CN102540755A - Exposure apparatus, exposure method, and method of making panel substrate for display - Google Patents
Exposure apparatus, exposure method, and method of making panel substrate for display Download PDFInfo
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- CN102540755A CN102540755A CN2011103560872A CN201110356087A CN102540755A CN 102540755 A CN102540755 A CN 102540755A CN 2011103560872 A CN2011103560872 A CN 2011103560872A CN 201110356087 A CN201110356087 A CN 201110356087A CN 102540755 A CN102540755 A CN 102540755A
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- beam irradiation
- irradiation device
- optical system
- mirror
- substrate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Abstract
A clamp is made to move relatively to multiple light beam irradiating apparatuses (20). The multiple light beam irradiating apparatuses (20) comprise: a lamp optical system (20c) for providing light beams, a space optical modulator (25) used for changing the angles of several masks arranged in two directions, thus to modulate the light beams, a drive circuit (27) which drives the space optical modulator (25) based on depicted data, and an irradiating optical system (20b) which flashes out the light beams modulated by the space optical modulator (25), scans the substrate via several light beams coming from a plurality of light beam irradiating apparatuses, and draws out the pattern upon the substrate. According to the unevenness of the movement angles of the masks of the space optical modulator of the light beam irradiating apparatuses, the incident angles of the light beams supplied by the space optical modulator of the light beam irradiating apparatuses can be adjusted.
Description
Technical field
The manufacturing approach that the present invention relates to a kind of exposure device, exposure method and use display panel (panel) substrate of said exposure device and exposure method; Said exposure device is in the manufacture process of the display panel substrate of liquid crystal display (display) device etc.; (beam) exposes to the substrate that is coated with photoresist (photoresist) with light beam; Come substrate is scanned by light beam; On substrate, depict pattern (pattern); The manufacturing approach that The present invention be more particularly directed to following exposure device, exposure method and use the display panel substrate of said exposure device and exposure method, said exposure device uses a plurality of beam irradiation devices, comes substrate is scanned by many light beams.
Background technology
Use exposure device; On substrate, form pattern by photoetching (photolithography) technology; Thereby produce thin film transistor (TFT) (the Thin FilmTransistor of the liquid crystal indicator that is used as display panel; TFT) substrate or colored filter (color filter) substrate, plasma show that (plasma display) panel is with substrate and organic electroluminescent (Electroluminescence, EL) display panel substrate etc.As exposure device; In the past; The exposure device of existing projection (projection) mode and exposure device near (proximity) mode; The exposure device of said projection pattern be to use lens (lens) or mirror with the graphic pattern projection of light shield (mask) to substrate, said exposure device near mode is that small gap (near gap (proximity gap)) is set between light shield and substrate, with the pattern transfer of light shield to substrate.
In recent years, developed following exposure device, this exposure device be with light beam irradiates to the substrate that is coated with photoresist, come substrate is scanned by light beam, thereby on substrate, depict pattern.Come substrate is scanned by light beam, thereby directly on substrate, depict pattern, therefore, need not expensive light shield.In addition, can change corresponding to various types of display panel substrates by the program (program) that will describe data (data) and scanning.As this kind exposure device, the exposure device that for example existing patent documentation 1, patent documentation 2 and patent documentation 3 are disclosed.
[prior art document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid is opened the 2010-44318 communique
[patent documentation 2] Japanese Patent Laid is opened the 2010-60990 communique
[patent documentation 3] Japanese Patent Laid is opened the 2010-102084 communique
When on substrate, depicting pattern by light beam, (DigitalMicromirror Device, the spatial light modulator (spatial light modulator) that DMD) waits comes light beam is modulated to use DMD.DMD is arranged in a plurality of small face mirror (mirror) that light beam is reflected the both direction of quadrature and constitutes, and driving circuit changes based on describing the angle of data with each face mirror, and whereby, the light beam that the illumination optical system is supplied with is modulated.Shine to substrate through the light beam of spatial light modulator modulation the illuminating optical system that comprises projecting lens from beam irradiation device.
In the manufacture process of the display panel substrate of liquid crystal indicator etc.; Because the exposure area is wide; Therefore, if use a beam irradiation device, and come whole base plate is scanned by a light beam; Then the scanning for whole base plate can expend time in, and the working time, (tact time) was elongated.For the working time is shortened, must use a plurality of beam irradiation devices, and come concurrently substrate to be scanned by many light beams.
The operating angle of the face mirror of DMD exists by the caused inequality of the tolerance of each DMD.If the operating angle of the face mirror of DMD is different, then can squint through the face mirror reflection of DMD and the light path of light beam that sees through the illuminating optical system of projecting lens etc., the intensity distributions of the diffraction light of light beam can change.When using a plurality of beam irradiation devices; And when many light beams come substrate scanned, there is following problem, promptly; If exist uneven to the intensity distributions of the diffraction light of the light beam of substrate irradiation from each beam irradiation device; Then analysis feature can be uneven, can't depict pattern equably, and describing quality can descend.
Summary of the invention
Problem of the present invention is: when coming substrate is scanned by many light beams from a plurality of beam irradiation devices; When on substrate, depicting pattern; Inequality to the intensity distributions of the diffraction light of light beam is revised; Thereby make and describe quality and improve, the inequality of the intensity distributions of the diffraction light of said light beam is that the inequality by the operating angle of the face mirror of spatial light modulator causes.In addition, problem of the present invention is: make high-quality display panel substrate.
