CN101515119A - Silicon chip bench double-bench switching system employing air floatation plane motor - Google Patents
Silicon chip bench double-bench switching system employing air floatation plane motor Download PDFInfo
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- CN101515119A CN101515119A CNA2009101315084A CN200910131508A CN101515119A CN 101515119 A CN101515119 A CN 101515119A CN A2009101315084 A CNA2009101315084 A CN A2009101315084A CN 200910131508 A CN200910131508 A CN 200910131508A CN 101515119 A CN101515119 A CN 101515119A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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Abstract
A silicon chip bench double-bench switching system employing an air floatation plane motor comprises a base bench and two same silicon chip benches which can do large range plane motion on the bench. A plane permanent magnetic array is arranged on top of the base bench, each silicon chip bench comprises a platform and a mobile electromagnetic structure and a air floatation structure which are arranged on bottom of the platform, the mobile electromagnetic structure comprises n coil arrays which is symmetrically distributed to X axis and Y axis in a coordinate system with silicon chip bench center of mass as origin, n is even number larger than or equal to 4, and arrangement direction of adjacent coil arrays are perpendicular; and the air floatation structure comprises at least two axis-symmetric uniform-distributed air floatation bearings. The invention guarantees center of mass driving of the silicon chip bench, simplifies control structure of the syste, reduces driving load, increases response speed of the silicon chip bench, acceleration and movement positioning precision in silicon chip bench movement process, and increases productivity, overlay accuracy and resolution of mask aligner.
Description
Technical field
The present invention relates to photo-etching machine silicon slice bench double-bench switching system, this system is mainly used in the semiconductor lithography machine, belongs to semiconductor manufacturing equipment field.
Technical background
In the production run of integrated circuit (IC) chip, the exposure transfer printing (photoetching) of the design configuration of chip on the silicon chip surface photoresist is one of most important operation wherein, and the used equipment of this operation is called litho machine (exposure machine).The resolution of litho machine and exposure efficiency affect the characteristic line breadth (resolution) and the throughput rate of integrated circuit (IC) chip greatly.And, determined the resolution and the exposure efficiency of litho machine again to a great extent as the kinematic accuracy and the work efficiency of the silicon chip ultraprecise motion locating system (being designated hereinafter simply as the silicon chip platform) of litho machine critical system.
The advanced scanning projecting photoetching machine ultimate principle as shown in Figure 1.From the deep UV (ultraviolet light) of light source 45 see through mask 47, lens combination 49 with a part of pattern imaging on the mask on certain Chip of silicon chip 50.Mask and silicon chip oppositely are synchronized with the movement by certain speed proportional, and the whole pattern imagings on the mask are on the certain chip (Chip) of silicon chip the most at last.
The basic role of silicon chip platform motion locating system is exactly to carry silicon chip and by speed of setting and direction motion, to realize the accurate transfer in mask figure each zone on silicon chip in exposure process.Because the live width of chip very little (minimum feature has reached 45nm at present) for guaranteeing the alignment precision and the resolution of photoetching, just requires the silicon chip platform to have high motion positions precision; Because the movement velocity of silicon chip platform affects the throughput rate of photoetching to a great extent, from the angle of boosting productivity, requires the movement velocity of silicon chip platform to improve constantly again.
Traditional silicon chip platform, described as patent EP 0729073 and patent US 5996437, have only a silicon chip motion positions unit in the litho machine, i.e. a silicon chip platform.Preliminary works such as leveling and focusing all will be finished in the above, and required chronic of these work particularly aimed at, owing to require to carry out the high low-velocity scanning of precision (typical alignment scanning speed is 1mm/s), so required time is very long.And it is very difficult to reduce its working time.Like this, in order to improve the production efficiency of litho machine, just must improve constantly the movement velocity of the stepping and the exposure scanning of silicon chip platform.And the raising of speed will unavoidably cause the deterioration of dynamic performance, need take a large amount of technical measures guarantees and improve the kinematic accuracy of silicon chip platform, will improve greatly for keeping existing precision or reaching the cost that high precision more will pay.
