CN105180504A - Semiconductor refrigeration device for circulating cooling system - Google Patents
Semiconductor refrigeration device for circulating cooling system Download PDFInfo
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- CN105180504A CN105180504A CN201510556222.6A CN201510556222A CN105180504A CN 105180504 A CN105180504 A CN 105180504A CN 201510556222 A CN201510556222 A CN 201510556222A CN 105180504 A CN105180504 A CN 105180504A
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- heat
- egr
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- conducting medium
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
Abstract
The invention discloses a semiconductor refrigeration device for a circulating cooling system. The semiconductor refrigeration device comprises a plurality of heat exchanging units which are stacked in a front and back alternate manner, wherein each heat exchanging unit comprises a semiconductor refrigeration layer, a heat-dissipation circulating device fitted on the heat dissipation surface of the semiconductor refrigeration layer and a heat-absorption circulating device fitted on the heat absorption surface of the semiconductor refrigeration layer; the heat-absorption circulating device is connected with a heat source, and the heat-dissipation circulating device is connected with a heat dissipation device. The semiconductor refrigeration device adopts a multiple-layer cold-hot cross heat exchanger structure and solves the problem that as a plurality of semiconductor refrigeration pieces are mounted in a certain space of the traditional semiconductor refrigerator, the number of the semiconductor refrigeration pieces is limited. The semiconductor refrigeration device meets large refrigeration power output and also has a high refrigeration energy efficiency ratio. The semiconductor refrigeration device has the advantages of being compact in structure and convenient to mount and has high economic and social benefits.
Description
Technical field
The present invention relates to a kind of semiconductor cooling device, particularly relate to a kind of semiconductor cooling device for circulating cooling system, belong to semiconductor refrigerating technology field.
Background technology
At present, known semiconductor chilling plate is connected through wire with semiconductor p-type (hereinafter referred to as P type) by semiconductor N type (hereinafter referred to as N-type), is bonded at the both ends of the surface composition of N-type and P type with 2 heat carriers (being generally the potsherd of electric insulation) respectively.During semiconductor chilling plate work, the radiating surface institute liberated heat of N-type and P type, outwardly distributes through corresponding heat carrier, the required heat absorbed of heat-absorbent surface of N-type and P type, outwardly absorb through heat carrier, the heat-absorbent surface of its N-type and P type has just had the function of refrigeration.But semiconductor cooler efficiency is low, and reason is: the radiating surface of N-type and P type and heat-absorbent surface, only an end face is connected with heat carrier, causes the area of heat trnasfer little; And the radiating surface of N-type and P type and heat-absorbent surface are placed in same space, the heat that result in again between its radiating surface and heat-absorbent surface disturbs mutually.Want to improve the refrigerating efficiency of partly leading device, just need to make radiating surface temperature low as far as possible, the heat conduction velocity of radiating surface is faster, radiating effect better, and heat-absorbent surface temperature is higher, and the refrigeration of heat-absorbent surface is better.
In prior art, for the semiconductor cooler of circulating cooling system, generally all comprise: semiconductor chilling plate, water-to-water heat exchanger, metal heat sink, axial flow blower etc.Refrigerator mid portion is heat exchanger, and heat exchanger two sides is the heat-absorbent surface of semiconductor chilling plate, and the radiating surface of TEC cooling piece is aluminium alloy heat radiator.Cooling water in system water tank, flows through water-to-water heat exchanger by cooling down through circulating pump, and the heat of semiconductor chilling plate radiating surface adds axial flow blower by aluminium alloy heat radiator and dissipated.Chiller of the prior art has following defect: in semiconductor cooler, the radiating surface of semiconductor chilling plate adds axial flow blower heat radiation by aluminium alloy heat radiator, and aluminium alloy heat radiator volume is large, and can contact with semiconductor chilling plate radiating surface the limited area carrying out heat exchange, semiconductor chilling plate limited amount is installed, unsuitable expanding system refrigeration work consumption; Aluminium alloy heat radiator is positioned at the parallel distribution in both sides, and not easily form unobstructed heat dissipation wind channel, radiating efficiency is low, thus has a strong impact on the refrigerating efficiency (40%-60% refrigeration efficiency ratio) of semiconductor chilling plate; Refrigerator overall volume is large, and installation site is by the restriction of heat dissipation wind channel, and inconvenience is installed, wasting space.
