CN101921648B - 水性切削液和浆 - Google Patents
水性切削液和浆 Download PDFInfo
- Publication number
- CN101921648B CN101921648B CN201010246951.9A CN201010246951A CN101921648B CN 101921648 B CN101921648 B CN 101921648B CN 201010246951 A CN201010246951 A CN 201010246951A CN 101921648 B CN101921648 B CN 101921648B
- Authority
- CN
- China
- Prior art keywords
- water
- cutting fluid
- weight
- cutting
- glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002173 cutting fluid Substances 0.000 title claims abstract description 51
- 238000005520 cutting process Methods 0.000 title claims abstract description 42
- 239000003795 chemical substances by application Substances 0.000 title abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 59
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 30
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- 239000002002 slurry Substances 0.000 claims description 27
- 239000003082 abrasive agent Substances 0.000 claims description 24
- -1 amino, carboxyl Chemical group 0.000 claims description 15
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 15
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 13
- 235000013861 fat-free Nutrition 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 238000009736 wetting Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 8
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 3
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 239000006185 dispersion Substances 0.000 abstract description 9
- 229920001296 polysiloxane Polymers 0.000 abstract description 5
- 239000006061 abrasive grain Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 230000006641 stabilisation Effects 0.000 description 7
- 238000011105 stabilization Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000027555 hydrotropism Effects 0.000 description 1
- 238000002356 laser light scattering Methods 0.000 description 1
- 229960003511 macrogol Drugs 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007415 particle size distribution analysis Methods 0.000 description 1
- JLFNLZLINWHATN-UHFFFAOYSA-N pentaethylene glycol Chemical compound OCCOCCOCCOCCOCCO JLFNLZLINWHATN-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
- C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/047—Siloxanes with specific structure containing alkylene oxide groups
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/048—Siloxanes with specific structure containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/05—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon
- C10M2229/052—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Lubricants (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明涉及水性切削液和浆，含有0.01～20wt％改性有机硅的水性切削液与磨料结合形成水性切削浆，其具有磨料的分散稳定性、粘度稳定性、以及较高的加工精度的优点。
Description
技术领域
本发明涉及一种在加工件的切削中起辅助作用的水性切削液和浆，加工件包括用于半导体、太阳能电池和其他工业领域的硅晶、石英、水晶、化合物半导体、磁性合金等的锭材。尤其是，涉及一种含有水性切削液和磨料的水性切削浆，其具有磨料分散稳定性、粘度稳定性以及与现有技术相比具有更高的加工精度的优点。
背景技术
一种已知的切削坚硬和脆性材料的锭材的方法是使用线锯或切断轮。在使用线锯的切削方法中，为了达到在切削工具和加工件之间进行润滑，去除摩擦热，并清除碎屑的目的，切削液通常在切削操作过程中加入。切削液包括含有矿物油和添加剂的油基切削液，含有聚乙二醇或聚丙二醇作为主要组分的二醇基切削液，以及表面活性剂水溶液形式的水性切削液。然而这些切削液有缺点。油基切削液在切削点的冷却效果差。如果加工件或工具被油基切削液污染，需要有机溶剂清洗液，从环境角度考虑是不希望的。二醇基切削液和水性切削液在切削操作中的粘度稳定性以及磨料的分散稳定性方面差。
为了解决这些问题，JP 2000-327838A提出了一种基于多元醇或衍生物的切削液，在其中加入斑脱土、纤维素和云母，从而有利于磨料的分散性。JP2006-278773A公开了一种水性切削液，其含有二醇和/或水密性醚和zeta-电位至少为0mV的颗粒，典型的是氧化铝。JP 2007-031502A公开了一种含有二醇、二醇醚和水的水性切削液。
在工业中，半导体硅晶片从硅锭切削而来，其直径已经从200mm增加到300mm，以及甚至到450mm。太阳能电池以及类似领域中所用的硅晶片变得越来越薄。需要一种能够满足直径和厚度变化需要的水性切削液。需要具有一种比现有技术加工精度更高的水性切削液。
引用列表
专利文献1：JP 2000-327838A(US 2003100455)
专利文献2：JP 2006-278773A
专利文献3：JP 2007-031502A(EP1752521，CN1903968)
发明内容
本发明的一个目的是提供一种水性切削液和浆，其具有磨料的分散稳定性、粘度稳定性以及与现有技术相比具有更高的加工精度的优点。
发明人已经发现通过向水性切削液中加入0.01～20重量％的改性有机硅(A)可以解决这个突出难题。
一方面，本发明提供一种含有(A)0.01～20重量％的改性有机硅的水性切削液。
改性有机硅通常选自聚醚、氨基、羧基、以及环氧基改性的有机硅。
在这种情况下，改性有机硅优选由下述平均组成式(1)表示，
R1 pR2 qR3 rSiO(4-p-q-r)/2 (1)
其中，R1为-(CR4 2)nX，R4为氢原子，具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，或羟基，n为1～20的整数，X为选自由氨基、羧基和环氧基构成的组中的官能团，R2为具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，R3为具有如下通式的有机基团：-CfH2fO(CgH2gO)hR5，R5为氢原子，无脂肪族不饱和键的、取代或未取代的单价烃基，或乙酰基，f为2～12的正数，g为2～4的正数，h为1～200的正数，且p，q和r为满足0≤p＜2.5，0.01≤q＜2.5，0≤r＜2.5且0.05＜p+q+r≤3.0的数。
切削液可进一步含有(B)1～20重量％的水，和(C)60～98.99重量％的亲水性多元醇和/或其衍生物。亲水性多元醇或其衍生物(C)优选在20℃具有至少为5重量％的水中溶解度，和具有达到0.01mmHg的蒸汽压。
另一方面，本发明提供了一种含有100重量份如上定义的水性切削液和50～200重量份磨料的水性切削浆。
本发明的有益效果
含有0.01～20wt％改性有机硅的水性切削液具有磨料的分散稳定性、浆形态时的粘度稳定性以及与现有技术相比具有更高的加工精度的优点。
具体实施方式
本发明的水性切削液被定义为含有0.01～20重量％改性有机硅(A)。适合的改性有机硅包括聚醚改性有机硅、氨基改性有机硅、羧基改性有机硅和环氧基改性有机硅。尤其是优选聚醚和氨基改性有机硅。含有改性有机硅对于显著降低水性切削液的动态接触角是有效的，导致了切削性能的显著提高。
在这种情况下，改性有机硅(A)优选由下述平均组成式(1)表示，
R1 pR2 qR3 rSiO(4-g-q-r)/2 (1)
其中，R1为-(CR4 2)nX，R4为氢原子，具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，或羟基，n为1～20的整数，X为选自由氨基、羧基和环氧基构成的组中的官能团，R2为具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，R3为具有如下通式的有机基团：-CfH2fO(CgH2gO)hR5，R5为氢原子，无脂肪族不饱和键的、取代或未取代的单价烃基，或乙酰基，f为2～12的正数，g为2～4的正数，h为1～200的正数，且p，q和r为满足0≤p＜2.5，0.01≤q＜2.5，0≤r＜2.5且0.05＜p+q+r≤3.0的数。
R2的例子包括烷基例如甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基和癸基，环烷基例如环戊基和环己基，氟化烷基例如三氟丙基和十七氟代癸基，其中甲基是优选的。
