CN107074664B - 赛隆烧结体和切削刀片 - Google Patents
赛隆烧结体和切削刀片 Download PDFInfo
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- CN107074664B CN107074664B CN201580052870.6A CN201580052870A CN107074664B CN 107074664 B CN107074664 B CN 107074664B CN 201580052870 A CN201580052870 A CN 201580052870A CN 107074664 B CN107074664 B CN 107074664B
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- Cutting Tools, Boring Holders, And Turrets (AREA)
Abstract
本发明的课题在于,提供具有耐热冲击性和耐VB磨耗性的赛隆烧结体和切削刀片。一种赛隆烧结体以及切削刀片,该赛隆烧结体的特征在于,包含β‑赛隆和21R‑赛隆,根据由X射线衍射分析得到的赛隆的峰强度算出的前述21R‑赛隆的峰强度I21R相对于各赛隆的峰强度的总计IA的比例[(I21R/IA)×100]为5%以上且低于30%。
Description
技术领域
本发明涉及赛隆烧结体和切削刀片。
背景技术
赛隆烧结体与氮化硅相比,具有优异的硬度和从室温至高温为止的温度范围内的高强度,被认为是化学稳定性高的原材料。因此,可以期待赛隆烧结体的机械用部件、耐热部件和耐磨耗部件等广泛的用途。作为赛隆烧结体的用途之一,有安装于切削刀具的切削刀片(例如专利文献1~5)。切削刀片是可拆卸地安装于切削刀具的主体部前端的切削刃,是也被称为不重磨刀片(throw-away tip)和刃口可替换刀片(cutting edge replaceabletip)等的工具部件。
现有技术文献
专利文献
专利文献1:日本特开2008-162882号公报
专利文献2:日本特开2013-224240号公报
专利文献3:WO2010/103839A1
专利文献4:日本特开昭60-239365号公报
专利文献5:日本特表2008-529948号公报
发明内容
发明要解决的问题
然而,用切削刀片切削耐热合金等被削材时,通常一般如下进行,在粗加工和半精加工中,分开使用特性不同的切削刀片。然而,分开使用切削刀片成为作业者的负担。如果可以利用同一切削刀片从粗加工进行至半精加工,则无需在切削中途替换切削刀具,有利于时间削减和作业的简略化,且使用不同的工具的风险降低。
因此,本发明的发明人等对能够从粗加工使用至半精加工的切削刀片进行了研究。粗加工中,例如,使用图2所示的、圆周上配置有多个切削刀片的切削刀具来进行被削材的面加工的情况下(称为铣床加工或铣刀加工),切削刀片中产生热龟裂,也有时导致缺损。认为这是由于,进行铣床加工时,在切削刀片与被削材之间间断地产生摩擦热,因此切削刀片与被削材接触的部分的温度(以下,称为切削温度)发生变动,由于重复切削刀片体积的膨胀和收缩而容易产生热龟裂。因此,作为粗加工中使用的切削刀片,期望具有耐热冲击性。另一方面,精加工中使用的切削刀片期望加工面性状优异。切削刀片中,如果VB磨耗进行,则切削阻力变高,其结果,不仅加工面性状恶化,而且有导致加工硬化的可能性。因此,作为精加工中使用的切削刀片,期望具有耐VB磨耗性。
本发明的目的在于,提供:具有耐热冲击性和耐VB磨耗性的赛隆烧结体和切削刀片。
用于解决问题的方案
用于解决前述课题的方案如下:
[1]一种赛隆烧结体,其特征在于,包含β-赛隆和21R-赛隆,
根据由X射线衍射分析得到的赛隆的峰强度算出的前述21R-赛隆的峰强度I21R相对于各赛隆的峰强度的总计IA的比例[(I21R/IA)×100]为5%以上且低于30%,室温至600℃为止的热膨胀系数为4.2ppm/K以下。
前述[1]的优选方案如以下所述。
[2]根据[1]所述的赛隆烧结体,其特征在于,Si6-ZAlZOZN8-Z所示的β-赛隆的Z值为0.3以上且1.0以下,
包含:选自由La和Ce组成的组中的至少一种稀土元素B以及选自由Y、Nd、Sm、Eu、Gd、Dy、Er、Yb和Lu组成的组中的至少一种稀土元素C,
前述稀土元素B与前述稀土元素C的摩尔比MB:MC以氧化物换算计为1.0:0.06~1.0:5.0,
