CN101899640A - Preparation method for copper-chromium alloy surface alloying - Google Patents
Preparation method for copper-chromium alloy surface alloying Download PDFInfo
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- CN101899640A CN101899640A CN 201010238978 CN201010238978A CN101899640A CN 101899640 A CN101899640 A CN 101899640A CN 201010238978 CN201010238978 CN 201010238978 CN 201010238978 A CN201010238978 A CN 201010238978A CN 101899640 A CN101899640 A CN 101899640A
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Abstract
The invention relates to a preparation method for copper-chromium alloy surface alloying, which belongs to the technical field of material surface strengthening. The process method comprises the following steps: coating alloy powder on the surface of a copper substrate, or forming a Cr film on the surface of the copper substrate by adopting the electrodeposition method, or spray-coating a Cr layer on the surface of the copper substrate by adopting the plasma spray coating method, then placing into a vacuum chamber, leading the vacuum degree P of the vacuum chamber to be 5 multiplied by 10-3Pa, then filling argon into the vacuum chamber as protective gas, starting a pulsed electron beam device, loading high voltage of 10-40keV, utilizing an electron beam for heating and further realizing the surface alloying. The ranges of main parameters of the electron beam surface alloying are as follows: the energy density is 1-20J/cm2, the pulse width is 2-5 mu s, and the pulse frequency is 1-30 times; and the effective size of electron beam spots is 70-100mm. The surface alloying processing method can form a copper-chromium alloyed layer with small grains on the surface of a copper-based material, and greatly improve the surface micro-hardness, the wear resistance, anti-fusion welding property and other performances.
Description
Technical field
The present invention relates to a kind of preparation method of copper-chromium alloy surface alloying, this method is to form the chromiumcopper layer by the method that adopts pulsed electron beam on the surface of copper base material, belongs to material surface and handles and the intensifying technology field.
Background technology
Because the mutual solid solubility of chromiumcopper is very little, therefore chromiumcopper combines the high rigidity and the copper favorable conductive thermal conductivity of chromium, be used widely at aspects such as preparation high-strength highly-conductive material, circuit lead frame, large high-speed turbine generator rotator lead, electric car and electric power train aerial condutors, proof voltage intensity height, dropout current ability are big because of having for the chromiumcopper of especially high chromium content, resistance fusion welding can the good and characteristics such as performance is low of damming, in being widely used in as contact material in the pressure vacuum interrupter.As the chromiumcopper of contact material, the intensity of material surface, microstructure uniformity and grain size etc. play crucial effect to the performance of contact material.Therefore the intensity of alloy surface and proof voltage intensity etc. are linear, how to improve the surface strength of alloy, and the microstructure of refinement alloy surface improves the performance of alloy, and then be vital the work-ing life of improving vacuum interrupter.Chromiumcopper in use weares and teares, and mainly concentrates on the surface, and the inefficacy of alloy often causes whole inefficacy owing to the surface of contact material takes the lead in losing efficacy, so the microstructure of copper-chromium alloy surface and performance seem and be even more important.
In research in the past, " Surface alloying of copper with chromium by CO such as Hirose are arranged abroad
2Laser " (Materials Science and Engineering A; 1994; 174:199-204) and " Laser surface alloying of copper with chromium I. Microstructure evolution. " (Materials Science and Engineering A; 1999; 268:216-226); " Laser surface alloying of copper with chromium I. Improvement in mechanical properties. " (Materials Science and Engineering A such as Dutta Majumdar, 1994,174:227-235) adopt laser surface alloying to study chromiumcopper.The domestic Liang Shuhua of having etc. " thin brilliant CuCr is the research of contact material " (powder metallurgy technology, 2000,18(3): 196-199) and Miao Baihe " laser surface remelting CuCr50 mmaterial " (use laser, 1999,19(5): 253-255) etc. employing laser has carried out remelting to copper-chromium alloy surface.
Electron beam (Electron Beam) process for treating surface be beam bombardment with high-energy-density to the metallic surface, and adopt the mode of high-speed sweep, make beam energy be distributed in the metallic surface equably.The electron beam process for treating surface is well used in machinery manufacturing industry, as on the gas turbine blades, on the mould and various tool carry out surface strengthening, reach and improve performances such as it is heat-resisting, anti-corrosion, wear-resisting.Pulsed electron beam sharply cools off after making the surface of material reach temperature of fusion the material rapid heating again, and improving nucleation rate inhibition grain growth by kinetic control can obtain nano-structure at material surface.Many in recent years investigators are just carrying out and utilize the electron beam surface strengthening technology to carry out the research of superalloy and functional materials.Up to now, yet there are no the employing pulsed electron beam chromiumcopper is carried out Alloying Treatment.
