Summary of the invention
The purpose of this invention is to provide a kind of the heat radiation well to enable to overcome the light emitting source encapsulation of optical attenuation problem.
According to a feature of the present invention, a kind of light emitting source encapsulation is provided, and this light emitting source encapsulation comprises: the clear hollow carrier, and this transparent carrier has accommodation space; Place the interior reflector of accommodation space of this transparent carrier, this reflector be for the diameter with sealed end and open end and this open end be the tubaeform cup-shaped thing bigger than the diameter of sealing end, the inner wall surface of this reflector is laid with light reflector or phosphor powder layer so that leaded light efficient is promoted, and the end wall of the sealed end of this reflector is formed with a plurality of through holes; Place near the light emission unit the open end of this reflector, this light emission unit comprises and has wafer installation surface and the two or more installation base plate that is formed at the conductive junction point on this installation surface, be installed on the installation surface of this installation base plate and have the LED wafer of the conductive junction point that a plurality of and the corresponding conductive junction point of this installation base plate be electrically connected, and a plurality ofly respectively have one and be connected conductive connecting pin with outside that first end of the corresponding conductive junction point electrical connection of this installation base plate and formation wall that the sealed end that passes this reflector gets end wall and this transparent carrier protrude out second end of this transparent carrier outside; And be arranged at the transparent cover body that can form confined space on this transparent carrier jointly with this transparent carrier, the setting of the through hole by this reflector, the enough physical principles because of cold and hot convection current of heat energy that produced when this LED wafer running produce the mobile purpose that can reach average heat transfer of gas circulation in this confined space.
According to another characteristic of the invention, a kind of light emitting source encapsulation is provided, and this light emitting source encapsulation comprises: the clear hollow carrier, and this transparent carrier has accommodation space; Place the interior reflector of accommodation space of this transparent carrier, this reflector is that the diameter with sealed end and open end and this open end is the tubaeform cup-shaped thing bigger than the diameter of sealing end, the inner wall surface of this reflector is laid with light reflector or phosphor powder layer so that leaded light efficient is promoted, and the end wall of the sealed end of this reflector is formed with a plurality of through holes; Place near the light emission unit the open end of this reflector, this light emission unit comprises LED wafer with a plurality of conductive junction points and a plurality ofly respectively has the outside that formation wall that first end that is electrically connected with the corresponding conductive junction point of this LED wafer and the sealed end that passes this reflector get end wall and this transparent carrier protrudes out second end of this transparent carrier outside and be connected conductive connecting pin; And be arranged at the transparent cover body that can form confined space on this transparent carrier jointly with this transparent carrier, the setting of the through hole by this reflector, the enough physical principles because of cold and hot convection current of heat energy that produced when this LED wafer running produce gas circulation and flow in this confined space, can reach the purpose of heat radiation.
According to another feature of the present invention, a kind of light emitting source encapsulation is provided, and this light emitting source encapsulation comprises: the first transparent installation base plate, this first transparent installation base plate have wafer installation surface and a plurality of conductive junction point that is formed on this wafer installation surface; The second transparent installation base plate, this second transparent installation base plate and this first transparent installation base plate relatively are provided with, and link together via the clear, viscous material so that be formed with accommodation space between them, the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this outside, space fully; Place the light emission unit in this accommodation space, this light emission unit comprise LED wafer with conductive junction point that a plurality of and the corresponding conductive junction point of this first transparent installation base plate be electrically connected with a plurality of respectively have with first end of the corresponding conductive junction point electrical connection of this LED wafer be connected conductive connecting pin with the outside that protrudes out this accommodation space outside; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has first end that protrudes out this accommodation space inside and the second end that is connected to this cooling base, like this, the heat energy that is produced when LED wafer operates is enough derived from this accommodation space inside via this group heat pipe and is delivered to this cooling base, can dissipate via these radiating fins.