Patent WO98/40791 (open date: 1998.9.17; Country origin: Holland) described structure adopts two silicon chip platform structures, and exposure preliminary works such as sheet, prealignment, aligning are transferred on second silicon chip platform up and down, and with the while self-movement of exposure silicon chip platform.Under the prerequisite that does not improve silicon chip platform movement velocity, a large amount of preliminary work of exposure silicon chip platform is shared by second silicon chip platform, thereby has shortened the every working time of silicon chip on exposure silicon chip platform greatly, has increased substantially production efficiency.Yet the major defect that this system exists is the non-barycenter driving problems of silicon wafer stage system.
The applicant is at patent of invention " the two chaptrels of stepping projection mask aligner change exposure ultraprecise location silicon chip the system " (number of patent application: ZL03156436.4) of application in 2003, a kind of two silicon chip platform switching fabrics with the double-side straight-line guide rail are disclosed, this double-platform exchange system for silicon chip platform does not exist overlapping on work space, therefore need not adopt the crash protection device.But also there are some problems in this double-platform exchange system for silicon chip platform, the one, and the guide rail merging precision that this system requirements is high; The 2nd, this system's bilateral guide rail has only a side space to be utilized simultaneously, causes this silicon wafer stage system physical dimension bigger, and this semi-conductor chip factory that space availability ratio is had relatively high expectations seems extremely important undoubtedly.The 3rd, this system's silicon chip platform need adopt the bridge-set of band drive unit when exchanging, and has increased the complicacy of system.
The applicant is at patent of invention " a kind of photo-etching machine silicon slice bench double-bench switching system that adopts the cross guide rail " (number of patent application: 200710303713.5) disclose a kind of structure that is realized the silicon slice bench double-bench exchange by 4 groups of double freedom driver elements of application in 2007, the motion of this silicon chip platform is by the realization of moving simultaneously of two adjacent double freedom driver elements, so system has certain requirement to synchro control.200710303712.0) and " a kind of photo-etching machine silicon slice bench double-bench switching system that adopts conveyer structure " (number of patent application: 200710303648.6) be respectively equipped with a H type driver element on the pre-service station and the station that exposes simultaneously, the applicant is at the patent of invention " a kind of photo-etching machine silicon slice bench double-bench switching system that adopts the transition catching device " of application in 2007 (number of patent application:.
Silicon chip platform in all foregoing invention patents all is to realize the multiple-degree-of-freedom planar motion by a plurality of single-degree-of-freedom linear electric motors being superimposed as H type or rhythmo structure such as cross.This lamination drives structure is when realizing plane motion, upper strata linear electric motors and the silicon chip platform that directly drives thereof all need the bottom linear electric motors to drive, increased the burden of bottom linear electric motors greatly, brought non-barycenter to drive simultaneously, need problems such as high-precise synchronization control, system architecture is also very complicated, has limited the motion positions precision of silicon chip platform, has hindered the raising of its location response speed.The applicant is in patent of invention " moving-coil type is done plane motion the magnetic floating six-freedom worktable on a large scale " (number of patent application: 200710304519.9) be the technical foundation of patent of the present invention of application in 2007, but exist the asymmetric mover that causes of coil arrangement stressed asymmetric, need electromagnetic force that the supporting that suspends is provided, heating is big, shortcomings such as control complexity.
Summary of the invention
In order to improve the acceleration of photo-etching machine silicon chip platform, speed and bearing accuracy, and then the raising of throughput rate, alignment precision and the resolution of promotion litho machine the invention provides a kind of double-platform exchange system for silicon chip platform that adopts air-floatation planar motor.
Technical scheme of the present invention is as follows:
A kind of double-platform exchange system for silicon chip platform that adopts air-floatation planar motor, comprise base station 11 and two silicon chip platforms that work in pre-service station silicon chip platform and exposure station respectively that structure is identical, the base station top is provided with plane permanent magnetic array 16, this plane permanent magnetic array is arranged by the staggered permanent magnet of a series of direction of magnetization and formed, it is characterized in that: described each silicon chip platform is made up of platform 12 and the mobile electromagnetic structure 14 and the air floating structure 13 that are arranged at the platform bottom; Described mobile electromagnetic structure is symmetrically distributed about X-axis in the coordinate system that with silicon chip platform barycenter is initial point by n and forms about the coil array that Y-axis is symmetrically distributed, and n is the even number more than or equal to 4, and adjacent windings arrayed direction is mutually 90 ° of layouts; Described air floating structure is made up of two uniform air-bearings of symmetry at least.