Exposure device of the present invention comprises: anchor clamps (chuck), supporting the substrate that is coated with photoresist; A plurality of beam irradiation devices; Have the lamp optical system of supplying with light beam, spatial light modulator, driving circuit, and illuminating optical system; The angle that said spatial light modulator will be arranged in a plurality of mirrors of both direction changes; Thereby light beam is modulated, and said driving circuit drives spatial light modulator based on describing data, and said illuminating optical system irradiates the light beam through the spatial light modulator modulation; And mobile unit; Anchor clamps and a plurality of beam irradiation device are relatively moved; By mobile unit anchor clamps and a plurality of beam irradiation device are relatively moved; Many light beams by from a plurality of beam irradiation devices come substrate is scanned, and on substrate, depict pattern, and each beam irradiation device comprises regulon; This regulon is according to the inequality of the operating angle of the face mirror of the spatial light modulator of each beam irradiation device, and the incident angle of the light beam that the spatial light modulator of each beam irradiation device of subtend is supplied with is regulated.
In addition; Exposure method of the present invention utilizes anchor clamps supporting to be coated with the substrate of photoresist; Anchor clamps and a plurality of beam irradiation device are relatively moved; Said a plurality of beam irradiation device comprises: supply with lamp optical system, spatial light modulator, driving circuit and the illuminating optical system of light beam, the angle that said spatial light modulator will be arranged in a plurality of mirrors of both direction changes, thereby light beam is modulated; Said driving circuit drives spatial light modulator based on describing data; Said illuminating optical system irradiates the light beam through the spatial light modulator modulation, comes substrate is scanned by many light beams from a plurality of beam irradiation devices, on substrate, depicts pattern; Said exposure method is the inequality according to the operating angle of the face mirror of the spatial light modulator of each beam irradiation device, and the incident angle of the light beam that the spatial light modulator of each beam irradiation device of subtend is supplied with is regulated.
Inequality according to the operating angle of the face mirror of the spatial light modulator of each beam irradiation device; The incident angle of the light beam that the spatial light modulator of each beam irradiation device of subtend is supplied with is regulated; Therefore; Even the operating angle of the face mirror of spatial light modulator exists uneven, the light path of the light beam of supplying with through the face mirror reflection of spatial light modulator and to illuminating optical system is also identical.Therefore, revised, describe quality and improve by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror of spatial light modulator.
And; For exposure device of the present invention, the lamp optical system of each beam irradiation device comprises the face mirror, and this face mirror makes beam reflection; Reflected light is supplied to the spatial light modulator of each beam irradiation device; The regulon of each beam irradiation device comprises: first module, according to the inequality of the operating angle of the face mirror of the spatial light modulator of each beam irradiation device, change the angle of the face mirror of the lamp optical system of each beam irradiation device; And Unit second, according to the angle of said mirror the position of said mirror is changed.
In addition; For exposure method of the present invention; In the lamp optical system of each beam irradiation device, the face mirror of utilization makes beam reflection, reflected light is supplied to the spatial light modulator of each beam irradiation device; Inequality according to the operating angle of the face mirror of the spatial light modulator of each beam irradiation device; The angle of the face mirror of the lamp optical system of each beam irradiation device is changed, and according to the angle of said mirror the position of said mirror is changed, the incident angle of the light beam that the spatial light modulator of each beam irradiation device of subtend is supplied with is regulated.
In the lamp optical system of each beam irradiation device; The face mirror of utilization makes beam reflection; Reflected light is supplied to the spatial light modulator of each beam irradiation device,, the angle of the face mirror of the lamp optical system of each beam irradiation device is changed according to the inequality of the operating angle of the face mirror of the spatial light modulator of each beam irradiation device; And the angle according to said mirror changes the position of said mirror; Therefore, need not to make whole lamp optical system to tilt, utilize the simple formation light beam that incident angle is different to be supplied to spatial light modulator.
And; For exposure device of the present invention, the lamp optical system of each beam irradiation device comprises optical element, and this optical element converges light beam; Then this light beam is supplied to the face mirror of the lamp optical system of each beam irradiation device; Unit second moves the whole lamp optical system of each beam irradiation device according to the angle of the face mirror of the lamp optical system of each beam irradiation device, and the position of said mirror is changed.
In addition; For exposure method of the present invention, in the lamp optical system of each beam irradiation device, utilize optical element that light beam is converged; Then this light beam is supplied to the face mirror of the lamp optical system of each beam irradiation device; Angle according to the face mirror of the lamp optical system of each beam irradiation device moves the whole lamp optical system of each beam irradiation device, and the position of said mirror is changed.
In the lamp optical system of each beam irradiation device; When the optical element that utilizes lens etc. converges light beam; When then this light beam being supplied to the face mirror of lamp optical system of each beam irradiation device, if individually the position of the face mirror of lamp optical system is changed, then in lamp optical system; The optical path length of light beam can change, Focus Club's skew of the light beam that converges because of the optical element of lens etc.Angle according to the face mirror of the lamp optical system of each beam irradiation device; The whole lamp optical system of each beam irradiation device is moved; The position of said mirror is changed; Therefore, the focus of the light beam that converges because of the optical element of lens etc. can not squint, and can be supplied to spatial light modulator by the light beam that incident angle is different.
The manufacturing approach of display panel substrate of the present invention uses said any exposure device or exposure method to come substrate is made public.By using said exposure device or exposure method, revised by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror of spatial light modulator, describe quality and improve, therefore, can make high-quality display panel substrate.
[effect of invention]
According to exposure device of the present invention and exposure method; Inequality according to the operating angle of the face mirror of the spatial light modulator of each beam irradiation device; The incident angle of the light beam that the spatial light modulator of each beam irradiation device of subtend is supplied with is regulated; Whereby, can be to revising by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror of spatial light modulator, describe quality and improve thereby can make.
And; According to exposure device of the present invention and exposure method, in the lamp optical system of each beam irradiation device, the face mirror of utilization makes beam reflection; Reflected light is supplied to the spatial light modulator of each beam irradiation device; According to the inequality of the operating angle of the face mirror of the spatial light modulator of each beam irradiation device, the angle of the face mirror of the lamp optical system of each beam irradiation device is changed, and the position of said mirror is changed according to the angle of said mirror; Therefore, the light beam that simple formation capable of using is different with incident angle is supplied to spatial light modulator.