Summary of the invention
The technical problem to be solved in the present invention is: how in certain space, to install more semiconductor cooling piece and improve radiating condition and improve refrigeration efficiency ratio.
For realizing above-mentioned goal of the invention, the invention provides a kind of semiconductor cooling device for circulating cooling system, comprising: the heat exchange unit that multiple positive and negative alternate stacks;
Wherein, described heat exchange unit comprises semiconductor refrigerating layer, is fitted in the heat radiation EGR of semiconductor refrigerating layer radiating surface and is fitted in the heat absorption EGR of semiconductor refrigerating layer heat-absorbent surface;
Described heat absorption EGR connects thermal source, and described heat radiation EGR connects heat abstractor.
Wherein more preferably, described semiconductor refrigerating layer is the semiconductor chilling plate that multi-disc level is laid.
Wherein more preferably, described heat radiation EGR hollow, is connected with heat-conducting medium capable of circulation in described heat radiation EGR;
Described heat absorption EGR hollow, is connected with heat-conducting medium capable of circulation in described heat absorption EGR.
Wherein more preferably, described heat radiation EGR connects described heat abstractor by heat radiation circulation line, and described heat abstractor is air-cooled radiating device.
Wherein more preferably, described heat radiation circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described heat abstractor form heat radiation closed circuit.
Wherein more preferably, air-cooled radiating device comprises wind-cooling heat dissipating row and blower fan, and described heat radiation row is provided with radiating fin, and described blower fan is fixed on described radiating fin both sides, both sides crosswind machine rotating in same direction.
Wherein more preferably, described heat absorption EGR connects described thermal source by heat absorption circulation line.
Wherein more preferably, described heat absorption circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described thermal source form heat radiation closed circuit.
Wherein more preferably, described heat-conducting medium is conduction oil or water.
Wherein more preferably, adjacent described heat exchange unit shares heat radiation EGR or heat absorption EGR.
Semiconductor cooling device for circulating cooling system provided by the invention, adopts the cold and hot cross exchanger structure of multilayer, and more semiconductor cooling piece installed by breakthrough conventional semiconductors refrigerator in certain space several quantitative limitation; Make semiconductor cooler while meeting larger refrigeration work consumption output, there is higher refrigeration efficiency ratio; Improve the radiating efficiency in semiconductor cooler for heat dissipation face, ensure that semiconductor cooler comparatively has high refrigeration efficiency ratio further.Semiconductor cooling device for circulating cooling system provided by the invention, not only compact conformation, the refrigeration efficiency ratio also with 85%-120% easy for installation, far away higher than traditional semiconductor cooler product refrigeration efficiency ratio, has higher economic benefit and social benefit.
Accompanying drawing explanation
Fig. 1 is semiconductor cooling device connection diagram of the present invention;
Fig. 2 is heat exchange unit structural representation of the present invention;
Fig. 3 is the semiconductor heat exchange unit STRUCTURE DECOMPOSITION schematic diagram shown in Fig. 2;
Fig. 4 is semiconductor cooling device structural representation of the present invention;
Fig. 5 is semiconductor refrigerating Rotating fields schematic diagram;
Fig. 6 is that semiconductor refrigerating layer cooling piece lays one of schematic diagram;
Fig. 7 is that semiconductor refrigerating layer cooling piece lays schematic diagram two;
Fig. 8 is heat absorption EGR and one of heat radiation EGR structural representation;
Fig. 9 is heat absorption EGR and heat radiation EGR structural representation two;
Figure 10 is the EGR of heat radiation shown in Fig. 8 front elevation;
Figure 11 is the EGR of heat radiation shown in Fig. 8 internal structure schematic diagram;
Figure 12 is the EGR of heat radiation shown in Fig. 9 front elevation;
Figure 13 is the EGR of heat radiation shown in Fig. 9 internal structure schematic diagram;
Figure 14 is semiconductor cooling device of the present invention expansion semiconductor heat exchange unit structural representation;