前述赛隆烧结体中的前述稀土元素B和前述稀土元素C的总含量以氧化物换算计为0.8摩尔%以上且4.0摩尔%以下。
[3]根据[1]或[2]所述的赛隆烧结体,其特征在于,由X射线衍射分析得到的α-赛隆的峰强度Iα相对于各赛隆的前述峰强度的总计IA的比例[(Iα/IA)×100]为0%以上且25%以下。
[4]根据[3]所述的赛隆烧结体,其特征在于,Mx(Si,Al)12(O,N)16(0<x≤2)所示的α-赛隆中,M为包含前述稀土元素B和前述稀土元素C的金属元素,
α-赛隆中的稀土元素B与稀土元素C的原子比Aα相对于赛隆烧结体中的稀土元素B与稀土元素C的原子比AS的比例Aα/AS为70%以下。
[5]根据[1]~[4]中任一项所述的赛隆烧结体,其特征在于,在包括21R-赛隆、12H-赛隆和15R-赛隆的多赛隆中,所述赛隆烧结体包含21R-赛隆且包含12H-赛隆和/或15R赛隆,
根据前述多赛隆的峰强度算出的各多型赛隆的峰强度的总计Ip相对于根据由X射线衍射分析得到的赛隆的峰强度算出的各赛隆的峰强度的总计IA的比例[(Ip/IA)×100]为50%以下。
[6]一种切削刀片,其包含[1]~[5]中任一项所述的赛隆烧结体。
发明的效果
本发明的赛隆烧结体具有耐热冲击性和耐VB磨耗性。另外,本发明的切削刀片包含具有耐热冲击性和耐VB磨耗性的赛隆烧结体,因此对耐热合金等被削材进行切削加工时,在粗加工和半精加工这两者中可以历经长时间地发挥充分的切削性能。因此,根据本发明,可以提供:对耐热合金等被削材进行切削加工时,粗加工和半精加工这两者中能够使用的长寿命的切削刀片。
附图说明
图1为示出本发明的切削刀片的一个实施例的概略说明图。
图2为示出具备图1所示的切削刀片的切削刀具的一个实施例的概略说明图。
具体实施方式
本发明的赛隆烧结体包含β-赛隆和21R-赛隆。
β-赛隆通常具有针状的形态。因此,赛隆烧结体中大量存在β-赛隆时,针状的晶粒彼此形成复杂交织的组织,由外部应力所导致的赛隆烧结体的龟裂的进行被抑制。即,赛隆烧结体中的β-赛隆的比例越多,赛隆烧结体的耐热冲击性越提高。
21R-赛隆通常具有柱状的形态。因此,不会形成β-赛隆那样的针状晶粒复杂交织的组织,与β-赛隆相比,对耐热冲击性的效果低。另一方面,21R-赛隆与耐热合金等被削材的耐化学反应性均优异,因此被削材难以熔接和扩散。因此,赛隆烧结体中包含21R-赛隆时,耐VB磨耗性提高。21R-赛隆是多型赛隆。本发明的赛隆烧结体可以与β-赛隆和21R-赛隆一起、进而包含作为多型赛隆的12H-赛隆和/或15R-赛隆。12H-赛隆和15R-赛隆与21R-赛隆同样地具有柱状的形态,耐化学反应性优异。这些多型赛隆中,21R-赛隆的长径比高,对龟裂进展的阻抗性高,因此认为,不仅有利于耐VB磨耗性的提高还有利于耐热冲击性的提高。
对于本发明的赛隆烧结体,根据由X射线衍射分析得到的赛隆的峰强度算出的21R-赛隆的峰强度I21R相对于各赛隆的峰强度的总计IA的比例[(I21R/IA)×100]为5%以上且低于30%,优选为8%以上且27%以下,更优选为10%以上且25%以下。本发明的赛隆烧结体包含β-赛隆和21R-赛隆,前述比例[(I21R/IA)×100]为5%以上且低于30%,优选为8%以上且27%以下,更优选为10%以上且25%以下,因此具有耐热冲击性和耐VB磨耗性这两者。前述比例[(I21R/IA)×100]成为赛隆烧结体中的21R-赛隆的含有比例的指标。前述比例[(I21R/IA)×100]低于5%时,赛隆烧结体中的21R-赛隆的含有比例少,因此无法充分得到21R-赛隆的耐VB磨耗性和耐热冲击性的提高效果。其结果,赛隆烧结体的耐VB磨耗性和耐热冲击性差。前述比例[(I21R/IA)×100]为30%以上时,赛隆烧结体的耐热冲击性差。认为这是由于,赛隆烧结体中的21R-赛隆的比例变多时,21R-赛隆的粗大颗粒容易生成,强度降低。
前述比例[(I21R/IA)×100]可以如下求出。首先,对赛隆烧结体的样品进行X射线衍射分析(XRD)。由X射线衍射分析得到的各赛隆的峰强度使用以下的2θ值中的峰高。需要说明的是,除了21R-赛隆之外的以下所示的各赛隆中,使用JCPDS卡片中的最大峰作为峰强度,而21R-赛隆中,使用JCPDS卡片中的除了最大峰之外的峰作为峰强度,因此,为了能够与其他赛隆的峰高对比,将在由X射线衍射分析得到的峰强度上乘以2.5而得到的值作为计算中使用的峰强度I21R。另外,鉴定为与以下所示的各赛隆不同种类的赛隆的峰的情况下,将X射线衍射图与JCPDS卡片对比,选择不易受到来自于其他赛隆的峰的影响的峰,所选择的峰不是最大峰的情况下,乘以适当的数值作为峰强度Ix。
