CN101646518B - 刀片与切削工具 - Google Patents

刀片与切削工具 Download PDF

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Publication number
CN101646518B
CN101646518B CN2008800088782A CN200880008878A CN101646518B CN 101646518 B CN101646518 B CN 101646518B CN 2008800088782 A CN2008800088782 A CN 2008800088782A CN 200880008878 A CN200880008878 A CN 200880008878A CN 101646518 B CN101646518 B CN 101646518B
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blade
silicon nitride
content
peak value
crystal
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CN101646518A (zh
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丰田亮二
铃木友辅
波多野祐规
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Entikai Cutting Tools Co ltd
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NGK Spark Plug Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
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Abstract

一种包括氮化硅烧结体的刀片,该氮化硅烧结体包括作为主要组分的β-Si3N4、Mg、和稀土元素Re(Y、La、Ce、Er、Dy、Yb)。Mg根据MgO换算的含量为1.0-7.0mol%,Re根据Re的氧化物换算的含量为0.4-1.0mol%,并且Mg和Re的总含量为1.7-7.5mol%且小于7.5mol%。刀片具有从烧结体的表面朝烧结体的内部氧含量增加的渐变组成,使得从表面起往内0.5mm以下的区域中含有0.8-1.5质量%的氧,从表面起往内0.5mm或以上的区域中含有1.1-2.3质量%的氧,并且所述区域之间氧含量的差值为0.1-1.0质量%。

Description

刀片与切削工具
技术领域
本发明涉及一种需要具有耐磨性的刀片和切削工具,尤其涉及一种适于切削铸铁等的刀片和切削工具。
背景技术
具有优良耐热性、耐磨性等的氮化硅基的烧结体(氮化硅烧结体)已作为材料用于各种类型的切削工具。
然而,氮化硅难于烧结,因此通常为烧结而使用烧结助剂。由于大量烧结助剂的使用使得烧结体的性能劣化,所以烧结助剂的量在允许烧结的范围内优选较小。
因此,如在以下例如涉及助剂类型和减少助剂使用量的专利文献1-5中提出了各种建议,以便获得改善的性能。
专利文献1公开了一种用于切削工具的氮化硅烧结体,该氮化硅烧结体通过使用非常少量的助剂,诸如Mg、Zr和Ce的氧化物来获得,从而具有特别好的耐磨性。
