CN102124826A - 印刷电路板的制造方法及印刷电路板 - Google Patents
印刷电路板的制造方法及印刷电路板 Download PDFInfo
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- CN102124826A CN102124826A CN2009801317270A CN200980131727A CN102124826A CN 102124826 A CN102124826 A CN 102124826A CN 2009801317270 A CN2009801317270 A CN 2009801317270A CN 200980131727 A CN200980131727 A CN 200980131727A CN 102124826 A CN102124826 A CN 102124826A
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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Abstract
本发明提供一种能够形成不会发生连接不良的填充导通孔的印刷电路板的制造方法和该印刷电路板。在导通孔用开口(60)的内壁形成了非电解镀膜(62)之后,对绝缘性树脂基材(56)实施电解镀,将电镀金属填充到导通孔用开口(60)内而形成填充导通孔(68)。因此,在进行电解镀时,电镀金属不仅自导通孔用开口(60)的底部析出,而且还自导通孔用开口(60)的侧壁的非电解镀膜(62)析出。结果,能够利用电解镀完全地填充导通孔用开口(62),形成不会发生连接不良的填充导通孔(68)。
Description
技术领域
本发明涉及一种利用填充导通孔(field via)连接绝缘性树脂层的表层和底层的印刷电路板及该印刷电路板的制造方法,特别是涉及一种能够较佳地应用在利用转印法将导体电路转印到绝缘性树脂层上的印刷电路板中的印刷电路板和该印刷电路板的制造方法。
背景技术
在印刷电路板领域,作为进行层间连接的方法,出于对电子设备小型化的要求,大多使用导通孔来代替通孔。此外,出于对印刷电路板的细间距化的要求,在形成导体电路时,将形成在转印用基材上的导体电路转印到绝缘性树脂层上的转印法正被付诸实用。关于采用转印法的印刷电路板的制造方法,例如有专利文献1、2。
在专利文献1、2中,利用转印法将导体电路埋入在绝缘构件中,在规定的位置形成导通孔用开口。然后,采用自下而上(bottom up)电镀法在导通孔用开口中形成填充导通孔。
专利文献1:US 7,297,562B1公报
专利文献2:日本特开2005-39233号公报
但是,在电镀时,电镀金属的析出速度容易不均匀。在自下而上电镀法中,对导通孔用开口的底部的导体电路通电,使金属自该底部析出。当所析出的金属与导通孔用开口的上部所相邻的导体电路接触时,电流在该导体电路中流动。即,在同时形成多个填充导通孔的情况下,在一部分导通孔用开口处,电镀金属的析出速度较快,当所析出的金属与导通孔用开口的上部所相邻的导体电路接触时,电路开始流向该导体电路。由此,电流主要在与导通孔用开口的上部相邻的导体电路中流动,在导通孔用开口的底部的导体电路中流动的电流减少。这是因为,导通孔用开口的底部的导体电路的表面积小于与导通孔用开口的上部相邻的导体电路的表面积。结果,很难使电镀金属自电镀金属的析出速度较慢的导通孔用开口析出,从而很难使电镀金属析出至与导通孔用开口的上部相邻的导体电路。因此,在电镀金属的析出速度较慢的导通孔用开口处,不能实现完全的导通,可能发生连接不良。
发明内容
本发明是为了解决上述问题而做成的,目的在于提供一种能够形成不会发生连接不良的填充导通孔的印刷电路板的制造方法及该印刷电路板。
为了达到上述目的,本发明的印刷电路板的制造方法的技术特征在于,
该方法包括下述工序:
准备具有第一表面和作为该第一表面的相反面的第二表面的绝缘性树脂基材;
在上述绝缘性树脂基材的第一表面和上述绝缘性树脂基材的第二表面埋入导体电路而形成基板;
形成从上述第一表面和第二表面中的一表面到达被埋入在另一表面中的导体电路的导通孔用开口;
对上述基板实施非电解镀,在上述导通孔用开口的内壁形成非电解镀膜;
对上述基板实施电解镀,将金属填充在上述导通孔用开口中而形成填充导通孔。
另外,本发明的印刷电路板的技术特征在于,
该印刷电路板包括:
