CN104775146A - Reel-to-reel continuous horizontal high-current electroplating system - Google Patents
Reel-to-reel continuous horizontal high-current electroplating system Download PDFInfo
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- CN104775146A CN104775146A CN201510099459.6A CN201510099459A CN104775146A CN 104775146 A CN104775146 A CN 104775146A CN 201510099459 A CN201510099459 A CN 201510099459A CN 104775146 A CN104775146 A CN 104775146A
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- Prior art keywords
- volume
- continuous horizontal
- circuit board
- flexible circuit
- electric current
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Abstract
The invention discloses a reel-to-reel continuous horizontal high-current electroplating system, comprising a flexible circuit board, a feeding reeling machine connected with the flexible circuit board and equipped with two feeding reels, an electroplating mechanism and a receiving reeling machine equipped with two receiving reels. The electroplating mechanism comprises a main tank and a plurality of groups of winding and bending units; each winding and bending unit comprises two drooping bent sections, four insoluble positive electrodes, two negative electrodes and two spray boxes; the main tank is filled with an electroplating solution; and a positive column is formed between each spray box at one side of the drooping bent section and one of the insoluble positive electrodes, a negative column is formed between two spray boxes at two sides of each drooping bent section, and the negative electrodes are located in the negative column. The reel-to-reel continuous horizontal high-current electroplating system has the characteristics of high production efficiency, a small occupied area compared with a machine with same production power, etc.
Description
Technical field
The present invention relates to circuit board electroplating field, particularly relate to a kind of volume to volume continuous horizontal formula height electric current electroplating system.
Background technology
High-tech electronic product along with the time make rapid progress, electronic product, except will considering to reduce costs, is reduced the thinning demand that consumption market is the most basic now especially by electronic product.One of current flexible circuit board important key component having become electronic product macro, easily bends by flexible circuit board, the feature of low cost, can in a large number for the production of precise electronic product.On the processing procedure of flexible circuit board now, mostly still adopt the transport model of individual discontinuous, in procedure for processing, often injure damage because human factor easily causes flexible circuit board to be scraped, cause macroscopic irregularity to cause affecting the yield of flexible circuit board.So the shortcoming that the transport model how improving individual discontinuous produces, it will be one of problem of following industry researchdevelopment.
During existing plating flexible circuit board, mainly utilize electrochemical means to be plated on flexible circuit board on the surface on metal, and then change character or the size on flexible circuit board surface.The primary process of plating is placed in containing the solution for plating thing composition thing leaching to be plated as negative electrode, metal sheet is as anode, galvanic anode can be divided into soluble anode and insoluble anode, after connecing direct supply, thing to be plated deposits required coating, but often because the too high surfacing that causes of electric current is uneven.In the processing procedure of flexible circuit board, meeting plated with copper or tin are on flexible circuit board usually.Generally speaking, copper electroplating layer has the advantages such as good electroconductibility, thermal conductivity and mechanical ductility because of it and is widely used in electronics field.So
Now will by electronic product macro, copper plating technology has become one of key link indispensable in processing procedure, but often in electroplating activity, because of the concentration of electroplate liquid or current density too highly cause bubble, the phenomenon of burning produces.The plating via processing procedure of tradition flexible circuit board mainly adopts soluble anode, and adopt the setting of low current density (below 2.2ASD, ASD are a kind of identical elements of current density, refer to the amperage of every square decimeter), integral production efficiency is lower.
For above problem, the volume to volume continuous horizontal formula height electric current electroplating system that urgently a kind of production efficiency high, equal production capacity board floor space is little.
Summary of the invention
The object of the present invention is to provide a kind of volume to volume continuous horizontal formula height electric current electroplating system with features such as production efficiency high, equal production capacity board floor space are little.
To achieve these goals, technical scheme of the present invention is: provide a kind of volume to volume continuous horizontal formula height electric current electroplating system, the feed rolls machine with two feed rolls comprising flexible circuit board and connected by described flexible circuit board, electroplating mechanism that and there is the rewinding rotary machine of two rewinding reels, described electroplating mechanism that comprises major trough and is placed in some groups of flexing devices in described major trough, described flexing device has two sagging tunes, four insoluble anodes, two negative electrodes and two spray boxes, electroplate liquid is marked with in described major trough, positive column is formed between the spray box of every described sagging tune side and insoluble anode, every described sagging tune both sides two described in form cathodic area between spray box, described anode is positioned at described cathodic area.
Described volume to volume continuous horizontal formula height electric current electroplating system also comprises two and is positioned at described cathodic area conductive roller.
Described volume to volume continuous horizontal formula height electric current electroplating system also comprises the flexible glue roller that two are positioned at described cathodic area, and described flexible glue roller is for oppressing described flexible circuit board and described conductive roller.
Described volume to volume continuous horizontal formula height electric current electroplating system also comprises the pre-treatment mechanism of described flexible circuit board treatment before plating and the aftertreatment mechanism to described flexible circuit board plating posttreatment, and described pretreating machine is set up between described feed rolls machine and described electroplating mechanism that; Described postprocessor is set up between described rewinding rotary machine and described electroplating mechanism that.