专利文献2公开了一种使烧结体最外层表面中的助剂挥发以将助剂的量减少至低于内部助剂量的技术,从而获得改善的耐磨性。
专利文献3公开了一种通过热处理在氮化硅烧结体的表面中形成α-硅铝氧氮聚合物的技术,从而获得增大的表面硬度和改善的耐磨性。
专利文献4公开了一种在SiO气体气氛中烧结的技术,从而降低烧结体的烧结表面的粗糙度,并从烧结体的最外层表面至10μm的深度形成具有16Gpa或以上维氏硬度的硬相。
专利文献5公开了一种技术:将稀土、Mg、Al限定为晶界形成组分并限定总量,从而改善抗热冲击性。
专利文献1:日本专利No.3550420
专利文献2:日本待审专利公布No.2002-12474
专利文献3:日本待审专利公布No.9-183667
专利文献4:日本待审专利公布No.8-323509
专利文献5:日本待审专利公布No.11-268957
发明内容
本发明要解决的问题
然而,专利文献1中所描述的技术涉及的问题是:尽管耐磨性极好,但由于所获得的材料的耐破损性因助剂量减少而不足,所以该获得的材料往往不可靠。
专利文献2中所描述的技术涉及的问题是:尽管具有烧结助剂的渐变组成,但由于作为与烧结助剂一起形成晶界相主要组分的氮化硅材料中包括的SiO2没有被根本考虑到,所以材料耐磨性不足。
专利文献3中所描述的技术涉及的问题是:由于在烧结体的表面中形成的α-硅铝氧氮聚合物具有比氮化硅低的强度,所以尽管获得了改善的耐磨性,但切削刀片的刀刃强度降低。
专利文献4中所描述的技术涉及的问题是:由于未进行耐磨性的改善,所以在用切削刀片高速切削期间,耐磨性不足。
专利文献5中所描述的技术涉及的问题是:非渐变组成导致差的耐磨性,并且Al2O3的高含量致使导热性降低,并由此导致低的耐破损性。
鉴于上述问题,作出的本发明具有的目的是提供一种可实现优良耐磨性和耐破损性的刀片和切削工具。
解决问题的手段
切削期间根据对象材料和切削条件而变化的刀片的刀刃温度通常高达800℃或以上。因此,耐热性和化学稳定性表现优异对改善耐磨性是重要的。
氮化硅烧结体中的晶界相作为包括助剂组分、Si、N、和O的非晶玻璃相或晶体相而存在。晶界相具有比氮化硅低的耐热性和耐腐蚀性,并且晶界相的量和组分影响到烧结体的耐热性和化学稳定性。
根据以上所述,首先需要减少耐热性、耐腐蚀性和化学稳定性差的晶界相的量。
本发明的发明者发现,通过选择烧结助剂能够改善耐磨性、特别是在高速切削期间的耐磨损性,该烧结助剂仅以少量就能致密化、在氮化硅的烧结期间用作助剂、并且在烧结期间容易向表面移动并挥发,从而在氮化硅的烧结步骤期间使微量的助剂组分运动至表面附近并使该助剂组分挥发,因此从内部到表面减少氧的量。发明者还发现,在挥发之后通过优化组分能获得具有耐磨性和耐破损性的包括氮化硅烧结体的刀片,从而完善本发明。
(1)第一实施例中的发明提供一种包括氮化硅烧结体的刀片,该氮化硅烧结体包括作为主要组分的β-Si3N4、Mg、和稀土元素Re(Y、La、Ce、Er、Dy、Yb)。Mg根据MgO换算的含量为1.0-7.0mol%,Re根据Re的氧化物换算的含量为0.4-1.0mol%,并且Mg和Re的总含量为1.7-7.5mol%且小于7.5mol%。刀片具有从烧结体的表面朝该烧结体的内部氧含量增加的渐变组成,使得从表面起往内小于0.5mm的区域中含有0.8-1.5质量%的氧,从表面起往内0.5mm或以上的区域中含有1.1-2.3质量%的氧,并且所述区域之间氧含量的差值为0.1-1.0质量%。