R5为氢原子、单价烃基或乙酰基。R5的例子包括氢原子、甲基、乙基、丙基、丁基和乙酰基。
在上述式-CfH2fO(CgH2gO)hR5中，f为2～12的正数，优选从2～6，更优选为3，g为2～4的正数，优选为2和3，更优选为2或2和3相结合，以及h为1～200的正数，优选为1～100，更优选为1～50。
在上述式(1)中，n为1～20的整数，优选1～10，更优选1～5。
R4的例子包括氢原子、甲基和羟基，其中氢原子是优选的。
基于水性切削液，改性有机硅的含量为0.01～20重量％，优选0.1～10重量％，且更优选0.1～5重量％。低于0.01wt％导致加工精度的降低，而高于20wt％导致不溶物的形成。
在一个优选的实施方案中，切削液还含有(B)1～20重量％的水，和(C)60～98.99重量％的亲水性多元醇和/或其衍生物。在一个更优选的实施方案中，切削液进一步含有(B)10～20重量％的水，和(C)80～95重量％的亲水性多元醇和/或其衍生物。低于1wt％的水会导致诸如加工精度降低这样的问题，而加入多于20wt％的水会导致水性切削液具有诸如低的粘度稳定性这样的问题。低于60wt％的亲水性多元醇和/或其衍生物会导致磨料分散性降低，而多于98.99wt％会导致加工精度降低。
亲水性多元醇及其衍生物(C)的例子包括乙二醇、二甘醇、三甘醇、二丙二醇、三丙二醇，和聚乙二醇。在聚乙二醇中，具有平均分子量为200～1000的聚乙二醇为优选的。例如，使用聚乙二醇200和400。优选地亲水性多元醇或其衍生物(C)在20℃时具有至少为5重量％的水中溶解度，和具有达到0.01mmHg的蒸汽压。
如果在20℃的水中溶解度低于5重量％，会引发在晶片清洗中必须用有机溶剂的问题。蒸汽压高于0.01mmHg会增加切削操作中起火的危险。
本发明另一个实施方案是含有100重量份水性切削液组分(A)～(C)和50～200重量份磨料的水性切削浆。适宜的磨料包括碳化硅、氧化铝和金刚石。碳化硅和金刚石是更适宜的。含有小于50pbw磨料的浆可能效果较差从而切削硅锭花费较长的时间。大于200pbw的磨料可能会影响分散。
添加剂例如消泡剂、水溶性聚合物、云母、疏水性二氧化硅和羧酸可加入该水性切削液和浆中，只要它们的性能不被削弱。
通常，多线锯具有在一定间隔刻有凹槽的两个导向轮。金属线被缠绕在导向轮的凹槽内并在一定张力下保持平行。
当切削一个待加工的样品时，所述浆供给金属线并造成切削线的双向或单向高速运转。上面放有待加工样品的工作台从上方位置向下行进到金属线，由此样品被同时切削为大量的具有相同形状的产品。
可选择的是，随着样品上升的工艺代替样品下降工艺，带有样品的工作台可以向上运动。
在多线锯切削中，一连串的提供含有磨料的浆给金属线以及使用粘附有浆的金属线切削待加工样品的步骤是重要的操作。
实施例
实施例和比较例如下通过举例的方式但并非限制。所有的份以及％都是以重量计。
实施例1
标记为M-1的流体通过混合13％的去离子水，18％的PEG200，和68％的二甘醇制备，并向其中加入1％的用分子式R2 2.21R3 0.27SiO0.76表示的聚醚改性的有机硅，其中R2为甲基且R3为-C3H6O(C2H4O)7.6H。该流体和碳化硅(SiC)磨料(ShinanoE1ectric Refining Co.，Ltd.，GP#1000，平均粒径11μm)混合并搅拌直到获得用于切削硅锭的水性浆。
通过测量刚刚制成以后以及静置24小时后的平均粒径来测量该水性切削浆的动态接触角并评价磨料的分散稳定性。结果如表3所示。还通过在如下条件下切削硅锭来评价浆的粘度稳定性和加工精度，结果也示于表3中。
切削条件
切削工具：多线锯
金属线直径：0.14mm
磨料：碳化硅(Shinano Electric Refining Co.，Ltd.，GP#1000，平均粒径11μm)
硅锭：多晶硅，尺寸125mm2，长90mm
切削间隔：0.40mm
切削速率：0.3mm/min
金属线运行速度：600m/min
评价
动态接触角
使用接触角测量仪(型号CA-D，Kyowa Interface Science Co.，Ltd.)，水性浆滴下以后30秒测量液滴在玻璃板上的接触角。
磨料的分散稳定性
使用Cilas公司的激光散射衍射粒度分布分析仪Cilas 1064，测量水性切削液刚刚制备完成后以及静置24小时后的平均粒径。计算粒径的增量。
粒径增量＝(24小时后的平均粒径)/(制备完成的平均粒径)
水性切削浆的粘度稳定性
使用Brookfield粘度仪，在硅锭切削操作前后测量水性切削浆的粘度，计算粘度增加百分比。
切削后的加工精度
切削后，检查切削晶片表面的锯痕。
○：没有锯痕
×：有锯痕
还检测晶片的总厚度变化(TTV)以及翘曲度或三维波度。硅锭被切成晶片以后，从每个锭相对的末端和中心切下的三个晶片，共九个晶片做为样品。每个晶片在四个角及其中间测量厚度，共八个点。总共获得72个厚度数据，从此计算出一个标准偏差。
实施例2
除了使用以式R1 0.67R2 2SiO0.67表示的氨基改性的有机硅以外，水性切削液(M-2)如实施例1中制备，其中作为改性有机硅，R1为-(CH2)2NH2且R2为甲基。其按照实施例1被评价。
实施例3
除了使用以式R1 0.33R2 2.33SiO0.67表示的羧基改性的有机硅以外，水性切削液(M-3)如实施例1中制备，其中作为改性有机硅，R1为-(CH2)2COOH且R2为甲基。其按照实施例1被评价。
实施例4
除了使用以式R1 0.67R2 2SiO0.67表示的环氧基改性的有机硅以外，水性切削液(M-4)如实施例1中制备，其中作为改性有机硅，R1为且R2为甲基。其按照实施例1被评价。
实施例5～9和比较实施例1～7