According to another feature again of the present invention, a kind of light emitting source encapsulation is provided, and this light emitting source encapsulation comprises: first transparency carrier, this first transparency carrier have wafer installation surface and a plurality of conductive junction point that is formed on this wafer installation surface; Second transparency carrier, this second transparency carrier and this first transparency carrier relatively are provided with, and link together via the clear, viscous material, so that be formed with accommodation space between them, the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this outside, space fully; Place the light emission unit in this accommodation space, this light emission unit comprise have the wafer installation surface and a plurality ofly be arranged on transparent installation base plate on this wafer installation surface, the LED wafer of conductive junction point with corresponding conductive junction point electrical connection of a plurality of and this transparent installation base plate respectively has first end with the corresponding conductive junction point electrical connection of this transparent installation base plate and is connected conductive connecting pin with the outside that protrudes out this accommodation space outside with a plurality of; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has first end that protrudes out this accommodation space inside and the second end that is connected to this cooling base, like this, the heat energy that is produced when LED wafer operates is enough derives from this accommodation space is inner via this group heat pipe, and deliver to this cooling base, can dissipate via these radiating fins.
According to another feature more of the present invention, a kind of light emitting source encapsulation is provided, and this light emitting source encapsulation comprises: the first transparent installation base plate, and this first transparent installation base plate has the wafer installation surface; The second transparent installation base plate, this second transparent installation base plate and this first transparent installation base plate relatively are provided with, and link together via the clear, viscous material, so that be formed with accommodation space between them, the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this outside, space fully; Place the light emission unit in this accommodation space, this light emission unit comprises that at least one respectively has the LED wafer of a plurality of conductive junction points; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has and protrudes out this accommodation space inner and first end that be electrically connected with the corresponding conductive junction point of each LED wafer and the second end that is connected to this cooling base, like this, the heat energy that is produced when LED wafer operates is enough derives from this accommodation space is inner via this group heat pipe, and deliver to this cooling base, can dissipate via these radiating fins, in these heat pipes each is towards the inclined-plane with light reflectance coating of these LED wafer towards the surface of the wafer installation surface of this first transparent installation base plate, and this can derive the sidelight that is sent by these LED wafer.
According to a feature more of the present invention, a kind of light emitting source encapsulation is provided, and this light emitting source encapsulation comprises: the first transparent installation base plate, and this first transparent installation base plate has the wafer installation surface; The second transparent installation base plate, this second transparent installation base plate and this first transparent installation base plate relatively are provided with, and link together via the clear, viscous material, so that be formed with accommodation space between them, the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this outside, space fully; Place the light emission unit in this accommodation space, this light emission unit comprises that at least one respectively has the LED wafer of a plurality of conductive junction points, and circuit board unit, the first end of this circuit board unit is positioned at this accommodation space, and its second end protrudes out in this accommodation space outside, this circuit board unit has to exchange changes DC circuit, the input that DC circuit is changeed in this interchange is suitable for being electrically connected to AC power, and its output is electrically connected to the conductive junction point of these LED wafer, this circuit board unit towards the surface of the wafer installation surface of this first transparent installation base plate for towards the inclined-plane with light reflectance coating of these LED wafer, it can be derived the sidelight that is sent by these LED wafer; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has first end that protrudes out this accommodation space inside and the second end that is connected to this cooling base, like this, the heat energy that is produced when LED wafer operates is enough derives from this accommodation space is inner via this group heat pipe, and deliver to this cooling base, it can dissipate via these radiating fins.