Summary of the invention
The object of the present invention is to provide and a kind ofly handle, thereby form one deck microhardness height, the chromiumcopper layer that wear resistance is good on the surface of copper base material by adopting the pulsed electron beam device that chromiumcopper is carried out surface alloying.
To achieve these goals, this patent is by the following technical solutions: a kind of preparation method of copper-chromium alloy surface alloying, it is characterized in that comprising the steps: (1) preparation chromiumcopper: with the red copper is base material chromium-coating powdered alloy on base material, perhaps adopt electrodip process to form the Cr film, perhaps adopt the plasma spray method at the surface of copper base material spraying Cr layer on the surface of copper base material; (2) the above-mentioned chromiumcopper for preparing is contained on the anchor clamps of adapted, puts into vacuum chamber, vacuumize, in vacuum chamber, charge into inert protective gas then; (3) starting impulse electron beam equipment carries out the electron beam irradiation to the chromiumcopper in the vacuum chamber; By adopting the pulsed electron beams heating surface, realize the copper-chromium alloy surface alloying of base material.
Further feature is: described Chrome metal powder powder all is a chromium powder; Any one or two kinds in tungsten powder, zirconium powder, nickel powder, iron powder, the molybdenum powder perhaps in chromium powder, have been added until whole five kinds, the weight percent content of chromium powder 〉=92%, any one weight percent content≤2% in tungsten powder, zirconium powder, nickel powder, iron powder, the molybdenum powder; Its coating method is to use the organic or inorganic binding agent, and with powdered alloy furnishing pasty state, brush is on the surface of copper base material, and coat-thickness is 100-800 μ m.
Adopting electrodip process is 10-50 μ m at the thickness that the surface of copper base material forms the Cr film.
Adopting the plasma spray method is 10-500 μ m at the thickness of the surface of copper base material spraying Cr layer.
The significant parameter scope of pulsed electron beam device irradiation: energy density 1-20J/cm
2, pulse width 2-5 μ s, pulse number 2-30 time, the effective dimensions of beam spot is 70-100mm.
The vacuum tightness P of described vacuum chamber＜5 * 10
-3Pa, the inert protective gas that charges into to vacuum chamber is an argon gas.
The preparation method of copper-chromium alloy surface alloying of the present invention; by chromiumcopper is put into vacuum chamber; vacuumize the back and under inert protective atmosphere, the electron beam irradiation is carried out on the surface of chromiumcopper; Alloying Treatment is carried out on surface to chromiumcopper; surface at the copper base material forms the tiny chromiumcopper layer of one deck crystal grain, and the performances such as microhardness, wear resistance and resistance fusion welding on surface improve greatly.
Embodiment:
Embodiment 1:
On the Cu matrix alloy surface that is of a size of 30mm * 30mm * 5mm (30mm * 30mm) through polishing and chromic acid (250g.l
-1) and sulfuric acid (2.5g.l
-1) mixed aqueous solution clean, be 1.2～1.4A.cm in voltage 4V, current density
-2, preparation thickness is the sample of 20 ± 1 μ m behind galvanic deposit under temperature of electroplating solution 310～315K (the stirring) 40min.Sample is contained on the anchor clamps of adapted, puts into vacuum chamber, vacuumize and meet the requirements of vacuum tightness, this vacuum tightness that reaches vacuum chamber is 2.0 * 10
-3Behind the Pa, close vacuum valve rapidly, in vacuum chamber, charge into purity then and be 99.99% argon gas up to 3.0 * 10
4Pa.Start RITM-2M pulsed electron beam device, on load voltage 20kev carries out Surface-Alloyed Disposal to the surface of alloy.The significant parameter of pulsed electron beam surface Hardening Treatment is: energy density 5J/cm
2, pulse width 3 μ s, pulse number 4 times, the effective dimensions of beam spot is 70mm.Described electrodip process is not further described at this as a kind of prior art.