当Mg根据MgO换算的含量小于1.0mol%,稀土元素Re(Y、La、Ce、Er、Dy、Yb)根据Re的氧化物换算的含量小于0.4mol%,或者总含量小于1.7mol%时,不能获得足够的可烧结性。当这些含量超过各自的上限时,不必要的大量助剂组分残留在烧结体中,这是不利的。
由于与SiO2一起的Mg降低晶界相的熔点和粘性,这对烧结产生有利效果,此外组合中的Mg和SiO2容易移动至表面部分并挥发,所以Mg是获得所期望刀片不可缺少的元素。
由于Re不仅有效地用于氮化硅粒子的针状化,而且由于小的离子半径而与Mg一起有效地用于烧结,并且还容易移动至表面部分并挥发,所以稀土元素Re(Y、La、Ce、Er、Dy、Yb)是获得所期望刀片的有利元素。
因此,在本发明中,如上所述限定Mg和稀土元素Re(Y、La、Ce、Er、Dy、Yb)的组分。
当从烧结体的表面起往内小于0.5mm的区域中的氧含量低于0.8质量%时,未致密化的部分、即所谓的白色部分残留,而当氧含量高于1.5质量%时,不能获得足够的耐磨性。
当从烧结体的表面起往内0.5mm或以上的区域中的氧含量低于1.0质量%时,不会形成氮化硅特有的针状结构,因此不能获得足够的耐破损性。当氧含量高于2.3质量%时,耐热性降低,这尤其在高速切削期间导致耐磨性降低。
当从表面起往内小于0.5mm的区域中的氧含量与从表面起往内0.5mm或以上的区域中的氧含量之间的差值小于0.1质量%时,渐变度平缓,使得难于同时获得耐磨性和耐破损性。当差值大于1.0质量%时,由于氧含量与表面部分中的氧含量的急剧差值而产生残余应力,这可能在表面部分中造成不利的剥离破损。
因此,在本发明中,如上所述限定氧含量。
根据如上构造的本发明的刀片,能获得极好的耐磨性和耐破损性,从而例如可进行铸铁的高速切削。
(2)第二实施例的发明具有的特征是,稀土元素Re为Yb,Mg根据MgO换算的含量为1.0-5.5mol%,Yb根据Yb2O3换算的含量为0.4-1.0mol%,并且Mg和Yb的总含量为1.7-6.0mol%且小于6.0mol%。
当稀土元素Re为Yb时,Mg和Yb的合成组合是获得耐磨性和耐破损性的最佳组合,Mg和Yb仅以少量有效地用于烧结并且还易于从表面挥发。因此,在本发明中,如上所述限定Mg和Yb的组分。
(3)第三实施例的发明具有的特征是,从表面起具有小于1.0mm的深度的外部区域(表面区域)中室温下的热导率为45W/m·K以上,并且从表面起具有1.0mm以上的深度的内部区域中室温下的热导率为40W/m·K以上。术语“室温”在此是指25℃(以下相同)。
较高的热导率有助于散热,从而减少刀片的过热,因此有效用于降低对热冲击。
根据本发明,在本发明中,从表面起具有小于1.0mm的深度的外部区域(表面区域)中室温下的热导率为45W/m·K以上,并且在从表面起具有1.0mm以上的深度的内部区域中室温下的热导率为40W/m·K以上,可明显抑制因出现和形成热裂纹所引起的氮化硅烧结体(从而刀片)的破损。
(4)第四实施例的发明具有的特征是,室温下的抗弯强度为900Mpa或以上。
本发明的刀片在室温下具有900Mpa或以上、并且优选具有1000Mpa或以上的抗弯强度(三点抗弯强度:JIS R1601)。
当将本实施例的刀片用于切削时,由于构成刀片的烧结体的强度较高,所以不仅单纯强度变得较高,而且抗热冲击性也变得较高,于是可实现稳定的切削。因此,具有上述三点抗弯强度的刀片是特别优选的。也就是说,可通过使用具有室温下900MPa以上的强度的本发明的刀片实现稳定的切削。