Description of drawings
About the present invention is to reach above-mentioned purpose, the technological means that is adopted and effect thereof, illustrates as follows especially exemplified by preferred embodiment and cooperation:
Fig. 1 is the signal phantom that shows the light emitting source encapsulation of first preferred embodiment of the present invention;
Fig. 2 is the signal phantom that shows the light emitting source encapsulation of second preferred embodiment of the present invention;
Fig. 3 is the signal phantom that shows the light emitting source encapsulation of the 3rd preferred embodiment of the present invention;
Fig. 4 is the signal phantom that shows the light emitting source encapsulation of the 4th preferred embodiment of the present invention;
Fig. 5 is the diagrammatic side view of light emission unit that shows the light emitting source encapsulation of the 5th preferred embodiment of the present invention;
Fig. 6 is the chart that shows the relation of the brightness of different chips and power;
Fig. 7 is the chart that shows the relation of the brightness of different chips and power;
Fig. 8 is the chart that shows the relation of the brightness of different chips and power;
Fig. 9 is the diagrammatic side view of light emission unit that shows the light emitting source encapsulation of the 6th preferred embodiment of the present invention;
Figure 10 is the diagrammatic side view of light emission unit that shows the light emitting source encapsulation of the 7th preferred embodiment of the present invention;
Figure 11 is the top schematic view of light emission unit that shows the light emitting source encapsulation of the 8th preferred embodiment of the present invention;
Figure 12 is the top schematic view of light emission unit that shows the light emitting source encapsulation of the 9th preferred embodiment of the present invention;
Figure 13 is the top schematic view of light emission unit that shows the light emitting source encapsulation of the tenth preferred embodiment of the present invention;
Figure 14 is the signal phantom that shows the light emitting source encapsulation of the 11 preferred embodiment of the present invention;
Figure 15 is the schematic isometric of another implementation of carrier that shows the light emitting source encapsulation of first preferred embodiment of the present invention;
Figure 16 is the schematic isometric of another implementation of carrier that shows the light emitting source encapsulation of second preferred embodiment of the present invention;
Figure 17 is the diagrammatic side view that shows when light emitting source encapsulation of the present invention is used in backlight arrangement;
Figure 18 is the schematic isometric that shows the light emitting source encapsulation of first preferred embodiment of the present invention;
Figure 19 is the schematic isometric that shows the light emitting source encapsulation of second preferred embodiment of the present invention;
Figure 20 is the signal phantom that shows the light emitting source encapsulation of the 13 preferred embodiment of the present invention;
Figure 21 is another signal phantom that shows the light emitting source encapsulation of the 13 preferred embodiment of the present invention;
Figure 22 is the signal phantom that shows the light emitting source encapsulation of the 14 preferred embodiment of the present invention;
Figure 23 is another signal phantom that shows the light emitting source encapsulation of the 14 preferred embodiment of the present invention;
Figure 24 is the signal phantom that shows the light emitting source encapsulation of the 15 preferred embodiment of the present invention;
Figure 25 is another signal phantom that shows the light emitting source encapsulation of the 15 preferred embodiment of the present invention;
Figure 26 is the signal phantom that shows the light emitting source encapsulation of the 16 preferred embodiment of the present invention;
Figure 27 is another signal phantom that shows the light emitting source encapsulation of the 16 preferred embodiment of the present invention;
Figure 28 is the signal phantom that shows the light emitting source encapsulation of the 17 preferred embodiment of the present invention;
Figure 29 is another signal phantom that shows the light emitting source encapsulation of the 17 preferred embodiment of the present invention;
Figure 30 is the signal phantom that shows the light emitting source encapsulation of the 18 preferred embodiment of the present invention;
Figure 31 is another signal phantom that shows the light emitting source encapsulation of the 18 preferred embodiment of the present invention;
Figure 32 is the signal phantom that shows the light emitting source encapsulation of the 12 preferred embodiment of the present invention; And
Figure 33 is the block schematic diagram that shows the interchange commentaries on classics DC circuit of light emitting source encapsulation of the present invention.
Embodiment
In the detailed description of the preferred embodiments of the present invention of back, identical or similar elements is to be indicated by identical label, and their detailed description will be omitted.In addition, for clear disclosure feature of the present invention, the element in the diagram is not to describe by actual ratio.