Described volume to volume continuous horizontal formula height electric current electroplating system also comprises the insoluble anode being positioned at described positive column to be fixed and is flatly positioned at described positive column, and described insoluble anode is fixed flat for fixing described insoluble anode.
Described spray box has a spray box plate body, and described spray box plate body is provided with multiple nozzle, and multiple described nozzle level direction is that a linear pattern is located on described jet pipe plate body, and vertical direction is located on described jet pipe plate body in " S " type curved arrangement.
The diapire of major trough described in the parallel to each other and level of described spray box, described nozzle level sprays.
Compared with prior art, volume to volume continuous horizontal formula height electric current electroplating system of the present invention, gloss-imparting agent is injected in this major trough, and pass to the setting of high current density 4.3ASD and this insoluble anode of arranging in pairs or groups, coordinate layout and the design of plate face thereof of this anode cover plate, thus the production capacity under reducing product fraction defective and then improving the same terms; Flexing design, sagging tune formula decrease board floor space under same production capacity.
By following description also by reference to the accompanying drawings, the present invention will become more clear, and these accompanying drawings are for explaining embodiments of the invention.
Accompanying drawing explanation
Fig. 1 is the structure iron of volume to volume continuous horizontal formula height electric current electroplating system of the present invention.
Fig. 2 is a Local map of volume to volume continuous horizontal formula height electric current electroplating system of the present invention.
Fig. 3 is another Local map of volume to volume continuous horizontal formula height electric current electroplating system of the present invention.
Embodiment
Referring to figs. 1 to Fig. 3, the present invention comprise flexible circuit board 10 for volume to volume continuous horizontal formula height electric current electroplating system 100 and connected by described flexible circuit board 10 the feed rolls machine 20 with two feed rolls 21, pre-treatment mechanism 30 to described flexible circuit board 10 treatment before plating, electroplating mechanism that 40, to the aftertreatment mechanism 50 of described flexible circuit board 10 plating posttreatment and the rewinding rotary machine 60 with two rewinding reels 61.
Described electroplating mechanism that 40 comprises major trough 41 and is placed in some groups of flexing devices in described major trough 41.Described flexing device has two sagging tune 421, four insoluble anode 422, two negative electrodes (figure does not make) and two spray boxes 424.Be marked with electroplate liquid in described major trough 41, between the spray box 424 of every described sagging tune 421 side and insoluble anode 422, form positive column.Every described sagging tune 421 both sides two described in form cathodic area between spray box 424, described negative electrode is positioned at described cathodic area.
Preferably, described volume to volume continuous horizontal formula height electric current electroplating system 100 also comprises conductive roller 70 and the flexible glue roller 75 that two are positioned at described cathodic area.Described flexible glue roller 75 is for oppressing described flexible circuit board 10 and described conductive roller 70.This flexible glue roller 75 makes this flexible circuit board 10 contact with conductive roller 70 more fully to strengthen conductive effect.
Preferably, described volume to volume continuous horizontal formula height electric current electroplating system 100 also comprises the insoluble anode being positioned at described positive column and fixes flat 80, and described insoluble anode fixes titanium copper-clad flat 80 for fixing described insoluble anode 422, support spray box 4241 and transmission current.
Preferably, described volume to volume continuous horizontal formula height electric current electroplating system 100 also comprises the sagging tune 421 of the some groups of flexing devices being positioned at described major trough 41, the design of group flexing device makes equal production capacity board floor space greatly reduce.
Particularly, described spray box 424 has a spray box plate body 4241, and described spray box plate body 4241 is provided with multiple nozzle 4242.Multiple described nozzle 4242 horizontal direction is that a linear pattern is located on described jet pipe plate body 4241, and horizontal direction is located on described jet pipe plate body 4242 in " S " type curved arrangement.The diapire of major trough 41 described in the parallel to each other and level of described spray box 424, described nozzle 4242 horizontal-jet.
Volume to volume continuous horizontal formula height electric current electroplating system of the present invention, gloss-imparting agent is injected in this major trough, and pass to the setting of high current density 4.3ASD and this insoluble anode of arranging in pairs or groups, coordinate layout and the design of plate face thereof of this anode cover plate, thus the production capacity under reducing product fraction defective and then improving the same terms; Flexing design, sagging tune formula decrease board floor space under same production capacity.
By in conjunction with most preferred embodiment, present invention is described above, but the present invention is not limited to the embodiment of above announcement, and should contain amendment that the various essence according to the present embodiment carries out, equivalent combinations.
Claims (6)
1. a volume to volume continuous horizontal formula height electric current electroplating system, it is characterized in that: the feed rolls machine with two feed rolls comprising flexible circuit board and connected by described flexible circuit board, electroplating mechanism that and there is the rewinding rotary machine of two rewinding reels, described electroplating mechanism that comprises major trough and is placed in some groups of flexing devices in described major trough, described flexing device has two sagging tunes, four insoluble anodes, two negative electrodes and two spray boxes, electroplate liquid is marked with in described major trough, positive column is formed between the spray box of every described sagging tune side and insoluble anode, every described sagging tune both sides two described in form cathodic area between spray box, described anode is positioned at described cathodic area.
