CN103186054B - Carrier device and exposure device - Google Patents
Carrier device and exposure device Download PDFInfo
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- CN103186054B CN103186054B CN201110459299.3A CN201110459299A CN103186054B CN 103186054 B CN103186054 B CN 103186054B CN 201110459299 A CN201110459299 A CN 201110459299A CN 103186054 B CN103186054 B CN 103186054B
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- objective table
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- sidewall
- wafer
- exposure device
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Abstract
The invention discloses a carrier device and an exposure device. The carrier device comprises a stage, wherein the stage comprises a first surface, a second surface opposite to the first surface, and a lateral wall located between the first surface and the second surface. The carrier device is characterized in that the stage further comprises an arc-shaped junction zone for connecting the lateral wall with the first surface and the second surface; and by means of the junction zone, the resistance of air to the stage and the disturbance generated by air during the movement of the stage are reduced.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly a kind of carrying apparatus and exposure device.
Background technology
Photoetching is as the very important operation together in semiconductor fabrication, and it is the technological process transferred on wafer by exposure by the figure on mask, is considered to the core procedure in large scale integrated circuit manufacture.Series of complex in semiconductor manufacturing and photoetching process consuming time has mainly been come by corresponding exposure machine.And the development of photoetching technique in other words exposure machine technology progress mainly round this three norms of live width, alignment precision and throughput rate launch.
In stepping projection exposure machine, wafer stage, for carrying wafer, is synchronized with the movement under the effect of drive unit.In current most stepping projection exposure machine, the bottom of wafer stage has corresponding air floating structure, by the pressure of air, wafer stage is floated, to reduce the interference of extraneous vibration to wafer stage, be conducive to the position of the wafer stage accurately controlling high-speed motion.
With reference to figure 1, Fig. 1 is the cross-sectional view of existing wafer stage, described wafer stage comprises first surface 101 second surface relative with first surface 101 102 and the sidewall 103 between first surface 101 and second surface 102, and first surface 101, second surface 102 and sidewall 103 form square wafer stage; The first surface 101 of described wafer stage also has sucker (not shown), for fixing wafer 105; The sidewall 103 of described wafer stage has the position-measurement device 104 measuring stage position, in order to measure the position of wafer stage, described position-measurement device 104 is interference of light meter, the transmitting and receiving end of interference of light meter is arranged in fixed pedestal (not shown), and the moving reflector of interference of light meter is arranged on sidewall 103.
More introductions about wafer stage please refer to the United States Patent (USP) that publication number is US2008/0192219A1.
Existing wafer stage is when moving, and due to the disturbance of air, the position of objective table can not accurately control, and affects the precision of alignment.
Summary of the invention
The problem that the present invention solves is to provide a kind of carrying apparatus and exposure device, reduces the disturbance of air, improves the degree of accuracy of stage position.
For solving the problem, the invention provides a kind of carrying apparatus, comprising:
Objective table, described objective table comprises the first surface second surface relative with first surface and the sidewall between first surface and second surface, it is characterized in that, described objective table also comprises the junctional area connecting described sidewall and first surface and second surface, described junctional area is curved, the disturbance that during reduction stage movement, air produces the resistance of objective table and air.
Optionally, described arc is the one of circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc.
Optionally, described arc is two or more combination of circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc.
Optionally, the sidewall of described objective table is provided with stage position measurement mechanism.
Optionally, described measurement mechanism is interference of light meter.
Optionally, described objective table bottom comprises the mattress device for making objective table float.
Optionally, described objective table first surface comprises sucker for fixing wafer or wafer clamper.
Optionally, the area of described first surface and second surface is greater than the area of wafer.
Optionally, the crowning of described arc is away from the center of objective table.
Present invention also offers a kind of exposure device, comprise: at least one objective table, described objective table comprises the first surface second surface relative with first surface, sidewall between first surface and second surface and connects the junctional area of described sidewall and first surface and second surface, described junctional area is curved, described first surface is for placing wafer, and exposure device exposes the wafer placed on the first surface.
Optionally, described exposure device is immersion exposure device.
Optionally, the number of described objective table is two.