β-赛隆的峰强度Iβ:2θ=33.4°附近处的峰高(β-赛隆的(1,0,1)面的峰高)
21R-赛隆(通式:SiAl6O2N6)的峰强度I21R:2θ=37.6°附近处的峰高×2.5(21R-赛隆的(1,0,10)面的峰高×2.5)
12H-赛隆(通式:SiAl5O2N5)的峰强度I12H:2θ=32.8°附近处的峰高(12H-赛隆的(0,0,12)面的峰高)
15R-赛隆(通式:SiAl4O2N4)的峰强度I15R:2θ=32.0°附近处的峰高(15R-赛隆的(0,0,15)面的峰高)
α-赛隆的峰强度Iα:2θ=30.8°附近处的峰高(α-赛隆的(2,0,1)面的峰高)
前述比例[(I21R/IA)×100]如前述那样算出由X射线衍射分析得到的各赛隆的峰强度的总计IA(=Iβ+Iα+I12H+I15R+I21R+Ix),将21R赛隆的峰强度I21R除以各赛隆的峰强度的总计IA,从而可以求出。
本发明的赛隆烧结体的室温至600℃为止的热膨胀系数优选为4.2ppm/K以下。室温至600℃为止的热膨胀系数为4.2ppm/K以下时,耐热冲击性优异。包含本发明的赛隆烧结体的切削刀片即本发明的赛隆烧结体制的切削刀片用于铣床加工中使用的切削刀具时,例如,如图2所示那样,用于圆周上配置有多个切削刀片的切削刀具的情况下,切削刀具旋转而进行被削材的面加工等时,在切削刀片与被削材之间间断地产生摩擦热,因此切削刀片与被削材接触的部分的切削温度在约600℃以下的温度范围内变动。切削温度变动时,由于切削刀片的体积的膨胀和收缩重复而容易产生热龟裂。另一方面,切削刀片的室温至600℃为止的热膨胀系数为4.2ppm/K以下时,可以降低切削温度变动所导致的体积的膨胀和收缩,不易产生热龟裂。即,热膨胀系数为4.2ppm/K以下的切削刀片的耐热冲击性优异,为长寿命。因此,特别是对于铣床加工中使用的切削刀片,室温至600℃为止的热膨胀系数优选为4.2ppm/K以下。
赛隆烧结体的室温(25℃)至600℃为止的热膨胀系数可以在氮气气氛中,以10℃/分钟的升温速度,依据JIS R 1618而测定。
本发明的赛隆烧结体的室温下的热导率优选为7W/k·m以上,通常为15W/k·m以下。热导率为7W/k·m以上时,使用本发明的赛隆烧结体作为切削刀片的情况下,易散发切削被削材时产生的热,特别是进行铣床加工时产生的切削温度的变动得到缓解,因此不易产生热龟裂。即,热导率为7W/k·m以上的切削刀片的耐热冲击性优异,为长寿命。因此,特别是对于铣床加工中使用的切削刀片,热导率优选为7W/k·m以上。
赛隆烧结体的室温(25℃)下的热导率可以依据JIS R 1611而测定。
β-赛隆由Si6-ZAlZOZN8-Z的通式所示,该Z值优选为0.3以上且1.0以下,更优选为0.6以上且0.9以下。通过Z值为0.3以上且1.0以下,优选为0.6以上且0.9以下,可以提供耐热冲击性和耐VB磨耗性进一步更优异的赛隆烧结体。Z值越大,即Al对β-赛隆的固溶量越多,越不易引起与耐热合金等被削材的化学反应。其结果,赛隆烧结体的化学磨耗被抑制,耐VB磨耗性提高。另一方面,通过β-赛隆中固溶Al,离子结合性提高,原子间的结合距离扩大。因此,Al对β-赛隆的固溶量越多,β-赛隆的颗粒变得越脆弱,因此强度降低,耐热冲击性降低。另外,Al对β-赛隆的固溶量越多,β-赛隆的形态越从针状变化为柱状,长径比越降低。其结果,不易形成针状晶粒的复杂交织的组织,对龟裂进展的阻抗性降低,因此耐热冲击性降低。因此,Z值超过1.0时,使用赛隆烧结体作为切削刀片的情况下,有无法得到用铣床加工对耐热合金进行粗加工时所需的耐热冲击性的担心。Z值低于0.3时,使用赛隆烧结体作为切削刀片的情况下,与耐热合金等被削材的反应性提高,有耐VB磨耗性差的担心。因此,Z值低于0.3时,有无法得到半精加工所需的耐VB磨耗性的担心。
Z=(a-7.60442)/0.0297···(1)
本发明的赛隆烧结体优选包含:选自由La和Ce组成的组中的至少一种稀土元素B以及选自由Y、Nd、Sm、Eu、Gd、Dy、Er、Yb和Lu组成的组中的至少一种稀土元素C。赛隆烧结体中包含稀土元素B和稀土元素C时,通常,赛隆烧结体的原料粉末中包含稀土元素B和稀土元素C。赛隆烧结体的原料粉末中仅包含稀土元素C时,容易生成α-赛隆。另外,赛隆烧结体的原料粉末中仅包含稀土元素B时,烧结性降低,难以得到致密的赛隆烧结体。另外,假定即使能够进行烧结,也变得容易生成多型赛隆,相对而言难以生成β-赛隆,结果,有耐热冲击性差的担心。另一方面,作为原料粉末包含稀土元素B和稀土元素C这两者时,赛隆烧结体烧结时,抑制α-赛隆的生成,容易生成β-赛隆和21R-赛隆。赛隆烧结体优选包含稀土元素B中的La。La与Ce相比,容易使β-赛隆形成针状,针状晶粒容易形成复杂交织的组织。赛隆烧结体优选包含稀土元素C中的选自由Y、Dy和Er组成的组中的至少一种。这些稀土元素C以少量的添加可以提高烧结性。