绝缘性树脂基材,其具有第一表面和作为该第一表面的相反面的第二表面;
导体电路,其埋入在上述绝缘性树脂基材的上述第一表面和上述第二表面中;
填充导通孔,其由非电解镀膜和电解镀膜构成,该非电解镀膜形成在导通孔用开口的内壁上,该导通孔用开口从上述第一表面和第二表面中的一表面到达被埋入在另一表面中的导体电路,上述电解镀膜填充在上述导通孔用开口内。
在本发明中,在对基板实施了非电解镀而在导通孔用开口的内壁形成了非电解镀膜之后,对基板实施电解镀而将金属填充在导通孔用开口中,形成填充导通孔。因此,电镀金属不仅自导通孔用开口的底部析出,而且还自导通孔用开口的侧壁的非电解镀膜析出,从而能够利用电解镀将导通孔用开口完全填充而形成不会发生连接不良的填充导通孔。
附图说明
图1的(A)~(E)是表示本发明的第一实施方式的印刷电路板的制造方法的工序图。
图2的(A)~(D)是表示第一实施方式的印刷电路板的制造工序的剖视图。
图3的(A)~(D)是表示第一实施方式的印刷电路板的制造工序的剖视图。
图4的(A)~(E)是表示第一实施方式的印刷电路板的制造工序的剖视图。
图5的(A)~(D)是表示第一实施方式的印刷电路板的制造工序的剖视图。
图6的(A)~(D)是表示本发明的第二实施方式的印刷电路板的制造工序的剖视图。
图7的(A)和(B)是表示本发明的实施方式的变更例的印刷电路板的制造工序的剖视图。
具体实施方式
第一实施方式
参照图1~图5说明本发明的第一实施方式的印刷电路板10的结构。图5的(C)表示该印刷电路板10的剖视图。图5的(D)表示将图5的(C)所示的印刷电路板10上下翻转而在该线路板10上安装作为电子零件的IC芯片90,并且将印刷电路板10载置在子板94上后的状态。如图5的(C)所示,在绝缘性树脂基材56的作为第一表面的上表面和与作为第一表面的相反面的第二表面的下表面埋入有导体电路42。埋入在绝缘性树脂基材56的上表面中的第一导通孔连接盘40和埋入在该基材56的下表面中的第二导通孔连接盘44由填充导通孔68连接。在该绝缘性树脂基材56的上表面和下表面上形成有阻焊层70。在阻焊层70的开口70a处设置有焊锡凸块76U、76D。如图5的(D)所示,利用焊锡凸块76U连接印刷电路板10和IC芯片90的焊盘92,利用焊锡凸块76D连接该线路板10和子板94的焊盘96。该印刷电路板10和IC芯片90由树脂塑封(mold),该结构未图示。
参照图1~图5说明第一实施方式的印刷电路板的制造方法。
(1)准备在绝缘性树脂层30的两面上依次层叠铜箔32、剥离层33和转印用基材34而成的转印用层叠体35,该铜箔32作为导体箔(参照图1的(A))。利用超声波处理将各转印用基材34的周缘部焊接在铜箔32上,在超声波焊接部35a的外侧形成作为对准标记的基准孔35b,该基准孔35b贯穿转印用层叠体35。
(2)在转印用层叠体35的两面的转印用基材34上以上述基准孔35b作为基准而形成具有规定图案的抗镀层38。详细而言,在位于转印用层叠体35的两面上的转印用基材34上层叠感光性干膜37。然后,在转印用层叠体35的上表面上配置掩模39A并进行曝光(参照图1的(B))。感光性干膜37和掩模39A彼此分开。掩模39A具有与对准标记46和具有第一导通孔连接盘40的导体电路42相对应的黑色图案。此外,掩模39A还具有与转印用层叠体35的基准孔35b相对应的对准标记39c。在配置掩模39A时,对位基准孔35b和对准标记39c。
在去除了掩模39A后,在转印用层叠体35的下表面上配置掩模39B并进行曝光(参照图1的(C))。感光性干膜37和掩模39B彼此分开。掩模39B具有黑色图案,该黑色图案与具有第二导通孔连接盘44的导体电路42相对应。此外,掩模39B还具有与转印用层叠体35的基准孔35b相对应的对准标记39c。在配置掩模39B时,对位基准孔35b和对准标记39c。
在去除了掩模39B后,进行显影处理,在转印用层叠体35的两面上形成抗镀层38。然后,利用电解镀将电解镀膜36形成在各转印用基材34上(参照图1的(D))。
(3)通过去除抗镀层38,在绝缘性树脂基材56的上表面用的转印用基材34上形成对准标记46和具有第一导通孔连接盘40的导体电路42。同时,在绝缘性树脂基材56的下表面用的转印用基材34上形成具有第二导通孔连接盘44的导体电路42(参照图1的(E))。由圆和该圆的中央的点构成对准标记46。第一导通孔连接盘40具有开口40a,第二导通孔连接盘44形成为板状。
