CN102791452B - 树脂模具 - Google Patents
树脂模具 Download PDFInfo
- Publication number
- CN102791452B CN102791452B CN201180012708.3A CN201180012708A CN102791452B CN 102791452 B CN102791452 B CN 102791452B CN 201180012708 A CN201180012708 A CN 201180012708A CN 102791452 B CN102791452 B CN 102791452B
- Authority
- CN
- China
- Prior art keywords
- resin
- methyl
- acrylate
- resin die
- fluorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3807—Resin-bonded materials, e.g. inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C2033/385—Manufacturing moulds, e.g. shaping the mould surface by machining by laminating a plurality of layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-053194 | 2010-03-10 | ||
JP2010053194 | 2010-03-10 | ||
PCT/JP2011/055505 WO2011111741A1 (ja) | 2010-03-10 | 2011-03-09 | 樹脂モールド |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102791452A CN102791452A (zh) | 2012-11-21 |
CN102791452B true CN102791452B (zh) | 2015-07-08 |
Family
ID=44563542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180012708.3A Active CN102791452B (zh) | 2010-03-10 | 2011-03-09 | 树脂模具 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20130049255A1 (zh) |
EP (1) | EP2546041B1 (zh) |
JP (2) | JP5908214B2 (zh) |
KR (1) | KR101381489B1 (zh) |
CN (1) | CN102791452B (zh) |
TW (1) | TWI428225B (zh) |
WO (1) | WO2011111741A1 (zh) |
Families Citing this family (31)
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JP5691717B2 (ja) * | 2010-10-20 | 2015-04-01 | ダイキン工業株式会社 | インプリント用樹脂モールド材料組成物 |
JP5697407B2 (ja) * | 2010-11-11 | 2015-04-08 | 旭化成株式会社 | 感光性樹脂積層体 |
KR101565221B1 (ko) * | 2010-12-09 | 2015-11-02 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 미세 구조 적층체, 미세 구조 적층체의 제작 방법 및 미세 구조체의 제조 방법 |
JP5678728B2 (ja) * | 2011-03-03 | 2015-03-04 | 大日本印刷株式会社 | モールドおよびその製造方法 |
JP5839877B2 (ja) * | 2011-07-27 | 2016-01-06 | 旭化成イーマテリアルズ株式会社 | スピンコート用樹脂鋳型 |
JP6067290B2 (ja) * | 2011-09-13 | 2017-01-25 | 旭化成株式会社 | メタマテリアル転写用積層体及びメタマテリアル被転写基材の製造方法 |
KR102051976B1 (ko) * | 2011-12-28 | 2020-01-08 | 오지 홀딩스 가부시키가이샤 | 유기발광다이오드, 유기발광다이오드의 제조방법, 화상표시장치 및 조명장치 |
WO2013154112A1 (ja) * | 2012-04-10 | 2013-10-17 | ダイキン工業株式会社 | インプリント用樹脂モールド材料組成物 |
JP2013237157A (ja) * | 2012-05-11 | 2013-11-28 | Kuraray Co Ltd | 樹脂成形体の製造方法、樹脂成形体、およびモールド |
US20150147533A1 (en) | 2012-05-25 | 2015-05-28 | Soken Chemical & Engineering Co., Ltd. | Photocurable Resin Composition for Imprinting, Production Method and Structure Thereof |
JP5990411B2 (ja) * | 2012-06-11 | 2016-09-14 | 旭化成株式会社 | 防塵膜の製造方法 |
EP3012097A3 (en) | 2012-06-13 | 2016-06-22 | Asahi Kasei E-materials Corporation | Function transfer product, functional layer transfer method, packed product, and function transfer film roll |
JP6176937B2 (ja) * | 2012-09-19 | 2017-08-09 | キヤノン株式会社 | インプリント用光硬化性組成物及び膜の製造方法 |
KR20150073954A (ko) | 2012-10-22 | 2015-07-01 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | 임프린트용 광경화성 수지 조성물, 임프린트용 몰드의 제조 방법 및 임프린트용 몰드 |
JP2014168868A (ja) | 2013-03-01 | 2014-09-18 | Sony Corp | 転写型および構造体の製造方法 |