Fig. 1 is the schematic sectional view that shows the light emitting source encapsulation U1 of first preferred embodiment of the present invention, and Figure 18 is the schematic isometric that is presented at the light emitting source encapsulation U1 among Fig. 1.
Please refer to shown in Fig. 1 and 18, the light emitting source of first preferred embodiment of the present invention encapsulation U1 comprises clear hollow carrier 1, place reflector 2 in this transparent carrier 1, light emission unit 3, and transparent cover body.
This transparent carrier 1 is example (seeing Figure 18) in the present embodiment with the hemisphere, yet, should be noted that this transparent carrier 1 is not restricted to hemisphere, it can have any suitable shape, for example, halfpipe or the like (seeing Figure 15).In addition, as long as can allow light transmit, this transparent carrier 1 can be made by any suitable material.
This reflector 2 is to have blind end and open end, and the diameter of this open end tubaeform cup-shaped thing bigger than the diameter of this blind end.The inner wall surface of this reflector 2 is laid with light reflector or phosphor powder layer (not shown), it can promote leaded light efficient, and be formed with a plurality of through holes 20 at the end wall of blind end, so that hot-air can get the opposite side of end wall via the side flow that these through holes 20 get end wall from the blind end of reflector 2 to the blind end of reflector 2.
This light emission unit 3 comprises transparent installation base plate 30, LED wafer 31 and is connected conductive connecting pin 32 with pair of outer.
This transparent installation base plate 30 can be made by any suitable material, and has the wafer installation surface 300 of parallel with the end surfaces of the sealed end of this reflector 2 (that is, becoming 180 °).On this wafer installation surface 300, be provided with two conductive junction points 301.This is electrically connected to the conductive junction point 301 of a correspondence of this installation base plate 30 to each the end in the conductive connecting pin 32, and its other end passes the sealed end of this reflector 2 and this shell 1 via the open end of this reflector 2 and can protrude out that this shell 1 is outside to be electrically connected with external circuit.
This LED wafer 31 is installed on the wafer installation surface 300 of this installation base plate 30, and has two conductive junction points 310 that are electrically connected with the corresponding conductive junction point 301 of this installation base plate 30 respectively.In the present embodiment, the conductive junction point 310 of this LED wafer 31 is electrically connected to each other via lead 33 with the conductive junction point 301 of this installation base plate 30.
It should be noted that these LED wafer 31 settings like this can make the light that is come out by six surface emitting of this LED wafer 31 be able to all be derived utilization, and then overall brightness is promoted.
This transparent cover body 4 is the open ends that are connected to this carrier 1, and it can form confined space jointly with this carrier 1.In the present embodiment, this lid 4 is spherical encapsulation with this carrier 1 common formation outward appearance.Certainly, as shown in Figure 15, this lid 4 is the encapsulation of tubulose with this carrier 1 common formation outward appearance.Should be noted that, when this lid 4 is the encapsulation of tubulose with this carrier 1 shared formation outward appearance, it is applicable to the backlight arrangement of this case inventor in No. 95117532 patent application, as shown in Figure 17, light emitting source of the present invention encapsulates between the prism of the brightness enhancement film that places backlight arrangement.
As mentioned above, because the setting of the through hole 20 of reflector 2, can cause hot and cold air to flow phenomenon in encapsulation inside, therefore the heat energy that produces owing to the running of LED wafer 31 enough effectively leaves, and then solve because of the overheated optical attenuation problem that rises, so the brightness of light emitting source of the present invention encapsulation U1 is promoted.
It should be noted, except the inner wall surface of this reflector 2, on the surfaces externally and internally of carrier, the wafer installation surface of installation base plate and with the surface of this wafer installation surface on and all can lay phosphor powder layer on the surfaces externally and internally at this lid.
Please refer to Fig. 2 and 19, the light emitting source encapsulation U2 of second preferred embodiment of the present invention is shown.Different with first preferred embodiment, the wafer installation surface 300 of the installation base plate 30 of the light emission unit 3 of present embodiment vertical with the end surfaces of the sealed end of this reflector 2 (that is, becoming 90 °).