The double-platform exchange system for silicon chip platform of employing air-floatation planar motor of the present invention, its feature also is: described mobile electromagnetic structure is made up of four coil arrays, each coil array is formed by five rectangle iron-less core coil linear array, and coil arrangement direction and permanent magnet array orientation angle at 45 is arranged; Described air floating structure is made up of 5 air-bearings that are arranged at the platform bottom, 5 air-bearings distribute about the X-axis rotational symmetry in the coordinate system that with silicon chip platform barycenter is initial point and distribute about the Y-axis rotational symmetry, and coil array and air-bearing are staggered in the platform bottom.
The double-platform exchange system for silicon chip platform of employing air-floatation planar motor of the present invention, its feature also is: this plane permanent magnetic array is arranged in the Halbach array by a series of permanent magnets on base.
The double-platform exchange system for silicon chip platform of employing air-floatation planar motor of the present invention has the following advantages and the high-lighting effect: cancelled the structure that this a plurality of single dof mobility parts stack forms the multiple-degree-of-freedom planar motion, Lorentz force directly drives each silicon chip platform and realizes that the two platforms on the surface level exchange and corresponding step-scan campaign, system architecture is simplified greatly, avoided the guide rail butt joint in the aforementioned patent, non-barycenter drives, a series of problems such as synchro control; Adopted gas suspension, in silicon chip platform uniform motion process, only need very little Control current, avoided the power of motor that six free magnetic suspension bearings bring in the aforementioned patent big, the big problem of generating heat, reduced the complexity of control simultaneously, improved the arrangement of coil array, coil array is not only about the symmetry of the heart in the heart of silicon chip platform, and coil array distributes about the X-axis rotational symmetry in the coordinate system that with silicon chip platform barycenter is initial point and distributes about the Y-axis rotational symmetry, the barycenter that has guaranteed the silicon chip platform drives, and has simplified the control structure of system; Alleviate the driving load greatly, improved the response speed of silicon chip platform, improved the speed in the silicon chip platform motion process greatly, acceleration and motion positions precision, and then improved throughput rate, alignment precision and the resolution of litho machine greatly.
Scheme attached explanation
Fig. 1 has shown the advanced scanning projecting photoetching machine basic functional principle.
Fig. 2 is the motion locating system that has only a silicon chip platform.
Fig. 3 is a kind of double-platform exchange system for silicon chip platform that adopts the lamination drives structure in the patent of the applicant 2007 application.
Fig. 4 is the three-dimensional exchange synoptic diagram of the double-platform exchange system for silicon chip platform of employing air-floatation planar motor of the present invention.
Fig. 5 is the 3-D view of silicon chip platform mobile electromagnetic structure in bottom of the present invention and air floating structure.
The 3-D view of Fig. 6 base station of the present invention and top Halbach permanent magnet array thereof.
Fig. 7 is the variation relation synoptic diagram of permanent magnet array gap density vertical component of the present invention about the XY coordinate.
Fig. 8 is the stressing conditions synoptic diagram of the mobile electromagnetic structure in silicon chip platform of the present invention bottom.
Among the figure:
1-silicon chip platform; The 2-platform; 3-H type driver element; 5-X is to linear electric motors; 7-Y is to linear electric motors; The 9-conveyer belt system; 10-docks slide block; The 11-base station; The 12-platform; The 13-air floating structure; 14-moves electromagnetic structure; 16-plane permanent magnetic array; The 17-base; The 18-first rectangular parallelepiped permanent magnet; The 19-second rectangular parallelepiped permanent magnet; The 45-light source; The 47-mask; The 49-lens combination; The 50-silicon chip.