(4)利用保护层50覆盖各转印用基材34上的导体电路42的表面(参照图2的(A))。
(5)利用钻头52在转印用层叠体35上形成孔(参照图2的(B))。在转印用层叠体35的超声波焊接部35a的内侧利用钻头52形成孔。孔由贯穿各转印用基材34的基准孔34a和贯穿绝缘性树脂层30、铜箔32、剥离层33的孔30a构成(参照图2的(C))。
(6)通过在超声波焊接部35a与各转印用基材34的基准孔34a之间裁切转印用层叠体35,将转印用基材34自转印用层叠体35剥离(参照图2的(D))。此时,利用剥离层33能够容易地剥离转印用基材34。
(7)自转印用基材34剥离保护层50(参照图3的(A))。另外,准备由预浸料(prepreg)构成的绝缘性树脂基材56。将各转印用基材34上下翻转而将各转印用基材34分别层叠在绝缘性树脂基材56的上下两面上。然后,将转印用基材34冲压于绝缘性树脂基材56的上表面和下表面,以将各转印用基材34上的导体电路42埋入到绝缘性树脂基材56中,从而形成基板56b(参照图3的(B))。在层叠转印用基材34之前,在绝缘性树脂基材56上预先在与各转印用基材34的基准孔34a相对应的位置形成基准孔56a。然后,在层叠转印用基材34时,将定位销54***到各基准孔34a和与该基准孔34a相对应的基准孔56a中,从而将形成在各转印用基材34上的导体电路42对位。在形成了基板56b之后,除去定位销54。对基板56b的周缘进行修边(trimming),去除自基板56b露出的树脂(未图示)。
(8)利用软蚀刻减小各转印用基材34的厚度。在进行了软蚀刻后,利用X射线投影从外侧确认对准标记46的位置,在基板56b上形成孔56c,该孔56c贯穿该标记46(参照图3的(C))。然后,对转印用基材34的表面实施黑化处理。
(9)以上述孔56c作为基准进行激光加工,从而在绝缘性树脂基材56上形成从该基材56的上表面到达第二导通孔连接盘44的导通孔用开口60(参照图3的(D))。第一导通孔连接盘40的开口40a与导通孔用开口60相对应,将该导通孔连接盘40作为掩模而利用激光加工来形成导通孔用开口60。
(10)在对各转印用基材34的表面实施了作为非电解镀用的预处理的、使该表面具有钯核的药液处理之后,利用非电解镀在导通孔用开口60的内壁上形成非电解镀膜62(参照图4的(A))。该非电解镀膜62也形成在各转印用基材34的表面上。
(11)在基板56b的上表面上形成抗镀层64A,该抗镀层64A具有与导通孔用开口60相对应的开口64a,在基板56b的下表面上形成抗镀层64B(参照图4的(B))。抗镀层64A的开口64a比导通孔用开口60大。
(12)进行电解镀,在导通孔用开口60内形成电解镀膜66而形成填充导通孔68(参照图4的(C))。此时,由于抗镀层64A的开口64a比导通孔用开口60大,因此在开口64a与导通孔用开口60之间露出的非电解镀膜62上也形成电解镀膜66。因此,在所形成的填充导通孔68中,形成从通过上述露出的非电解镀膜62的平面向上方突出的突出部。
(13)对填充导通孔68的表面进行蚀刻,去除该填充导通孔68的突出部(参照图4的(D))。
(14)在去除了抗镀层64A、64B后,利用软蚀刻去除各转印用基材34。在具有对准标记46的区域的内侧,裁切基板56b而形成印刷电路板10(参照图4的(E))。此时,填充导通孔68的表面和绝缘性树脂基材56的表面实际位于同一个平面上。
(15)在印刷电路板10的上表面和下表面形成具有规定的开口70a的阻焊层70(参照图5的(A))。
(16)在阻焊层70的开口70a形成由镀镍膜72和镀金膜74构成的耐腐蚀层(参照图5的(B))。
(17)在阻焊层70的开口70a处印刷焊锡膏并进行回流焊,从而形成焊锡凸块76U、76D(参照图5的(C))。
(18)在将印刷电路板10上下翻转后,借助焊锡凸块76U将IC芯片90安装在印刷电路板10上,借助焊锡凸块76D将印刷电路板10安装在子板94上(参照图5的(D))。
在第一实施方式中,对绝缘性树脂基材56实施非电解镀,在导通孔用开口60的内壁上形成非电解镀膜62。然后,对绝缘性树脂基材56实施电解镀,将电镀金属填充在导通孔用开口60中而形成填充导通孔68。即,填充导通孔68由形成在导通孔用开口60的内壁上的非电解镀膜62和形成在该非电解镀膜62上的电解镀膜66构成。因此,在进行电解镀时,电镀金属不仅从导通孔用开口60的底部析出,而且还从导通孔用开口60的侧壁的非电解镀膜62析出。结果,能够利用电解镀完全地填充导通孔用开口60,在第二导通孔连接盘44与第一导通孔连接盘40之间形成不会发生连接不良的填充导通孔68。