当作为助剂组分的ZrO2和Al2O3的总含量为0.6质量%或以下时,本发明的刀片在无性能劣化的情况下可维持45W/m·K或以上的热导率,并获得改善的可烧结性。当作为助剂组分的ZrO2和Al2O3的总含量超过0.6质量%时,助剂组分向表面的移动减缓,并且不能获得充分渐变的组成,耐磨性降低,热导率降低,并且耐破损性也随之降低,这是不合需要的。
(5)第五实施例的发明具有的特征是,在晶界相中包括含有Yb元素、Mg元素、Si元素、O元素、和N元素的晶体。
通过在由氮化硅烧结体构成的晶界相中产生含有Yb元素、Mg元素、Si元素、O元素、和N元素的晶体,在晶界相中存在的玻璃相可被仅少量添加的烧结助剂进一步减小,从而刀片可具有特别优异的耐磨性和耐破损性。含有Yb元素、Mg元素、Si元素、O元素、和N元素的晶体不局限于特定的种类,但在晶界相中存在YbMgSi2O5N时,YbMgSi2O5N是优选的,YbMgSi2O5N可获得氮化硅烧结体明显改善的耐磨性和耐破损性。
由本发明的氮化硅烧结体构成的刀片大致包括:主晶体相,该主晶体相含有作为主要组分的一种或多种氮化硅(以下也称为“Si3N4”)和硅铝氧氮聚合物的晶体粒子;和晶界相,该晶界相含有由Yb元素、Mg元素、Si元素、O元素、和N元素构成的晶体(以下提供晶体的化合物也称为“YbMgSi化合物”)。
主晶体相含有一种或多种氮化硅和/或硅铝氧氮聚合物的晶体粒子。主晶体相中含有的氮化硅包括作为主要组分的β-Si3N4,并且可只包括β-Si3N4或可包括α-Si3N4和β-Si3N4的混合物。在氮化硅包括α-Si3N4和β-Si3N4的混合物的情况下,α-Si3N4的比率、即α比率优选为0-30%。当α比率超过30%时,可存在因烧结体中的针状粒子减少而引起例如韧性降低的机械特性劣化的缺点。α比率可通过X射线衍射法获得α-Si3N4的峰值强度(Iα)和β-Si3N4的峰值强度(Iβ)根据方程:[Iα/(Iα+Iβ)]×100计算。
氮化硅中含有的作为杂质的氧的含量通常为0.8-2质量%。低的氧含量可导致可烧结性降低,而高的氧含量可导致诸如耐热性或热导率降低的缺点。氮化硅优选具有0.5-1.6μm的平均粒径。当平均粒径小于0.5μm时,可存在诸如低的可成形性的缺点。
主晶体相中含有的硅铝氧氮聚合物是用于Si-Al-O-N系化合物的通称。α-硅铝氧氮聚合物为如下的一种化合物,该化合物具有在α-Si3N4的晶体中部分置换地溶解在硅和氮位置处的铝和氧、以及因电荷补偿间隙溶解的金属离子。β-硅铝氧氮聚合物为如下一种化合物,该化合物具有在β-Si3N4的晶体中部分置换地溶解在硅和氮的位置处的铝和氧。
主晶体相中含有的硅铝氧氮聚合物不局限于特定的类型,并且可以是α-硅铝氧氮聚合物、β-硅铝氧氮聚合物、和α-硅铝氧氮聚合物与β-硅铝氧氮聚合物的混合物中的任何一种。当硅铝氧氮聚合物为α-硅铝氧氮聚合物与β-硅铝氧氮聚合物的混合物时,α-硅铝氧氮聚合物的比率、即α比率优选小于30%。当α比率超过30%时,可存在因烧结体中针状粒子减少而引起诸如韧性降低的机械特性劣化,这导致氮化硅烧结体较低的耐破损性。α比率可以以与上面Si3N4的情况下α比率相同的方式,通过由X射线衍射法获得α-硅铝氧氮聚合物的峰值强度(Iα)和β-硅铝氧氮聚合物的峰值强度(Iβ)计算出。
主晶体相需含有一种或多种氮化硅和硅铝氧氮聚合物的晶体粒子。主晶体相可主要含有氮化硅的晶体粒子,或者可主要含有硅铝氧氮聚合物的晶体粒子,或者可主要含有氮化硅的晶体粒子和硅铝氧氮聚合物的晶体粒子。
