CN102201414B - 半导体存储装置及其制造方法 - Google Patents
半导体存储装置及其制造方法 Download PDFInfo
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- CN102201414B CN102201414B CN2011100524056A CN201110052405A CN102201414B CN 102201414 B CN102201414 B CN 102201414B CN 2011100524056 A CN2011100524056 A CN 2011100524056A CN 201110052405 A CN201110052405 A CN 201110052405A CN 102201414 B CN102201414 B CN 102201414B
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- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010072921A JP5032623B2 (ja) | 2010-03-26 | 2010-03-26 | 半導体記憶装置 |
JP072921/2010 | 2010-03-26 |
Publications (2)
Publication Number | Publication Date |
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CN102201414A CN102201414A (zh) | 2011-09-28 |
CN102201414B true CN102201414B (zh) | 2013-12-18 |
Family
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CN2011200565899U Expired - Lifetime CN202205748U (zh) | 2010-03-26 | 2011-03-04 | 半导体存储装置 |
CN2011100524056A Active CN102201414B (zh) | 2010-03-26 | 2011-03-04 | 半导体存储装置及其制造方法 |
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Application Number | Title | Priority Date | Filing Date |
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CN2011200565899U Expired - Lifetime CN202205748U (zh) | 2010-03-26 | 2011-03-04 | 半导体存储装置 |
Country Status (4)
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US (1) | US8314478B2 (zh) |
JP (1) | JP5032623B2 (zh) |
CN (2) | CN202205748U (zh) |
TW (1) | TWI442325B (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5032623B2 (ja) * | 2010-03-26 | 2012-09-26 | 株式会社東芝 | 半導体記憶装置 |
JP5337110B2 (ja) | 2010-06-29 | 2013-11-06 | 株式会社東芝 | 半導体記憶装置 |
JP2012212417A (ja) | 2011-03-24 | 2012-11-01 | Toshiba Corp | 半導体メモリカード |
JP2013025540A (ja) * | 2011-07-20 | 2013-02-04 | Toshiba Corp | 半導体記憶装置 |
JP2013062470A (ja) * | 2011-09-15 | 2013-04-04 | Powertech Technology Inc | 半導体装置 |
US8611437B2 (en) | 2012-01-26 | 2013-12-17 | Nvidia Corporation | Ground referenced single-ended signaling |
US9338036B2 (en) | 2012-01-30 | 2016-05-10 | Nvidia Corporation | Data-driven charge-pump transmitter for differential signaling |
US9153539B2 (en) * | 2013-03-15 | 2015-10-06 | Nvidia Corporation | Ground-referenced single-ended signaling connected graphics processing unit multi-chip module |
US9170980B2 (en) * | 2013-03-15 | 2015-10-27 | Nvidia Corporation | Ground-referenced single-ended signaling connected graphics processing unit multi-chip module |
US9147447B2 (en) * | 2013-03-15 | 2015-09-29 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
US9171607B2 (en) | 2013-03-15 | 2015-10-27 | Nvidia Corporation | Ground-referenced single-ended system-on-package |
US9153314B2 (en) | 2013-03-15 | 2015-10-06 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
US9251870B2 (en) * | 2013-04-04 | 2016-02-02 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
USD730908S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730910S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730907S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD729251S1 (en) * | 2014-06-27 | 2015-05-12 | Samsung Electronics Co., Ltd. | Memory card |
USD727913S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD727911S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD730909S1 (en) * | 2014-06-27 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD727912S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD736215S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736214S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736212S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD727910S1 (en) * | 2014-07-02 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD798868S1 (en) * | 2015-08-20 | 2017-10-03 | Isaac S. Daniel | Combined subscriber identification module and storage card |
USD773466S1 (en) * | 2015-08-20 | 2016-12-06 | Isaac S. Daniel | Combined secure digital memory and subscriber identity module |
USD783622S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
USD783621S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
JP2022039765A (ja) * | 2020-08-28 | 2022-03-10 | キオクシア株式会社 | プリント配線板、メモリシステム、およびプリント配線板の製造方法 |
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US6541311B1 (en) * | 1998-04-06 | 2003-04-01 | Infineon Technologies Ag | Method of positioning a component mounted on a lead frame in a test socket |
CN202205748U (zh) * | 2010-03-26 | 2012-04-25 | 株式会社东芝 | 半导体存储装置 |
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JP2002288618A (ja) * | 2001-03-23 | 2002-10-04 | Toshiba Corp | 携帯可能電子媒体及び電子回路部品 |
JP2004349396A (ja) | 2003-05-21 | 2004-12-09 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7193305B1 (en) | 2004-11-03 | 2007-03-20 | Amkor Technology, Inc. | Memory card ESC substrate insert |
US20060267173A1 (en) * | 2005-05-26 | 2006-11-30 | Sandisk Corporation | Integrated circuit package having stacked integrated circuits and method therefor |
JP2007193763A (ja) * | 2005-12-20 | 2007-08-02 | Toshiba Corp | 半導体メモリカード |
US20090096073A1 (en) * | 2007-10-16 | 2009-04-16 | Kabushiki Kaisha Toshiba | Semiconductor device and lead frame used for the same |
JP4945682B2 (ja) * | 2010-02-15 | 2012-06-06 | 株式会社東芝 | 半導体記憶装置およびその製造方法 |
JP2011181697A (ja) * | 2010-03-01 | 2011-09-15 | Toshiba Corp | 半導体パッケージおよびその製造方法 |
JP5337110B2 (ja) * | 2010-06-29 | 2013-11-06 | 株式会社東芝 | 半導体記憶装置 |
JP5242644B2 (ja) * | 2010-08-31 | 2013-07-24 | 株式会社東芝 | 半導体記憶装置 |
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2010
- 2010-03-26 JP JP2010072921A patent/JP5032623B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-03 TW TW100107016A patent/TWI442325B/zh active
- 2011-03-04 CN CN2011200565899U patent/CN202205748U/zh not_active Expired - Lifetime
- 2011-03-04 CN CN2011100524056A patent/CN102201414B/zh active Active
- 2011-03-18 US US13/051,582 patent/US8314478B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US6541311B1 (en) * | 1998-04-06 | 2003-04-01 | Infineon Technologies Ag | Method of positioning a component mounted on a lead frame in a test socket |
CN202205748U (zh) * | 2010-03-26 | 2012-04-25 | 株式会社东芝 | 半导体存储装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI442325B (zh) | 2014-06-21 |
JP5032623B2 (ja) | 2012-09-26 |
CN102201414A (zh) | 2011-09-28 |
JP2011205013A (ja) | 2011-10-13 |
US8314478B2 (en) | 2012-11-20 |
CN202205748U (zh) | 2012-04-25 |
US20110233741A1 (en) | 2011-09-29 |
TW201203128A (en) | 2012-01-16 |
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