在第一实施方式中,在转印用层叠体35的各转印用基材34上形成导体电路42。因此,能够同时形成绝缘性树脂基材56的上表面用的导体电路42和下表面用的导体电路42。结果,能够使埋入在绝缘性树脂基材56的上表面和下表面中的导体电路42彼此形成为相同的厚度和组成,提高导体电路42的可靠性。
此外,通过用绝缘性树脂层30、铜箔32、剥离层33和转印用基材34构成转印用层叠体35,能够较厚地形成该层叠体35。因此,仅支承转印用层叠体35的端面,就能输送该层叠体35,从而能够防止例如输送辊与转印用基材34上的导体电路42接触,保护导体电路42。
在第一实施方式中,将保护层50层叠在各转印用基材34的导体电路42上。然后,在进行了自转印用层叠体35剥离转印用基材34的工序之后,自各转印用基材34剥离保护层50。通过用保护层50保护导体电路42,能够在例如使用钻头52在各转印用基材34上形成基准孔34a时,降低使导体电路42带有划痕的可能性,提高导体电路42的可靠性。
此外,通过用保护层50支承转印用基材34,能够在自转印用层叠体35剥离转印用基材34时以及在将转印用基材34自转印用层叠体35剥离掉后,防止较薄的转印用基材34挠曲、卷曲,从而能够保护该基材34上的导体电路42。
在第一实施方式中,以转印用层叠体35的基准孔35b作为基准形成抗镀层38。由此,能够使形成在各转印用基材34上的导体电路42彼此对位,提高导体电路42的位置精度。
此外,在转印用层叠体35的各转印用基材34上形成了导体电路42后,形成贯穿各转印用基材34的基准孔34a。然后,通过将定位销54***到形成在各转印用基材34上的基准孔34a中,能够使形成在各转印用基材34上的导体电路42对位。在将形成在各转印用基材34上的导体电路42彼此对位了的状态下形成基准孔34a。因此,能够提高基准孔34a的位置精度。结果,埋入在绝缘性树脂基材56的下表面中的导体电路42的相对于埋入在绝缘性树脂基材56的上表面中的导体电路42的位置不会偏离,该导体电路42的位置精度较高。
此外,通过形成了贯穿转印用层叠体35的孔,能够同时在各转印用基材34上形成基准孔34a。因此,能够提高各基准孔34a的位置精度,从而进一步提高导体电路42的位置精度。
在第一实施方式中,在转印用基材34上形成对准标记46。因此,能够以该对准标记46为基准形成导通孔用开口60,提高导通孔用开口60的位置精度。
在第一实施方式中,在形成非电解镀膜62的工序之后,在各转印用基材34上形成电解镀用的抗镀层64A、64B。然后,在实施电解镀而形成填充导通孔68的工序之后,去除抗镀层64A、64B,并且去除转印用基材34。在非电解镀的前阶段对转印用基材34进行药液处理,从而使钯核等残留在各转印用基材34的表面上。但是,由于在电解镀后去除转印用基材34,因此钯核不会残留在绝缘性树脂基材56的表面上,而能够提高印刷电路板10的可靠性。
在第一实施方式中,在利用电解镀形成填充导通孔68的工序后且在去除抗镀层64A的工序前,对填充导通孔68的表面实施蚀刻。即,在残留有抗镀层64A的状态下,对填充导通孔68的表面实施蚀刻。因此,能够选择性地去除填充导通孔68的突出部,提高填充导通孔68的表面平坦性。
在第一实施方式中,将第一导通孔连接盘40作为掩模而利用激光加工来形成导通孔用开口60。因此,能够提高导通孔用开口60的位置精度。
在第一实施方式中,在印刷电路板10的埋入有第二导通孔连接盘44的表面上安装有IC芯片90。即,印刷电路板10的埋入有第二导通孔连接盘44的表面构成IC芯片90的安装面。在印刷电路板10上,埋入有第二导通孔连接盘44的表面的平坦性高于埋入有第一导通孔连接盘40的表面的平坦性。这是因为,填充导通孔68的表面的中央在蚀刻的作用下稍微向内侧凹陷。由于以平坦性较高的表面构成IC芯片90的安装面,因此安装有IC芯片90的印刷电路板10的可靠性能够得到提高。
第二实施方式
参照图6说明第二实施方式的印刷电路板的制造方法。