本发明中由氮化硅烧结体构成的刀片包括主晶体相,该主晶体相具有在85-98质量%范围内、优选在90-97质量%范围内的一种或多种氮化硅和/或硅铝氧氮聚合物的晶体粒子。在刀片中,一种或多种氮化硅和/或硅铝氧氮聚合物的晶体粒子、包含在稍后描述的晶界相中的YbMgSi化合物、和用于形成可包含在后述晶界相中的晶体相和/或玻璃材料的化合物总计达到100质量%。当主晶体相的含量超过98质量%时,耐破损性可由于降低的可烧结性而降低,而在低于85质量%的情况下,不能充分保证氮化硅和/或硅铝氧氮聚合物所固有的优良的机械特性和耐热性。
第六实施例的发明具有的特征是,在氮化硅烧结体的刀片的X射线衍射图中,基于所述晶体中的YbMgSi2O5N的峰值当中指示最大强度的峰值的强度(IYb)与基于氮化硅或硅铝氧氮聚合物的峰值当中指示最大强度的峰值的强度(Is)的比值大于0%,并且小于等于10%。
相对于基于氮化硅或硅铝氧氮聚合物的峰值当中指示最大强度的峰值的强度(Is),基于YbMgSi2O5N的峰值当中指示最大强度的峰值的强度(IYb)更加优选为1-9%,特别优选为1.5-3.0%。当YbMgSi化合物相对氮化硅的含量在以上范围内时,由氮化硅烧结体构成的刀片可获得特别优秀的耐磨性和耐破损性,并且甚至在800℃或以上的高温下的高速切削期间还可获得特别优秀的耐磨性。峰值的强度(IYb)和(Is)中的每一强度可在氮化硅烧结体的X射线衍射图中认为是从基线起的高度。
通常包含在晶界相中的YbMgSi化合物可部分地含包含在主晶体相中。
晶界相可包括作为主要组分的晶体相和/或玻璃相,该晶体相和/或玻璃相除含有YbMgSi化合物以外,还含有用于构成烧结助剂等的元素。当烧结助剂、氮化硅、和作为杂质包含在氮化硅中的硅石组分在烧结期间转化成液相、有助于烧结、然后在冷却期间固化时,产生晶体相和/或玻璃相。由于诸如YAG相、YAM相、Yb2Si2O7等的晶体相通常低的韧性,所以将该晶体相控制为合适的丰度(质量%)。
鉴于玻璃相通常低的熔点、低的韧性、以及低的硬度,考虑到在形成烧结体期间的可烧结性,将玻璃相控制为合适的丰度(质量%)。根据氮化硅烧结体、YbMgSi化合物等适当调节的晶体相和玻璃相的丰度应尽可能地小,或者应适宜大致为零。
(7)第七实施例的发明是一种切削工具,该切削工具包括保持器和附接至该保持器的刀片,该刀片在第一至第六实施例中的任一个实施例中描述。
可通过使用包括附接至保持器的刀片的切削工具以期望的方式进行切削。在该情况下,优选将MgCO3材料粉末用作Mg源,以制造上述氮化硅烧结体(从而制造刀片)。
通常将MgO粉末用作氮化硅烧结体的材料。然而,在该情况下,除非合适地进行气氛控制,否则由于本发明的氮化硅烧结体的表面中助剂组分从表面挥发而引起的过度挥发,产生未致密化的部分、即所谓的白色部分。
当将MgCO3用作原材料时,MgCO3在烧结期间在相对低的温度下分解,以在氮气气氛中产生CO2(MgCO3→MgO+CO2↑)。这可抑制助剂组分从表面过度挥发,从而可制造具有无白色部分的稳定表面的氮化硅烧结体。
附图说明
图1A是实施例中的刀片的透视图,而图1B是示出刀片的刀尖部分的放大透视图。
图2是示出切削方式的说明视图。
图3是示出包含实验示例中样品的烧结条件和混合组成的表1的说明图。
图4是示出包含实验结果的表2的说明图。
图5是示例中的样品2的X射线衍射图。
图6A是横截面视图,图6B是纵截面视图,而图6C是示出切削方向的说明视图。
图7是示出实验结果的图表。
附图标记说明
1刀片
3切削刃
5倒角
7刀尖
9保持器
11切削工具
具体实施方式
以下参考附图说明本发明的实施例。