Figure 15 is the semiconductor cooling device structural representation that the present invention adopts heat absorption EGR shown in Fig. 8 and heat radiation EGR;
Figure 16 is the semiconductor cooling device structural representation that the present invention adopts heat absorption EGR shown in Fig. 9 and heat radiation EGR;
Figure 17 is semiconductor cooling device of the present invention and air-cooled radiating device connection diagram;
Figure 18 is that the present invention is dispelled the heat circulation line connection diagram;
Figure 19 is air-cooled radiating device structural representation of the present invention;
Figure 20 is that the present invention is absorbed heat circulation line connection diagram.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
As shown in Figures 1 to 4, the invention provides a kind of semiconductor cooling device for circulating cooling system, comprising: the heat exchange unit 1 that multiple positive and negative alternate stacks; Wherein, heat exchange unit 1 comprises semiconductor refrigerating layer 10, is fitted in the heat radiation EGR 11 of the radiating surface 101 of semiconductor refrigerating layer 10 and is fitted in the heat absorption EGR 12 of heat-absorbent surface 102 of semiconductor refrigerating layer 10; Heat absorption EGR 12 connects thermal source 2, and heat radiation EGR connects heat abstractor 3.Detailed description is launched to the semiconductor cooling device for circulating cooling system provided by the invention below.
As shown in Figure 5, Figure 6, in each heat exchange unit 1, semiconductor refrigerating layer 10 comprises more semiconductor cooling piece 100, and more semiconductor cooling piece 100 can according to power requirement or actual conditions serial or parallel connection.The semiconductor refrigerating layer 10 that more semiconductor cooling piece 100 forms comprises a radiating surface 101 and a heat-absorbent surface 102, the radiating surface of more semiconductor cooling piece 100 in the same way (heat-absorbent surface of all semiconductor chilling plates or radiating surface are in same direction) level lay formed have larger heat-absorbent surface and radiating surface semiconductor refrigerating layer 10.As shown in Figure 7, general semiconductor refrigerating layer considers the space that semiconductor cooling device is installed and volume size, and semiconductor chilling plate 100 can adopt single setting or arrange setting more.Correspondingly, the heat absorption EGR 12 of the heat radiation EGR 11 being fitted in the radiating surface 101 of semiconductor refrigerating layer 10 and the heat-absorbent surface 102 being fitted in semiconductor refrigerating layer 10, all needs to do corresponding adjustment according to the area of the radiating surface 101 of semiconductor refrigerating layer 10 or the area of heat-absorbent surface 102.In order to absolute raising refrigerating efficiency, increase Energy Efficiency Ratio, preferably by identical with the area of the area of the contact surface of semiconductor refrigerating layer 10 and the radiating surface of semiconductor refrigerating layer 10 for heat radiation EGR 11, the EGR 12 that in like manner absorbs heat is identical with the area of the area of the contact surface of semiconductor refrigerating layer 10 and the heat-absorbent surface of semiconductor refrigerating layer 10.In the present invention, the contact surface between preferably adjacent heat exchange unit 1 also scribbles heat-conducting silicone grease; Preferably on the radiating surface 101 of semiconductor refrigerating layer 10 and the contact surface of heat radiation EGR 11, also scribble heat-conducting silicone grease; Preferably on the heat-absorbent surface 102 of semiconductor refrigerating layer 10 and the contact surface of heat absorption EGR 12, also scribble heat-conducting silicone grease.
As shown in Figure 8, Figure 9, in order to ensure that the heat of thermal source is taken away by semiconductor cooling device in time further, improving refrigerating efficiency as far as possible, improving Energy Efficiency Ratio, heat radiation EGR 11 preferably hollow, is connected with heat-conducting medium capable of circulation in heat radiation EGR 11; Heat absorption EGR 12 hollow, is connected with heat-conducting medium capable of circulation in heat absorption EGR 12.Heat-conducting medium can be organic heat-conducting medium, also can be inorganic heat-conducting medium.Heat-conducting medium is preferably conduction oil or water.In order to cut down finished cost, heat radiation EGR 11 preferably adopts identical structure member with heat absorption EGR 12.For heat abstractor 11, its concrete structure is described in detail below.
