, 530a, 540a and two chips lead-in wire 610a, 620a.Two bump contacted chip 310a, 320a structure are identical, roughly become L shaped shape.The structure of two support chip 210a, 220a is also identical, becomes rectangular configuration.The structure of two chips lead-in wire 610a, 620a is also identical, becomes rectangular configuration.
On bridge heap thickness direction; Two bump contacted chip 310a, 320a are positioned at the upper strata; Four diode chip for backlight unit 510a, 520a, 530a, 540a are positioned at the intermediate layer, and two support chip 210a, 220a and two chip lead-in wire 610a, 620a are positioned at lower floor and in the same plane.
On the top plan view of bridge heap, whole packaging body 100a becomes square shape structure, and two support chip 210a, 220a are positioned at the diagonal position of packaging body 100a, and two chip lead-in wire 610a, 620a are positioned at another diagonal position of packaging body 100a.
The front of support chip 210a is fixedly connected with the negative pole end of diode chip for backlight unit 510a and the positive terminal of diode chip for backlight unit 520a.The front of support chip 220a is fixedly connected with the negative pole end of diode chip for backlight unit 530a and the positive terminal of diode chip for backlight unit 540a.
The end of brace 310a is fixedly connected with the positive terminal of diode chip for backlight unit 510a, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530a; The end of brace 320a is fixedly connected with the negative pole end of diode chip for backlight unit 520a, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540a.
The front of chip lead-in wire 610a is fixedly connected with the breakover point of brace 310a; The cathode output end that packaging body 100a constitutes the bridge heap is exposed in the bottom surface of chip lead-in wire 610a; The front of chip lead-in wire 620a is fixedly connected with the breakover point of brace 320a, and the cathode output end that packaging body 100a constitutes the bridge heap is exposed in the bottom surface of chip lead-in wire 620a.The ac input end that packaging body 100 constitutes the bridge heap is exposed in the bottom surface of support chip 210a, 220a.Be positioned at the diagonal angle of packaging body 100a as the support chip 210a of ac input end, the bottom surface of 220a, as the chip lead-in wire 620a of positive and negative electrode output, another diagonal angle that 610a lays respectively at packaging body 100a.
Embodiment 9
Referring to Figure 10; Square formula bridge shown in figure heap, the packaging body 100b that comprises a square shape be arranged on two support chip 210b in the packaging body 100b, 220b, two bump contacted chip 310b, 320b, four diode chip for backlight unit 510b, 520b, 530b, 540b and two pin configuration 610b, 620b.Two bump contacted chip 310b, 320b structure are identical, roughly become L shaped shape.The structure of two support chip 210b, 220b is also identical.The structure of two pin configuration 610b, 620b is also identical.
On bridge heap thickness direction, two bump contacted chip 310b, 320b are positioned at the upper strata, and four diode chip for backlight unit 510b, 520b, 530b, 540b are positioned at the intermediate layer, and two support chip 210b, 220b and two pin configuration 610b, 620b are positioned at lower floor.
On the top plan view of bridge heap, two support chip 210b, 220b are positioned at the diagonal position of packaging body 100b, and two pin configuration 610b, 620b are positioned at another diagonal position of packaging body 100b.
The part 211b that support chip 210b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the positive terminal of diode chip for backlight unit 510b and the positive terminal of diode chip for backlight unit 520b; It is a folding type terminal pin 212b that support chip 210b support chip 210b extends the outer part of packaging body 100b, and folding type terminal pin 212b is fitted in the bottom surface of packaging body 100b; The part 221b that support chip 220b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the negative pole end of diode chip for backlight unit 530b and the negative pole end of diode chip for backlight unit 540b; It is a folding type terminal pin 222b that support chip 220b support chip 220b extends the outer part of packaging body 100b, and folding type terminal pin 222b is fitted in the bottom surface of packaging body 100b.
The end of brace 310b is fixedly connected with the negative pole end of diode chip for backlight unit 510b, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530b; The end of brace 320b is fixedly connected with the negative pole end of diode chip for backlight unit 520b, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540b.
The part 611b that pin configuration 610b is positioned at packaging body 100 is a rectangle; Be fixedly connected with the breakover point of brace 310b; It is a folding type terminal pin 612b that chip lead-in wire 610b extends the outer part of packaging body 100b, and folding type terminal pin 612b is fitted in the bottom surface of packaging body 100b; The part 621b that chip lead-in wire 620b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the breakover point of brace 320b; It is a folding type terminal pin 622b that chip lead-in wire 620b extends the outer part of packaging body 100b, and folding type terminal pin 622b is fitted in the bottom surface of packaging body 100b.