[实施例]
a)首先,描述根据本实施例的刀片。
如图1A-1B中所示,根据本实施例的刀片1是由(如ISO标准SNGN120408中所规定的)具有大致方形板状形状的氮化硅烧结体制成的切削刀片。
刀片1包括位于该刀片的每一面(每一刀面)上周边处的切削刃3,并且在切削刃3中形成有倒角5。刀片1的刀尖7平滑地弯曲。
本实施例的刀片1包括Mg和稀土元素Re(Y、La、Ce、Er、Dy、Yb)。Mg根据MgO换算的含量为1.0-7.0mol%,Re根据Re的氧化物换算的含量为0.4-1.0mol%,而Mg和Re的总含量为1.7至7.5mol%。
此外,刀片1具有氧含量从烧结体的表面向该烧结体的内部增加的渐变组成,使得从表面起往内小于0.5mm的区域中含有0.8-1.5质量%的氧,从表面起往内0.5mm或以上的区域中含有1.1-2.3质量%的氧,并且区域之间氧含量的差值为0.1-1.0质量%。
此外,刀片1在室温下具有45W/m·K以上的热导率,并且在从表面起具有1.0mm以上的深度的内部区域中具有40W/m·K以上的热导率。刀片1在室温下具有900Mpa以上的弯曲强度(三点弯曲强度:JISR1601)。
刀片1由氮化硅烧结体组成,该氮化硅烧结体包括以晶界相含有Yb元素、Mg元素、Si元素、O元素、以及N元素的晶体。
此外,在刀片1中,在X射线衍射图中,基于所述晶体中的YbMgSi2O5N的峰值当中指示最大强度的峰值的强度(IYb)与基于氮化硅或硅铝氧氮聚合物的峰值当中指示最大强度的峰值的强度(Is)的比值大于0%,并且小于等于10%。
因此,如上所述构成的本实施例中的刀片1具有高耐磨性和高耐破损性,如在稍后描述的实验性示例中所示。
如图2示范性所示,例如,将上述刀片1接合至要用作切削工具11的柱状钢保持器9的顶端。
例如,使用刀片1的切削工作通过将前刀面与侧刀面之间的刀尖7压靠在旋转工件W上进行。
b)接下来描述根据本实施例的刀片的制造方法。
首先,作为主要组分具有1.0μm或以下的平均粒径的α-Si3N4粉末以及作为烧结助剂分别具有1.0μm或以下的平均粒径的Yb2O3粉末、Y2O3粉末、La2O3粉末、CeO2粉末、Er2O3粉末、Dy2O3粉末、MgO粉末、MgCO3粉末、Al2O3粉末、ZrO2粉末以图3中所示的混和比例配重。
使用具有氮化硅内壁的罐和氮化硅球将配重的材料与乙醇或水溶剂混合96小时,以便将Al2O3污染减至最低程度,并获得浆料。
通过325目的网筛筛分浆料,并添加溶解在乙醇或水中的5.0质量%的蜡型有机粘结剂,然后喷干该浆料。
将获得的粒化粉末挤压成如ISO标准SNGN 120408中规定的形状,然后在加热器中,在1大气压的氮气气氛中以600℃进行60分钟的脱脂。
随后,进行脱脂压块的一次烧结。具体而言,将压块置入SiC坩埚或氮化硅坩埚中,并在第一阶段中,以图3(表1)中所指示的大气压(样品1-20中每个的大气压)将压块在1,800-1,900℃下保持60-180分钟,然后在第二阶段中,以等于或小于大气压的大气压将压块在比第一阶段低(1,800℃或以下)的温度下保持120-360分钟,以实现烧结。
将获得的氮化硅烧结体研磨成如ISO标准SNGN 120408中所规定的形状,以获得本实施例中的刀片1,即稍后所述实验中要使用的本发明范围内的示例的刀片(样品1-20)。
如上所述,在本实施例中,使用具有上述混合组成的材料(尤其是MgCO3),并以2大气压或以下的低压进行一次烧结。因此,能够获得具有上述构型并呈现优良特性的刀片1。