如实施例1，通过混合和搅拌如表1和2中所示的数量的组分制备水性切削液(M-5～M-18)。如实施例1，该流体和SiC磨料(Shinano Eiectric RefiningCo.，Ltd.，GP#1000，平均粒径11μm)混合并搅拌直到获得水性浆。
通过测量刚刚制备完成后以及静置24小时后的平均粒径来测量该水性切削浆的动态接触角并评价磨料的分散稳定性。结果如表3和4所示。还通过在实施例1中相同条件下切削硅锭来评价浆的粘度稳定性和加工精度。结果也示于表3和4中。
表1
表2
Noigen TDS-30：Dai-Ichi Kogyo Seiyaku Co.，Ltd.的商标，RO(CH2CH2)nOH，R＝13个碳，n＝3
Noigen TDS-80：Dai-Ichi Kogyo Seiyaku Co.，Ltd.的商标，RO(CH2CH2)nOH，R＝13个碳，n＝8
PEG200：Sanyo Chemical Industries Ltd.的商标，聚乙二醇，平均分子量200
PEG400：Sanyo Chemical Industries Ltd.的商标，聚乙二醇，平均分子量400
表3
表4
Claims (17)
1.水性切削液，含有(A)0.01～20重量％的改性有机硅、(B)1～20重量％的水和(C)60～98.99重量％的亲水性多元醇和／或其衍生物；
其中改性有机硅为由下述平均组成式(1)表示，
R1 pR2 qR3 rSiO(4-p-q-r)/2 (1)
其中，R1为-(CR4 2)nX，R4为氢原子，具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，或羟基，n为1～20的整数，X为选自氨基、羧基和环氧基中的官能团，R2为具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，R3为具有通式-CfH2fO(cgH2gO)hR5的有机基团，R5为氢原子，无脂肪族不饱和键的、取代或未取代的单价烃基，或乙酰基，f为2～12的正数，g为2～4的正数，h为1～200的正数，且p，q和r为满足0≤p＜2.5，0.01≤q＜2.5，0≤r＜2.5且0.05＜p+q+r≤3.0的数。
2.权利要求1的切削液，其中改性有机硅为聚醚、氨基、羧基、或环氧基改性的有机硅。
3.权利要求1的切削液，其中亲水性多元醇或其衍生物(C)在20℃具有至少为5重量％的水中溶解度，和具有0.01mmHg的蒸汽压。
4.权利要求1的切削液，其中成分(C)选自乙二醇、二甘醇、三甘醇、二丙二醇、三丙二醇、和聚乙二醇。
5.权利要求1的切削液，其中成分(C)是具有200～1000的平均分子量的聚乙二醇。
6.含有100重量份权利要求1的水性切削液和50～200重量份磨料的水性切削浆。
7.权利要求6的水性切削浆，其中磨料选自碳化硅、氧化铝和金刚石。
8.含有100重量份权利要求4的水性切削液和50～200重量份磨料的水性切削浆。
9.权利要求8的水性切削浆，其中磨料选自碳化硅、氧化铝和金刚石。
10.含有100重量份权利要求5的水性切削液和50～200重量份磨料的水性切削浆。
11.权利要求4的水性切削浆，其用于辅助切削选自硅晶、石英、水晶、化合物半导体、和磁性合金的锭材。
12.使用水性切削液切削锭材的方法，其中水性切削液包含：
(A)下述平均组成式(1)表示的0.01～20重量％的改性有机硅，
R1 pR2 qR3 rSiO(4-p-q-r)/2 (1)
其中，R1为-(CR4 2)nX，R4为氢原子，具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，或羟基，n为1～20的整数，X为选自氨基、羧基和环氧基中的官能团，R2为具有1～20个碳原子且无脂肪族不饱和键的、取代或未取代的单价烃基，R3为具有通式-CfH2fO(cgH2gO)hR5的有机基团，R5为氢原子，无脂肪族不饱和键的、取代或未取代的单价烃基，或乙酰基，f为2～12的正数，g为2～4的正数，h为1～200的正数，且p，q和r为满足0≤p＜2.5，0.01≤q＜2.5，0≤r＜2.5且0.05＜p+q+r≤3.0的数；
(B)1～20重量％的水；和
(C)60～98.99重量％的亲水性多元醇和／或其衍生物。
13.权利要求12的方法，其中成分(C)选自乙二醇、二甘醇、三甘醇、二丙二醇、三丙二醇、和聚乙二醇。
14.要得要求12的方法，其中成分(C)是具有200～1000的平均分子量的聚乙二醇。
15.权利要求12的方法，其中多线锯用于切削。
16.权利要求15的方法，其中切削被引导以使多线锯沿双向或单向移动。
17.权利要求12至16中任一项的方法，其中锭材是硅晶、石英、水晶、化合物半导体、和磁性合金。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009141070 | 2009-06-12 | ||
| JP2009-141070 | 2009-06-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101921648A CN101921648A (zh) | 2010-12-22 |
| CN101921648B true CN101921648B (zh) | 2014-07-30 |
Family
ID=43308904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010246951.9A Expired - Fee Related CN101921648B (zh) | 2009-06-12 | 2010-06-11 | 水性切削液和浆 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8591611B2 (zh) |
| EP (1) | EP2441550B1 (zh) |