Embodiment
Below in conjunction with accompanying drawing concrete structure of the present invention, mechanism and the course of work are further described.
The advanced scanning projecting photoetching machine ultimate principle as shown in Figure 1.From the deep UV (ultraviolet light) of light source 45 see through mask 47, lens combination 49 with a part of pattern imaging on the mask on certain Chip of silicon chip 50.Mask and silicon chip oppositely are synchronized with the movement by certain speed proportional, and the whole pattern imagings on the mask are on the certain chip (Chip) of silicon chip the most at last.The basic role of silicon chip motion locating system (silicon chip platform) is exactly to carry silicon chip and by speed of setting and direction motion, to realize the accurate transfer in mask figure each zone on silicon chip in exposure process.
Traditional advanced scanning projecting photoetching machine silicon chip platform has only a silicon chip motion locating system as shown in Figure 2 in the litho machine, promptly have only a silicon chip platform.Preliminary work such as leveling, focusing all will be finished on same silicon chip platform, and required chronic of these work particularly aimed at, owing to require to carry out the high low-velocity scanning of precision (typical alignment scanning speed is 1mm/s), so required time is very long.In order to improve the exposure efficiency of litho machine, photo-etching machine silicon slice bench double-bench switching system of the present invention, exposure preliminary works such as leveling, focusing, aligning are transferred on the silicon chip platform of pre-service station, and work alone simultaneously with the silicon chip platform of exposure station, thereby shorten the working time of silicon chip on exposure silicon chip platform greatly.
The double-platform exchange system for silicon chip platform of the how free plane motion of employing lamination drives structure realization as shown in Figure 3.This system comprises the silicon chip platform 1 and the silicon chip platform 1 that runs on the exposure station that run on the pre-service station, described silicon chip platform drives by H type driver element 3, drive silicon chip platform 1 and do X, the motion of Y direction on a large scale, described H type driver element is made up of to linear electric motors 7 to linear electric motors 5 and Y bilateral X, in base station 11 both sides conveyer belt system 9 is installed, is sent to the exposure station by the pre-service station in order to drive silicon chip platform 1.This lamination drives structure, complex structure, when realizing plane motion, upper strata linear electric motors and the silicon chip platform that directly drives thereof all need the bottom linear electric motors to drive, increased the burden of bottom linear electric motors greatly, limit the motion positions precision of silicon chip platform, hindered the raising of its location response speed.
The double-platform exchange system for silicon chip platform of employing air-floatation planar motor of the present invention comprises base station 11 and two silicon chip platforms that work in pre-service station and exposure station respectively that structure is identical, the base station top is provided with plane permanent magnetic array 16, and this plane permanent magnetic array is arranged by the staggered permanent magnet of a series of direction of magnetization and formed; Described each silicon chip platform is made up of platform 12 and the mobile electromagnetic structure 14 and the air floating structure 13 that are arranged at the platform bottom; Described mobile electromagnetic structure is symmetrically distributed about X-axis in the coordinate system that with silicon chip platform barycenter is initial point by n and forms about the coil array that Y-axis is symmetrically distributed, and n is the even number more than or equal to 4, and adjacent windings arrayed direction is mutually 90 ° of layouts; Described air floating structure is made up of two uniform air-bearings of rotational symmetry at least; Described mobile electromagnetic structure is made up of four coil arrays, and each coil array is formed by five rectangle iron-less core coil linear array, and coil arrangement direction and permanent magnet array orientation angle at 45 is arranged; Described air floating structure is made up of 5 air-bearings that are arranged at the platform bottom, 5 air-bearings distribute about the X-axis rotational symmetry in the coordinate system that with silicon chip platform barycenter is initial point and distribute about the Y-axis rotational symmetry, and coil array and air-bearing are staggered in the platform bottom.Described plane permanent magnetic array is arranged in the Halbach array by a series of permanent magnets on base.