As shown in Fig. 8 to Figure 10, heat abstractor 11 has two parallel up and down planes, makes heat abstractor 11 better fit tightly the radiating surface of semiconductor refrigerating layer 10.As shown in Figure 11 figure to 13, in order to the contact area strengthening heat-conducting medium in heat abstractor 11 is quick as far as possible, heat is taken away, heat abstractor 11 hollow is arranged, and is also provided with maze lattice 111, forms the passage 112 that heat-conducting medium flows through between adjacent labyrinth 111 in heat abstractor 11 inside.As shown in Fig. 8 to Figure 13, the outlet 120 of heat-conducting medium entrance 110 and heat-conducting medium can be arranged on the same one or both ends of heat abstractor 11 by heat abstractor 11 according to the actual requirements.
As shown in Fig. 4, Figure 14 to Figure 16, semiconductor cooling device for circulating cooling system provided by the invention adopts multiple heat exchange unit 1 positive and negative alternate to stack, the quantity of semiconductor chilling plate 100 can be increased in limited space more, thus improve the refrigeration work consumption of semiconductor cooling device, improve Energy Efficiency Ratio.Adopt the semiconductor cooling device for circulating cooling system provided by the invention can Longitudinal Extension heat exchange unit 1 according to actual needs, to increase the refrigeration work consumption (such as can at existing heat exchange unit 1 set up heat exchange unit 1 up and down) of semiconductor cooling device.In addition as shown in Figure 15, Figure 16, for saving semiconductor cooling device height in a longitudinal direction further, adjacent heat exchange unit 1 shares heat radiation EGR 11 or heat absorption EGR 12.The space of saving in this way can also increase heat exchange unit further, thus improves the refrigeration work consumption of semiconductor cooling device, improves Energy Efficiency Ratio.In addition as shown in Figure 15, Figure 16, when multiple heat exchange unit 1 positive and negative alternate stacks, heat abstractor 11 or the heat absorption EGR 12 of multiple hot cell 1 can be connected by pipeline.As shown in figure 15, if adopt heat abstractor 11 two ends shown in Fig. 8, Figure 10, Figure 11 to arrange the outlet 120 of heat-conducting medium entrance 110 and heat-conducting medium respectively, when the heat abstractor 11 of multiple heat exchange unit 1 or heat absorption EGR 12 are connected, the two ends of multiple heat exchange unit 1 are provided with connecting line, and possible volume is larger.As shown in figure 16, if adopt the heat abstractor 11 shown in Fig. 9, Figure 12, Figure 13 to arrange the outlet 120 of heat-conducting medium entrance 110 and heat-conducting medium with one end, when the heat abstractor 11 of multiple heat exchange unit 1 or heat absorption EGR 12 are connected, only same one end of multiple heat exchange unit 1 is provided with connecting line, relative to the semiconductor cooling device small volume shown in Figure 15.
As shown in Fig. 1, Figure 17, heat radiation EGR connects heat abstractor by heat radiation circulation line, and heat abstractor is air-cooled radiating device 30.As shown in figure 18, heat radiation circulation line comprises heat-conducting medium case 31 and heat-conducting medium circulating pump 32, and heat-conducting medium case 31, heat-conducting medium circulating pump 31, heat radiation EGR 12, air-cooled radiating device 30 are connected and formed heat radiation closed circuit.As shown in figure 19, air-cooled radiating device comprises wind-cooling heat dissipating row and blower fan, and heat radiation row is provided with radiating fin, and blower fan is fixed on radiating fin both sides, both sides crosswind machine rotating in same direction.
The EGR of heat absorption shown in 0 connects thermal source by heat absorption circulation line as shown in Figure 1, Figure 2.Heat absorption circulation line comprises heat-conducting medium case 21 and heat-conducting medium circulating pump 22, and heat-conducting medium case 21, heat-conducting medium circulating pump 22, heat absorption EGR 11, thermal source 2 are connected and formed heat radiation closed circuit.