| JP (1) | JP5408251B2 (zh) |
| KR (2) | KR20120036796A (zh) |
| CN (1) | CN101921648B (zh) |
| BR (1) | BRPI1011223A2 (zh) |
| MY (1) | MY152049A (zh) |
| TW (1) | TW201113357A (zh) |
| WO (1) | WO2010143649A1 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5538044B2 (ja) * | 2010-04-16 | 2014-07-02 | Ｊｘ日鉱日石エネルギー株式会社 | 耐摩耗性に優れる潤滑油組成物 |
| CN103525528A (zh) * | 2013-02-14 | 2014-01-22 | 郑州新安华砂轮有限公司 | 一种切削液及其配制方法 |
| JP6078397B2 (ja) | 2013-03-29 | 2017-02-08 | シーシーアイ株式会社 | 作動液 |
| CN105636479B (zh) * | 2013-10-16 | 2018-03-13 | 皇家飞利浦有限公司 | 用于牙菌斑检测的设备 |
| WO2018221972A2 (ko) * | 2017-06-01 | 2018-12-06 | 영창케미칼 주식회사 | 절삭유 조성물 |
| KR102062341B1 (ko) | 2017-06-01 | 2020-01-03 | 영창케미칼 주식회사 | 절삭유 조성물 및 그를 이용한 절삭방법 |
| CN112877124B (zh) * | 2020-09-09 | 2022-05-31 | 武汉宜田科技发展有限公司 | 一种金刚石线线切割用水性切割液及其制备和使用方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3009083B2 (ja) * | 1993-05-14 | 2000-02-14 | 信越化学工業株式会社 | 泡抑制剤組成物 |
| JPH07157792A (ja) * | 1993-11-01 | 1995-06-20 | Xerox Corp | 水性ベース切削油剤 |
| JP3259516B2 (ja) * | 1994-04-25 | 2002-02-25 | 信越化学工業株式会社 | パルプ黒液用消泡剤 |
| JP2000327838A (ja) | 1999-05-18 | 2000-11-28 | Super Silicon Kenkyusho:Kk | ワイヤソー又はバンドソー用水性研削液 |
| EP1077233A3 (de) * | 1999-08-19 | 2001-08-16 | Wacker-Chemie GmbH | Trennmittel gegen bituminöse Stoffe |
| JP2001164240A (ja) | 1999-12-06 | 2001-06-19 | Ishii Hyoki Corp | 水性切削液 |
| JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| JP2004260123A (ja) * | 2003-02-28 | 2004-09-16 | Sanyo Chem Ind Ltd | シリコンインゴットスライス用クーラント |
| US7387970B2 (en) * | 2003-05-07 | 2008-06-17 | Freescale Semiconductor, Inc. | Method of using an aqueous solution and composition thereof |
| JP4564735B2 (ja) * | 2003-10-22 | 2010-10-20 | 旭硝子株式会社 | 研磨スラリーおよび半導体集積回路の製造方法 |
| JP4515071B2 (ja) * | 2003-10-30 | 2010-07-28 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 毛髪化粧料組成物 |
| KR100611064B1 (ko) * | 2004-07-15 | 2006-08-10 | 삼성전자주식회사 | 화학 기계적 연마 공정용 슬러리 조성물, 상기 슬러리조성물을 이용한 화학 기계적 연마 방법 및 상기 방법을이용한 게이트 패턴의 형성 방법 |
| JP4566045B2 (ja) | 2005-03-29 | 2010-10-20 | ユシロ化学工業株式会社 | 水性砥粒分散媒組成物 |
| JP4481898B2 (ja) | 2005-07-25 | 2010-06-16 | ユシロ化学工業株式会社 | 水性砥粒分散媒組成物 |
| JP4735844B2 (ja) * | 2005-08-03 | 2011-07-27 | 日信化学工業株式会社 | 硝子繊維処理浸透剤及び硝子繊維処理剤組成物 |
| US8216673B2 (en) * | 2005-08-03 | 2012-07-10 | Nissin Chemical Industry Co., Ltd. | Glass fiber-treating agent and glass fiber-treating composition |
| JP2007231384A (ja) * | 2006-03-02 | 2007-09-13 | Matsumura Sekiyu Kenkyusho:Kk | 非鉄金属用防食剤および非鉄金属用水溶性切削・研削加工油剤組成物 |
-
2010