Fig. 4 is the three-dimensional exchange synoptic diagram for a specific embodiment of the double-platform exchange system for silicon chip platform of employing air-floatation planar motor of the present invention, as seen from the figure: be made up of with two identical silicon chip platforms 1 that work in pre-service station silicon chip platform and exposure station respectively of structure base station 11.Wherein, the silicon chip platform is made up of platform 12 (being placed with circular silicon chip 50 on it) and the mobile electromagnetic structure 14 and the air floating structure 13 that are arranged at platform bottom.Moving electromagnetic structure is symmetrically distributed about X-axis in the coordinate system that with silicon chip platform barycenter is initial point by n and forms about the coil array that Y-axis is symmetrically distributed, and n is the even number more than or equal to 4, and adjacent windings arrayed direction is mutually 90 ° of layouts; Described air floating structure is made up of two uniform air-bearings of rotational symmetry at least.
Fig. 5 is a specific embodiment of the present invention, mobile electromagnetic structure 14 is symmetrically distributed about X-axis in the coordinate system that with silicon chip platform barycenter is initial point by four and forms about the coil array that Y-axis is symmetrically distributed, each adjacent windings array direction is arranged mutually at an angle of 90, each coil array is formed by 5 rectangle iron-less core coil linear array, and coil arrangement direction and permanent magnet array orientation angle at 45 is arranged as shown in Figure 5.Air floating structure is made up of 5 air-bearings that are arranged at the platform bottom, and 5 air-bearings distribute about the X-axis rotational symmetry in the coordinate system that with silicon chip platform barycenter is initial point and distribute about the Y-axis rotational symmetry, and coil array and air-bearing are staggered in the platform bottom.Described air floating structure is made up of 5 air-bearings that are arranged at the platform bottom, 5 air-bearings distribute about the X-axis rotational symmetry in the coordinate system that with silicon chip platform barycenter is initial point and distribute about the Y-axis rotational symmetry, and coil array and air-bearing are staggered in the platform bottom.During work, provide the gas suspension on base station 11 of each silicon chip platform at vertical direction by air-bearing.After the operation of each silicon chip platform station on finishing, press among Fig. 4 the path movement shown in the big arrow to next station, continue to finish the operation of next station, thereby with the structure of this similar cycle streamline realize with exposure preliminary work such as the sheet up and down of last silicon chip, prealignment, aligning and afterwards the parallel of a silicon wafer exposure job carry out, improved the throughput rate of litho machine greatly.
As shown in Figure 6, base station 11 is made up of base 17 and the plane permanent magnetic array 16 that is arranged on the base 17, plane permanent magnetic array 16 is arranged in the Halbach array by big permanent magnet 18 of a series of rectangular parallelepipeds and the little permanent magnet 19 of rectangular parallelepiped by rule shown in Figure 4 on base 17, array direction on the XY plane with coil arrangement direction (being X-axis or Y direction among the figure) angle at 45, the big permanent magnet 18 of rectangular parallelepiped among Fig. 6 is (long, wide, height is respectively 2a, a, a, a is the length on 18 1 limits of permanent magnet) vertically (being the direction of 2a) be magnetized, produce the N utmost point and the S utmost point, the N and the S that are labeled in the permanent magnetism upper surface represent the superposed magnetic pole title of this permanent magnet, the little permanent magnet 19 of rectangular parallelepiped is (long, wide, height is respectively a, 0.5a, 2a, a is the length of side of 19 1 minor faces of permanent magnet) along magnetizing on the length of side direction of 0.5a, direction of magnetization (wide direction) is (arrow points to the permanent magnet N utmost point by the permanent magnet S utmost point) shown in the arrow of permanent magnet surface.Some permanent magnets such as Fig. 6 arrange according to certain rules, make the direction of magnetization of permanent magnet be staggered.In the air gap of plane permanent magnetic array 16 between base station 11 and silicon chip platform 1 or produce air-gap field on the surface of contact.Fig. 7 is the variation relation synoptic diagram of the gap density vertical component Bz of plane permanent magnetic array shown in Figure 6 about the XY coordinate.Between the same side of two adjacent identical permanent magnets be pole span apart from τ in the same row among Fig. 6, it also is the distance between the gap density two adjacent peak values of Fig. 7 midplane permanent magnet array.