本发明的赛隆烧结体中的前述稀土元素B与前述稀土元素C的摩尔比MB:MC以氧化物换算计优选为1.0:0.06~1.0:5.0,更优选为1.0:0.1~1.0:3.0。换言之,稀土元素B与稀土元素C的摩尔比MC/MB优选为0.06以上且5.0以下,更优选为0.1以上且3.0以下。前述摩尔比MB:MC以氧化物换算计为1.0:0.06~1.0:5.0,特别是为1.0:0.1~1.0:3.0时,烧结时β-赛隆与21R-赛隆容易以期望的含有比例生成,可以提供耐热冲击性和耐VB磨耗性优异的赛隆烧结体。前述摩尔比MC/MB低于0.06时,烧结性降低,难以得到致密的赛隆烧结体。另外,假定即使能够进行烧结,也有形成的赛隆烧结体的耐热冲击性差的担心。前述摩尔比MC/MB大于5.0时,烧结时容易生成α-赛隆,难以生成21R-赛隆。其结果,有耐热冲击性差的担心。假定即使生成21R-赛隆,前述摩尔比MC/MB超过5.0时,晶界相中具有石榴石型晶体结构的晶体也容易析出。因此,形成的赛隆烧结体容易变脆,作为切削刀片使用时,有耐热冲击性差的担心。
赛隆烧结体中的稀土元素B和稀土元素C的总含量以氧化物换算计优选为0.8摩尔%以上且4.0摩尔%以下,更优选为1.0摩尔%以上且3.0摩尔%以下。如果前述含量以氧化物换算计为0.8摩尔%以上且4.0摩尔%以下,特别是为1.0摩尔%以上且3.0摩尔%以下,则烧结时β-赛隆和21R-赛隆容易以期望的含有比例生成。其结果,可以提供耐热冲击性和耐VB磨耗性优异、且致密的赛隆烧结体。前述含量以氧化物换算计低于0.8摩尔%时,烧结性降低,有无法得到致密的赛隆烧结体的担心。另外,假定即使能够进行烧结,β-赛隆的形态也难以变为针状,有无法得到针状晶粒复杂交织的组织的担心。因此,形成的赛隆烧结体有耐热冲击性差的担心。前述含量以氧化物换算计大于4.0摩尔%时,晶界相容易发生偏析,其结果,赛隆烧结体的强度降低,有耐热冲击性差的担心。另外,前述含量以氧化物换算计大于4.0摩尔%时,赛隆中没有固溶的稀土元素B和C在晶界相中大量残留,从而容易大量形成软的晶界相。因此,形成的赛隆烧结体有耐热冲击性差的担心。
赛隆烧结体中的稀土元素B和稀土元素C的各含量和总含量可以利用荧光X射线分析或化学分析而测定。
本发明的赛隆烧结体优选不包含α-赛隆或以特定的比例包含α-赛隆。α-赛隆通常具有球状的形态。因此,赛隆烧结体中的α-赛隆的含有比例越多,越变脆,耐热冲击性容易降低。另一方面,赛隆烧结体中的α-赛隆的含有比例越多,硬度越变高,因此耐VB磨耗性容易提高。因此,对于本发明的赛隆烧结体,由X射线衍射分析得到的α-赛隆的峰强度Iα相对于各赛隆的前述峰强度的总计IA的比例[(Iα/IA)×100]优选为0%以上且25%以下,更优选为3%以上且15%以下。前述比例[(Iα/IA)×100]为0%以上且25%以下,特别是为3%以上且15%以下时,可以提供耐热冲击性和耐VB磨耗性进一步更优异的赛隆烧结体。前述比例[(Iα/IA)×100]成为赛隆烧结体中的α-赛隆的含有比例的指标。前述比例[(Iα/IA)×100]超过25%时,耐VB磨耗性提高,而耐热冲击性容易降低。
前述比例[(Iα/IA)×100]可以如下求出:如前述那样算出由X射线衍射分析得到的各赛隆的峰强度的总计IA(=Iβ+Iα+I12H+I15R+I21R+Ix),将α-赛隆的峰强度Iα除以各赛隆的峰强度的总计IA,从而求出。
本发明的赛隆烧结体的α-赛隆的峰强度Iα的比例[(Iα/IA)×100]为0%以上且25%以下时,Mx(Si,Al)12(O,N)16(0<x≤2)所示的α-赛隆中,M为包含前述稀土元素B和前述稀土元素C的金属元素,α-赛隆中的稀土元素B与稀土元素C的原子比Aα相对于赛隆烧结体中的稀土元素B与稀土元素C的原子比AS的比例Aα/AS优选为70%以下。