And, according to exposure device of the present invention and exposure method, in the lamp optical system of each beam irradiation device; Utilize optical element that light beam is converged; Then this light beam is supplied to the face mirror of the lamp optical system of each beam irradiation device, the angle according to the face mirror of the lamp optical system of each beam irradiation device moves the whole lamp optical system of each beam irradiation device; Thereby the position of said mirror is changed; Whereby, can not make the focal shift of the light beam that converges because of optical element, can be supplied to spatial light modulator by the light beam that incident angle is different.
Manufacturing approach according to display panel substrate of the present invention; Can be to revising by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror of spatial light modulator; Describe the quality raising thereby can make, therefore, can make high-quality display panel substrate.
Description of drawings
Fig. 1 is the figure that the summary of the exposure device of expression an embodiment of the invention constitutes.
Fig. 2 is the side view of the exposure device of an embodiment of the invention.
Fig. 3 is the front elevation of the exposure device of an embodiment of the invention.
Fig. 4 is the figure that the summary of beam irradiation device of the exposure device of expression an embodiment of the invention constitutes.
Fig. 5 be the expression DMD face mirror portion one the example figure.
Fig. 6 is the figure that the action to the laser length measurement system describes.
Fig. 7 is the figure that the summary formation of control part is described in expression.
Fig. 8 A is the side view of face mirror fixed mount, and Fig. 8 B is the back view of face mirror fixed mount.
Fig. 9 is the stereographic map of XY platform.
Figure 10 is the figure that the exposure method to an embodiment of the invention describes.
Figure 11 is the figure that the exposure method to an embodiment of the invention describes.
Figure 12 is the figure that the exposure method to an embodiment of the invention describes.
Figure 13 is the figure that explanation utilizes the scanning that light beam comes substrate is carried out.
Figure 14 is the figure that explanation utilizes the scanning that light beam comes substrate is carried out.
Figure 15 is the figure that explanation utilizes the scanning that light beam comes substrate is carried out.
Figure 16 is the figure that explanation utilizes the scanning that light beam comes substrate is carried out.
Figure 17 be the expression liquid crystal indicator the TFT substrate manufacturing step one the example process flow diagram.
Figure 18 be the expression liquid crystal indicator colored filter substrate manufacturing step one the example process flow diagram.
1: substrate 3: pedestal
4:X guiding piece 5:X platform
6:Y guiding piece 7:Y platform
8: theta stage 10: anchor clamps
11: door 20: beam irradiation device
20a: head 20b: illuminating optical system
20c: lamp optical system 21: LASER Light Source unit
22: optical fiber 23a: collimation lens
23b: fly's-eye lens 23c: collector lens
24a, 24b: face mirror 25: digital micro-mirror device (DMD)
25a: face mirror 26: projecting lens
27:DMD driving circuit 31,33: linear scale
32,34: scrambler 40: the laser length measurement system control device
41: LASER Light Source 42,44: laser interferometer
43,45: 51: the first prisms of excellent mirror
51a: 52: the second prisms of reflecting surface
54: face mirror fixed mount 54a: back up pad
54b: body 54c: draft helical spring
54d: set screw 55:XY platform
55a: platform base 55b:X platform
55c: Y platform 55d, 55e: adjusting knob
60: platform driving circuit 70: main control unit
71: describe control part 72: storer
73: bandwidth settings portion 74: central point coordinate determination section
75: coordinate determination section 101～106,201～204: step
W: bandwidth X, Y, Z, θ: direction
Embodiment
Fig. 1 is the figure that the summary of the exposure device of expression an embodiment of the invention constitutes.In addition, Fig. 2 is the side view of the exposure device of an embodiment of the invention, and Fig. 3 is the front elevation of the exposure device of an embodiment of the invention.Exposure device comprises: pedestal (base) 3, X guiding piece (guide) 4, X platform (stage) 5, Y guiding piece 6, Y platform 7, theta stage 8, anchor clamps 10, door (gate) 11, beam irradiation device 20, linear scale (linear scale) 31, linear scale 33, scrambler (encoder) 32, scrambler 34, laser (laser) length measurement system, laser length measurement system control device 40, platform driving circuit 60 and main control unit 70.Moreover, among Fig. 2 and Fig. 3, omitted LASER Light Source 41, laser length measurement system control device 40, platform driving circuit 60 and the main control unit 70 of laser length measurement system.Exposure device is except comprising said member; Also comprise substrate transferring mechanical arm (robot), temperature control unit (unit) etc.; Said substrate transferring mechanical arm moves into substrate 1 to anchor clamps 10; And substrate 1 is taken out of from anchor clamps 10, and said temperature control unit is managed the temperature in installing.
Moreover, below XY direction in the illustrated embodiment be illustration, also can change directions X and Y direction.
Among Fig. 1 and Fig. 2, anchor clamps 10 are positioned at the delivery location that substrate 1 is sent.At this delivery location place, by not shown substrate transferring mechanical arm substrate 1 is moved into to anchor clamps 10, in addition, substrate 1 is taken out of from anchor clamps 10 by not shown substrate transferring mechanical arm.Vacuum suction is carried out at the back side of 10 pairs of substrates 1 of anchor clamps, thereby is supporting the back side of this substrate 1.The surfaces coated of substrate 1 is furnished with photoresist.
Above the exposure position that substrate 1 is made public, cross over pedestal 3 ground and be provided with door (gate) 11.This door 11 is equipped with a plurality of beam irradiation devices 20.Moreover this embodiment has represented to use the example of the exposure device of eight beam irradiation devices 20, but the quantity of beam irradiation device is not limited thereto, and the present invention is applicable to the exposure device that uses plural beam irradiation device.