对图6的(A)所示的绝缘性树脂基材112的表面进行激光加工,形成与导体电路和对准标记相对应的凹部114(参照图6的(B))。然后,将电镀金属填充到凹部114中而形成导体电路42和对准标记46。详细而言,在对绝缘性树脂基材112的表面实施了使该表面具有钯核的药液处理之后,利用非电解镀在凹部114的内壁形成非电解镀膜116(参照图6的(C))。此时,在绝缘性树脂基材112的表面上也形成有非电解镀膜116。进行电解镀而在凹部114内形成电解镀膜118,将电镀金属填充到凹部114中,形成对准标记46和具有导通孔连接盘40、44的各导体电路42(参照图6的(D))。此时,在绝缘性树脂基材112的表面上也形成有电解镀膜118。之后的工序与上述参照图3的(C)~图5说明了的第一实施方式相同,因此省略说明。
在第二实施方式中,直接在绝缘性树脂基材112的表面上形成导体电路42。因此,能够省略第一实施方式中的从转印用层叠体35的准备工序到将导体电路42转印到绝缘性树脂基材56的转印工序的一系列工序(上述工序(1)~工序(7))。
本发明并不限定于上述各实施方式的结构,也可以如下所述地改变各实施方式的结构。
在第一实施方式中,也可以省略设置绝缘性树脂层30、铜箔32和剥离层33,以各转印用基材34彼此独立的状态在各转印用基材34上分别形成导体电路42。
在第二实施方式中,也可以不利用非电解镀膜116和电解镀膜118形成导体电路42,而是通过在将具有金属粒子的填充剂填充到凹部114内后,使该填充剂固化来形成导体电路42。另外,也可以只进行非电解镀来形成导体电路42。
在各实施方式中,在将抗镀层64A的开口64a形成为与导通孔用开口60实际相同的大小的情况下,能够使电解镀之后的填充导通孔68的表面和基板56b的表面实际位于同一平面上。在该情况下,也可以省略对填充导通孔68的表面进行蚀刻。
在各实施方式中,例如也可以在非电解镀之前形成抗镀层64B(参照图7的(A))。
在各实施方式中,也可以不上下翻转印刷电路板10地将IC芯片90安装该线路板10上(参照图7的(B))。即,印刷电路板10的埋入有第一导通孔连接盘40的表面也可以构成IC芯片90的安装面。
在各实施方式中,也可以省略设置对准标记46,代替该标记46而以埋入在绝缘性树脂基材56中的导体电路42为基准来形成导通孔用开口60。另外,也可以不从基板56b去除具有对准标记46的区域。
实施例
下面,利用实施例更加详细地说明本发明,本发明并不限定于实施例的范围。
(1)准备转印用层叠体35(参照图1的(A)),通过在厚度为0.2~0.8mm的由玻璃环氧树脂或BT(双马来酰亚胺三嗪)树脂构成的绝缘性树脂层30的两面上依次层叠铜箔32、剥离层33和转印用基材34,形成该转印用层叠体35。例如,作为转印用层叠体35,准备铜箔32的厚度为5μm且转印用基材34由厚度为18μm的铜箔构成的日立化成株式会社生产的商品名称为MCL-E679FG(R)的层叠体。在该情况下,绝缘性树脂层30较厚,容易在之后的工序中形成抗蚀层。利用超声波处理将各转印用基材34的周缘部焊接于铜箔32。以变幅杆(horn)的振幅约为12μm,变幅杆的频率f=28kHz,变幅杆的压力p=大约0~12kgf,变幅杆的移动速度v=大约10mm/sec的条件来进行超声波处理(超声波焊接),将铜箔32和转印用基材34以框状焊接。由此,能够防止在超声波焊接部35a的内侧,在进行药液处理工序时药液进入到铜箔32与转印用基材34之间。在超声波焊接部35a的外侧形成作为对准标记的基准孔35b,该基准孔35b贯穿转印用层叠体35。
(2)在将蚀刻液(MEC株式会社生产,商品名称为Cz8101)喷涂到转印用基材34的表面上而对该表面实施了粗面化处理后,对转印用层叠体35进行水洗后进行烘干。然后,在位于转印用层叠体35的两面的转印用基材34上层叠市面上售卖的感光性干膜37。然后,在转印用层叠体35的上表面上配置掩模39A并以100mJ/cm2的条件进行曝光(参照图1的(B))。感光性干膜37与掩模39A彼此分开。掩模39A具有与对准标记46和具有第一导通孔连接盘40的导体电路42相对应的黑色图案。此外,掩模39A还具有与转印用层叠体35的基准孔35b相对应的对准标记39c。在配置掩模39A时,对位基准孔35b和对准标记39c。例如以在从转印用层叠体35的下表面向基准孔35b内照射光的状态下,利用对准标记39c挡住该光的方式配置掩模39A,从而对位基准孔35b和对准标记39c。