还以相同的方式制备超出本发明范围的比较例的刀片(样品A-O)(应指出的是采用图3(表1)中所指示的条件。)。
[实验示例]
接下来,将描述通过使用样品进行的实验性示例。
a)首先,将提供测量样品刀片的特性等的方法的说明。
通过已知的荧光X射线或化学分析等分析相应样品(烧结体)中相应元素(除非金属元素以外,以下相同)的含量,并且通过将各元素看作氧化物或氮化物的化合物,例如对于Si的Si3N4、对于Mg的MgO、或对于Yb的YbO3来计算质量比。
在后述图4(表2)中,各烧结体中的助剂组分以mol%为单位的值表示。通过将以mol%为单位的值乘以各组分的分子量,以将烧结体的总百分数调节为100%,可获得以质量%为单位的转换值。
通过从样品表面起的0.5mm位置处切削各样品、在0.5mm位置的两侧上分别压碎表面侧区域和内侧区域、进行脉冲加热和熔化、并使用非色散红外法来测量氧含量。
通过将各样品研磨成具有10mm直径和1-2mm厚度的圆盘、并通过在室温下使用JIS R1611中所描述的方法(所谓的激光闪光法)来测量热导率。具体而言,通过使用具有1mm厚度的样品来测量从表面起到1mm的热导率,而通过使用具有2mm厚度的样品测量从表面起往里1mm或以上的热导率。
通过制备具有3mm(长度)×4mm(宽度)×36mm或以上(高度)尺寸的各样品、研磨样品、并在室温下根据JIS R1601进行五次或以上的三点弯曲试验而获得平均值来测量强度。试验期间优选为30mm的跨距可小于30mm(下限:10mm)。
在Cu管、垂直测角仪和50kV的X射线管电压的条件下,使用由Rigaku Denki Kogyo株式会社生产的X射线衍射仪在2θ=20-70°的范围内对各样品进行X射线衍射,以便检查α-Si3N4是否已转化成β-Si3N4,或者检查晶界相中是否存在由Yb元素、Mg元素、Si元素、O元素和N元素组成的晶体。参考PDF卡数据得出所获得的X射线衍射图中的峰值。在各样品的各X射线衍射图中识别β-Si3N4的峰值,从而确认用作材料的α-Si3N4已转化成β-Si3N4
在样品1、2、4、13-18的X射线衍射图中,除了识别β-Si3N4特有的峰值外,还识别YbMgSi2O5N特有的峰值(使用PDF卡48-1634进行YbMgSi2O5N的识别)。在样品N的X射线衍射图中,除了识别β-Si3N4特有的峰值外,还识别Yb2Si2O7特有的峰值。在样品3、5-12、19、20和样品A-M、O的X射线衍射图中,除了识别β-Si3N4特有的峰值外,不识别任何YbMgSi化合物的晶体特有的峰值。
根据从相应X射线衍射图的基线起的相应高度,通过获得YbMgSi2O5N特有的峰值当中指示最大强度的峰值强度(IYb)和基于β-Si3N4或硅铝氧氮聚合物的峰值当中指示最大强度的峰值强度(Is),然后通过根据方程(IYb/Is)×100%进行计算,获得X射线衍射图中的峰值强度比。例如,图5示出图4中的样品2(表2)的X射线衍射图。
在该X射线衍射图中,在2θ(度)=30°附近用(IYb)的强度识别YbMgSi2O5N特有的峰值(图5中带有▲的峰值)当中表示最大强度的峰值,而在2θ(度)=36°附近用(Is)的强度识别基于β-Si3N4的峰值(图5中带有●的峰值)当中表示最大强度的峰值。基于(IYb)和(Is)的强度计算峰值强度比。图4(表2)中示出各刀片计算出的峰值强度比。
通过阿基米德法测量各样品的密度,并将测得的密度除以理论密度以获得理论密度比。在本发明(实施例)范围内的所有样品中的各样品中,理论密度比足够高(具体为99.0或以上),并且使烧结体致密化,而不会在该烧结体中残留微孔。