MY176541A (en) * | 2013-11-07 | 2020-08-14 | Agc Inc | Mold release film and process for producing semiconductor package |
JP6324049B2 (ja) * | 2013-12-11 | 2018-05-16 | 旭化成株式会社 | 機能転写体及び機能層の転写方法 |
JP6371076B2 (ja) * | 2014-02-24 | 2018-08-08 | 旭化成株式会社 | フィルム状モールドの製造方法 |
JP6375135B2 (ja) * | 2014-04-23 | 2018-08-15 | 東洋合成工業株式会社 | 樹脂モールド及び複数の部品の製造方法 |
US11008466B2 (en) | 2016-07-08 | 2021-05-18 | Daikin Industries, Ltd. | Curable composition, process for producing same, and article produced therewith |
WO2018012340A1 (ja) * | 2016-07-12 | 2018-01-18 | シャープ株式会社 | 防汚性フィルム |
CN108474872B (zh) * | 2016-07-12 | 2020-04-21 | 夏普株式会社 | 防污性薄膜 |
WO2018173930A1 (ja) | 2017-03-23 | 2018-09-27 | Agc株式会社 | インプリント用硬化性組成物、レプリカモールドおよびその製造方法 |
KR102452035B1 (ko) | 2017-04-14 | 2022-10-11 | 삼성디스플레이 주식회사 | 소프트 몰드용 조성물, 이를 이용하여 제조된 소프트 몰드 |
JP2019096606A (ja) | 2017-11-21 | 2019-06-20 | 三菱マテリアル株式会社 | 絶縁導体および絶縁導体の製造方法 |
JP6734331B2 (ja) * | 2018-08-22 | 2020-08-05 | シャープ株式会社 | 防汚性フィルムの製造方法 |
JP2020152093A (ja) * | 2019-03-15 | 2020-09-24 | パナック株式会社 | 複合体の製造方法、及び複合体 |
CN110061079A (zh) * | 2019-05-22 | 2019-07-26 | 深圳市欧椰华新能源有限公司 | 一种太阳能电池板的表面封装膜及其制作方法 |
US20220339825A1 (en) | 2019-12-02 | 2022-10-27 | Ev Group E. Thallner Gmbh | Method and device for detaching a stamp |
JP7136831B2 (ja) * | 2020-04-08 | 2022-09-13 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | スタンパ構造を備えたスタンパ並びにその製造方法 |
US20220181165A1 (en) * | 2020-12-08 | 2022-06-09 | Compass Technology Company Limited | Fabrication Method of Flexible Cyclo-Olefin Polymer (COP) Substrate for IC Packaging of Communication Devices and Biocompatible Sensors Devices |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1845795A (zh) * | 2003-08-19 | 2006-10-11 | 纳诺普托公司 | 亚微米级构图方法和体系 |
CN101060995A (zh) * | 2004-11-24 | 2007-10-24 | 分子制模股份有限公司 | 在模具与可聚合组合物之间提供所需特性的方法和组合物 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US5907017A (en) * | 1997-01-31 | 1999-05-25 | Cornell Research Foundation, Inc. | Semifluorinated side chain-containing polymers |
DE10062203A1 (de) * | 2000-12-13 | 2002-06-20 | Creavis Tech & Innovation Gmbh | Verfahren zur Abformung von hydrophoben Polymeren zur Erzeugung von Oberflächen mit beständig wasser- und ölabweisenden Eigenschaften |
US6906115B2 (en) * | 2001-06-27 | 2005-06-14 | Daikin Industries, Ltd. | Surface treatment composition and preparation thereof |
US20050023433A1 (en) | 2003-07-31 | 2005-02-03 | Alps Electric Co., Ltd. | Resin optical component mold having minute concavo-convex portions and method of manufacturing resin optical component using the same |
JP2005047080A (ja) * | 2003-07-31 | 2005-02-24 | Alps Electric Co Ltd | 微細凹凸面を有する樹脂製光学部品成形用型及びこれを用いた樹脂製光学部品の製造方法 |
US20050116387A1 (en) * | 2003-12-01 | 2005-06-02 | Davison Peter A. | Component packaging apparatus, systems, and methods |
JP4500928B2 (ja) * | 2004-10-25 | 2010-07-14 | アルプス電気株式会社 | 金型の製造方法 |
JP2006198883A (ja) * | 2005-01-20 | 2006-08-03 | Asahi Glass Co Ltd | モールドおよび表面に微細パターンを有する物品 |