α-赛隆的峰强度Iα的比例[(Iα/IA)×100]为0%以上且25%以下时,前述比例Aα/AS为70%以下的赛隆烧结体的耐热冲击性和耐VB磨耗性提高。已知,稀土元素B的离子半径大,就单独而言不会侵入固溶于α-赛隆。然而,通过在赛隆烧结体的原料粉末中添加稀土元素B和稀土元素C这两者,稀土元素C侵入固溶于α-赛隆时,稀土元素的能够侵入的位点稍扩大,因此,可以使稀土元素B侵入固溶于α-赛隆。稀土元素B和稀土元素C这两者侵入固溶的α-赛隆与稀土元素C单独侵入固溶的α-赛隆相比,不易引起脱粒。由此,稀土元素B和稀土元素C这两者侵入固溶的α-赛隆的耐热冲击性优异。而且,前述比例Aα/AS为70%以下,即,对于稀土元素B与稀土元素C的原子比,与赛隆烧结体整体相比α-赛隆小,为70%以下,稀土元素B对α-赛隆的侵入固溶率变小时,晶界相与α-赛隆的界面结合力进一步提高。其结果,更不易引起脱粒,故耐热冲击性优异。
α-赛隆中所含的稀土元素B和稀土元素C的含量可以使用透射型电子显微镜所附带的元素分析器(EDS)来测定。
对于本发明的赛隆烧结体,在包括21R-赛隆、12H-赛隆和15R-赛隆的多赛隆中,所述赛隆烧结体至少包含21R-赛隆即可,除了21R-赛隆之外也可以包含12H-赛隆和/或15R赛隆。本发明的赛隆烧结体包含21R-赛隆且包含12H-赛隆和/或15R赛隆的情况下,根据前述多赛隆的峰强度算出的各多型赛隆的峰强度的总计Ip相对于根据由X射线衍射分析得到的赛隆的峰强度算出的各赛隆的峰强度的总计IA的比例[(Ip/IA)×100]优选为5%以上且50%以下,优选为7%以上且40%以下,更优选为10%以上且30%以下。前述比例[(Ip/IA)×100]成为赛隆烧结体中的多型赛隆的含有比例的指标。本发明的赛隆烧结体以前述比例包含21R-赛隆以及12H-赛隆和/或15R-赛隆时,具有耐热冲击性和耐VB磨耗性。前述比例[(Ip/IA)×100]低于5%时,赛隆烧结体中的21R-赛隆的含有比例变得低于5%,因此无法充分得到21R-赛隆的耐VB磨耗性和耐热冲击性的提高效果。其结果,耐VB磨耗性和耐热冲击性差。前述比例[(Ip/IA)×100]超过50%时,特别是超过60%时,赛隆烧结体中的多型赛隆的含有比例多,相对地β-赛隆的含有比例变少。因此,有耐热冲击性差的担心。
前述比例[(Ip/IA)×100]可以如下求出:如前述那样算出由X射线衍射分析得到的各赛隆的峰强度的总计IA(=Iβ+Iα+I12H+I15R+I21R+Ix)和多型赛隆的峰强度的总计Ip(=I12H+I15R+I21R),将多型赛隆的峰强度的总计Ip除以各赛隆的峰强度的总计IA,从而求出。
对于本发明的赛隆烧结体,相对于赛隆烧结体,优选总计含有70面积%以上且99面积%以下的由包含β-赛隆和21R-赛隆的多型赛隆和α-赛隆构成的赛隆,更优选含有85面积%以上且97面积%以下。在赛隆烧结体中以前述比例包含赛隆时,这些赛隆的特性容易以赛隆烧结体的特性的形式得到反映。本发明的赛隆烧结体除了前述赛隆之外例如还可以包含SiC、TiN、TiCN、TiC、WC等硬质碳氮化物。在赛隆烧结体中以前述比例包含的赛隆在赛隆烧结体中大多以具有亚微米至数微米左右的短轴径、且1~20左右的长径比的晶粒的形式存在。在该晶粒彼此之间存在有非晶态或部分地作为结晶质的晶界相。晶界相在赛隆烧结体烧结时以液相的形式存在,有利于赛隆烧结体的烧结性的提高。
赛隆相对于赛隆烧结体的总计比例可以如下求出。将赛隆烧结体以任意的平面切断,利用扫描型电子显微镜以2000~5000倍的倍率拍摄镜面加工过的切断面。对所得微结构照片进行图像分析,将赛隆和除此之外的相分类,测定各面积。前述总计比例通过算出赛隆的面积相对于照片整体的面积的比例而求出。
本发明的赛隆烧结体具有耐热冲击性和耐VB磨耗性。即,对于本发明的赛隆烧结体,使用赛隆烧结体作为切削刀片,对耐热合金等被削材进行切削加工时,可以在粗加工和半精加工这两者中历经长时间地发挥充分的切削性能。特别是,在铣床加工中可以在粗加工至半精加工这两者中历经长时间地发挥充分的切削性能。
以下对本发明的赛隆烧结体的制造方法的一例进行说明。将α-Si3N4粉末、Al2O3粉末、AlN粉末等包含构成赛隆的元素的粉末与稀土元素B的氧化物粉末即La2O3粉末和CeO2粉末中的至少一种与稀土元素C的氧化物粉末即Y2O3粉末、Nd2O3粉末、Sm2O3粉末、Eu2O3粉末、Gd2O3粉末、Dy2O3粉末、Er2O3粉末、Yb2O3粉末和Lu2O3粉末中的至少一种进行混合,形成原料粉末。需要说明的是,对于α-Si3N4粉末,通过用氢氟酸等实施酸处理等,从而除去氧化硅(SiOx)等的氧化物层,通过使氧的含量低于1.0质量%,从而赛隆烧结体中可以容易生成21R-赛隆。另外,也可以使用21R-赛隆粉末代替AlN。也可以使用氢氧化物代替氧化物。原料粉末优选使用:平均粒径5μ以下、优选3μ以下、进一步优选1μ以下的粉末。这些原料粉末考虑烧结后的赛隆烧结体的组成来确定各自的配混比例即可。