Part 611b, the chip lead-in wire 620b that pin configuration 610b is positioned at packaging body 100 is positioned at the part 621b of packaging body 100b, part 211b that support chip 210b is positioned at packaging body 100b, part 221b that support chip 220b is positioned at packaging body 100b is in the same plane, and the bottom surface of folding type terminal pin 612b, 622b, 212b, 222b is in the same plane.Folding type terminal pin 612b, 622b constitute the ac input end of bridge heap; Folding type terminal pin 212b constitutes the cathode output end of bridge heap; Folding type terminal pin 222b constitutes the cathode output end of bridge heap; Be positioned at the diagonal angle of packaging body 100a as folding type terminal pin 212b, the 222b of positive and negative electrode output, as the folding type terminal pin 612b of ac input end, another diagonal angle that 622b is positioned at packaging body 100a.
Embodiment 10
Referring to Figure 11; Square formula bridge shown in figure heap, the packaging body 100b that comprises a square shape be arranged on two support chip 210b in the packaging body 100b, 220b, two bump contacted chip 310b, 320b, four diode chip for backlight unit 510b, 520b, 530b, 540b and two pin configuration 610b, 620b.Two bump contacted chip 310b, 320b structure are identical, roughly become L shaped shape.The structure of two support chip 210b, 220b is also identical.The structure of two pin configuration 610b, 620b is also identical.
On bridge heap thickness direction, two bump contacted chip 310b, 320b are positioned at the upper strata, and four diode chip for backlight unit 510b, 520b, 530b, 540b are positioned at the intermediate layer, and two support chip 210b, 220b and two pin configuration 610b, 620b are positioned at lower floor.
On the top plan view of bridge heap, two support chip 210b, 220b are positioned at the diagonal position of packaging body 100b, and two pin configuration 610b, 620b are positioned at another diagonal position of packaging body 100b.
The part 211b that support chip 210b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the negative pole end of diode chip for backlight unit 510b and the negative pole end of diode chip for backlight unit 520b; It is a folding type terminal pin 212b that support chip 210b support chip 210b extends the outer part of packaging body 100b, and folding type terminal pin 212b is fitted in the bottom surface of packaging body 100b; The part 221b that support chip 220b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the positive terminal of diode chip for backlight unit 530b and the positive terminal of diode chip for backlight unit 540b; It is a folding type terminal pin 222b that support chip 220b support chip 220b extends the outer part of packaging body 100b, and folding type terminal pin 222b is fitted in the bottom surface of packaging body 100b.
The end of brace 310b is fixedly connected with the positive terminal of diode chip for backlight unit 510b, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530b; The end of brace 320b is fixedly connected with the positive terminal of diode chip for backlight unit 520b, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540b.
The part 611b that pin configuration 610b is positioned at packaging body 100 is a rectangle; Be fixedly connected with the breakover point of brace 310b; It is a folding type terminal pin 612b that chip lead-in wire 610b extends the outer part of packaging body 100b, and folding type terminal pin 612b is fitted in the bottom surface of packaging body 100b; The part 621b that chip lead-in wire 620b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the breakover point of brace 320b; It is a folding type terminal pin 622b that chip lead-in wire 620b extends the outer part of packaging body 100b, and folding type terminal pin 622b is fitted in the bottom surface of packaging body 100b.
Part 611b, the chip lead-in wire 620b that pin configuration 610b is positioned at packaging body 100 is positioned at the part 621b of packaging body 100b, part 211b that support chip 210b is positioned at packaging body 100b, part 221b that support chip 220b is positioned at packaging body 100b is in the same plane, and the bottom surface of folding type terminal pin 612b, 622b, 212b, 222b is in the same plane.Folding type terminal pin 612b, 622b constitute the ac input end of bridge heap; Folding type terminal pin 212b constitutes the cathode output end of bridge heap; Folding type terminal pin 222b constitutes the cathode output end of bridge heap; Be positioned at the diagonal angle of packaging body 100a as folding type terminal pin 222b, the 212b of positive and negative electrode output, as the folding type terminal pin 612b of ac input end, another diagonal angle that 622b is positioned at packaging body 100a.