在去除了掩模39A之后,在转印用层叠体35的下表面上配置掩模39B并以100mJ/cm2的条件进行曝光(参照图1的(C))。感光性干膜37与掩模39B彼此分开。掩模39B具有与具有第二导通孔连接盘44的导体电路42相对应的黑色图案。此外,掩模39B还具有与转印用层叠体35的基准孔35b相对应的对准标记39c。在配置掩模39B时,对位基准孔35b和对准标记39c。例如以在从转印用层叠体35的上表面向基准孔35b内照射光的状态下,利用对准标记39c挡住该光的方式配置掩模39B,从而对位基准孔35b和对准标记39c。
在去除了掩模39B之后,利用0.8%的碳酸钠进行显影处理,形成厚度为25μm的具有规定图案的抗镀层38。然后,以下述条件进行电解镀铜,在各转印用基材34上形成厚度为18μm的电解镀铜膜36(参照图1的(D))。
电解镀铜溶液
硫酸 2.24mol/l
硫酸铜 0.26mol/l
添加剂 19.5ml/l
(安美特日本公司生产,カパラシドGL)
电解镀铜的条件
电流密度 1A/dm2
时间 70分钟
温度 22±2℃
(3)通过用50℃的40g/l的NaOH水溶液去除抗镀层38,在绝缘性树脂基材56的上表面用的转印用基材34上形成对准标记46和具有第一导通孔连接盘40的导体电路42。同时在绝缘性树脂基材56的下表面用的转印用基材34上形成具有第二导通孔连接盘44的导体电路42(参照图1的(E))。各导体电路42和对准标记46的厚度均为18μm。对准标记46由圆和该圆的中央的点构成。第一导通孔连接盘40具有开口40a,第二导通孔连接盘44形成为圆板状。然后,将蚀刻液(MEC公司生产,商品名称为Cz8101)喷涂到导体电路42和对准标记46上,实施粗面化处理。
(4)利用由PET等树脂构成的保护层50覆盖该转印用基材34上的导体电路42(参照图2的(A))。
(5)使用钻头52在转印用层叠体35上形成多个孔(参照图2的(B))。在转印用层叠体35的超声波焊接部35a的内侧利用钻头52形成孔。上述孔由贯穿各转印用基材34的基准孔34a和贯穿绝缘性树脂层30、铜箔32和剥离层33的孔30a构成(参照图2的(C))。
(6)利用雕刻加工(router processing)在超声波焊接部35a与各转印用基材34的基准孔34a之间裁切转印用层叠体35,自转印用层叠体35剥离转印用基材34(参照图2的(D))。
(7)自转印用基材34剥离保护层50(参照图3的(A))。将各转印用基材34上下翻转,分别层叠在由两张层叠在一起的预浸料(日立工业株式会社生产,商品名称为GEA-679FGGSZPE)构成的厚度为36μm的绝缘性树脂基材56的上下两面上。以采用了真空层压装置的真空冲压,将各转印用基材34真空冲压于绝缘性树脂基材56。此时,向绝缘性树脂基材56埋入各转印用基材34的导体电路42而形成基板56b(参照图3的(B))。在层叠转印用基材34之前,预先利用钻头在绝缘性树脂基材56上的与各转印用基材34的基准孔34a相对应的位置形成基准孔56a。然后,在层叠转印用基材34时,将定位销54***到各基准孔34a和与该基准孔34a相对应的基准孔56a中,从而对形成在各转印用基材34上的导体电路42进行对位。在形成了基板56b之后,去除定位销54。对基板56b的周缘进行修边,去除自基板56b露出的树脂(未图示)。
(8)利用软蚀刻使各转印用基材34的厚度减小至5μm。在软蚀刻中,使用的是含有硫酸和过氧化氢的蚀刻液、或含有过硫酸钠的蚀刻液。在进行了软蚀刻后,利用X射线的投影,从外侧确认对准标记46的位置,在基板56b上形成孔56c,该孔56c贯穿该标记46(参照图3的(C))。对转印用基材34的表面实施黑化处理,使该表面黑化。
(9)以上述孔56c为基准,利用二氧化碳激光循环加工在绝缘性树脂基材56上形成导通孔用开口60,该导通孔用开口60从该基材56的上表面到达第二导通孔连接盘44(参照图3的(D))。详细而言,对转印用基材34的表面照射二氧化碳激光,将第一导通孔连接盘40作为掩模而形成导通孔用开口60。二氧化碳激光循环加工的条件是:波长为10.4μm、脉冲宽度为15μs,射击次数为5shots。在形成了导通孔用开口60之后,将基板56b浸渍在例如铬酸、高锰酸、钾的水溶液中,或者使用O2等离子体、CF4等离子体、或O2与CF4的混合气体的等离子体,去除导通孔用开口60内的树脂残渣。
(10)对各转印用基材34的表面实施使该表面具有钯催化剂(安美特公司生产)的药液处理。然后,利用非电解镀在导通孔用开口60的内壁上形成厚度为0.45μm的非电解镀膜62(参照图4的(A))。详细而言,将基板56b浸渍在由下述组成构成的30℃的非电解镀铜溶液中,形成非电解镀铜膜62。此时,在各转印用基材34的表面上形成非电解镀铜膜62。