Fig. 4 is the figure that the summary of beam irradiation device of the exposure device of expression an embodiment of the invention constitutes.Beam irradiation device 20 comprises: and illuminating optical system 20b, lamp optical system 20c, optical fiber (optical fiber) 22, digital micro-mirror device (Digital MicromirrorDevice, DMD) 25, DMD driving circuit 27, first prism (prism) 51, second prism 52, face mirror fixed mount (mirror holder) 54 and XY platform 55.Illuminating optical system 20b comprises projecting lens 26.In addition, lamp optical system 20c comprises: collimation lens (collimationlens) 23a, fly's-eye lens (fly eye lens) 23b, collector lens (condenser lens) 23c, face mirror 24a and face mirror 24b.
DMD25 is a spatial light modulator, and this spatial light modulator is to make a plurality of small face mirror of beam reflection be arranged in the both direction of quadrature and constitute, and this DMD25 changes the angle of each face mirror come light beam is modulated.DMD driving circuit 27 is described data based on what main control unit 70 supplied with, and the angle of each face mirror of DMD25 is changed.Through the light beam of DMD25 modulation once more to 52 incidents of second prism, then by the reflection of the inclined-plane of second prism 52, from second prism 52 to the illuminating optical system 20b incident that comprises projecting lens 26.Light beam to illuminating optical system 20b incident shines to substrate 1 from illuminating optical system 20b.
Among Fig. 2 and Fig. 3, anchor clamps 10 are equipped on theta stage 8, below theta stage 8, are provided with Y platform 7 and X platform 5.This X platform 5 is equipped on X guiding piece 4 set on the pedestal 3, and moves to directions X along X guiding piece 4.Y platform 7 is equipped on Y guiding piece 6 set on the X platform 5, and moves to the Y direction along Y guiding piece 6.Theta stage 8 is equipped on Y platform 7, and rotates to the θ direction.In X platform 5, Y platform 7 and theta stage 8; Be provided with the not shown driving mechanism of ball screw (ball screw) and motor (motor) or linear motor (linear motor) etc., each driving mechanism is that the platform driving circuit 60 by Fig. 1 drives.
Fig. 5 be the expression DMD face mirror portion one the example figure.The DMD25 of beam irradiation device 20 is configured to respect to the tilt angle θ of regulation of Z direction, and this Z direction is with to be used to light beam from beam irradiation device 20 direction of scanning (directions X (the accompanying drawing depth direction of Fig. 5)) when coming substrate 1 scanned vertical.If be with respect to the Z direction and dispose DMD25 obliquely, then be arranged in any the face mirror 25a among a plurality of the mirror 25a of both direction of quadrature, will and the face mirror 25a of adjacency between corresponding position, gap cover, therefore, can seamlessly depict pattern.
Moreover; In this embodiment, utilize X platform 5 that anchor clamps 10 are moved to directions X, whereby; Be used to come substrate 1 is scanned from the light beam of beam irradiation device 20; But beam irradiation device 20 is moved, whereby, be used to come substrate 1 is scanned from the light beam of beam irradiation device 20.In addition, in this embodiment, utilize Y platform 7 that anchor clamps 10 are moved to the Y direction; Whereby, scanning area is changed, this scanning area is to be used to light beam from beam irradiation device 20 scanning area when coming substrate 1 scanned; But beam irradiation device 20 is moved; Whereby, scanning area is changed, this scanning area is to be used to light beam from beam irradiation device 20 scanning area when coming substrate 1 scanned.
Among Fig. 1 and Fig. 2, pedestal 3 is provided with the linear scale 31 to the directions X elongation.Subsidiary on linear scale 31 have following scale, and this scale detects in order to the amount of movement towards directions X to X platform 5.In addition, X platform 5 is provided with the linear scale 33 to the elongation of Y direction.Subsidiary on linear scale 33 have following scale, and this scale detects in order to the amount of movement towards the Y direction to Y platform 7.
Among Fig. 1 and Fig. 3, a side at X platform 5 is equipped with scrambler 32 in opposite directions with linear scale 31.The scale of 32 pairs of linear scales 31 of this scrambler detects, and exports pulse (pulse) signal to main control unit 70.In addition, among Fig. 1 and Fig. 2, a side at Y platform 7 is equipped with scrambler 34 in opposite directions with linear scale 33.The scale of 34 pairs of linear scales 33 of scrambler detects, and exports pulse signal to main control unit 70.The pulse signal of 70 pairs of scramblers 32 of this main control unit is counted (count); Thereby the amount of movement towards directions X to X platform 5 detects; And the pulse signal to scrambler 34 is counted, thereby the amount of movement towards the Y direction of Y platform 7 is detected.
Fig. 6 is the figure that the action to the laser length measurement system describes.Moreover, among Fig. 6, omitted door 11 and beam irradiation device 20 shown in Figure 1.The laser length measurement system is the length measurement system of well-known laser interference formula, and this laser length measurement system comprises: LASER Light Source 41, laser interferometer 42, laser interferometer 44, excellent mirror (bar mirror) 43 and excellent mirror 45.Rod mirror 43 is installed on a side to the elongation of Y direction of anchor clamps 10.In addition, excellent mirror 45 is installed on a side to the directions X elongation of anchor clamps 10.
On the other hand; Laser interferometer 44 will be from laser beam irradiation to the excellent mirror 45 of LASER Light Source 41; And receive 45 laser light reflected light beams of excellent mirror, thereby to measuring from the laser beam of LASER Light Source 41 and the interference between 45 laser light reflected light beams of excellent mirror.Laser length measurement system control device 40 is by the control of main control unit 70, comes the position of the Y direction of anchor clamps 10 is detected according to the mensuration result of laser interferometer 44.