图4(表2)中示出除理论密度比之外的测量结果。
b)接下来,将提供各样品刀片的性能试验的说明。
(1)耐磨损性
使用具有SNGN120408中规定的形状并具有0.2mm的倒角的各刀片。如图6中所示,将两端表面上具有残留铸砂的FC200选为切削工件,并且使刀片在箭头A的方向上移动,以进行切削加工。
具体而言,在500mm/min的切削速度、0.2mm/转的进给速率和干式切削的条件下进行切削加工,并测量最大侧刀面磨损尺寸并将该最大侧刀面磨损尺寸表示为磨损尺寸(单位:mm)。
在图6中,L1为260mm,L2为300mm,L3为100mm,而壁厚为20mm。
结果在图4(表2)中示出。
(2)耐破损性
使用具有SNGN432中规定的形状并具有0.1mm的倒角的各刀片进行切削加工。
具体而言,将FC200选为切削工件,并在150mm/min的切削速度、2.0mm的切削深度、每加工行程具有0.05mm/转的增量的0.60mm/转的初始进给速率、和干式切削的条件下进行切削加工。通过出现破损时的进给速率评估耐破损性。
结果在图7和图4(表2)中示出。
如图7和图4的表2中清楚所示,与比较例的样品相比较,本发明范围内的示例的各样品呈现出较小的磨损尺寸和破损时较高的进给速率,从而在耐磨性和耐破损性方面表现优秀。
应理解的是,本发明不局限于上述实施例或示例,而是可在不偏离本发明的范围的情况下以各种形式实践。

Claims (7)

1.一种刀片,包括:
氮化硅烧结体,所述氮化硅烧结体包括:
作为主要组分的β-Si3N4
Mg;以及
稀土元素Re,
Mg根据MgO换算的含量为1.0-7.0mol%,Re根据Re的氧化物换算的含量为0.4-1.0mol%,并且Mg和Re的总含量为1.7-7.5mol%且小于7.5mol%,
其中所述稀土元素Re为Y、La、Ce、Er、Dy或Yb,
其中所述刀片具有从所述烧结体的表面朝所述烧结体的内部氧含量增加的渐变组成,使得在从表面起往内小于0.5mm的区域中含有0.8-1.5质量%的氧,在从表面起往内0.5mm以上的区域中含有1.1-2.3质量%的氧,并且所述区域之间氧含量的差值为0.1-1.0质量%。
2.如权利要求1所述的刀片,
其中所述稀土元素Re为Yb,并且
其中Mg根据MgO换算的含量为1.0-5.5mol%,Yb根据Yb2O3换算的含量为0.4-1.0mol%,并且Mg和Yb的总含量为1.7-6.0mol%且小于6.0mol%。
3.如权利要求1所述的刀片,其中室温下的热导率在从表面起具有小于1.0mm的深度的外部区域中为45W/m·K以上,并且室温下的热导率在从表面起具有1.0mm以上的深度的内部区域中为40W/m·K以上。
4.如权利要求1所述的刀片,其中室温下的JIS R1601标准下的三点弯曲强度为900Mpa以上。
5.如权利要求1所述的刀片,其中晶界相中包括含有Yb元素、Mg元素、Si元素、O元素和N元素的晶体。
6.如权利要求5所述的刀片,其中在所述氮化硅烧结体的刀片的X射线衍射图中,基于所述晶体中的YbMgSi2O5N的峰值当中指示最大强度的峰值的强度(IYb)与基于氮化硅或硅铝氧氮聚合物的峰值当中指示最大强度的峰值的强度(Is)的比值大于0%,并且小于等于10%。
7.一种切削工具,包括:
保持器;以及
附接至所述保持器的如权利要求1-6中任一项所述的刀片。
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