非电解镀铜溶液
CuSO4·5H2O 10g/l
HCHO 8g/l
NaOH 5g/l
酒石酸钾钠 45g/l
添加剂 30ml/l
(11)对形成有非电解镀铜膜62的基板56b进行水洗后使基板56b干燥,之后将市面上售卖的感光性干膜粘贴在该基板56b的上下两面上。将掩模配置在干膜上,以210mJ/cm2的条件进行曝光,使用0.8%的碳酸钠水溶液进行显影处理。利用该一系列的处理在基板56b的上表面上形成具有开口64a的抗镀层64A,在基板56b的下表面上形成抗镀层64B(参照图4的(B))。抗镀层64A的开口64a大于导通孔用开口60。
(12)以下述条件进行电解镀,在导通孔用开口60内形成电解镀铜膜66而形成填充导通孔68(参照图4的(C))。此时,在填充导通孔68处形成上述突出部。
电解镀铜溶液
硫酸 2.24mol/l
硫酸铜 0.26mol/l
添加剂 19.5ml/l
(安美特日本公司生产,カパラシドGL)
电解镀铜的条件
电流密度 0.55A/dm2
时间 156分钟
温度 22±2℃
(13)以使用了主要成分是氯化铜的蚀刻液的蚀刻处理,去除填充导通孔68的突出部,使该填充导通孔68的表面平坦化(参照图4的(D))。
(14)在使用50℃的40g/l的NaOH水溶液去除了抗镀层64A、64B之后,以使用了上述蚀刻液的软蚀刻,去除转印用基材34。在具有对准标记46的区域的内侧裁切基板56b,形成印刷电路板10(参照图4的(E))。
(15)在印刷电路板10的上表面和下表面以20μm的厚度涂敷市面上售卖的阻焊剂组成物70。在对阻焊剂组成物70进行了干燥处理后,使描画有与阻焊层70的开口70a相对应的图案的厚度为5mm的光掩模与阻焊层70紧密接触。然后,利用1000mJ/cm2的紫外线进行曝光,使用DMTG溶液进行显影处理,在阻焊层70上形成直径为200μm的开口70a(参照图5的(A))。
然后,以80℃加热一个小时、100℃加热一个小时、120℃加热一个小时、150℃加热三个小时的条件分别进行加热处理,使阻焊层70硬化,形成具有开口70a且厚度为15~25μm的阻焊图案层70。
(16)然后,将形成有阻焊层70的印刷电路板10在含有氯化镍(2.3×10-1mol/l)、次磷酸钠(2.8×10-1mol/l)、柠檬酸钠(1.6×10-1mol/l)的pH=4.5的非电解镀镍溶液中浸渍20分钟,在开口70a处形成厚度为5μm的镀镍层72。然后,将印刷电路板10在含有氰化金钾(7.6×10-3mol/l)、氯化铵(1.9×10-1mol/l)、柠檬酸钠(1.2×10-1mol/l)、次磷酸钠(1.7×10-1mol/l)的非电解镀金溶液中以80℃的条件浸渍7.5分钟,在镀镍层72上形成厚度为0.03μm的镀金层74(参照图5的(B))。除了镍-金层之外,也可以形成单层的锡层、贵金属层(金、银、钯、铂等)。
(17)将含有锡—铅的焊锡膏印刷在与IC芯片90相对应的阻焊层70的开口70a处,将含有锡-锑的焊锡膏印刷在与子板94相对应的阻焊层70的开口70a处。然后,以200℃的条件进行回流焊,从而形成焊锡凸块(焊锡体)76U、76D(参照图5的(C))。
(18)在将印刷电路板10上下翻转后,借助焊锡凸块76U将IC芯片90安装在印刷电路板10上,借助焊锡凸块76D将该线路板10安装在子板94上(参照图5的(D))。
工业实用性
在上述实施方式中,以在绝缘性树脂基材的两面埋入有导体电路的印刷电路板为例说明了本发明,但本发明的填充导通孔的形成方法当然也能够应用在下述这样的多层印刷电路板中,即,在埋入有导体电路的绝缘性树脂基材的两面还层叠有绝缘性树脂基材的多层印刷电路板。
附图标记说明
10、印刷电路板;30、绝缘性树脂层;32、铜箔;34、转印用基材;35、转印用层叠体;42、导体电路;50、保护层;56、绝缘性树脂基材;60、导通孔用开口;62、非电解镀膜;64A、64B、抗镀层;66、电解镀膜;68、填充导通孔。
Claims (15)
1.一种印刷电路板的制造方法,其中,
该方法包括下述工序:
准备具有第一表面和作为该第一表面的相反面的第二表面的绝缘性树脂基材;
在上述绝缘性树脂基材的第一表面和第二表面埋入导体电路而形成基板;
形成从上述第一表面和第二表面中的一表面到达被埋入在另一表面中的导体电路的导通孔用开口;
对上述基板实施非电解镀,在上述导通孔用开口的内壁形成非电解镀膜;