Compared with prior art, technical solution of the present invention has the following advantages:
Sidewall is connected by the junctional area of arc with first surface and second surface, be equivalent to the angle of cut cambering by the sidewall of square stage of the prior art and upper and lower surface, when stage movement, the junctional area of arc can reduce the resistance of air to objective table, reduce the disturbance of air in stage movement process, make the light of interference of light meter can not be subject to the impact of air turbulence in the reflection of the moving reflector of sidewall and the aerial transmission of reflected light, improve the precision of the objective table of interference of light measurement amount, the gauge position of wafer on objective table is made not have deviation, when exposing the wafer on objective table, improve the accuracy of exposure and the precision of alignment.In addition, due to objective table operationally, air reduces its resistance, can reduce the generation of drive unit heat, reduce energy consumption.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of existing wafer stage;
Fig. 2 is the structural representation of embodiment of the present invention carrying apparatus;
Fig. 3 is that Fig. 2 is along line of cut A-B directional profile structural representation;
The partial enlargement structural representation that Fig. 4 is the junctional area shown in Fig. 3.
Embodiment
Existing exposure machine adopts interference of light meter to measure the position of wafer stage, to ensure the accuracy of position measurement.Interference of light meter utilizes principle of interference to measure the difference of light path thus the optical instrument of mensuration displacement, the light that the light source of interference of light meter sends, two-way is divided into by spectroscope, and reflect can be combined in spectroscope from stationary mirror and moving reflector respectively and produce interference fringe, when moving reflector moves, the optical path difference of two reflected light that stationary mirror and moving reflector reflect changes, the light intensity of the interference fringe that two reflected light can be incorporated on spectroscope changes, the light intensity change of interference fringe is converted to electric impulse signal by the photo-electric conversion element in the receptacle of interference of light meter and electronic circuit etc., through shaping, after amplifying, input up-down counter calculates overall pulse number, the displacement of moving reflector is calculated again by robot calculator.Interference of light meter is in the application being used for the position measuring wafer stage, and the moving reflector of interference of light meter is arranged on the sidewall of wafer stage, and other parts of interference of light meter are arranged on the changeless pedestal in position.
Inventor finds, the alignment precision of the wafer using existing exposure machine to expose is limited.
Inventor studies discovery further, the speed of the motion of wafer stage in exposure machine is generally 0.2 ~ 1 meter per second, relative to other moving components in exposure machine, the movement velocity of wafer stage is quite fast, and the wafer stage of existing exposure machine is square platform, the sidewall of wafer stage and the angle of cut of upper and lower surface are right angle, when wafer stage moves, air produces resistance to wafer stage sidewall, the air in exposure machine is very easily made to produce disturbance on the sidewall contact face of wafer stage, the turbulent flow of such as air, the light that the disturbance of this air can affect interference of light meter is in the reflection of the moving reflector of the sidewall of wafer stage and the aerial transmission of reflected light, the optical path difference of the two-way light causing the spectroscope of interference of light meter to separate produces deviation, the light intensity of the interference fringe on spectroscope is made to produce deviation, affect the accuracy of interference of light meter, the position of the wafer stage of interference of light measurement amount is made to produce deviation, on wafer stage, the gauge position of wafer also produces deviation, and during to exposing wafer, the precision of exposure is the gauge position positive correlation with wafer, the deviation of the gauge position of wafer causes the reduction exposing alignment precision on rear wafer.
For solving the problem, inventor proposes a kind of carrying apparatus, comprise: objective table, described objective table comprises the first surface second surface relative with first surface and the sidewall between first surface and second surface, it is characterized in that, described objective table also comprises the junctional area connecting described sidewall and first surface and second surface, and described junctional area is curved.According to aerodynamic principle, when stage movement, the resistance of air to objective table can be reduced in the junctional area of arc.
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.When describing the embodiment of the present invention in detail, for ease of illustrating, schematic diagram can be disobeyed general ratio and be made partial enlargement, and described schematic diagram is example, and it should not limit the scope of the invention at this.In addition, the change of the three-dimensional space of length, width and the degree of depth should be comprised in actual fabrication.
With reference to figure 2, Fig. 2 is the structural representation of embodiment of the present invention carrying apparatus, comprise: objective table 20, described objective table 20 comprises: the second surface 202 that first surface 201 is relative with first surface 201, the sidewall 203 between first surface 201 and second surface 202, connect the junctional area 204 of described sidewall 203 and first surface 201 and second surface 202, and described junctional area 204 is curved.First surface 201, second surface 202, sidewall 203, first surface 201 and the junctional area between second surface 202 and sidewall 203 204 form objective table 20.
Described objective table 20 can be the metal material such as steel, aluminium, and described objective table 20 also can be the nonmetallic materials of the rigidity of lightweight.
The first surface 201 of described objective table 20 also have sucker or the wafer clamper (not shown) of fixing wafer.Described sucker can adopt vacuum suction or electromagnetic adsorption.
In other embodiments of the invention, the first surface 201 of objective table 20 can be used for placing light shield.
The bottom of described objective table 20 also has the mattress device (not shown) for making objective table float.
