CN101667464A - Novel high-power cooling module integrating air cooling, water cooling and electronic cooling - Google Patents
Novel high-power cooling module integrating air cooling, water cooling and electronic cooling Download PDFInfo
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- CN101667464A CN101667464A CN200910027478A CN200910027478A CN101667464A CN 101667464 A CN101667464 A CN 101667464A CN 200910027478 A CN200910027478 A CN 200910027478A CN 200910027478 A CN200910027478 A CN 200910027478A CN 101667464 A CN101667464 A CN 101667464A
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- heating radiator
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Abstract
The invention relates to a novel high-power cooling module integrating air cooling, water cooling and electronic cooling. The novel high-power cooling module can decrease the temperature of a heatingdevice to be lower than an environmental temperature, has good cooling effect and great range of application and is suitable for various environmental occasions. The novel high-power cooling module comprises fans, a water pump, a pipeline and a water-cooling head in contact with the heating device and is characterized in that the cooling module is formed by assembling a radiator, an exchanger anda semi-conductor cooling plate; the cross section of the radiator is a quadrangular rounded rectangle; the hot surface of the semi-conductor cooling plate is connected with the outer end plane of therectangular radiator; the cold surface of the semi-conductor cooling plate is connected with the exchanger which forms a circulating loop together with the water pump and the water-cooling head; and the fans are respectively mounted at both sides of the axial end surface of the radiator.
Description
(1) technical field
The present invention relates to efficient cooling technology device field, be specially the high-power refrigerating module that a kind of novel air-cooled, water-cooled and electronic cooling combine.
(2) background technology
Present water-cooled cooling system, it is by the water-cooled head, water pump, water row heating radiator, fan, pipeline is formed, its refrigerating module is exactly a water-cooled head, it can only be reduced to environment temperature with temperature at most, and it is unsuitable in environment temperature than higher application scenario and the lower device of working temperature, so its scope of application is little.
(3) summary of the invention
At the problems referred to above, the invention provides the high-power refrigerating module that a kind of novel air-cooled, water-cooled and electronic cooling combine, it can drop to the temperature of heater members and be lower than environment temperature, good cooling results, can be applicable to various environment occasions, the scope of application is big.
A kind of novel air-cooled, the high-power refrigerating module that water-cooled and electronic cooling combine, its technical scheme is such: it comprises fan, water pump, pipeline, the water-cooled head, a described water-cooled contact heating element, it is characterized in that: described refrigerating module is specially heating radiator, interchanger, semiconductor chilling plate combines, described heating radiator cross section is the rectangle of four rounding of angle, the hot side of described semiconductor chilling plate connects the outer transverse plane of described rectangle heating radiator, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a closed circuit, and described fan is installed on the both sides of the axial end of described rectangle heating radiator.
It is further characterized in that: described rectangle heating radiator is specifically for the rectangular aluminum heat radiator soldering of multi-disc intermediate hollow forms, and the core of described rectangle heating radiator connects; Described mounting plane is distributed on four outer faces of described rectangle heating radiator, and described semiconductor chilling plate is four, and described interchanger is four, described interchanger, semiconductor chilling plate, mounting plane by clip, screw is fastening is fitted and connected;
Temperature sensor is fitted and connected described exchanger surfaces by sensor clip, screw are fastening;
Described four interchangers are communicated with by described pipeline, and one in described four interchangers is communicated with described water pump, and another in described four interchangers is communicated with described water-cooled head, and described water pump is communicated with described water-cooled head; Described interchanger inside is equipped with the multi-disc radiating fin; Screw connects an end face of support, described fan, fan installing plate, described rectangle shape heating radiator successively.
Adopt water-cooling system of the present invention, described refrigerating module is specially heating radiator, interchanger, semiconductor chilling plate combines, described heating radiator cross section is the rectangle of four rounding of angle, the hot side of described semiconductor chilling plate connects the outer transverse plane of described rectangle heating radiator, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a closed circuit, described fan is installed on the both sides of the axial end of described rectangle heating radiator, when described heater element is worked, the heat that distributes conducts to described water-cooled head, liquid coolant with heat transferred to described interchanger inside, the interchanger internal heat is the huyashi-chuuka (cold chinese-style noodles) of heat transferred to described semiconductor chilling plate, its heat is passed to the hot side of described semiconductor chilling plate from the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, the heat of the hot side of described semiconductor chilling plate blows away heat by described fan at last by described rectangle heat sink radiates.Because semiconductor chilling plate can quick heat radiating, its good cooling results, can guarantee that temperature with heater members drops to and be lower than environment temperature that so native system can be applicable to various environment occasions, the scope of application is big.
(4) description of drawings
Fig. 1 is a three-dimensional icon intention of the present utility model;
Fig. 2 is the stereographic map of heating radiator of the present utility model.