Among Fig. 4, main control unit 70 comprises describes control part, and this describes control part will describe the DMD driving circuit 27 that data are supplied to beam irradiation device 20.Fig. 7 is the figure that the summary formation of control part is described in expression.Describing control part 71 comprises: storer (memory) 72, bandwidth (bandwidth) configuration part 73, central point coordinate determination section 74 and coordinate determination section 75.The XY coordinate that storer 72 will be described data is stored as address (address), this describe data be supplied to each beam irradiation device 20 DMD driving circuit 27 describe data.
The Building Y target scope of describing data that bandwidth settings portion 73 decision is read from storer 72, whereby, the bandwidth of the Y direction of the light beam that the illuminating optical system 20b from beam irradiation device 20 is irradiated is set.
40 pairs of following positions of laser length measurement system control device are detected, and this position is to begin substrate 1 to the exposure position position of anchor clamps 10 on the XY direction before making public.Central point coordinate determination section 74 is according to the detected position of anchor clamps 10 on the XY direction of laser length measurement system control device 40, the XY coordinate of the central point of the anchor clamps 10 before decision begins substrate 1 made public.Among Fig. 1, when coming by the light beam from beam irradiation device 20 substrate 1 scanned, 70 pairs of platform driving circuits 60 of main control unit are controlled, and by X platform 5 anchor clamps 10 are moved to directions X.When in the scanning area of substrate 1, moving, 70 pairs of platform driving circuits 60 of main control unit are controlled, and by Y platform 7 anchor clamps 10 are moved to the Y direction.Among Fig. 7; 74 pairs of pulse signals from scrambler 32, scrambler 34 of central point coordinate determination section are counted; To detecting of X platform 5 towards the amount of movement of directions X and the amount of movement towards the Y direction of Y platform 7, thus the XY coordinate of the central point of decision anchor clamps 10.
The XY coordinate of the central point of the anchor clamps 10 that coordinate determination section 75 is determined based on central point coordinate determination section 74, the XY coordinate of data is described in decision, this describe data be supplied to each beam irradiation device 20 DMD driving circuit 27 describe data.Storer 72 is imported the XY coordinate that coordinate determination section 75 determined as address, that is stored in the address with the XY coordinate of having imported describes the DMD driving circuit 27 that data export each beam irradiation device 20 to.
Below, the exposure method of an embodiment of the invention is described.Among Fig. 5, each face mirror 25a of DMD25 is a square, and making each face mirror 25a serves as that axle rotates with one of which bar diagonal line, and the angle with each face mirror 25a changes whereby.Even the operating angle of the face mirror 25a of DMD25 for example is ± 12 degree, also exist by the caused inequality of the tolerance of each DMD.If the operating angle of the face mirror 25a of DMD25 is different; Then among Fig. 4; The light path of following light beam can squint, and this light beam is the light beam that reflects and see through the illuminating optical system 20b that comprises projecting lens 26 through the face mirror 25a of DMD25, and the intensity distributions of the diffraction light of light beam can change.When using a plurality of beam irradiation devices 20; And when many light beams come substrate 1 scanned; If have inequality to the intensity distributions of the diffraction light of the light beam of substrate 1 irradiation from each beam irradiation device 20, then can't depict pattern equably, describing quality can descend.
Among Fig. 4, the face mirror 24b of lamp optical system 20c is kept by face mirror fixed mount 54.In addition, lamp optical system 20c and face mirror fixed mount 54 are equipped on XY platform 55.In this embodiment; Inequality according to the operating angle of the face mirror 25a of the DMD25 of each beam irradiation device 20; Come the incident angle of light beam is regulated by face mirror fixed mount 54 and XY platform 55, this light beam is supplied to the DMD25 of each beam irradiation device 20.
Fig. 8 A is the side view of face mirror fixed mount, and Fig. 8 B is the back view of face mirror fixed mount.Face mirror fixed mount 54 comprises: back up pad 54a, body 54b, draft helical spring (coil spring) 54c and set screw 54d.Shown in Fig. 8 A, the back side of the face mirror 24b of lamp optical system 20c is installed on back up pad 54a, and is supported by back up pad 54a.Back up pad 54a is by two draft helical spring 54c and to the pressuring direction of body 54b.Shown in Fig. 8 B, three set screw 54d screw in to body 54b, and shown in Fig. 8 A, the front end of each set screw 54d and back up pad 54a come in contact, thereby are keeping the interval of back up pad 54a and body 54b.Rotate the axle shown in some locking wires in Fig. 8 B among three set screw 54d and be any the set screw 54d among two set screw 54d that dispose symmetrically; Change the screw-in amount of set screw 54d; Whereby; Back up pad 54a tilts to the direction with the axle quadrature shown in some locking wires, thereby the angle of opposite mirror 24b is regulated.Moreover, also can be made as following structure, that is, wait by motor to make set screw 54d rotation.
Fig. 9 is the stereographic map of XY platform.XY platform 55 comprises: platform base 55a, X platform 55b, Y platform 55c, adjusting knob 55d and adjusting knob 55e.X platform 55b is equipped on platform base 55a, and by the mechanism of worm gear (worm gear) or tooth bar (rack) and pinion wheel etc. and be linked to adjusting knob 55d, this adjusting knob 55d is arranged at platform base 55a.Rotate adjusting knob 55d, whereby, X platform 55b moves to directions X on platform base 55a.Y platform 55c is equipped on X platform 55b, and by the mechanism of worm gear or tooth bar and pinion wheel etc. and be linked to adjusting knob 55e, this adjusting knob 55e is arranged at X platform 55b.Rotate adjusting knob 55e, whereby, Y platform 55c moves to the Y direction on X platform 55b.Moreover, also can be made as following structure, that is, wait by motor to make adjusting knob 55d, 55e rotation.