The described mobile electromagnetic structure 14 that is arranged at silicon chip platform 1 bottom is by four or be symmetrically distributed about X-axis in the coordinate system that with silicon chip platform barycenter is initial point and form about the coil array that Y-axis is symmetrically distributed greater than four even number, and described each coil array is formed by one or more identical rectangle iron-less core coil linear array; It is optimized structure is to adopt four coil arrays, and each coil array is formed by five identical rectangle iron-less core coil linear array.The length of rectangle iron-less core coil is greater than four times of the pole span of Halbach array, and width is 0.8～1 times of Halbach array pole span.General being about of square coil is 7a, wide about 1.4a, coil thickness is about 0.4a (a is the length of side of 5 one minor faces of permanent magnet), and coil arrangement direction and permanent magnet array orientation angle at 45 (or along X-direction or along Y direction) arrange that each adjacent windings array direction is arranged mutually at an angle of 90.
In the air-gap field that permanent magnet array produces, be subjected to Lorentz force action behind each coil electricity, its suffered Lorentz force can be decomposed into three mutually perpendicular component, i.e. power Fz vertically, in the XY plane along the power F1 of coil long side direction and in the XY plane perpendicular to the power F2 of coil long side direction, calculate by analysis and the emulation discovery, the silicon chip platform along directions X or when the Y direction is moved Fz and F2 in the stroke of about 1.414 τ, change by sinusoidal rule, the peak value size is about 2N, the F1 size is about 0.00001N-0.0001N, approximate 0, and be far smaller than Fz and F2 so ignore.Like this by suitable control strategy, control the electric current of each coil separately, can make power Fz that all coils produces at vertical direction to make a concerted effort be zero, the rigidity of considering the vacuum preload gas suspension simultaneously is near the zero damping characteristic, the fully independently plane motion on base station of each silicon chip platform be can realize, thereby two platform exchanges and corresponding step-scan campaign on the surface level realized easily.
Fig. 7 has represented that single silicon chip platform has 4 coil arrays stressing conditions when driving, 4 coil arrays are called first coil array, second coil array, tertiary coil array and the 4th coil array, and the center of their bottom surfaces is respectively O1, O2, O3 and O4.ABCD is the bottom surface of silicon chip platform 1 among the figure, and abcd is the projection of ABCD on the base station end face.3 durection component F ' xi, the F ' yi of i (i=1,2,3,4) coil array and F ' zi act on the center O ' i of this bottom surface, armature unit, so under the effect of above-mentioned force component, the silicon chip platform is realized moving along x, y direction.
Claims (3)
1. double-platform exchange system for silicon chip platform that adopts air-floatation planar motor, comprise base station (11) and two silicon chip platforms that work in pre-service station and exposure station respectively that structure is identical, the base station top is provided with plane permanent magnetic array (16), this plane permanent magnetic array is arranged by the staggered permanent magnet of a series of direction of magnetization and formed, it is characterized in that: described each silicon chip platform is made up of platform (12) and the mobile electromagnetic structure (14) and the air floating structure (13) that are arranged at bottom the platform; Described mobile electromagnetic structure is symmetrically distributed about X-axis in the coordinate system that with silicon chip platform barycenter is initial point by n and forms about the coil array that Y-axis is symmetrically distributed, and n is the even number more than or equal to 4, and adjacent windings arrayed direction is mutually 90 ° of layouts; Described air floating structure is made up of two uniform air-bearings of rotational symmetry at least.
2. according to the double-platform exchange system for silicon chip platform of the described employing air-floatation planar motor of claim 1, it is characterized in that: described mobile electromagnetic structure is made up of four coil arrays, each coil array is formed by five rectangle iron-less core coil linear array, and coil arrangement direction and permanent magnet array orientation angle at 45 is arranged; Described air floating structure is made up of 5 air-bearings that are arranged at the platform bottom, 5 air-bearings distribute about the X-axis rotational symmetry in the coordinate system that with silicon chip platform barycenter is initial point and distribute about the Y-axis rotational symmetry, and coil array and air-bearing are staggered in the platform bottom.
