CN102625564B - 屏蔽印刷电路板 - Google Patents
屏蔽印刷电路板 Download PDFInfo
- Publication number
- CN102625564B CN102625564B CN201110130678.8A CN201110130678A CN102625564B CN 102625564 B CN102625564 B CN 102625564B CN 201110130678 A CN201110130678 A CN 201110130678A CN 102625564 B CN102625564 B CN 102625564B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electric conductivity
- printed circuit
- insulating barrier
- cement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004568 cement Substances 0.000 claims abstract description 155
- 238000005728 strengthening Methods 0.000 claims abstract description 120
- 239000002245 particle Substances 0.000 claims abstract description 111
- 230000004888 barrier function Effects 0.000 claims abstract description 77
- 238000009434 installation Methods 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 19
- 239000010935 stainless steel Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 230000000052 comparative effect Effects 0.000 description 24
- 238000000034 method Methods 0.000 description 23
- 239000004020 conductor Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000005611 electricity Effects 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 241000555268 Dendroides Species 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 238000013461 design Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 230000006315 carbonylation Effects 0.000 description 3
- 238000005810 carbonylation reaction Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001568 sexual effect Effects 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical class CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 150000004657 carbamic acid derivatives Chemical class 0.000 description 1
- 229910021386 carbon form Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 230000003389 potentiating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-016554 | 2011-01-28 | ||
JP2011016554A JP5308465B2 (ja) | 2011-01-28 | 2011-01-28 | シールドプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102625564A CN102625564A (zh) | 2012-08-01 |
CN102625564B true CN102625564B (zh) | 2016-05-04 |
Family
ID=45346011
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110130678.8A Active CN102625564B (zh) | 2011-01-28 | 2011-05-16 | 屏蔽印刷电路板 |
CN2011201604157U Expired - Lifetime CN202085399U (zh) | 2011-01-28 | 2011-05-16 | 屏蔽印刷电路板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011201604157U Expired - Lifetime CN202085399U (zh) | 2011-01-28 | 2011-05-16 | 屏蔽印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5308465B2 (zh) |
KR (1) | KR101776711B1 (zh) |
CN (2) | CN102625564B (zh) |
TW (1) | TWI501708B (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5308465B2 (ja) * | 2011-01-28 | 2013-10-09 | タツタ電線株式会社 | シールドプリント配線板 |
JP5395854B2 (ja) * | 2011-08-11 | 2014-01-22 | タツタ電線株式会社 | プリント配線板及びプリント配線板の製造方法 |
WO2014077406A1 (ja) * | 2012-11-19 | 2014-05-22 | タツタ電線株式会社 | 積層フィルム及びシールドプリント配線板 |
WO2014132951A1 (ja) | 2013-02-26 | 2014-09-04 | タツタ電線株式会社 | フレキシブルプリント配線板用補強部材、フレキシブルプリント配線板、及び、シールドプリント配線板 |
KR102026751B1 (ko) * | 2013-05-28 | 2019-09-30 | 타츠타 전선 주식회사 | 형상 유지 필름, 및 이 형상 유지 필름을 구비한 형상 유지형 플렉시블 배선판 |
JP6239884B2 (ja) * | 2013-07-16 | 2017-11-29 | 住友電工プリントサーキット株式会社 | 電子部品及びその製造方法 |
CN103763893B (zh) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法 |
JP6409760B2 (ja) * | 2014-12-11 | 2018-10-24 | 東洋インキScホールディングス株式会社 | プリント配線板の製造方法 |
JP5861790B1 (ja) * | 2015-02-25 | 2016-02-16 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