Figure 10～Figure 12 is the figure that the exposure method to an embodiment of the invention describes.Figure 10～Figure 12 representes the light path of the light beam in the beam irradiation device 20; Figure 10 is that the operating angle of the face mirror 25a of DMD25 is the situation of 12 degree; Figure 11 be DMD25 face mirror 25a operating angle less than 12 the degree situation, Figure 12 be DMD25 face mirror 25a operating angle greater than 12 the degree situation.Moreover, among Figure 10～Figure 12,, the face mirror 25a of DMD25 is amplified, and only represented a face mirror 25a for easy to understand.
Among Figure 10～Figure 12, collimation lens 23a, fly's-eye lens 23b and the collector lens 23c of the light beam transmission illumination optical system 20c that penetrates from optical fiber 22, after quilt cover mirror 24a, the 24b reflection, from lamp optical system 20c to 51 incidents of first prism.To the light of first prism, 51 incidents by the reflection of the inclined-plane of first prism 51 and to reflecting surface 51a irradiation, the face 51a that then is reflected reflection, from the inclined-plane of first prism 51 to the inclined-plane incident of second prism 52.To light transmission second prism 52 of the inclined-plane incident of second prism 52, to the face mirror 25a of DMD25 irradiation.When the face mirror 25a of DMD25 was in work (on) state, face mirror 25a institute beam reflected was once more to 52 incidents of second prism, then by the reflection of the inclined-plane of second prism 52, from second prism 52 to the illuminating optical system 20b incident that comprises projecting lens 26.
Among Figure 10, come the angle of opposite mirror 24b to regulate, make the light beam that sees through second prism 52 penetrate to the direction of DMD25 with the angle of stipulating by face mirror fixed mount 54.In addition, by XY platform 55 lamp optical system 20c and face mirror fixed mount 54 are moved to the XY direction, the position of opposite mirror 24b is regulated, and makes the light beam that sees through second prism 52 shine to DMD25.
Among Figure 11 and Figure 12; When the operating angle of the face mirror 25a of DMD25 is spent less than 12 or greater than 12, spending; Inequality according to the operating angle of the face mirror 25a of DMD25; So that the face mirror 25a institute beam reflected of the duty of DMD25 is according to the mode of following angle to 52 incidents of second prism; Change by face mirror fixed mount 54 angles with face mirror 24b, thereby will change through the light beam of second prism 52 angle when the direction of DMD25 penetrates, said angle is to be 12 (Figure 10) identical angles when spending with the operating angle of the face mirror 25a of DMD25.Then; Angle according to the face mirror 24b that has changed; So that see through the mode of the light beam of second prism 52, by XY platform 55 lamp optical system 20c and face mirror fixed mount 54 are moved to the XY direction, thereby the position of face mirror 24b is changed to the DMD25 irradiation.Whereby, according to the inequality of the operating angle of the face mirror 25a of DMD25, the incident angle of the light beam of the face mirror 25a irradiation of subtend DMD25 is regulated.Moreover among Figure 11 and Figure 12, the operating angle of the face mirror 25a of DMD25 is that the light path of 12 light beams till the face mirror 25a of lamp optical system 20c to DMD25 of (Figure 10) when spending is to be represented by some locking wires.
Inequality according to the operating angle of the face mirror 25a of the DMD25 of each beam irradiation device 20; The incident angle of the light beam that the DMD25 of each beam irradiation device 20 of subtend supplies with is regulated; Therefore; Even the operating angle of the face mirror 25a of DMD25 exists uneven, the light path of the light beam of supplying with through the face mirror 25a of DMD25 reflection and to illuminating optical system 20b is also identical.Therefore, revised, describe quality and improve by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror 25a of DMD25.
In addition; In the lamp optical system 20c of each beam irradiation device 20, utilize face mirror 24b to make beam reflection, reflected light is supplied to the DMD25 of each beam irradiation device 20; Inequality according to the operating angle of the face mirror 25a of the DMD25 of each beam irradiation device 20; The angle of the face mirror 24b of the lamp optical system 20c of each beam irradiation device 20 is changed, and the position of face mirror 24b is changed, therefore according to the angle of face mirror 24b; Need not to make whole lamp optical system 20c to tilt, utilize the simple formation light beam that incident angle is different to be supplied to DMD25.
In addition; In the lamp optical system 20c of each beam irradiation device 20, when the optical element that utilizes collector lens 23c etc. converges light beam, when then this light beam being supplied to the face mirror 24b of lamp optical system 20c of each beam irradiation device 20; If individually the position of the face mirror 24b of lamp optical system 20c is changed; Then in lamp optical system 20c, the optical path length of light beam can change, Focus Club's skew of the light beam that converges because of the optical element of collector lens 23c etc.Angle according to the face mirror 24b of the lamp optical system 20c of each beam irradiation device 20; The whole lamp optical system 20c of each beam irradiation device 20 is moved; Thereby the position of face mirror 24b is changed; Therefore, the focus of the light beam that converges because of the optical element of collector lens 23c etc. can not squint, and the different light beam of incident angle is supplied to DMD25.
Figure 13～Figure 16 is the figure that explanation utilizes the scanning that light beam comes substrate is carried out.Figure 13～Figure 16 has represented following example, that is, by eight light beams from eight beam irradiation devices 20, along directions X substrate 1 is carried out four scanning, thereby whole base plate 1 is scanned.Among Figure 13～Figure 16, the head 20a that comprises illuminating optical system 20b of each beam irradiation device 20 is represented by dotted line.The light beam that irradiates from the head 20a of each beam irradiation device 20 has bandwidth W in the Y direction, and X platform 5 is moved to directions X, whereby, comes substrate 1 is scanned to the direction shown in the arrow.