3. according to the double-platform exchange system for silicon chip platform of the described employing air-floatation planar motor of claim 1, it is characterized in that: described plane permanent magnetic array is arranged in the Halbach array by a series of permanent magnets on base.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101315084A CN101515119A (en) | 2009-04-03 | 2009-04-03 | Silicon chip bench double-bench switching system employing air floatation plane motor |
| CN2009101729499A CN101694560B (en) | 2009-04-03 | 2009-09-11 | Silicon wafer stage double-stage exchange system by adopting air-floatation planar motor |
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| CNA2009101315084A CN101515119A (en) | 2009-04-03 | 2009-04-03 | Silicon chip bench double-bench switching system employing air floatation plane motor |
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| CN101515119A true CN101515119A (en) | 2009-08-26 |
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| CN102097982A (en) * | 2011-02-24 | 2011-06-15 | 华中科技大学 | Permanent-magnet synchronous magnetic suspension planar motor |
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| CN113156775A (en) * | 2021-04-27 | 2021-07-23 | 华中科技大学 | Proximity type exposure light source and exposure method |
| CN113589651A (en) * | 2020-04-30 | 2021-11-02 | 上海微电子装备（集团）股份有限公司 | Air bearing device and photoetching equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102097982A (en) * | 2011-02-24 | 2011-06-15 | 华中科技大学 | Permanent-magnet synchronous magnetic suspension planar motor |
| CN102097982B (en) * | 2011-02-24 | 2013-06-05 | 华中科技大学 | Permanent-magnet synchronous magnetic suspension planar motor |
| CN102495531A (en) * | 2011-11-12 | 2012-06-13 | 哈尔滨工业大学 | Double-stage revolving and switching method and apparatus based on independent synchronic direction-regulation |
| CN103186054A (en) * | 2011-12-31 | 2013-07-03 | 中芯国际集成电路制造(上海)有限公司 | Carrier device and exposure device |
| CN103186054B (en) * | 2011-12-31 | 2014-12-24 | 中芯国际集成电路制造(上海)有限公司 | Carrier device and exposure device |
| CN103208867A (en) * | 2012-01-17 | 2013-07-17 | 上海微电子装备有限公司 | Magnet unit, magnet array, magnetic levitation planar motor and lithographic device using magnetic levitation planar motor |
| CN103208867B (en) * | 2012-01-17 | 2015-06-17 | 上海微电子装备有限公司 | Magnet unit, magnet array, magnetic levitation planar motor and lithographic device using magnetic levitation planar motor |
| CN104275567A (en) * | 2013-07-12 | 2015-01-14 | 亚企睦自动设备有限公司 | Fixing jig for parts, fixing device, and fixing carrier |
| CN105425550A (en) * | 2016-01-14 | 2016-03-23 | 哈尔滨工业大学 | Moving coil gas-magnetism combined air-suspension double-workpiece-stage vector circular-arc exchange method and device based on staggered magnetic steel arrangement |
| CN105487342A (en) * | 2016-01-14 | 2016-04-13 | 哈尔滨工业大学 | Wireless-communication-based dynamic-magnetic-steel magnetic levitation dual-stage vector arc switching method and device |
| CN105549331A (en) * | 2016-01-14 | 2016-05-04 | 哈尔滨工业大学 | Active balanced mass moving coil gas-magnetic combined gas-suspension dual workpiece stage vector arc based stage exchanging method and device |
| CN105549330A (en) * | 2016-01-14 | 2016-05-04 | 哈尔滨工业大学 | Active balanced mass moving coil magnetic-suspension dual workpiece stage vector arc based stage exchanging method and device |
| WO2019128449A1 (en) * | 2017-12-29 | 2019-07-04 | 广东极迅精密仪器有限公司 | Displacement device |
| CN113589651A (en) * | 2020-04-30 | 2021-11-02 | 上海微电子装备（集团）股份有限公司 | Air bearing device and photoetching equipment |
| CN113156775A (en) * | 2021-04-27 | 2021-07-23 | 华中科技大学 | Proximity type exposure light source and exposure method |
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