JP6432439B2 (ja) * | 2015-04-28 | 2018-12-05 | 東芝ライテック株式会社 | 照明装置 |
JP6568436B2 (ja) * | 2015-09-15 | 2019-08-28 | 住友電気工業株式会社 | 電子部品、接着シート及び電子部品の製造方法 |
JP6187568B2 (ja) * | 2015-09-17 | 2017-08-30 | 東洋インキScホールディングス株式会社 | 電磁波シールド用積層体、電磁波シールド積層体、電子機器およびその製造方法 |
JP6194939B2 (ja) * | 2015-09-17 | 2017-09-13 | 東洋インキScホールディングス株式会社 | 電磁波シールド用積層体、電磁波シールド積層体、電子機器およびその製造方法 |
CN110235530A (zh) * | 2017-02-13 | 2019-09-13 | 拓自达电线株式会社 | 印制线路板 |
CN110958766B (zh) * | 2017-02-13 | 2023-10-17 | 拓自达电线株式会社 | 接地构件、屏蔽印制线路板及屏蔽印制线路板的制造方法 |
WO2019031555A1 (ja) * | 2017-08-09 | 2019-02-14 | タツタ電線株式会社 | 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 |
JP6566008B2 (ja) * | 2017-11-24 | 2019-08-28 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
CN108132113A (zh) * | 2018-01-31 | 2018-06-08 | 北京他山科技有限公司 | 应用多功能层实现电磁屏蔽的传感器、电子皮肤和机器人 |
CN108738226B (zh) * | 2018-05-04 | 2020-11-13 | 华显光电技术(惠州)有限公司 | 柔性电路板结构、背光组件与移动终端 |
CN110691497B (zh) * | 2018-07-06 | 2024-04-23 | 广州方邦电子股份有限公司 | 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 |
TWI771595B (zh) * | 2018-10-29 | 2022-07-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
TWI782213B (zh) * | 2018-10-29 | 2022-11-01 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
WO2020189686A1 (ja) | 2019-03-19 | 2020-09-24 | タツタ電線株式会社 | シールドプリント配線板、シールドプリント配線板の製造方法、及び、接続部材 |
CN110461086B (zh) * | 2019-08-30 | 2021-01-08 | 维沃移动通信有限公司 | 一种电路板、电路板制作方法及终端 |
CN111312078B (zh) * | 2020-03-05 | 2022-03-08 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其侧面邦定方法 |
TW202214050A (zh) * | 2020-09-18 | 2022-04-01 | 日商拓自達電線股份有限公司 | 附接地構件之屏蔽印刷配線板及接地構件 |
CN114286538B (zh) * | 2020-09-28 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | 具有插接手指的多层线路板及其制作方法 |
CN114325543B (zh) * | 2021-11-23 | 2024-03-22 | 国能朔黄铁路发展有限责任公司 | 电流互感器异常监测装置和控制方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW516352B (en) * | 2001-07-06 | 2003-01-01 | Advanced Semiconductor Eng | Manufacturing method for printed circuit board |
CN202085399U (zh) * | 2011-01-28 | 2011-12-21 | 大自达电线股份有限公司 | 屏蔽印刷电路板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002116455A (ja) * | 2000-08-01 | 2002-04-19 | Kyodo Printing Co Ltd | 液晶表示装置、液晶表示装置の電極基材及び液晶表示装置の製造方法 |
JP4843979B2 (ja) * | 2004-03-30 | 2011-12-21 | 住友ベークライト株式会社 | 回路基板 |
JP2009302327A (ja) * | 2008-06-13 | 2009-12-24 | Sharp Corp | 配線部材の接続構造およびそれを備えた太陽電池モジュールならびにその製造方法 |
JP5150534B2 (ja) * | 2009-03-06 | 2013-02-20 | 信越ポリマー株式会社 | カバーレイフィルム、その製造方法およびフレキシブルプリント配線板 |
-
2011
- 2011-01-28 JP JP2011016554A patent/JP5308465B2/ja active Active
- 2011-04-15 TW TW100113141A patent/TWI501708B/zh active
- 2011-05-12 KR KR1020110044562A patent/KR101776711B1/ko active IP Right Grant
- 2011-05-16 CN CN201110130678.8A patent/CN102625564B/zh active Active
- 2011-05-16 CN CN2011201604157U patent/CN202085399U/zh not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW516352B (en) * | 2001-07-06 | 2003-01-01 | Advanced Semiconductor Eng | Manufacturing method for printed circuit board |
CN202085399U (zh) * | 2011-01-28 | 2011-12-21 | 大自达电线股份有限公司 | 屏蔽印刷电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN102625564A (zh) | 2012-08-01 |
TWI501708B (zh) | 2015-09-21 |
KR20120087753A (ko) | 2012-08-07 |
KR101776711B1 (ko) | 2017-09-08 |
JP5308465B2 (ja) | 2013-10-09 |
CN202085399U (zh) | 2011-12-21 |
TW201233262A (en) | 2012-08-01 |
JP2012156457A (ja) | 2012-08-16 |
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