Identical with first preferred embodiment, transparent cover body 4 and this carrier 1 of present embodiment can form the encapsulation that outward appearance is a tubulose jointly, as shown in Figure 16.
See also shown in Figure 3ly, the light emitting source of the 3rd preferred embodiment of the present invention encapsulation U3 is shown.Different with first and second preferred embodiments, the LED wafer 31 of this light emission unit 3 is installed on the wafer installation surface 300 of this installation base plate 30 to cover crystal type (Flip Chip), and the surface of the industrial sapphire layer (sapphire) of this LED wafer 31 is formed with V shape groove 34, and it can promote the light reflection efficiency up to 2 times.
It should be noted that in the present embodiment, the lip-deep V shape groove 34 that is formed on the industrial sapphire layer of LED wafer 31 is asymmetrical V shape groove.
See also shown in Figure 4ly, the light emitting source of the 4th preferred embodiment of the present invention encapsulation U4 is shown.Different with the 3rd preferred embodiment, the surface of the industrial sapphire layer of the LED wafer 31 of this light emission unit 3 also is formed with the V shape groove 35 of symmetry except asymmetrical V shape groove 34, and the wafer installation surface 300 of installation base plate 30 is vertical with the end surfaces of the sealed end of this reflector 2.
See also shown in Figure 5ly, the light emission unit 3 of the light emitting source of the 5th preferred embodiment of the present invention encapsulation is shown.In the present embodiment, except this LED wafer 31, this light emission unit 3 also comprises laser diode wafer 4.This laser diode wafer 4 also is mounted on the wafer installation surface 300 of this installation base plate 30, and is to be connected with these LED wafer 31 serial or parallel connections.
In addition, in the present embodiment, be laid in fluorescence coating on the inner surface of this reflector and be doped with the fluorescent material that is fit to this LED wafer 31 and the different wave length of this laser diode wafer 4 respectively, so that laser diode wafer 4 can be when LED wafer 31 once excites wherein a kind of suitable fluorescent material the another kind of suitable fluorescent material of secondary excitation, this can reach two sections energy rank and excite and promote the brightness (see figure 6).Certainly, in aforesaid first to fourth preferred embodiment, this LED wafer can be replaced by laser diode wafer, and this can excite more the high energy rank to send more high brightness effect (seeing Fig. 7 and 8).
See also shown in Figure 9ly, the light emission unit 3 of the light emitting source of the 6th preferred embodiment of the present invention encapsulation is shown.Different with the 5th preferred embodiment, on another surface relative that this laser diode wafer 4 is installed on this installation base plate 30 with wafer installation surface 300.
It should be noted that though this LED wafer 31 is shown on the different surfaces that is arranged on this installation base plate 30 symmetrically with this laser diode wafer 4 in Fig. 9, yet they can be arranged on the different surfaces of this installation base plate 30 asymmetricly.
See also shown in Figure 10ly, the light emitting source of the 7th preferred embodiment of the present invention encapsulation U7 is shown.Different with first to six preferred embodiment, installation base plate is omitted in the present embodiment.These conductive connecting pins 32 are employed gold threads in general routing joint technology (wire bonding process), and are electrically connected to the conductive junction point 310 of the correspondence of this LED wafer 31.Coated by transparent adhesive tape 36 in the junction of these conductive connecting pins 32 with these conductive junction points 310, this can strengthen the connection of these conductive connecting pins 32 and corresponding conductive junction point 310.
See also shown in Figure 11ly, the light emission unit 3 of the light emitting source of the 8th preferred embodiment of the present invention encapsulation is shown.Different with the 5th preferred embodiment, the conductive junction point 310,40 of wafer 31,4 in the present embodiment is arranged on the side of wafer 31,4.