WO2008156177A1 (ja) | 2007-06-20 | 2008-12-24 | Asahi Glass Company, Limited | 酸化物ガラスの表面処理方法 |
JP5077110B2 (ja) * | 2007-07-23 | 2012-11-21 | 旭硝子株式会社 | ナノインプリント用モールドおよびその製造方法 |
KR101652680B1 (ko) * | 2008-05-29 | 2016-08-31 | 아사히 가라스 가부시키가이샤 | 광경화성 조성물 및 표면에 미세 패턴을 갖는 성형체의 제조 방법 |
JP2010053194A (ja) | 2008-08-27 | 2010-03-11 | Toyo Ink Mfg Co Ltd | 印刷インキバインダーおよび該バインダーを用いた印刷インキ組成物ならびに該印刷インキを用いた被覆物 |
WO2010029899A1 (ja) * | 2008-09-09 | 2010-03-18 | ダイキン工業株式会社 | フッ素ゴム架橋成形体の製造方法 |
JP5611519B2 (ja) * | 2008-10-29 | 2014-10-22 | 富士フイルム株式会社 | ナノインプリント用組成物、パターンおよびその形成方法 |
EP2199855B1 (en) * | 2008-12-19 | 2016-07-20 | Obducat | Methods and processes for modifying polymer material surface interactions |
JP6067290B2 (ja) * | 2011-09-13 | 2017-01-25 | 旭化成株式会社 | メタマテリアル転写用積層体及びメタマテリアル被転写基材の製造方法 |
-
2011
- 2011-03-09 WO PCT/JP2011/055505 patent/WO2011111741A1/ja active Application Filing
- 2011-03-09 KR KR1020127022992A patent/KR101381489B1/ko active IP Right Grant
- 2011-03-09 US US13/583,171 patent/US20130049255A1/en not_active Abandoned
- 2011-03-09 TW TW100107969A patent/TWI428225B/zh active
- 2011-03-09 CN CN201180012708.3A patent/CN102791452B/zh active Active
- 2011-03-09 EP EP11753399.2A patent/EP2546041B1/en active Active
- 2011-03-09 JP JP2011051063A patent/JP5908214B2/ja active Active
-
2015
- 2015-10-26 JP JP2015209564A patent/JP6038261B2/ja active Active
-
2018
- 2018-03-19 US US15/925,342 patent/US10766169B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1845795A (zh) * | 2003-08-19 | 2006-10-11 | 纳诺普托公司 | 亚微米级构图方法和体系 |
CN101060995A (zh) * | 2004-11-24 | 2007-10-24 | 分子制模股份有限公司 | 在模具与可聚合组合物之间提供所需特性的方法和组合物 |
Also Published As
Publication number | Publication date |
---|---|
EP2546041A4 (en) | 2013-11-27 |
US10766169B2 (en) | 2020-09-08 |
WO2011111741A1 (ja) | 2011-09-15 |
JP2011207221A (ja) | 2011-10-20 |
EP2546041B1 (en) | 2018-10-03 |
TWI428225B (zh) | 2014-03-01 |
JP2016026122A (ja) | 2016-02-12 |
EP2546041A1 (en) | 2013-01-16 |
KR20120128659A (ko) | 2012-11-27 |
CN102791452A (zh) | 2012-11-21 |
JP5908214B2 (ja) | 2016-04-26 |
TW201144027A (en) | 2011-12-16 |
KR101381489B1 (ko) | 2014-04-04 |
US20130049255A1 (en) | 2013-02-28 |
US20180207841A1 (en) | 2018-07-26 |
JP6038261B2 (ja) | 2016-12-07 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ASAHI CHEMICAL CORP. Free format text: FORMER OWNER: ASAHI KASEI KOGYO K.K. Effective date: 20131128 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20131128 Address after: Japan's Tokyo Chiyoda jimbocho Kanda a chome 105 times Applicant after: Asahi Chemical Corp. Address before: Japan's Osaka Osaka North Island in the three chome 3 No. 23 Applicant before: Asahi Kasei Kogyo K. K. |
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C14 | Grant of patent or utility model | ||
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20160511 Address after: Japan's Tokyo Chiyoda jimbocho Kanda a chome 105 times Patentee after: Asahi Kasei Kogyo K. K. Address before: Japan's Tokyo Chiyoda jimbocho Kanda a chome 105 times Patentee before: Asahi Chemical Corp. |