Embodiment 11
Referring to Figure 12; Square formula bridge shown in figure heap, the packaging body 100b that comprises a square shape be arranged on two support chip 210b in the packaging body 100b, 220b, two bump contacted chip 310b, 320b, four diode chip for backlight unit 510b, 520b, 530b, 540b and two pin configuration 610b, 620b.Two bump contacted chip 310b, 320b structure are identical, roughly become L shaped shape.The structure of two support chip 210b, 220b is also identical.The structure of two pin configuration 610b, 620b is also identical.
On bridge heap thickness direction, two bump contacted chip 310b, 320b are positioned at the upper strata, and four diode chip for backlight unit 510b, 520b, 530b, 540b are positioned at the intermediate layer, and two support chip 210b, 220b and two pin configuration 610b, 620b are positioned at lower floor.
On the top plan view of bridge heap, two support chip 210b, 220b are positioned at the diagonal position of packaging body 100b, and two pin configuration 610b, 620b are positioned at another diagonal position of packaging body 100b.
The part 211b that support chip 210b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the positive terminal of diode chip for backlight unit 510b and the negative pole end of diode chip for backlight unit 520b; It is a folding type terminal pin 212b that support chip 210b support chip 210b extends the outer part of packaging body 100b, and folding type terminal pin 212b is fitted in the bottom surface of packaging body 100b; The part 221b that support chip 220b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the positive terminal of diode chip for backlight unit 530b and the negative pole end of diode chip for backlight unit 540b; It is a folding type terminal pin 222b that support chip 220b support chip 220b extends the outer part of packaging body 100b, and folding type terminal pin 222b is fitted in the bottom surface of packaging body 100b.
The end of brace 310b is fixedly connected with the negative pole end of diode chip for backlight unit 510b, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 530b; The end of brace 320b is fixedly connected with the positive terminal of diode chip for backlight unit 520b, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 540b.
The part 611b that pin configuration 610b is positioned at packaging body 100 is a rectangle; Be fixedly connected with the breakover point of brace 310b; It is a folding type terminal pin 612b that chip lead-in wire 610b extends the outer part of packaging body 100b, and folding type terminal pin 612b is fitted in the bottom surface of packaging body 100b; The part 621b that chip lead-in wire 620b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the breakover point of brace 320b; It is a folding type terminal pin 622b that chip lead-in wire 620b extends the outer part of packaging body 100b, and folding type terminal pin 622b is fitted in the bottom surface of packaging body 100b.
Part 611b, the chip lead-in wire 620b that pin configuration 610b is positioned at packaging body 100 is positioned at the part 621b of packaging body 100b, part 211b that support chip 210b is positioned at packaging body 100b, part 221b that support chip 220b is positioned at packaging body 100b is in the same plane, and the bottom surface of folding type terminal pin 612b, 622b, 212b, 222b is in the same plane.Folding type terminal pin 212b, 222b constitute the ac input end of bridge heap; Folding type terminal pin 612b constitutes the cathode output end of bridge heap; Folding type terminal pin 622b constitutes the cathode output end of bridge heap; Be positioned at the diagonal angle of packaging body 100a as folding type terminal pin 622b, the 612b of positive and negative electrode output, as the folding type terminal pin 212b of ac input end, another diagonal angle that 222b is positioned at packaging body 100a.
Embodiment 12
Referring to Figure 13; Square formula bridge shown in figure heap, the packaging body 100b that comprises a square shape be arranged on two support chip 210b in the packaging body 100b, 220b, two bump contacted chip 310b, 320b, four diode chip for backlight unit 510b, 520b, 530b, 540b and two pin configuration 610b, 620b.Two bump contacted chip 310b, 320b structure are identical, roughly become L shaped shape.The structure of two support chip 210b, 220b is also identical.The structure of two pin configuration 610b, 620b is also identical.
On bridge heap thickness direction, two bump contacted chip 310b, 320b are positioned at the upper strata, and four diode chip for backlight unit 510b, 520b, 530b, 540b are positioned at the intermediate layer, and two support chip 210b, 220b and two pin configuration 610b, 620b are positioned at lower floor.
On the top plan view of bridge heap, two support chip 210b, 220b are positioned at the diagonal position of packaging body 100b, and two pin configuration 610b, 620b are positioned at another diagonal position of packaging body 100b.