Embodiment 2:
Choosing chromium powder content is the Chrome metal powder powder that 99wt% and tungsten powder content prepare for the 1wt% ratio, with organic or inorganic binding agent (as liquid glue, acetic acid silicate bond or the vinyl acetate between to for plastic aqueous solution), or the suitable binder of prior art, (60mm * 60mm) is stained with the powder bed that a layer thickness is 200 μ m on the surface of copper base material on the Cu matrix alloy surface that is of a size of 60mm * 60mm * 5mm; Dried alloy sample is contained on the anchor clamps of adapted, puts into vacuum chamber, vacuumize and meet the requirements of vacuum tightness, this vacuum tightness that reaches vacuum chamber is 4.0 * 10
-3Behind the Pa, close vacuum valve rapidly, in vacuum chamber, charge into purity then and be 99.99% argon gas up to 4.0 * 10
4Pa.Start RITM-2M pulsed electron beam device, on load voltage 20kev carries out Surface-Alloyed Disposal to the surface of alloy.The significant parameter of pulsed electron beam surface Hardening Treatment is: energy density 12J/cm
2, pulse width 4 μ s, pulse number 8 times, the effective dimensions of beam spot is 80mm.
Certainly, in chromium powder, add any one or two kinds in tungsten powder, zirconium powder, nickel powder, iron powder, the molybdenum powder until whole five kinds, any one weight percent content≤2% in tungsten powder, zirconium powder, nickel powder, iron powder, the molybdenum powder, as 0.5%, 0.6%, 0.8%, 1%, 1.2%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2.0% etc., can both satisfy needs of the present invention, reach identical purpose.
Embodiment 3:
On the Cu matrix alloy surface that is of a size of 30mm * 30mm * 5mm (30mm * 30mm) through polishing and chromic acid (250g.l
-1) and sulfuric acid (2.5g.l
-1) mixed aqueous solution clean after, adopting the plasma spray method is the Cr layer of 150 μ m at the surperficial coating thickness at the copper base material.Sample is contained on the anchor clamps of adapted, puts into vacuum chamber, vacuumize and meet the requirements of vacuum tightness, this vacuum tightness that reaches vacuum chamber is 2.6 * 10
-3Behind the Pa, close vacuum valve rapidly, in vacuum chamber, charge into purity then and be 99.99% argon gas up to 3.0 * 10
4Pa.Start RITM-2M pulsed electron beam device, on load voltage 20kev carries out Surface-Alloyed Disposal to the surface of alloy.The significant parameter of pulsed electron beam surface Hardening Treatment is: energy density 8J/cm
2, pulse width 4 μ s, pulse number 6 times, the effective dimensions of beam spot is 100mm.
Claims (6)
1. the preparation method of a copper-chromium alloy surface alloying, it is characterized in that comprising the steps: (1) preparation chromiumcopper: with the red copper is base material chromium-coating powdered alloy on base material, perhaps adopt electrodip process to form the Cr film, perhaps adopt the plasma spray method at the surface of copper base material spraying Cr layer on the surface of copper base material; (2) the above-mentioned chromiumcopper for preparing is contained on the anchor clamps of adapted, puts into vacuum chamber, vacuumize, in vacuum chamber, charge into inert protective gas then; (3) starting impulse electron beam equipment carries out the electron beam irradiation to the chromiumcopper in the vacuum chamber; By adopting the pulsed electron beams heating surface, realize the copper-chromium alloy surface alloying of base material.
2. process for alloying surface method according to claim 1 is characterized in that: described Chrome metal powder powder all is a chromium powder; Any one or two kinds in tungsten powder, zirconium powder, nickel powder, iron powder, the molybdenum powder perhaps in chromium powder, have been added until whole five kinds, the weight percent content of chromium powder 〉=92%, any one weight percent content≤2% in tungsten powder, zirconium powder, nickel powder, iron powder, the molybdenum powder; Its coating method is to use the organic or inorganic binding agent, and with powdered alloy furnishing pasty state, brush is on the surface of copper base material, and coat-thickness is 100-800 μ m.
3. process for alloying surface method according to claim 1 is characterized in that: adopting electrodip process is 10-50 μ m at the thickness that the surface of copper base material forms the Cr film.
4. process for alloying surface method according to claim 1 is characterized in that: adopting the plasma spray method is 10-500 μ m at the thickness of the surface of copper base material spraying Cr layer.
5. it is characterized in that according to the arbitrary described process for alloying surface method of claim 1 to 4: the significant parameter scope of pulsed electron beam device irradiation: energy density 1-20J/cm
2, pulse width 2-5 μ s, pulse number 2-30 time, the effective dimensions of beam spot is 70-100mm.