接着,将制备好的原料粉末、溶解于乙醇的微晶蜡系的有机粘合剂和乙醇投入至Si3N4制的槽中,使用Si3N4制的球,将原料粉末进行湿式混合。使所得浆料充分干燥,加压成形为期望的形状。在加热装置内、在1个大气压的氮气气氛下、以400~800℃,对所得成形体实施60~120分钟的脱脂处理。进而,将经过脱脂的成形体配置于Si3N4制的容器内,在氮气气氛下,在1700~1900℃下经过120~360分钟进行加热,从而可以得到赛隆烧结体。所得赛隆烧结体的理论密度低于99%时,进一步在1000个大气压的氮气气氛下,在1500~1700℃下进行120~240分钟的HIP处理,得到以理论密度计为99%以上的致密体。
本发明的赛隆烧结体可以作为切削刀片使用。图1为示出本发明的切削刀片的一个实施例的概略说明图。图2为示出具备图1所示的切削刀片的切削刀具的一个实施例的概略说明图。如图1所示那样,本实施方式的切削刀片1为大致圆筒形状,安装于铣刀用支架11等,作为切削刀具10使用。铣刀用支架11在其圆周上的多处具备安装部12。切削刀片1可拆卸地安装于该安装部12。该切削刀具10用于耐热合金等被削材的铣床加工(铣刀加工)等。包含本发明的赛隆烧结体的切削刀片1、即、以本发明的赛隆烧结体作为原材料的切削刀片1如图2所示那样,安装于用于进行铣床加工的铣刀用支架来使用,除此之外,也可以安装于进行旋削加工的旋削加工用支架而使用。本发明的赛隆烧结体具有耐热冲击性和耐VB磨耗性,因此特别适合用于能够进行铣床加工的切削刀具,可以在粗加工至半精加工为止通用地使用。
本实施方式的切削刀片1由本发明的赛隆烧结体形成。该切削刀片1由前述赛隆烧结体形成,因此具有耐热冲击性和耐VB磨耗性。即,该切削刀片1具有能够耐于耐热合金等被削材的粗加工、特别是铣床加工的耐热冲击性和利用半精加工得到美观的加工面所要求的耐VB磨耗性,特别是可以在铣床加工中在粗加工至半精加工为止通用地使用。该切削刀片1可以适合用于将因科镍合金718等包含Ni作为主成分的耐热合金和沃斯帕洛伊合金等以Ni作为主成分、且包含10质量%以上的Co的耐热合金等作为被削材的切削加工。
对于本发明的切削刀片,作为其他实施方式,也可以由前述赛隆烧结体和设置于前述赛隆烧结体外周面的至少一部分的、包含以TiN、Ti(C,N)、TiC、Al2O3、(Ti,Al)N和(Ti,Si)N为代表的各种硬质碳氧氮化物的覆膜而形成。切削刀片在赛隆烧结体的齿顶间隙的至少一部分设置前述覆膜时,前述覆膜与被削材的反应性低,为高硬度,因此耐磨耗性更进一步提高。
本发明的赛隆烧结体不限定于切削刀片,可以作为其他切削刀具、机械用部件、耐热部件、耐磨耗部件等使用。
实施例
(切削刀片的制作)
将平均粒径1.0μm以下的α-Si3N4粉末、Al2O3粉末、AlN粉末与稀土元素的氧化物粉末以成为表1~表3所示的组成的方式进行配混,形成原料粉末。需要说明的是,α-Si3N4粉末根据需要用氢氟酸进行酸处理,或者使用氧量少的试剂。接着,将配混好的原料粉末、溶解于乙醇的微晶蜡系的有机粘合剂和乙醇投入至Si3N4制的槽中,使用Si3N4制的球,对原料粉末进行湿式混合。使所得浆料充分干燥,加压成形为ISO标准中的RNGN120700T01020的切削刀片的形状。在加热装置内,在1个大气压的氮气气氛下,以约600℃,对所得成形体实施60分钟的脱脂处理。进而,将经过脱脂的成形体配置于Si3N4制的容器内,在氮气气氛下,在1850℃下经过240分钟进行加热,得到赛隆烧结体。所得赛隆烧结体的理论密度低于99%时,进一步在1000个大气压的氮气气氛下,在1600℃下进行180分钟的HIP处理,得到以理论密度计为99%以上的致密体。将该赛隆烧结体用金刚石磨石进行研磨加工,从而调整为ISO标准中的RNGN120700T01020的形状,得到切削刀具用的切削刀片。
[表1]
*为使用氧量少的氮化硅粉末或进行了酸处理的氮化硅粉末
[表2]
*为使用氧量少的氮化硅粉末或进行了酸处理的氮化硅粉末
[表3]
*为使用氧量少的氮化硅粉末或进行了酸处理的氮化硅粉末
(切削刀片的分析)
将分析所得赛隆烧结体的结果示于表4~表6。
赛隆烧结体中含有的赛隆的种类通过对所得赛隆烧结体进行X射线衍射分析来鉴定。