In sum, the semiconductor cooling device for circulating cooling system provided by the invention, adopts the cold and hot cross exchanger structure of multilayer, and more semiconductor cooling piece installed by breakthrough conventional semiconductors refrigerator in certain space several quantitative limitation; Make semiconductor cooler while meeting larger refrigeration work consumption output, there is higher refrigeration efficiency ratio; Improve the radiating efficiency in semiconductor cooler for heat dissipation face, ensure that semiconductor cooling device possesses higher refrigeration efficiency ratio further.The present invention is compact conformation not only, and easy for installation.Also there is the refrigeration efficiency ratio of 85%-120%, far away higher than the refrigeration efficiency ratio of traditional semiconductor cooler product, there is higher economic benefit and social benefit.
Above embodiment is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (10)
1. for a semiconductor cooling device for circulating cooling system, it is characterized in that, comprising: the heat exchange unit that multiple positive and negative alternate stacks;
Wherein, described heat exchange unit comprises semiconductor refrigerating layer, is fitted in the heat radiation EGR of semiconductor refrigerating layer radiating surface and is fitted in the heat absorption EGR of semiconductor refrigerating layer heat-absorbent surface;
Described heat absorption EGR connects thermal source, and described heat radiation EGR connects heat abstractor.
2. semiconductor cooling device as claimed in claim 1, is characterized in that, described semiconductor refrigerating layer is the semiconductor chilling plate that multi-disc level is laid.
3. semiconductor cooling device as claimed in claim 1, it is characterized in that, described heat radiation EGR hollow, is connected with heat-conducting medium capable of circulation in described heat radiation EGR;
Described heat absorption EGR hollow, is connected with heat-conducting medium capable of circulation in described heat absorption EGR.
4. semiconductor cooling device as claimed in claim 3, is characterized in that, described heat radiation EGR connects described heat abstractor by heat radiation circulation line, and described heat abstractor is air-cooled radiating device.
5. semiconductor cooling device as claimed in claim 4, it is characterized in that, described heat radiation circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described heat abstractor form heat radiation closed circuit.
6. semiconductor cooling device as claimed in claim 4, is characterized in that, air-cooled radiating device comprises wind-cooling heat dissipating row and blower fan, and described heat radiation row is provided with radiating fin, and described blower fan is fixed on described radiating fin both sides, both sides crosswind machine rotating in same direction.
7. semiconductor cooling device as claimed in claim 3, is characterized in that, described heat absorption EGR connects described thermal source by heat absorption circulation line.
8. semiconductor cooling device as claimed in claim 7, it is characterized in that, described heat absorption circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described thermal source form heat radiation closed circuit.
9. semiconductor cooling device as claimed in claim 3, it is characterized in that, described heat-conducting medium is conduction oil or water.
10. semiconductor cooling device as claimed in claim 1, is characterized in that, adjacent described heat exchange unit shares heat radiation EGR or heat absorption EGR.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510556222.6A CN105180504A (en) | 2015-09-02 | 2015-09-02 | Semiconductor refrigeration device for circulating cooling system |
| PCT/CN2016/094310 WO2017036283A1 (en) | 2015-09-02 | 2016-08-10 | Semiconductor refrigerating device for circulation cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510556222.6A CN105180504A (en) | 2015-09-02 | 2015-09-02 | Semiconductor refrigeration device for circulating cooling system |
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| CN105180504A true CN105180504A (en) | 2015-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510556222.6A Pending CN105180504A (en) | 2015-09-02 | 2015-09-02 | Semiconductor refrigeration device for circulating cooling system |