The part 211b that support chip 210b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the negative pole end of diode chip for backlight unit 510b and the positive terminal of diode chip for backlight unit 520b; It is a folding type terminal pin 212b that support chip 210b support chip 210b extends the outer part of packaging body 100b, and folding type terminal pin 212b is fitted in the bottom surface of packaging body 100b; The part 221b that support chip 220b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the negative pole end of diode chip for backlight unit 530b and the positive terminal of diode chip for backlight unit 540b; It is a folding type terminal pin 222b that support chip 220b support chip 220b extends the outer part of packaging body 100b, and folding type terminal pin 222b is fitted in the bottom surface of packaging body 100b.
The end of brace 310b is fixedly connected with the positive terminal of diode chip for backlight unit 510b, and the other end is fixedly connected with the positive terminal of diode chip for backlight unit 530b; The end of brace 320b is fixedly connected with the negative pole end of diode chip for backlight unit 520b, and the other end is fixedly connected with the negative pole end of diode chip for backlight unit 540b.
The part 611b that pin configuration 610b is positioned at packaging body 100 is a rectangle; Be fixedly connected with the breakover point of brace 310b; It is a folding type terminal pin 612b that chip lead-in wire 610b extends the outer part of packaging body 100b, and folding type terminal pin 612b is fitted in the bottom surface of packaging body 100b; The part 621b that chip lead-in wire 620b is positioned at packaging body 100b is a rectangle; Be fixedly connected with the breakover point of brace 320b; It is a folding type terminal pin 622b that chip lead-in wire 620b extends the outer part of packaging body 100b, and folding type terminal pin 622b is fitted in the bottom surface of packaging body 100b.
Part 611b, the chip lead-in wire 620b that pin configuration 610b is positioned at packaging body 100 is positioned at the part 621b of packaging body 100b, part 211b that support chip 210b is positioned at packaging body 100b, part 221b that support chip 220b is positioned at packaging body 100b is in the same plane, and the bottom surface of folding type terminal pin 612b, 622b, 212b, 222b is in the same plane.Folding type terminal pin 212b, 222b constitute the ac input end of bridge heap; Folding type terminal pin 612b constitutes the cathode output end of bridge heap; Folding type terminal pin 622b constitutes the cathode output end of bridge heap; Be positioned at the diagonal angle of packaging body 100a as folding type terminal pin 612b, the 622b of positive and negative electrode output, as the folding type terminal pin 212b of ac input end, another diagonal angle that 222b is positioned at packaging body 100a.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.

Claims (17)

1. square formula bridge heap comprises a packaging body and two support chips, two bump contacted chips, four diode chip for backlight unit of being arranged in the packaging body; On bridge heap thickness direction, two bump contacted chips are positioned at the upper strata, and four diode chip for backlight unit are positioned at the intermediate layer, and two support chips are positioned at lower floor; On the top plan view of bridge heap; On the top plan view of bridge heap, on the top plan view of bridge heap, be fixedly connected with two diode chip for backlight unit on each piece support chip; And each bump contacted chip respectively with two support chips on each diode chip for backlight unit be fixedly connected; It is characterized in that said packaging body is a square formula structure, the diagonal angle that said two support chips are positioned at packaging body constitutes ac input end; This square formula bridge heap also comprises two pin configurations that are fixedly connected with two bump contacted chips respectively, and two pin configurations are positioned at another diagonal angle of packaging body, and said two support chips and two pin configurations constitute positive and negative electrode output and the ac input end that bridge is piled.
2. square formula bridge heap as claimed in claim 1 is characterized in that the structure of said two bump contacted chips is identical, and the structure of two support chips is identical, and the structure of two pin configurations is identical.
3. according to claim 1 or claim 2 square formula bridge heap; It is characterized in that said two support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace; Two each pin configurations are divided into first, second pin configuration; Four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, and wherein said first pin configuration is the first column terminal pin, and the said first column terminal pin is fixedly connected with said first brace; Said second pin configuration is the second column terminal pin, and the said second column terminal pin is fixedly connected with said second brace; Described square formula bridge heap also comprises the 3rd column terminal pin and the 4th column terminal pin, and the 3rd column terminal pin is fixedly connected with the bottom surface of said first support chip, and the 4th column terminal pin is fixedly connected with the bottom surface of said second support chip; The 3rd column terminal pin and the 4th column terminal pin are positioned at a diagonal angle of packaging body, and the first column terminal pin and second column lead-in wire are positioned at another diagonal angle of packaging body; First, second, third and fourth column lead-in wire constitutes the positive and negative electrode output and the ac input end of bridge heap.