切断赛隆烧结体,利用扫描型电子显微镜观察镜面加工后的切断面,结果,赛隆烧结体中,在晶粒彼此之间均观察到部分包含晶体的非晶态的晶界相。另外,对利用扫描型电子显微镜拍摄的照片进行分析,分为赛隆和除了赛隆之外的相,测定各自的面积,结果,对于赛隆的面积相对于照片整体的面积的比例,试验编号4、24、25、28为70~85面积%,试验编号1、3、5~23、27、29、30为85~95面积%,试验编号2、26为95~99面积%。
β-赛隆的Z值是对所得赛隆烧结体进行X射线衍射分析,如前述那样使用式(1)而求出的。
21R-赛隆的含量、多型赛隆的总含量和α-赛隆的含量是对所得赛隆烧结体进行X射线衍射分析,如前述那样分别算出21R-赛隆的峰强度I21R相对于各赛隆的峰强度的总计IA的比例[(I21R/IA)×100]、各多型赛隆的峰强度的总计Ip相对于各赛隆的峰强度的总计IA的比例[(Ip/IA)×100]和α-赛隆的峰强度Iα相对于各赛隆的峰强度的总计IA的比例[(Iα/IA)×100]而求出的。
所得赛隆烧结体的室温(25℃)至600℃为止的热膨胀系数在氮气气氛中、以10℃/分钟的升温速度、依据JIS R 1618而测定。
所得赛隆烧结体中包含的、稀土元素B和稀土元素C的含量利用荧光X射线分析而求出。
α-赛隆中包含的稀土元素B和稀土元素C的含量利用透射型电子显微镜所附带的EDS来测定。具体而言,对5个以上的α-赛隆颗粒进行EDS分析,算出所得值的平均值而求出。
依据JIS R 1611测定所得赛隆烧结体的室温(25℃)下的热导率,结果,试验编号1~23、25、29、30为7W/k·m以上,试验编号24、26~28低于7W/k·m。
(切削刀片的切削性能的评价)
将所得切削刀片安装于图2所示的铣刀用支架,在以下的切削加工条件下进行切削试验。切削加工中,将达到如下任一者时的加工距离示于表4~表6。
(1)VB磨耗超过0.3mm时(VB)
(2)由耐热冲击性不足所导致的热龟裂产生缺损时(TC)
[切削加工条件1]
被削材:因科镍合金718
切削速度:1000m/分钟
输送速度:0.2mm/tooth
切口:1mm
切削油:无
[切削加工条件2]
被削材:因科镍合金718
切削速度:1200m/分钟
输送速度:0.17mm/tooth
切口:1mm
切削油:无
[表4]
[表5]
[表6]
如表4~表6所示那样可知,对于本发明的范围内的切削刀片,在切削加工中,VB磨耗超过0.3mm为止和由耐热冲击性不足所导致的热龟裂产生缺损为止的加工时间长,具有耐VB磨耗性和耐热冲击性。因此,本发明的范围内的切削刀片以因科镍合金718等耐热合金作为被削材可以用于粗加工和半精加工这两者。另一方面可知,本发明的范围外的切削刀片与本发明的切削刀片相比,VB磨耗超过0.3mm为止或由耐热冲击性不足所导致的热龟裂产生缺损为止的加工时间短,耐VB磨耗性和耐热冲击性中的至少一者差。
以下,对表4~表6的试验结果进行更具体地说明。
如表4所示那样,21R-赛隆的含量低于5%的试验编号17、21~23、25、29的切削刀片与处于本发明的范围内的切削刀片相比,加工时间短。前述切削刀片的寿命因素为VB磨耗或由耐热冲击性不足所导致的缺损,因此可知,21R-赛隆的含量低于5%时,耐VB磨耗和耐热冲击性中的任一者差。
如表4所示那样,21R-赛隆的含量为30%以上的试验编号19和20的切削刀片与处于本发明的范围内的切削刀片相比,加工时间短。前述切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,21R-赛隆的含量为30%以上时,耐热冲击性差。
如表4所示那样,热膨胀系数大于4.2ppm/K的试验编号20、21、24的切削刀片与试验编号1~16、18、26~28、30的切削刀片相比,加工时间短。前述切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,热膨胀系数大于4.2ppm/K时,有耐热冲击性差的倾向。
如表4所示那样,在21R-赛隆的基础上包含除了21R-赛隆之外的多型赛隆、且其总含量大于50%的试验编号19的切削刀片与试验编号1~16、18、26~28、30的切削刀片相比,加工时间短。前述切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,多型赛隆的总含量大于50%时,有耐热冲击性差的倾向。
如表4所示那样,α-赛隆的含量大于25%的试验编号21的切削刀片与试验编号1~16、18、26~28、30的切削刀片相比,加工时间短。前述切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,α-赛隆的含量大于25%时,有耐热冲击性差的倾向。