It should be noted, though in the 5th and the 8th preferred embodiment, be example with LED wafer 31 and laser diode wafer 4, yet the present invention is not limited to this, and it can all adopt LED wafer 31 or all adopt laser diode wafer 4.
See also shown in Figure 12ly, the light emission unit 3 of the light emitting source of the 9th preferred embodiment of the present invention encapsulation is shown.Different with the 8th preferred embodiment, present embodiment comprise four wafers 31,4 and these wafers 31,4 with " ten " word shape arranges and is installed on the wafer installation surface 300 of this installation base plate 30.
See also shown in Figure 13ly, the light emission unit 3 of the light emitting source of the tenth preferred embodiment of the present invention encapsulation is shown.Different with the 8th preferred embodiment, present embodiment comprise eight wafers 31,4 and these wafers 31,4 with " rice " word shape arranges and is installed on the wafer installation surface 300 of this installation base plate 30.
See also shown in Figure 14ly, the light emitting source of the 11 preferred embodiment of the present invention encapsulation U11 is shown.Different with first preferred embodiment, the light emitting source encapsulation U11 of present embodiment also comprises the heat abstractor of the outer wall surface that is attached to this carrier 1.This heat abstractor comprises pedestal 80 and a plurality of fin 81 that is formed on this pedestal 80 on the outer wall surface that is installed on this carrier 1.
See also shown in Figure 32ly, the light emitting source of the 12 preferred embodiment of the present invention encapsulation U12 is shown.Different with the 11 preferred embodiment, the heat abstractor of the light emitting source encapsulation U12 of present embodiment comprises one group of heat pipe 82, pedestal 80 and a plurality of fin 81 that is formed on this pedestal 80.
Each heat pipe in this group heat pipe 82 has near the first end the LED wafer 31 that protrudes out this light emission unit 3 and is connected to the second end of this pedestal 80.Therefore, the heat energy that is produced when LED wafer 31 runnings is enough derives from this light emitting source encapsulation inside via this group heat pipe 82, and delivers to this pedestal 80, and it can dissipate via these radiating fins 81.
It should be noted, in aforesaid preferred embodiment, in the confined space of this light emitting source encapsulation U1 to U12, can be poured the non-conductive transparent heat-conducting liquid that is doped with fluorescent material, so that at this (a plurality of) wafer 31, the heat energy that is produced during 4 runnings is enough to be conducted heat, arrives external metallization through the inner heat conduction of confined space by the circulation of non-conductive transparent heat-conducting liquid in this confined space, or through the confined space surface radiating.
It should be noted,, prevent that precipitation reagent must be added into this non-conductive transparent heat-conducting liquid in order to prevent the fluorescent material precipitation.
Perhaps, in aforesaid preferred embodiment, this light emission unit also comprises the phosphor powder layer (not shown) that can cover this (a plurality of) wafer on the installation surface that is formed at this installation base plate, and non-conductive pure water is poured in this confined space, conduct heat by the circulation of non-conductive pure water in this confined space so that the heat energy that is produced when this (a plurality of) wafer running is enough, derive heat through heat pipe again.
In addition, in aforesaid preferred embodiment, conductive junction point and the circuit trace of this transparent installation base plate on the wafer installation surface can be formed by the transparent conductive material as tin indium oxide, indium zinc oxide or the like.
See also shown in Figure 20 and 21, the light emitting source of the 13 preferred embodiment of the present invention encapsulation U13 is shown.In the present embodiment, this light emitting source encapsulation U13 comprises first transparency carrier 90.This first transparency carrier 90 has wafer installation surface 900 and a plurality of conductive junction point 901 that is formed on this wafer installation surface 900.
Second transparency carrier 91 relatively is provided with this first transparency carrier 90, and links together via clear, viscous material 910, so that be formed with accommodation space between them.The light that this accommodation space can send wafer six faces that place in it exports to this outside, space fully.