Figure 13 representes primary scanning, carries out primary scanning to directions X, whereby, depicts pattern in the scanning area shown in the grey in Figure 13.After the primary end of scan, Y platform 7 is moved to the Y direction, whereby, substrate 1 moves the distance identical with bandwidth W to the Y direction.Figure 14 representes secondary scanning, carries out secondary scanning to directions X, whereby, depicts pattern in the scanning area shown in the grey in Figure 14.After secondary end of scan, Y platform 7 is moved to the Y direction, whereby, substrate 1 moves the distance identical with bandwidth W to the Y direction.Figure 15 representes scanning for the third time, carries out scanning for the third time to directions X, whereby, depicts pattern in the scanning area shown in the grey in Figure 15.After the end of scan for the third time, Y platform 7 is moved to the Y direction, whereby, substrate 1 moves the distance identical with bandwidth W to the Y direction.Figure 16 representes the 4th time scanning, carries out the 4th time scanning to directions X, whereby, depicts pattern in the scanning area shown in the grey in Figure 16, the end of scan of whole base plate 1.
Moreover; Represented following example among Figure 13～Figure 16, that is, substrate 1 has been carried out four scanning along directions X; Thereby whole base plate 1 is scanned; But the number of times of scanning is not limited to four times, also can carry out below three times or the scanning more than five times to substrate 1 along directions X, thereby whole base plate 1 is scanned.
According to the above embodiment of having explained; Inequality according to the operating angle of the face mirror 25a of the DMD25 of each beam irradiation device 20; The incident angle of the light beam that the DMD25 of each beam irradiation device 20 of subtend supplies with is regulated; Whereby, can be to revising by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror 25a of DMD25, describe quality and improve thereby can make.
And; In the lamp optical system 20c of each beam irradiation device 20; Utilize face mirror 24b to make beam reflection, reflected light is supplied to the DMD25 of each beam irradiation device 20, according to the inequality of the operating angle of the face mirror 25a of the DMD25 of each beam irradiation device 20; The angle of the face mirror 24b of the lamp optical system 20c of each beam irradiation device 20 is changed; And the angle according to face mirror 24b changes the position of face mirror 24b, and whereby, the light beam that simple formation capable of using is different with incident angle is supplied to DMD25.
And; In the lamp optical system 20c of each beam irradiation device 20, utilize the optical element of collector lens 23c etc. that light beam is converged, then this light beam is supplied to the face mirror 24b of the lamp optical system 20c of each beam irradiation device 20; Angle according to the face mirror 24b of the lamp optical system 20c of each beam irradiation device 20; The whole lamp optical system 20c of each beam irradiation device 20 is moved, thereby the position of face mirror 24b is changed, whereby; Can not make the focal shift of the light beam that the optical element because of collector lens 23c etc. converges, can be supplied to DMD25 by the light beam that incident angle is different.
Use exposure device of the present invention or exposure method to come substrate is made public; Whereby; Can be to revising by the inequality of the intensity distributions of the diffraction light of the uneven caused light beam of the operating angle of the face mirror of spatial light modulator; Describe the quality raising thereby can make, therefore, can make high-quality display panel substrate.
For example, Figure 17 be the expression liquid crystal indicator the TFT substrate manufacturing step one the example process flow diagram.Form in the step (step (step) 101) at film; By sputter (sputter) method or plasma chemical vapor deposition (chemical vapor deposition (Chemical Vapor Deposition; CVD)) method etc. forms the film of electric conductor film or the insulator film etc. of the transparency electrode of using as liquid crystal drive on substrate.In photoresist application step (step 102), wait by the roller rubbing method to be coated with photoresist, form the photoresistance film forming by film on the formed film of step (step 101).In step of exposure (step 103), use exposure device, on the photoresistance film, form pattern.In development step (step 104), wait developer solution is supplied on the photoresistance film by spray (shower) development method, the redundance of photoresistance film is removed.In etching (etching) step (step 105),, will remove by the part that is not covered that film forms in the formed film of step (step 101) by the photoresistance film by wet etching (wet etching).In strip step (step 106), by stripper following photoresistance film to be peeled off, this photoresistance film is a photoresistance film of having accomplished the effect of the light shield in the etch step (step 105).Before or after said each step, come as required substrate is implemented the washing/drying step.Said step is repeated repeatedly, on substrate, form tft array (array).
In addition, Figure 18 be the expression liquid crystal indicator colored filter substrate manufacturing step one the example process flow diagram.Form in the step (step 201) at black matrix" (black matrix),, on substrate, form black matrix" by photoresist coating, exposure, development, etching and the processing of peeling off etc.Form in the step (step 202) at colored pattern,, on substrate, form colored pattern by decoration method or pigment dispersing method etc.To the colored pattern of R, G, B and repeatedly carry out said step.Form in the step (step 203) at diaphragm, on colored pattern, form diaphragm, form in the step (step 204), on diaphragm, form ELD at ELD.Before said each step, midway or afterwards, come as required substrate is implemented the washing/drying step.
In the manufacturing step of TFT substrate shown in Figure 17; Can exposure device of the present invention or exposure method be applied to step of exposure (step 103); In the manufacturing step of colored filter substrate shown in Figure 180, can exposure device of the present invention or exposure method be applied to the exposure-processed that black matrix" forms step (step 201) and colored pattern formation step (step 202).