如表4所示那样,包含α-赛隆的切削刀片中的比例Aα/AS超过70%的试验编号30的切削刀片与试验编号1、3~16、18的切削刀片相比,加工时间短。试验编号30的切削刀片的寿命因素为由耐缺损性不足所导致的缺损,因此可知,比例Aα/AS超过70%时,有耐热冲击性差的倾向。
如表5所示那样,β-赛隆的Z值低于0.3的试验编号E的切削刀片与试验编号A~C的切削刀片相比,加工时间短。另外,试验编号E的切削刀片的寿命因素为VB磨耗,因此可知,β-赛隆的Z值低于0.3时,有耐VB磨耗性差的倾向。
如表5所示那样,β-赛隆的Z值大于1.0的试验编号D的切削刀片与试验编号A~C的切削刀片相比,加工时间短。另外,试验编号D的切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,β-赛隆的Z值大于1.0时,有耐热冲击性差的倾向。
如表6所示那样,包含稀土元素B和稀土元素C、且摩尔比MC/MB低于0.06的试验编号iv的切削刀片与试验编号i~iii的切削刀片相比,加工时间短。另外,试验编号iv的切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,摩尔比MC/MB低于0.06时,有耐热冲击性差的倾向。
如表6所示那样,摩尔比MC/MB大于5.0的试验编号v的切削刀片与试验编号i~iii的切削刀片相比,加工时间短。试验编号v的切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,摩尔比MC/MB大于5.0时,有耐热冲击性差的倾向。
如表4所示那样,稀土元素B的含量和稀土元素C的含量的总计低于0.8摩尔%的试验编号26的切削刀片与试验编号1~16、18、27、28、30的切削刀片相比,加工时间短。试验编号26的切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,稀土元素B的含量和稀土元素C的含量的总计低于0.8摩尔%时,有耐热冲击性差的倾向。
如表4所示那样,稀土元素B的含量和稀土元素C的含量的总计大于4.0摩尔%的试验编号24的切削刀片与试验编号1~16、18、26~28、30的切削刀片相比,加工时间短。另外,试验编号24的切削刀片的寿命因素为由耐热冲击性不足所导致的缺损,因此可知,稀土元素B和C的含量大于4.0摩尔%时,有耐热冲击性差的倾向。
附图标记说明
1 切削刀片
10 切削刀具
11 铣刀用支架
12 安装部
Claims (5)
1.一种赛隆烧结体,其特征在于,包含β-赛隆和21R-赛隆,
根据由X射线衍射分析得到的赛隆的峰强度算出的所述21R-赛隆的峰强度I21R相对于各赛隆的峰强度的总计IA的比例[(I21R/IA)×100]为5%以上且27%以下,室温至600℃为止的热膨胀系数为4.2ppm/K以下,
由X射线衍射分析得到的α-赛隆的峰强度Iα相对于各赛隆的所述峰强度的总计IA的比例[(Iα/IA)×100]为0%以上且15%以下。
2.根据权利要求1所述的赛隆烧结体,其特征在于,Si6-ZAlZOZN8-Z所示的β-赛隆的Z值为0.3以上且1.0以下,
包含:选自由La和Ce组成的组中的至少一种稀土元素B以及选自由Y、Nd、Sm、Eu、Gd、Dy、Er、Yb和Lu组成的组中的至少一种稀土元素C,
所述稀土元素B与所述稀土元素C的摩尔比MB:MC以氧化物换算计为1.0:0.06~1.0:5.0,
所述赛隆烧结体中的所述稀土元素B和所述稀土元素C的总含量以氧化物换算计为0.8摩尔%以上且4.0摩尔%以下。
3.根据权利要求2所述的赛隆烧结体,其特征在于,Mx(Si,Al)12(O,N)16(0<x≤2)所示的α-赛隆中,M为包含所述稀土元素B和所述稀土元素C的金属元素,
α-赛隆中的稀土元素B与稀土元素C的原子比Aα相对于赛隆烧结体中的稀土元素B与稀土元素C的原子比AS的比例Aα/AS为70%以下。
4.根据权利要求1或2所述的赛隆烧结体,其特征在于,在包括21R-赛隆、12H-赛隆和15R-赛隆的多赛隆中,所述赛隆烧结体包含21R-赛隆且包含12H-赛隆和/或15R赛隆,
根据所述多赛隆的峰强度算出的各多型赛隆的峰强度的总计Ip相对于根据由X射线衍射分析得到的赛隆的峰强度算出的各赛隆的峰强度的总计IA的比例[(Ip/IA)×100]为50%以下。
5.一种切削刀片,其包含权利要求1或2所述的赛隆烧结体。
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