4. square formula bridge heap as claimed in claim 3 is characterized in that the positive terminal of first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first column terminal pin and the second column terminal pin are as the ac input end of bridge heap; The 3rd column terminal pin is as the cathode output end of bridge heap, and the 4th column terminal pin is as the cathode output end of bridge heap.
5. square formula bridge heap as claimed in claim 3 is characterized in that the negative pole end of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first column terminal pin and the second column terminal pin are as the ac input end of bridge heap; The 3rd column terminal pin is as the cathode output end of bridge heap, and the 4th column terminal pin is as the cathode output end of bridge heap.
6. square formula bridge heap as claimed in claim 3; It is characterized in that; The negative pole end of the positive terminal of said first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the negative pole end of the positive terminal of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first column terminal pin is as the cathode output end of bridge heap; The second column terminal pin is as the cathode output end of bridge heap, and the 3rd column terminal pin and the 4th column terminal pin are as the ac input end of bridge heap.
7. square formula bridge heap as claimed in claim 3; It is characterized in that; The positive terminal of the negative pole end of said first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the positive terminal of the negative pole end of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first column terminal pin is as the cathode output end of bridge heap; The second column terminal pin is as the cathode output end of bridge heap, and the 3rd column terminal pin and the 4th column terminal pin are as the ac input end of bridge heap.
8. according to claim 1 or claim 2 square formula bridge heap; It is characterized in that said two support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace; Two each pin configurations are divided into first, second pin configuration; Four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, and wherein said first pin configuration comprises first chip lead-in wire, and the front of said first chip lead-in wire is fixedly connected with said first brace; Said second pin configuration comprises second chip lead-in wire, and the front of said second chip lead-in wire is fixedly connected with said second brace; Packaging body is all exposed with the bottom surface of first and second chip lead-in wire in the bottom surface of said first and second support chip, and the bottom surface of first and second support chip is positioned at a diagonal angle of packaging body, and the bottom surface of first and second chip lead-in wire is positioned at another diagonal angle of packaging body; Constitute the positive and negative electrode output and the ac input end of bridge heap.
9. square formula bridge heap as claimed in claim 8 is characterized in that the positive terminal of first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the bottom surface of the bottom surface of first chip lead-in wire and second chip lead-in wire is as the ac input end of bridge heap; The bottom surface of first support chip is as the cathode output end of bridge heap, and the bottom surface of second support chip is as the cathode output end of bridge heap.
10. square formula bridge heap as claimed in claim 8 is characterized in that the negative pole end of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, and the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the bottom surface of the bottom surface of first chip lead-in wire and second chip lead-in wire is as the ac input end of bridge heap; The bottom surface of first support chip is as the cathode output end of bridge heap, and the bottom surface of second support chip is as the cathode output end of bridge heap.
11. square formula bridge heap as claimed in claim 8; It is characterized in that; The negative pole end of the positive terminal of said first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the negative pole end of the positive terminal of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the bottom surface of first chip lead-in wire is as the cathode output end of bridge heap; The bottom surface of second chip lead-in wire is as the cathode output end of bridge heap, and the bottom surface of the bottom surface of first support chip and second support chip is as the ac input end of bridge heap.
12. square formula bridge heap as claimed in claim 8; It is characterized in that; The positive terminal of the negative pole end of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the positive terminal of the negative pole end of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the bottom surface of first chip lead-in wire is as the cathode output end of bridge heap; The bottom surface of second chip lead-in wire is as the cathode output end of bridge heap, and the bottom surface of the bottom surface of first support chip and second support chip is as the ac input end of bridge heap.