对上述基板实施电解镀,将金属填充在上述导通孔用开口中而形成填充导通孔。
2.根据权利要求1所述的方法,其中,
形成上述基板的工序包括下述工序:
准备具有绝缘性树脂层和转印用基材的转印用层叠体,该转印用基材隔着导体箔和剥离层层叠在该绝缘性树脂层的两面上;
在上述转印用层叠体的各转印用基材上形成导体电路;
自上述转印用层叠体剥离各转印用基材;
将各转印用基材冲压到上述绝缘性树脂基材的第一表面和第二表面上,以将上述转印用基材上的上述导体电路埋入上述绝缘性树脂基材。
3.根据权利要求2所述的方法,其中,
形成上述基板的工序还包括下述工序:
进行了在上述转印用层叠体的各转印用基材上形成导体电路的工序之后,在各转印用基材上的导体电路上层叠保护层;
在进行了自上述转印用层叠体剥离各转印用基材的工序之后,自各转印用基材剥离上述保护层。
4.根据权利要求2所述的方法,其中,
形成上述基板的工序还包括下述工序:
进行了在上述转印用层叠体的各转印用基材上形成导体电路的工序之后,形成基准孔,该基准孔贯穿上述各转印用基材;
在将上述各转印用基材冲压于上述绝缘性树脂基材的工序中,将销***到形成在上述各转印用基材上的上述基准孔中,从而将形成在各转印用基材上的导体电路对位。
5.根据权利要求4所述的方法,其中,
形成上述基准孔的工序具有下述工序,即,通过形成贯穿上述转印用层叠体的孔,而在各转印用基材上同时形成基准孔。
6.根据权利要求2所述的方法,其中,
在转印用基材上形成导通孔用开口形成用的对准标记。
7.根据权利要求2所述的方法,其中,
在上述转印用层叠体的各转印用基材上形成导体电路的工序包括下述工序:
在上述转印用层叠体上形成对准标记;
以上述对准标记为基准,在各转印用基材上形成电解镀用的抗镀层;
对上述各转印用基材实施电解镀而形成导体电路;
去除上述抗镀层。
8.根据权利要求2所述的方法,其中,
该方法还包括下述工序:
在形成上述非电解镀膜的工序之前,进行非电解镀用的预先处理;
在形成上述非电解镀膜的工序之后,在上述转印用基材上形成上述电解镀用的抗镀层;
在形成上述填充导通孔的工序之后,去除上述抗镀层;
去除上述转印用基材。
9.根据权利要求8所述的方法,其中,
该方法还包括下述工序:
在形成上述填充导通孔的工序后且在去除上述抗镀层的工序前,对上述填充导通孔的表面实施蚀刻处理。
10.根据权利要求1所述的方法,其中,
形成上述基板的工序包括下述工序,即,将具有与上述导通孔用开口相对应的开口的导体电路埋入在绝缘性树脂基材中;
形成上述导通孔用开口的工序包括下述工序,即,将具有上述开口的导体电路作为掩模,利用激光加工形成导通孔用开口。
11.根据权利要求1所述的方法,其中,
上述填充导通孔由形成在导通孔用开口的内壁上的非电解镀膜和形成在该非电解镀膜上的电解镀膜构成。
12.根据权利要求1所述的方法,其中,
形成上述基板的工序包括下述工序:
在上述绝缘性树脂基材的第一表面和第二表面形成与上述导体电路相对应的凹部;
对上述绝缘性树脂基材实施非电解镀,在上述凹部的内壁形成非电解镀膜;
对上述绝缘性树脂基材实施电解镀,将金属填充到上述凹部中而形成导体电路。
13.一种印刷电路板,其中,
该印刷电路板包括:
绝缘性树脂基材,其具有第一表面和作为该第一表面的相反面的第二表面;
导体电路,其埋入在上述绝缘性树脂基材的上述第一表面和上述第二表面中;
填充导通孔,其由非电解镀膜和电解镀膜构成,该非电解镀膜形成在导通孔用开口的内壁上,该导通孔用开口从上述第一表面和第二表面中的一表面到达被埋入在另一表面中的导体电路,上述电解镀膜填充在上述导通孔用开口内。
14.根据权利要求13所述的印刷电路板,其中,
上述填充导通孔由形成在导通孔用开口的内壁上的非电解镀膜和形成在该非电解镀膜上的电解镀膜构成。
15.根据权利要求13所述的印刷电路板,其中,
上述导通孔用开口形成为从第一表面通向被埋入在第二表面中的导体电路,第二表面构成电子零件的安装面。
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WO2010038559A1 (ja) | 2010-04-08 |
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JP5223926B2 (ja) | 2013-06-26 |
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