CN102737921B - 温度熔断器 - Google Patents
温度熔断器 Download PDFInfo
- Publication number
- CN102737921B CN102737921B CN201210096329.3A CN201210096329A CN102737921B CN 102737921 B CN102737921 B CN 102737921B CN 201210096329 A CN201210096329 A CN 201210096329A CN 102737921 B CN102737921 B CN 102737921B
- Authority
- CN
- China
- Prior art keywords
- conductor
- leading
- housing
- lid
- temperature fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims abstract description 159
- 239000000565 sealant Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 230000004907 flux Effects 0.000 description 12
- 229910001092 metal group alloy Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000010891 electric arc Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000003763 carbonization Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011082211A JP5782285B2 (ja) | 2011-04-01 | 2011-04-01 | 温度ヒューズ |
JP2011-082211 | 2011-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102737921A CN102737921A (zh) | 2012-10-17 |
CN102737921B true CN102737921B (zh) | 2016-12-14 |
Family
ID=46993214
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210096329.3A Expired - Fee Related CN102737921B (zh) | 2011-04-01 | 2012-04-01 | 温度熔断器 |
CN2012201383337U Expired - Fee Related CN202549763U (zh) | 2011-04-01 | 2012-04-01 | 温度熔断器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012201383337U Expired - Fee Related CN202549763U (zh) | 2011-04-01 | 2012-04-01 | 温度熔断器 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5782285B2 (zh) |
CN (2) | CN102737921B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5782285B2 (ja) * | 2011-04-01 | 2015-09-24 | 株式会社タムラ製作所 | 温度ヒューズ |
JP6437221B2 (ja) * | 2014-06-27 | 2018-12-12 | デクセリアルズ株式会社 | スイッチ素子、スイッチ回路及び警報回路 |
JP6437253B2 (ja) * | 2014-09-12 | 2018-12-12 | デクセリアルズ株式会社 | 保護素子及び実装体 |
EP3544041B1 (en) * | 2016-11-21 | 2021-09-15 | Sony Group Corporation | Connection member, moving body and power supply system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1327250A (zh) * | 2000-06-07 | 2001-12-19 | 三柱利特尔保险丝株式会社 | 微波炉高压保险丝组件及其制造方法 |
CN202549763U (zh) * | 2011-04-01 | 2012-11-21 | 田村温度部品有限公司 | 温度熔断器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147138U (ja) * | 1982-03-29 | 1983-10-03 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズ |
JPS59149355U (ja) * | 1983-03-25 | 1984-10-05 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズ |
JPS6076844U (ja) * | 1983-10-31 | 1985-05-29 | 関西日本電気株式会社 | 温度ヒユ−ズ |
JPH05205607A (ja) * | 1992-01-28 | 1993-08-13 | Techno Enajisu Kk | ヒューズ |
US6774760B2 (en) * | 2001-06-05 | 2004-08-10 | Cooper Technologies Company | Fuse element positioning body |
JP2005141912A (ja) * | 2003-11-04 | 2005-06-02 | Anzen Dengu Kk | 温度ヒューズ |
-
2011
- 2011-04-01 JP JP2011082211A patent/JP5782285B2/ja active Active
-
2012
- 2012-04-01 CN CN201210096329.3A patent/CN102737921B/zh not_active Expired - Fee Related
- 2012-04-01 CN CN2012201383337U patent/CN202549763U/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1327250A (zh) * | 2000-06-07 | 2001-12-19 | 三柱利特尔保险丝株式会社 | 微波炉高压保险丝组件及其制造方法 |
CN202549763U (zh) * | 2011-04-01 | 2012-11-21 | 田村温度部品有限公司 | 温度熔断器 |
Also Published As
Publication number | Publication date |
---|---|
CN102737921A (zh) | 2012-10-17 |
CN202549763U (zh) | 2012-11-21 |
JP5782285B2 (ja) | 2015-09-24 |
JP2012216478A (ja) | 2012-11-08 |
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Effective date of registration: 20160704 Address after: Tokyo, Japan, Japan Applicant after: Tamura Manufacturing Co., Ltd. Address before: Saitama Prefecture, Japan Applicant before: Tamura Temperature Component Corporation Applicant before: Tamura Manufacturing Co., Ltd. |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170103 Address after: Osaka Japan Patentee after: Uchihashi Estack Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: K.K. Tamura Seisakusho |
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Effective date of registration: 20170510 Address after: Tokyo, Japan, Japan Patentee after: Tamura Manufacturing Co., Ltd. Address before: Osaka Japan Patentee before: Uchihashi Estack Co., Ltd. |
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