- 2010-06-09 WO PCT/JP2010/059752 patent/WO2010143649A1/ja active Application Filing
- 2010-06-09 BR BRPI1011223A patent/BRPI1011223A2/pt not_active IP Right Cessation
- 2010-06-09 US US12/934,749 patent/US8591611B2/en active Active
- 2010-06-09 KR KR1020117021047A patent/KR20120036796A/ko not_active Application Discontinuation
- 2010-06-09 JP JP2011518552A patent/JP5408251B2/ja not_active Expired - Fee Related
- 2010-06-09 EP EP10786180.9A patent/EP2441550B1/en not_active Not-in-force
- 2010-06-09 MY MYPI2011003613 patent/MY152049A/en unknown
- 2010-06-11 CN CN201010246951.9A patent/CN101921648B/zh not_active Expired - Fee Related
- 2010-06-11 TW TW099119118A patent/TW201113357A/zh unknown
- 2010-06-11 KR KR1020100055163A patent/KR20100133907A/ko not_active Application Discontinuation
Non-Patent Citations (1)
| Title |
|---|
| JP特开2005-129637A 2005.05.19 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201113357A (en) | 2011-04-16 |
| EP2441550A1 (en) | 2012-04-18 |
| EP2441550B1 (en) | 2016-09-07 |
| WO2010143649A1 (ja) | 2010-12-16 |
| CN101921648A (zh) | 2010-12-22 |
| KR20100133907A (ko) | 2010-12-22 |
| KR20120036796A (ko) | 2012-04-18 |
| JPWO2010143649A1 (ja) | 2012-11-29 |
| BRPI1011223A2 (pt) | 2016-03-15 |
| US8591611B2 (en) | 2013-11-26 |
| JP5408251B2 (ja) | 2014-02-05 |
| EP2441550A4 (en) | 2012-11-21 |
| US20110113699A1 (en) | 2011-05-19 |
| MY152049A (en) | 2014-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101921648B (zh) | 水性切削液和浆 | |
| CN101906346B (zh) | 水性切削液和浆 | |
| KR101370101B1 (ko) | 와이어쏘잉용 절삭유 조성물 | |
| US8980809B2 (en) | Cutting fluids with improved performance | |
| JP6204029B2 (ja) | 水性加工液 | |
| WO1999035220A1 (fr) | Fluide de coupe aqueux, agent de coupe aqueux et procede de coupe de materiaux durs et cassants y relatif | |
| KR20140018265A (ko) | 고정 지립 와이어소용 수용성 가공액 | |
| US8597538B2 (en) | Composition for improving dryness during wire sawing | |
| CN117127188A (zh) | 一种金属清洗剂及其制备方法和应用 | |
| US11001780B2 (en) | Cutting oil composition | |
| JP2002080883A (ja) | ワイヤソ−用水溶性加工液 | |
| KR20110039725A (ko) | 와이어 쏘우용 수용성 절삭액 조성물 | |
| KR101342627B1 (ko) | 금속성 및 다이아몬드 와이어 쏘잉용 수용성 금속 가공유 조성물 | |
| JPH11286693A (ja) | ワイヤソー用加工液 | |
| WO2022210926A1 (ja) | 加工液、加工液用組成物及び脆性材料加工液組成物 | |
| KR20130067809A (ko) | 수성 절삭액 조성물 | |
| KR20130046289A (ko) | 수성 절삭액 조성물 | |
| KR20110038340A (ko) | 와이어 쏘우용 수용성 절삭액 조성물 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140730 Termination date: 20150611 |
|
| EXPY | Termination of patent right or utility model |