6. process for alloying surface method according to claim 1 is characterized in that: the vacuum tightness P of described vacuum chamber＜5 * 10
-3Pa, the inert protective gas that charges into to vacuum chamber is an argon gas.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102618869A (en) * | 2012-04-16 | 2012-08-01 | 重庆理工大学 | Workpiece surface rapid coating and remelting method and device based on large-area electron beams |
| CN102677014A (en) * | 2012-05-29 | 2012-09-19 | 重庆理工大学 | Modification method for alloying surface of magnesium alloy |
| CN102691040A (en) * | 2012-05-29 | 2012-09-26 | 重庆理工大学 | Treatment method for alloying surface of superhigh-strength aluminum alloy |
| CN103074626A (en) * | 2013-01-18 | 2013-05-01 | 大连理工大学 | Surface alloying treatment method for precipitation-hardening martensite stainless steel |
| CN103602983A (en) * | 2013-11-25 | 2014-02-26 | 桂林电器科学研究院有限公司 | Technological method for modifying copper-chromium alloy surface |
| CN104120245A (en) * | 2014-08-06 | 2014-10-29 | 陕西斯瑞工业有限责任公司 | Method for processing surface of CuCr contact material for vacuum arc-extinguishing chamber |
| CN104894515A (en) * | 2015-05-27 | 2015-09-09 | 陕西斯瑞工业有限责任公司 | Electric-arc ion plating method for forming CuCr coating on surface of CuCr contact |
| CN106676517A (en) * | 2016-12-16 | 2017-05-17 | 陕西斯瑞新材料股份有限公司 | Method for preparing copper-chromium composite contact material through electron beam cladding process |
| CN114231914A (en) * | 2021-11-17 | 2022-03-25 | 中国科学院金属研究所 | Low-interdiffusion and high-temperature-oxidation-resistant coating for copper conductor and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1054275A (en) * | 1990-02-14 | 1991-09-04 | 机械电子工业部北京机电研究所 | Surface alloying technology with electronic beam |
-
2010
- 2010-07-28 CN CN2010102389783A patent/CN101899640B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1054275A (en) * | 1990-02-14 | 1991-09-04 | 机械电子工业部北京机电研究所 | Surface alloying technology with electronic beam |
Non-Patent Citations (1)
| Title |
|---|
| 《Materials Science and Engineering A》 19941231 AKio Hiose 等 Surface alloying of copper with chromium by CO2 laser 199-206 1-6 , 第174期 2 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102618869A (en) * | 2012-04-16 | 2012-08-01 | 重庆理工大学 | Workpiece surface rapid coating and remelting method and device based on large-area electron beams |
| CN102618869B (en) * | 2012-04-16 | 2014-04-16 | 重庆理工大学 | Workpiece surface rapid coating and remelting method and device based on large-area electron beams |
| CN102677014A (en) * | 2012-05-29 | 2012-09-19 | 重庆理工大学 | Modification method for alloying surface of magnesium alloy |
| CN102691040A (en) * | 2012-05-29 | 2012-09-26 | 重庆理工大学 | Treatment method for alloying surface of superhigh-strength aluminum alloy |
| CN102677014B (en) * | 2012-05-29 | 2014-05-07 | 重庆理工大学 | Modification method for alloying surface of magnesium alloy |
| CN103074626A (en) * | 2013-01-18 | 2013-05-01 | 大连理工大学 | Surface alloying treatment method for precipitation-hardening martensite stainless steel |
| CN103602983A (en) * | 2013-11-25 | 2014-02-26 | 桂林电器科学研究院有限公司 | Technological method for modifying copper-chromium alloy surface |
| CN103602983B (en) * | 2013-11-25 | 2015-12-09 | 桂林电器科学研究院有限公司 | A kind of processing method of copper-chromium alloy surface modification |
| CN104120245A (en) * | 2014-08-06 | 2014-10-29 | 陕西斯瑞工业有限责任公司 | Method for processing surface of CuCr contact material for vacuum arc-extinguishing chamber |
| CN104894515A (en) * | 2015-05-27 | 2015-09-09 | 陕西斯瑞工业有限责任公司 | Electric-arc ion plating method for forming CuCr coating on surface of CuCr contact |
| CN106676517A (en) * | 2016-12-16 | 2017-05-17 | 陕西斯瑞新材料股份有限公司 | Method for preparing copper-chromium composite contact material through electron beam cladding process |
| CN114231914A (en) * | 2021-11-17 | 2022-03-25 | 中国科学院金属研究所 | Low-interdiffusion and high-temperature-oxidation-resistant coating for copper conductor and preparation method thereof |
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