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| CN (1) | CN105180504A (en) |
| WO (1) | WO2017036283A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017036283A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Semiconductor refrigerating device for circulation cooling system |
| CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
| CN106996424A (en) * | 2017-05-21 | 2017-08-01 | 响水星火传动件有限公司 | A kind of bearing block with self-refrigeration cooling function |
| CN109944678A (en) * | 2019-03-12 | 2019-06-28 | 杭州富阳春江汽车空调厂 | A kind of radiating subassembly of novel vehicle radiator |
| CN109974334A (en) * | 2017-12-27 | 2019-07-05 | 宁波方太厨具有限公司 | A kind of Wind-cooling type semiconductor cooling device |
| CN113143441A (en) * | 2020-09-23 | 2021-07-23 | 童明伟 | Semiconductor wafer tandem type minimally invasive cryogenic scalpel |
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| CN108832228A (en) * | 2018-06-20 | 2018-11-16 | 安徽知之信息科技有限公司 | A kind of water circle device of new energy car battery case |
| CN112285672A (en) * | 2020-10-30 | 2021-01-29 | 浙江汉恒热电科技有限公司 | Laser radar heat abstractor |
| CN112416098A (en) * | 2020-11-13 | 2021-02-26 | 上海英众信息科技有限公司 | Computer heat abstractor and control system thereof |
| CN114063748A (en) * | 2021-11-24 | 2022-02-18 | 内蒙古工业大学 | Semiconductor refrigerating and radiating device for notebook computer |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351950B1 (en) * | 1997-09-05 | 2002-03-05 | Fisher & Paykel Limited | Refrigeration system with variable sub-cooling |
| CN2513056Y (en) * | 2001-05-02 | 2002-09-25 | 邱泽国 | Medium circulation semiconductor refrigerator |
| US20100313576A1 (en) * | 2006-08-02 | 2010-12-16 | Lakhi Nandlal Goenka | Hybrid vehicle temperature control systems and methods |
| CN203561015U (en) * | 2013-11-18 | 2014-04-23 | 北京德能恒信科技有限公司 | Multi-layer heat pipe heat-exchange-type semiconductor refrigeration system |
| CN204923552U (en) * | 2015-09-02 | 2015-12-30 | 北京三相典创科技有限公司 | A semiconductor refrigerator for circulative cooling system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105180504A (en) * | 2015-09-02 | 2015-12-23 | 北京三相典创科技有限公司 | Semiconductor refrigeration device for circulating cooling system |
-
2015
- 2015-09-02 CN CN201510556222.6A patent/CN105180504A/en active Pending
-
2016
- 2016-08-10 WO PCT/CN2016/094310 patent/WO2017036283A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351950B1 (en) * | 1997-09-05 | 2002-03-05 | Fisher & Paykel Limited | Refrigeration system with variable sub-cooling |
| CN2513056Y (en) * | 2001-05-02 | 2002-09-25 | 邱泽国 | Medium circulation semiconductor refrigerator |
| US20100313576A1 (en) * | 2006-08-02 | 2010-12-16 | Lakhi Nandlal Goenka | Hybrid vehicle temperature control systems and methods |
| CN203561015U (en) * | 2013-11-18 | 2014-04-23 | 北京德能恒信科技有限公司 | Multi-layer heat pipe heat-exchange-type semiconductor refrigeration system |
| CN204923552U (en) * | 2015-09-02 | 2015-12-30 | 北京三相典创科技有限公司 | A semiconductor refrigerator for circulative cooling system |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017036283A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Semiconductor refrigerating device for circulation cooling system |
| CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
| CN106766346B (en) * | 2016-12-26 | 2022-09-20 | 华南理工大学 | Circulating water-cooled heat dissipation semiconductor refrigerating system |
| CN106996424A (en) * | 2017-05-21 | 2017-08-01 | 响水星火传动件有限公司 | A kind of bearing block with self-refrigeration cooling function |
| CN109974334A (en) * | 2017-12-27 | 2019-07-05 | 宁波方太厨具有限公司 | A kind of Wind-cooling type semiconductor cooling device |
| CN109974334B (en) * | 2017-12-27 | 2024-01-16 | 宁波方太厨具有限公司 | Air-cooled semiconductor refrigerating device |
| CN109944678A (en) * | 2019-03-12 | 2019-06-28 | 杭州富阳春江汽车空调厂 | A kind of radiating subassembly of novel vehicle radiator |
| CN109944678B (en) * | 2019-03-12 | 2020-06-19 | 温州市骐邦环保科技有限公司 | Novel radiator's radiator unit |
| CN113143441A (en) * | 2020-09-23 | 2021-07-23 | 童明伟 | Semiconductor wafer tandem type minimally invasive cryogenic scalpel |
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| Publication number | Publication date |
|---|---|
| WO2017036283A1 (en) | 2017-03-09 |
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Application publication date: 20151223 |