13. the heap of square formula bridge according to claim 1 or claim 2; It is characterized in that said two support chips are divided into first, second support chip, two bump contacted chips are divided into first, second brace; Two each pin configurations are divided into first, second pin configuration; Four diode chip for backlight unit are divided into first, second, third, fourth diode chip for backlight unit, and wherein said first pin configuration comprises first chip lead-in wire, and the front of said first chip lead-in wire is fixedly connected with said first brace; Said second pin configuration comprises second chip lead-in wire, and the front of said second chip lead-in wire is fixedly connected with said second brace; Said first chip lead-in wire is provided with the first folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; Said second chip lead-in wire is provided with the second folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; Said first support chip is provided with the 3rd folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; Said second support chip is provided with the 4th folding type terminal pin that extends packaging body and be fitted in the packaging body bottom surface; The 3rd folding type terminal pin and the 4th folding type terminal pin are positioned at a diagonal angle of packaging body; The first folding type terminal pin and the second folding type terminal pin are positioned at another diagonal angle of packaging body, constitute the positive and negative electrode output and the ac input end of bridge heap.
14. square formula bridge heap as claimed in claim 13 is characterized in that the positive terminal of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, the negative pole end of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin and the second folding type terminal pin are as the ac input end of bridge heap; The 3rd folding type terminal pin is as the cathode output end of bridge heap, and the 4th folding type terminal pin is as the cathode output end of bridge heap.
15. square formula bridge heap as claimed in claim 13 is characterized in that the negative pole end of said first, second diode chip for backlight unit is fixedly connected with the front of first support chip, the positive terminal of the 3rd, the 4th diode chip for backlight unit is fixedly connected with the front of second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin and the second folding type terminal pin are as the ac input end of bridge heap; The 3rd folding type terminal pin is as the cathode output end of bridge heap, and the 4th folding type terminal pin is as the cathode output end of bridge heap.
16. square formula bridge heap as claimed in claim 13; It is characterized in that; The negative pole end of the positive terminal of said first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the negative pole end of the positive terminal of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the negative pole end of first diode chip for backlight unit and the negative pole end of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the positive terminal of second diode chip for backlight unit and the positive terminal of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin is as the cathode output end of bridge heap; The second folding type terminal pin is as the cathode output end of bridge heap, and the 3rd folding type terminal pin and the 4th folding type terminal pin are as the ac input end of bridge heap.
17. square formula bridge heap as claimed in claim 13; It is characterized in that; The positive terminal of the negative pole end of first diode chip for backlight unit and second diode chip for backlight unit is fixedly connected with first support chip, and the positive terminal of the negative pole end of the 3rd diode chip for backlight unit and the 4th diode chip for backlight unit is fixedly connected with second support chip; First brace is fixedly connected with the positive terminal of first diode chip for backlight unit and the positive terminal of the 3rd diode chip for backlight unit; Second brace is fixedly connected with the negative pole end of second diode chip for backlight unit and the negative pole end of the 4th diode chip for backlight unit; Wherein the first folding type terminal pin is as the cathode output end of bridge heap; The second folding type terminal pin is as the cathode output end of bridge heap, and the 3rd folding type terminal pin and the 4th folding type terminal pin are as the ac input end of bridge heap.
CN2011101616996A 2011-06-15 2011-06-15 Block bridge pile Pending CN102832207A (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2018024042A1 (en) * 2016-08-05 2018-02-08 苏州固锝电子股份有限公司 Bridge rectifier device having enhanced heat dissipation performance

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JPS5615058A (en) * 1979-07-16 1981-02-13 Mitsubishi Electric Corp Composite semiconductor device
JPS5683055A (en) * 1979-12-11 1981-07-07 Mitsubishi Electric Corp Rectifying diode bridge
CN201812815U (en) * 2010-07-27 2011-04-27 苏州固锝电子股份有限公司 Rectifier for preventing crystal grains from drifting
CN202084544U (en) * 2011-06-15 2011-12-21 上海金克半导体设备有限公司 Diamond bridge rectifier

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Publication number Priority date Publication date Assignee Title
JPS5615058A (en) * 1979-07-16 1981-02-13 Mitsubishi Electric Corp Composite semiconductor device
JPS5683055A (en) * 1979-12-11 1981-07-07 Mitsubishi Electric Corp Rectifying diode bridge
CN201812815U (en) * 2010-07-27 2011-04-27 苏州固锝电子股份有限公司 Rectifier for preventing crystal grains from drifting
CN202084544U (en) * 2011-06-15 2011-12-21 上海金克半导体设备有限公司 Diamond bridge rectifier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018024042A1 (en) * 2016-08-05 2018-02-08 苏州固锝电子股份有限公司 Bridge rectifier device having enhanced heat dissipation performance

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Application publication date: 20121219