Claims (8)
1. exposure device comprises:
Anchor clamps are supporting the substrate that is coated with photoresist;
A plurality of beam irradiation devices; Have the lamp optical system of supplying with light beam, spatial light modulator, driving circuit, and illuminating optical system; The angle that said spatial light modulator will be arranged in a plurality of mirrors of both direction changes; Thereby light beam is modulated, and said driving circuit drives said spatial light modulator based on describing data, and said illuminating optical system irradiates the light beam through said spatial light modulator modulation; And
Mobile unit relatively moves said anchor clamps and said a plurality of beam irradiation device,
By said mobile unit said anchor clamps and said a plurality of beam irradiation device are relatively moved; Many light beams by from said a plurality of beam irradiation devices come substrate is scanned; On said substrate, depict pattern, said exposure device is characterised in that:
Each beam irradiation device comprises regulon; This regulon is according to the inequality of the operating angle of the face mirror of the said spatial light modulator of said each beam irradiation device, and the incident angle of the light beam that the said spatial light modulator of said each beam irradiation device of subtend is supplied with is regulated.
2. exposure device according to claim 1 is characterized in that: wherein
The said lamp optical system of said each beam irradiation device comprises the face mirror, and this face mirror makes beam reflection, and reflected light is supplied to the said spatial light modulator of said each beam irradiation device,
The said regulon of said each beam irradiation device comprises: first module; According to the inequality of the operating angle of said mirror of the said spatial light modulator of said each beam irradiation device, the angle of said mirror of the said lamp optical system of said each beam irradiation device is changed; And Unit second, according to the angle of said mirror the position of said mirror is changed.
3. exposure device according to claim 2 is characterized in that: wherein
The said lamp optical system of said each beam irradiation device comprises optical element, and this optical element converges light beam, then this light beam is supplied to said mirror of the said lamp optical system of said each beam irradiation device,
Said Unit second moves the whole said lamp optical system of said each beam irradiation device according to the angle of said mirror of the said lamp optical system of said each beam irradiation device, and the position of said mirror is changed.
4. exposure method,
Utilize anchor clamps supporting to be coated with the substrate of photoresist,
Anchor clamps and a plurality of beam irradiation device are relatively moved; Said a plurality of beam irradiation device comprises: lamp optical system, spatial light modulator, driving circuit and the illuminating optical system of supplying with light beam; The angle that said spatial light modulator will be arranged in a plurality of mirrors of both direction changes; Thereby light beam is modulated; Said driving circuit drives said spatial light modulator based on describing data, and said illuminating optical system irradiates the light beam through said spatial light modulator modulation
Many light beams by from said a plurality of beam irradiation devices come substrate is scanned, and on said substrate, depict pattern, and said exposure method is characterised in that:
According to the inequality of the operating angle of the face mirror of the said spatial light modulator of each beam irradiation device, the incident angle of the light beam that the said spatial light modulator of said each beam irradiation device of subtend is supplied with is regulated.
5. exposure method according to claim 4 is characterized in that: wherein
In the said lamp optical system of said each beam irradiation device, utilize said mirror to make beam reflection, reflected light is supplied to the said spatial light modulator of said each beam irradiation device,
Inequality according to the operating angle of said mirror of the said spatial light modulator of said each beam irradiation device; The angle of said mirror of the said lamp optical system of said each beam irradiation device is changed; And the angle according to said mirror changes the position of said mirror, and the incident angle of the light beam that the said spatial light modulator of said each beam irradiation device of subtend is supplied with is regulated.
6. exposure method according to claim 5 is characterized in that: wherein
In the said lamp optical system of said each beam irradiation device, utilize optical element that light beam is converged, then this light beam is supplied to said mirror of the said lamp optical system of said each beam irradiation device,
Angle according to said mirror of the said lamp optical system of said each beam irradiation device moves the whole said lamp optical system of said each beam irradiation device, and the position of said mirror is changed.
7. the manufacturing approach of a display panel substrate is characterized in that:
Use comes substrate is made public according to each described exposure device in the claim 1 to 3.
8. the manufacturing approach of a display panel substrate is characterized in that:
Use comes substrate is made public according to each described exposure method in the claim 4 to 6.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010273043A JP5611016B2 (en) | 2010-12-07 | 2010-12-07 | Exposure apparatus, exposure method, and manufacturing method of display panel substrate |
| JP2010-273043 | 2010-12-07 |
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| CN102540755A true CN102540755A (en) | 2012-07-04 |
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|---|---|---|---|
| CN2011103560872A Pending CN102540755A (en) | 2010-12-07 | 2011-11-08 | Exposure apparatus, exposure method, and method of making panel substrate for display |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5611016B2 (en) |
| KR (1) | KR101375886B1 (en) |
| CN (1) | CN102540755A (en) |
| TW (1) | TW201224679A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105739184A (en) * | 2014-12-07 | 2016-07-06 | 上海微电子装备有限公司 | Alignment device, system and method |
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| JP2014146012A (en) * | 2013-01-30 | 2014-08-14 | Hitachi High-Technologies Corp | Pattern formation method and device |
| JP7281021B2 (en) * | 2020-04-23 | 2023-05-24 | ドルビー ラボラトリーズ ライセンシング コーポレイション | Projection system and method with adjustable angle illumination |
| KR20230091134A (en) * | 2020-10-23 | 2023-06-22 | 돌비 레버러토리즈 라이쎈싱 코오포레이션 | Projection system and method using fold mirror and integral rod adjustment |
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| JP2008233112A (en) * | 2005-06-22 | 2008-10-02 | Fujifilm Holdings Corp | Production method of color filter, and color filter and display unit |
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| JP4863948B2 (en) * | 2007-07-30 | 2012-01-25 | 株式会社日立ハイテクノロジーズ | Exposure apparatus, exposure method, and manufacturing method of display panel substrate |
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| JP2002374025A (en) * | 2002-04-01 | 2002-12-26 | Komatsu Ltd | Narrow-band laser device |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20120063427A (en) | 2012-06-15 |
| JP5611016B2 (en) | 2014-10-22 |
| JP2012123128A (en) | 2012-06-28 |
| TW201224679A (en) | 2012-06-16 |
| KR101375886B1 (en) | 2014-03-18 |
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Application publication date: 20120704 |