2. volume to volume continuous horizontal formula height electric current electroplating system according to claim 1, is characterized in that: also comprise two and be positioned at described cathodic area conductive roller; The two flexible glue rollers being positioned at described cathodic area, described flexible glue roller is for oppressing described flexible circuit board and described conductive roller.
3. volume to volume continuous horizontal formula height electric current electroplating system according to claim 2, it is characterized in that: also comprise the pre-treatment mechanism of described flexible circuit board treatment before plating and the aftertreatment mechanism to described flexible circuit board plating posttreatment, described pretreating machine is set up between described feed rolls machine and described electroplating mechanism that; Described postprocessor is set up between described rewinding rotary machine and described electroplating mechanism that.
4. volume to volume continuous horizontal formula height electric current electroplating system according to claim 3, it is characterized in that: also comprise the insoluble anode being positioned at described positive column and fix that titanium copper-clad is flat is positioned at described positive column, described insoluble anode fix titanium copper-clad flat for fixing described insoluble anode, support spray box and transmission current.
5. volume to volume continuous horizontal formula height electric current electroplating system according to claim 4, it is characterized in that: described spray box has a spray box plate body, described spray box plate body is provided with multiple nozzle, multiple described nozzle level direction is that a linear pattern is located on described jet pipe plate body, and the S-shaped curved arrangement of vertical direction is located on described jet pipe plate body.
6. volume to volume continuous horizontal formula height electric current electroplating system according to claim 5, is characterized in that: described spray box is parallel to each other and be horizontally placed on the diapire of described major trough, and described nozzle level sprays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510099459.6A CN104775146A (en) | 2015-03-06 | 2015-03-06 | Reel-to-reel continuous horizontal high-current electroplating system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510099459.6A CN104775146A (en) | 2015-03-06 | 2015-03-06 | Reel-to-reel continuous horizontal high-current electroplating system |
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| CN104775146A true CN104775146A (en) | 2015-07-15 |
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| CN201510099459.6A Pending CN104775146A (en) | 2015-03-06 | 2015-03-06 | Reel-to-reel continuous horizontal high-current electroplating system |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI563130B (en) * | 2015-09-21 | 2016-12-21 | Triumphant Gate Ltd | |
| CN107723766A (en) * | 2016-08-10 | 2018-02-23 | 凯基有限公司 | The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board |
| CN107858727A (en) * | 2017-12-18 | 2018-03-30 | 上海华友金裕微电子有限公司 | A kind of efficiently round wire bond carrying device of new high speed electro-deposition |
| CN108624943A (en) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | A kind of horizontal continuity electroplanting device and preparation method thereof |
| CN110733920A (en) * | 2018-07-18 | 2020-01-31 | 惠州市捷成机电设备有限公司 | single-row roll-to-roll continuous horizontal production equipment |
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| JP3299725B2 (en) * | 1998-12-11 | 2002-07-08 | 株式会社ケミトロン | Plating method and its equipment |
| CN102453939A (en) * | 2010-10-25 | 2012-05-16 | 嘉联益科技股份有限公司 | Cabinet for roll-to-roll conveying selective electroplating flexible printed circuit board and manufacturing process of cabinet |
| CN103060869A (en) * | 2012-12-31 | 2013-04-24 | 上海新阳半导体材料股份有限公司 | Flexible carrier sheet electroplating device |
| TW201508095A (en) * | 2013-08-30 | 2015-03-01 | Intech Electronics Co Ltd | Electroplating apparatus for manufacturing flexible printed circuit board |
-
2015
- 2015-03-06 CN CN201510099459.6A patent/CN104775146A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3299725B2 (en) * | 1998-12-11 | 2002-07-08 | 株式会社ケミトロン | Plating method and its equipment |
| CN102453939A (en) * | 2010-10-25 | 2012-05-16 | 嘉联益科技股份有限公司 | Cabinet for roll-to-roll conveying selective electroplating flexible printed circuit board and manufacturing process of cabinet |
| CN103060869A (en) * | 2012-12-31 | 2013-04-24 | 上海新阳半导体材料股份有限公司 | Flexible carrier sheet electroplating device |
| TW201508095A (en) * | 2013-08-30 | 2015-03-01 | Intech Electronics Co Ltd | Electroplating apparatus for manufacturing flexible printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI563130B (en) * | 2015-09-21 | 2016-12-21 | Triumphant Gate Ltd | |
| CN107723766A (en) * | 2016-08-10 | 2018-02-23 | 凯基有限公司 | The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board |
| CN107858727A (en) * | 2017-12-18 | 2018-03-30 | 上海华友金裕微电子有限公司 | A kind of efficiently round wire bond carrying device of new high speed electro-deposition |
| CN108624943A (en) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | A kind of horizontal continuity electroplanting device and preparation method thereof |
| CN110733920A (en) * | 2018-07-18 | 2020-01-31 | 惠州市捷成机电设备有限公司 | single-row roll-to-roll continuous horizontal production equipment |
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Application publication date: 20150715 |