Described objective table 20 also comprises the drive unit (not shown) making stage movement.
The area of first surface 201 and second surface 202 is greater than the area of wafer.
The sidewall 203 of described objective table 20 is provided with the measurement mechanism (not shown) for measuring stage position.Described measurement mechanism is interference of light meter, and the moving reflector of interference of light meter is arranged on the sidewall 203 of objective table 20, and other parts of interference of light meter are arranged on the fixing pedestal around objective table 20.
Four limits of first surface 201 and second surface 202 are identical with the shape of the arc of the junctional area 204 of sidewall 203.
With reference to figure 3, Fig. 3 be Fig. 2 along line of cut A-B directional profile structural representation, described objective table 20 comprises: the second surface 202 that first surface 201 is relative with first surface 201, the sidewall 203 between first surface 201 and second surface 202, connect the junctional area 204 of described sidewall 203 and first surface 201 and second surface 202.Described junctional area 204 is curved, the crowning of arc away from the center of objective table 20, the height of sidewall 203 slightly larger than or equal the height of moving reflector 205 of interference of light meter.
Sidewall 203 is connected by the junctional area 204 of arc with first surface 201 and second surface 202, be equivalent to the angle of cut cambering by the sidewall of square stage of the prior art and upper and lower surface, when objective table 20 moves, the junctional area 204 of arc can reduce the resistance of air to objective table 20, reduce the disturbance of air in objective table 20 motion process, make the light of interference of light meter can not be subject to the impact of air turbulence in the reflection of the moving reflector 205 of sidewall 203 and the aerial transmission of reflected light, improve the precision of the objective table 20 of interference of light measurement amount, the gauge position of wafer on objective table 20 is made not have deviation, when carrying out coherent detection or PROCESS FOR TREATMENT to the wafer on objective table 20, improve detection and PROCESS FOR TREATMENT precision, find after deliberation, sidewall 203 is connected by the junctional area 204 of arc with first surface 201 and second surface 202, compared to existing square stage, can reduce by the air resistance of 60%, improve the alignment precision of 60%.In addition, due to objective table 20 operationally, air reduces its resistance, can reduce the generation of drive unit heat, reduce energy consumption.
In the board adopting two objective table, the motion of an objective table can be reduced to the interference of another one objective table, improve the accuracy of stage position.
The arc of described junctional area 204 can be the one of circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc.
Described junctional area 204 arc also can be two or more combination of circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc.
Described junctional area 204 arc also can be the arc of other shapes.
In the embodiment of the present invention, junctional area 204 arc is the combination of one or more in circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc, refer to that the arc of junctional area 204 has the Partial Feature on curve corresponding to the function such as circle, ellipse, logarithmic function, exponential function, quadratic function, parabolic function, and the crowning of curve is all away from the center of objective table.
Junctional area 204 arc is the combination of multiple curve arc, and when being to reduce stage movement further, air is to the resistance of objective table.Please refer to Fig. 4, Fig. 4 is the partial enlargement structural representation of Fig. 3 junctional area 204.The arc of described junctional area 204 is divided into three parts, comprise: Part I I, Part II II, Part III III, the curve arc that Part I I, Part II II, Part III III are corresponding different respectively, such as Part I I can be elliptic arc, Part II II is logarithmic curve arc, and Part III III is parabolic curve arc, makes junctional area 204 have the cambered surface of a gradient gradual change, during to reduce stage movement further, air is to the resistance of objective table.The arc of described junctional area 204 can be divided into the multiple parts being greater than three in other embodiments of the invention.
The junctional area 204 forming arc can adopt the frosting technology of existing advanced person and numerically-controlled machine technique square shaped objective table to process.Wind-tunnel facilities and relevant Computer Simulation and the Aerodynamic parameter of design aids to the objective table of processing can be utilized to carry out preferably, make as: the parameters such as resistance, lift, torsion are minimum, to design preferred arcuate structure.
Present invention also offers a kind of exposure device had as above-mentioned carrying apparatus, comprise: at least one objective table, described objective table comprises the first surface second surface relative with first surface, sidewall between first surface and second surface and connects the junctional area of described sidewall and first surface and second surface, described junctional area is curved, described first surface is for placing wafer, and exposure device exposes the wafer placed on the first surface.
Described exposure device is immersion exposure device.
The objective table of described exposure device is two, has the objective table of arc junctional area, can reduce the motion of an objective table to the interference of another one objective table, improves the accuracy of stage position.
