CN101467501B - 印制电路板及该印制电路板的制造方法 - Google Patents
印制电路板及该印制电路板的制造方法 Download PDFInfo
- Publication number
- CN101467501B CN101467501B CN2007800216555A CN200780021655A CN101467501B CN 101467501 B CN101467501 B CN 101467501B CN 2007800216555 A CN2007800216555 A CN 2007800216555A CN 200780021655 A CN200780021655 A CN 200780021655A CN 101467501 B CN101467501 B CN 101467501B
- Authority
- CN
- China
- Prior art keywords
- resistance
- printed circuit
- circuit board
- conductor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (32)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88837707P | 2007-02-06 | 2007-02-06 | |
US60/888,377 | 2007-02-06 | ||
PCT/JP2007/065167 WO2008096464A1 (ja) | 2007-02-06 | 2007-08-02 | プリント配線板及びそのプリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101467501A CN101467501A (zh) | 2009-06-24 |
CN101467501B true CN101467501B (zh) | 2011-07-20 |
Family
ID=39675190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800216555A Expired - Fee Related CN101467501B (zh) | 2007-02-06 | 2007-08-02 | 印制电路板及该印制电路板的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7902463B2 (zh) |
JP (1) | JP4702904B2 (zh) |
KR (1) | KR101002500B1 (zh) |
CN (1) | CN101467501B (zh) |
TW (1) | TWI389607B (zh) |
WO (1) | WO2008096464A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8125086B2 (en) * | 2008-05-28 | 2012-02-28 | Hynix Semiconductor Inc. | Substrate for semiconductor package |
CN102107559A (zh) * | 2009-12-25 | 2011-06-29 | 山东华菱电子有限公司 | 一种热敏打印头的制造方法 |
JP2012028511A (ja) * | 2010-07-22 | 2012-02-09 | On Semiconductor Trading Ltd | 回路基板およびその製造方法、回路装置およびその製造方法、絶縁層付き導電箔 |
CN102958275B (zh) * | 2011-08-31 | 2017-02-15 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
CN103898498B (zh) * | 2012-12-28 | 2016-06-01 | 富葵精密组件(深圳)有限公司 | 黑化药水及透明印刷电路板的制作方法 |
JP6781631B2 (ja) * | 2014-08-29 | 2020-11-04 | タツタ電線株式会社 | フレキシブルプリント配線板用補強部材、及びそれを備えたフレキシブルプリント配線板 |
CN109673099B (zh) * | 2017-10-13 | 2020-09-01 | 欣兴电子股份有限公司 | 多层线路结构及其制作方法 |
EP3651216B1 (en) * | 2018-08-20 | 2024-03-13 | LG Chem, Ltd. | Embedded electrode substrate for transparent light-emitting element display, and method for manufacturing same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020179329A1 (en) * | 2001-06-05 | 2002-12-05 | Dai Nippon Printing Co., Ltd. | Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element |
CN1404353A (zh) * | 2001-08-28 | 2003-03-19 | 耀华电子股份有限公司 | 利用实心铜柱互连导通的印刷电路板的制作方法 |
JP2003152301A (ja) * | 2001-11-16 | 2003-05-23 | Mitsubishi Electric Corp | プリント配線板およびその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0787261B2 (ja) * | 1988-08-25 | 1995-09-20 | 株式会社村田製作所 | 銅張積層板 |
JPH045887A (ja) * | 1990-04-23 | 1992-01-09 | Mitsubishi Gas Chem Co Inc | 印刷部品搭載プリント配線板の製造法 |
DE4113231A1 (de) | 1990-04-23 | 1991-10-24 | Mitsubishi Gas Chemical Co | Verfahren zur herstellung einer printplatine |
US6353540B1 (en) * | 1995-01-10 | 2002-03-05 | Hitachi, Ltd. | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
JPH114056A (ja) | 1997-06-11 | 1999-01-06 | Sony Corp | 印刷抵抗プリント配線板及びその製作方法 |
JP3051700B2 (ja) * | 1997-07-28 | 2000-06-12 | 京セラ株式会社 | 素子内蔵多層配線基板の製造方法 |
JPH11103170A (ja) * | 1997-09-29 | 1999-04-13 | Kyocera Corp | 抵抗体内蔵多層セラミック回路基板 |
US6444083B1 (en) * | 1999-06-30 | 2002-09-03 | Lam Research Corporation | Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof |
US6317023B1 (en) * | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
JP3946578B2 (ja) * | 2001-06-05 | 2007-07-18 | 大日本印刷株式会社 | 受動素子を備えた配線板の製造方法、受動素子を備えた配線板 |
JP2003124010A (ja) * | 2001-10-18 | 2003-04-25 | Rohm Co Ltd | チップ型電子部品の製造方法、およびチップ型電子部品 |
TWI335347B (en) * | 2003-05-27 | 2011-01-01 | Ajinomoto Kk | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
TW592004B (en) | 2003-08-13 | 2004-06-11 | Tong Hsing Electronic Ind Ltd | Printed circuit board combined with thick-film resistor and thin-film circuit and its manufacturing method |
US7100270B2 (en) * | 2003-09-25 | 2006-09-05 | Tong Hsing Electric Industries Ltd. | Method of fabricating a thin film integrated circuit with thick film resistors |
TWI224389B (en) | 2003-09-29 | 2004-11-21 | Phoenix Prec Technology Corp | Semiconductor package substrate with embedded resistors and method for fabricating the same |
KR100619367B1 (ko) * | 2004-08-26 | 2006-09-08 | 삼성전기주식회사 | 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법 |
US7323762B2 (en) * | 2004-11-01 | 2008-01-29 | Phoenix Precision Technology Corporation | Semiconductor package substrate with embedded resistors and method for fabricating the same |
JPWO2007097249A1 (ja) * | 2006-02-20 | 2009-07-09 | ダイセル化学工業株式会社 | 多孔性フィルム及び多孔性フィルムを用いた積層体 |
KR100881695B1 (ko) * | 2007-08-17 | 2009-02-06 | 삼성전기주식회사 | 캐패시터 내장형 인쇄회로기판 및 그 제조 방법 |
-
2007
- 2007-08-02 WO PCT/JP2007/065167 patent/WO2008096464A1/ja active Application Filing
- 2007-08-02 CN CN2007800216555A patent/CN101467501B/zh not_active Expired - Fee Related
- 2007-08-02 KR KR1020087013249A patent/KR101002500B1/ko not_active IP Right Cessation
- 2007-08-02 JP JP2008556989A patent/JP4702904B2/ja not_active Expired - Fee Related
- 2007-08-10 TW TW096129632A patent/TWI389607B/zh not_active IP Right Cessation
- 2007-08-24 US US11/844,788 patent/US7902463B2/en active Active
-
2009
- 2009-10-06 US US12/574,287 patent/US8621748B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020179329A1 (en) * | 2001-06-05 | 2002-12-05 | Dai Nippon Printing Co., Ltd. | Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element |
CN1404353A (zh) * | 2001-08-28 | 2003-03-19 | 耀华电子股份有限公司 | 利用实心铜柱互连导通的印刷电路板的制作方法 |
JP2003152301A (ja) * | 2001-11-16 | 2003-05-23 | Mitsubishi Electric Corp | プリント配線板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100021627A1 (en) | 2010-01-28 |
CN101467501A (zh) | 2009-06-24 |
KR101002500B1 (ko) | 2010-12-17 |
TWI389607B (zh) | 2013-03-11 |
WO2008096464A1 (ja) | 2008-08-14 |
JPWO2008096464A1 (ja) | 2010-05-20 |
JP4702904B2 (ja) | 2011-06-15 |
US20080185172A1 (en) | 2008-08-07 |
US8621748B2 (en) | 2014-01-07 |
US7902463B2 (en) | 2011-03-08 |
TW200835404A (en) | 2008-08-16 |
KR20080087083A (ko) | 2008-09-30 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: IBIDEN ELECTRONICS (BEIJING) CO., LTD. Free format text: FORMER OWNER: IBIDEN CO., LTD. Effective date: 20120213 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20120213 Address after: 100176 No. 15 East Rongchang street, Beijing economic and Technological Development Zone, China Patentee after: IBIDEN Electronics (Beijing) Co.,Ltd. Address before: Gifu County, Japan Patentee before: IBIDEN Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20210802 |
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CF01 | Termination of patent right due to non-payment of annual fee |