(5) embodiment
See Fig. 1, Fig. 2, it comprises fan 3, water pump 12, pipeline 11, water-cooled 1, water-cooled 1 a contact heating element, refrigerating module is specially heating radiator 10, interchanger 5, semiconductor chilling plate 8 and combines, heating radiator 10 cross sections are the rectangle of four rounding of angle, the hot side of semiconductor chilling plate 8 connects the outer transverse plane of rectangle heating radiator 10, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 8 connects interchanger 5, interchanger 5 and water pump 12, water-cooled 1 formation, one closed circuit, fan 3 is installed on the both sides of the axial end of rectangle heating radiator 10.
Rectangular aluminum heat radiator 13 solderings that rectangle heating radiator 10 is specially the multi-disc intermediate hollow form, and the core of rectangle heating radiator 10 connects; Mounting plane 14 is distributed on four outer faces of rectangle heating radiator 10, and semiconductor chilling plate 8 is four, and interchanger 5 is four, interchanger 5, semiconductor chilling plate 8, mounting plane 14 by clip 6, screw is fastening is fitted and connected; Temperature sensor 7 is by sensor clip 8, fastening interchanger 5 surfaces that are fitted and connected of screw.
Four interchangers 5 are communicated with by pipeline 11, and another in 12, four interchangers 5 of a connection water pump in four interchangers 5 is communicated with water-cooled 1, and water pump 12 is communicated with water-cooleds 1; Interchanger 5 inside are equipped with the multi-disc radiating fin; Screw connects an end face of support 2, fan 3, fan installing plate 4, rectangle shape heating radiator 10 successively.
Claims (7)
1, a kind of novel air-cooled, the high-power refrigerating module that water-cooled and electronic cooling combine, it comprises fan, water pump, pipeline, the water-cooled head, a described water-cooled contact heating element, it is characterized in that: described refrigerating module is specially heating radiator, interchanger, semiconductor chilling plate combines, described heating radiator cross section is the rectangle of four rounding of angle, the hot side of described semiconductor chilling plate connects the outer transverse plane of described rectangle heating radiator, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a closed circuit, and described fan is installed on the both sides of the axial end of described rectangle heating radiator.
2, the high-power refrigerating module that combines according to described a kind of novel air-cooled, the water-cooled of claim 1 and electronic cooling, it is characterized in that: described rectangle heating radiator is specifically for the rectangular aluminum heat radiator soldering of multi-disc intermediate hollow forms, and the core of described rectangle heating radiator connects.
3, the high-power refrigerating module that combines according to described a kind of novel air-cooled, the water-cooled of claim 2 and electronic cooling, it is characterized in that: described mounting plane is distributed on four outer faces of described rectangle heating radiator, described semiconductor chilling plate is four, described interchanger is four, described interchanger, semiconductor chilling plate, mounting plane by clip, screw is fastening is fitted and connected.
4, the high-power refrigerating module that combines according to described a kind of novel air-cooled, the water-cooled of claim 3 and electronic cooling is characterized in that: temperature sensor is fitted and connected described exchanger surfaces by sensor clip, screw are fastening.
5, the high-power refrigerating module that combines according to described a kind of novel air-cooled, the water-cooled of claim 4 and electronic cooling, it is characterized in that: described four interchangers are communicated with by described pipeline, one in described four interchangers is communicated with described water pump, in described four interchangers another is communicated with described water-cooled head, and described water pump is communicated with described water-cooled head.
6, the high-power refrigerating module that combines according to described a kind of novel air-cooled, the water-cooled of claim 5 and electronic cooling, it is characterized in that: described interchanger inside is equipped with the multi-disc radiating fin.
7, the high-power refrigerating module that combines according to described a kind of novel air-cooled, the water-cooled of claim 6 and electronic cooling, it is characterized in that: screw connects an end face of support, described fan, fan installing plate, described rectangle shape heating radiator successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027478A CN101667464A (en) | 2009-05-07 | 2009-05-07 | Novel high-power cooling module integrating air cooling, water cooling and electronic cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027478A CN101667464A (en) | 2009-05-07 | 2009-05-07 | Novel high-power cooling module integrating air cooling, water cooling and electronic cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101667464A true CN101667464A (en) | 2010-03-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910027478A Pending CN101667464A (en) | 2009-05-07 | 2009-05-07 | Novel high-power cooling module integrating air cooling, water cooling and electronic cooling |
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| CN (1) | CN101667464A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN108539926A (en) * | 2018-05-16 | 2018-09-14 | 芜湖市艾德森自动化设备有限公司 | A kind of high effect forced radiator of versatility motor apparatus |
| CN108650861A (en) * | 2018-07-12 | 2018-10-12 | 江门市银河科技发展有限公司 | A kind of heat generating components high temperature water flow cooling device |
-
2009
- 2009-05-07 CN CN200910027478A patent/CN101667464A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN108539926A (en) * | 2018-05-16 | 2018-09-14 | 芜湖市艾德森自动化设备有限公司 | A kind of high effect forced radiator of versatility motor apparatus |
| CN108650861A (en) * | 2018-07-12 | 2018-10-12 | 江门市银河科技发展有限公司 | A kind of heat generating components high temperature water flow cooling device |
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| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100310 |