The sidewall of objective table is connected by the junctional area of arc with first surface and second surface, be equivalent to the angle of cut cambering by the sidewall of square stage of the prior art and upper and lower surface, when stage movement, the junctional area of arc can reduce the resistance of air to objective table, reduce the disturbance of air in stage movement process, make the light of interference of light meter can not be subject to the impact of air turbulence in the reflection of the moving reflector of sidewall and the aerial transmission of reflected light, improve the precision of the objective table of interference of light measurement amount, the gauge position of wafer on objective table is made not have deviation, exposure device is when to exposing wafer on objective table, improve the accuracy of exposure and the precision of alignment.
To sum up, the carrying apparatus that the embodiment of the present invention provides and exposure device, sidewall is connected by the junctional area of arc with first surface and second surface, be equivalent to the angle of cut cambering by the sidewall of square stage of the prior art and upper and lower surface, when stage movement, the junctional area of arc can reduce the resistance of air to objective table, reduce the disturbance of air in stage movement process, make the light of interference of light meter can not be subject to the impact of air turbulence in the reflection of the moving reflector of sidewall and the aerial transmission of reflected light, improve the precision of the objective table of interference of light measurement amount, the gauge position of wafer on objective table is made not have deviation, when exposing the wafer on objective table, improve the accuracy of exposure and the precision of alignment.In addition, due to objective table operationally, air reduces its resistance, can reduce the generation of drive unit heat, reduce energy consumption.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solution of the present invention; therefore; every content not departing from technical solution of the present invention; the any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all belong to the protection domain of technical solution of the present invention.
Claims (10)
1. a carrying apparatus, comprising:
Objective table, described objective table comprises the first surface second surface relative with first surface and the sidewall between first surface and second surface, it is characterized in that, described objective table also comprises the junctional area connecting described sidewall and first surface and second surface, described junctional area is curved, the disturbance that during reduction stage movement, air produces the resistance of objective table and air, the sidewall of described objective table is provided with stage position measurement mechanism, and described measurement mechanism is interference of light meter.
2. carrying apparatus as claimed in claim 1, it is characterized in that, described arc is the one of circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc.
3. carrying apparatus as claimed in claim 1, it is characterized in that, described arc is two or more combination of circular arc, elliptic arc, logarithmic curve arc, index curve arc, conic arc, parabolic curve arc.
4. carrying apparatus as claimed in claim 1, it is characterized in that, described objective table bottom comprises the mattress device for making objective table float.
5. carrying apparatus as claimed in claim 1, is characterized in that, described objective table first surface comprises sucker for fixing wafer or wafer clamper.
6. carrying apparatus as claimed in claim 1, it is characterized in that, the area of described first surface and second surface is greater than the area of wafer.
7. carrying apparatus as claimed in claim 1, is characterized in that, the crowning of described arc is away from the center of objective table.
8. an exposure device, it is characterized in that, comprise: at least one objective table, described objective table comprises the first surface second surface relative with first surface, sidewall between first surface and second surface and connects the junctional area of described sidewall and first surface and second surface, described junctional area is curved, described first surface is for placing wafer, exposure device exposes the wafer placed on the first surface, the sidewall of described objective table is provided with stage position measurement mechanism, and described measurement mechanism is interference of light meter.
9. exposure device as claimed in claim 8, it is characterized in that, described exposure device is immersion exposure device.
10. exposure device as claimed in claim 8, it is characterized in that, the number of described objective table is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459299.3A CN103186054B (en) | 2011-12-31 | 2011-12-31 | Carrier device and exposure device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459299.3A CN103186054B (en) | 2011-12-31 | 2011-12-31 | Carrier device and exposure device |
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| Publication Number | Publication Date |
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| CN103186054A CN103186054A (en) | 2013-07-03 |
| CN103186054B true CN103186054B (en) | 2014-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110459299.3A Active CN103186054B (en) | 2011-12-31 | 2011-12-31 | Carrier device and exposure device |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432440A (en) * | 2001-11-27 | 2003-07-30 | 东京毅力科创株式会社 | Solution processing unit and method |
| CN101515119A (en) * | 2009-04-03 | 2009-08-26 | 清华大学 | Silicon chip bench double-bench switching system employing air floatation plane motor |
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2011
- 2011-12-31 CN CN201110459299.3A patent/CN103186054B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432440A (en) * | 2001-11-27 | 2003-07-30 | 东京毅力科创株式会社 | Solution processing unit and method |
| CN101515119A (en) * | 2009-04-03 | 2009-08-26 | 清华大学 | Silicon chip bench double-bench switching system employing air floatation plane motor |
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| Publication number | Publication date |
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| CN103186054A (en) | 2013-07-03 |
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