Light emission unit 3 places in this accommodation space.This light emission unit 3 comprises the LED wafer 31 of the conductive junction point 310 that at least one corresponding conductive junction point with a plurality of and this first transparency carrier 90 901 is electrically connected, and pair of outer connects conductive connecting pin 32.This is electrically connected to the conductive junction point 901 of a correspondence of this first transparency carrier 90 to each the end in the conductive connecting pin 32, and its other end protrudes out this accommodation space outside.
Heat abstractor comprises one group of heat pipe or metal bar 82, cooling base 80 and a plurality of radiating fin 81 that is installed on this cooling base 80.Each heat pipe 82 in this group heat pipe 82 has the first end that protrudes out this accommodation space inside and is connected to the second end of this cooling base 80, like this, the heat energy that is produced when wafer 31 runnings is enough derived from this accommodation space inside via this group heat pipe 82 and is delivered to this cooling base 80, and it can dissipate via these radiating fins 81.
It should be noted, can be poured the non-conductive transparent heat-conducting liquid that is doped with fluorescent material in the accommodation space, conduct heat, arrive external metallization by the circulation of non-conductive transparent heat-conducting liquid in this confined space so that the heat energy that is produced when this (a plurality of) wafer running is enough through the inner heat conduction of confined space, or through the confined space surface radiating.
In addition, in aforesaid preferred embodiment, conductive junction point and the circuit trace of this transparent installation base plate on the wafer installation surface can be formed by the transparent conductive material as tin indium oxide, indium zinc oxide or the like.
In addition, the outer surface at this first and second transparency carrier also can be formed with phosphor powder layer 902,911.
See also shown in Figure 22 and 23, the light emitting source of the 14 preferred embodiment of the present invention encapsulation U14 is shown.Different with the 13 preferred embodiment, on this first transparency carrier 90, do not form conductive junction point and this light emission unit 3 also comprises transparent installation base plate 30.This installation base plate 30 has wafer installation surface 300 and a plurality of conductive junction point 301 that is installed on this wafer installation surface 300 and is electrically connected with the corresponding conductive junction point 310 of these wafers 31.
See also shown in Figure 24 and 25, the light emitting source of the 15 preferred embodiment of the present invention encapsulation U15 is shown.Different with the 14 preferred embodiment, this first transparency carrier 90 is longer than this second transparency carrier 91.This light emission unit 3 also comprises the interchange away from the end portion of this second transparency carrier 91 that places this first transparency carrier 90 to be changeed DC circuit 37 and is sheathed on metal connector 38 on the end portion of this first transparency carrier 90 that this circuit 37 is installed.This interchange is changeed DC circuit 37 and is had the output that is electrically connected with corresponding conductive connecting pin 32.
This metal connector 38 is at the metal connector that is used on the known bulb bulb is fixed on the AC power supplies socket, and has the electrode that exchanges the input electrical connection of changeing DC circuit 37 with this.
In the present embodiment, cooling base and radiating fin are omitted, and second end that protrudes out in this accommodation space outside of heat pipe 82 is connected to this metal connector 38.
Therefore, present embodiment can replace present bulb.
Figure 26 and 27 shows the light emitting source encapsulation U16 of the 16 preferred embodiment of the present invention.Different with the 13 preferred embodiment, present embodiment also comprises the transparent tube body 92 that is sheathed on this first and second transparency carrier 90 and 91 outsides.This comes to be electrically connected with corresponding conductive junction point 301 via the circuit trace on the installation surface 300 of this installation base plate 30 to heat pipe 82, and first end portion of each heat pipe 82 extends to this body 92 outsides from an end of this body 92, it can further extend to the mounting receptacle of known fluorescent tube, and second end portion of each heat pipe 82 is electrically connected with the output that changes DC circuit 37 exchanging of these body 92 inside.The input that DC circuit 37 is changeed in this interchange is connected to a pair of electrode 370 that is suitable for protruding out to the mounting receptacle of known fluorescent tube.Therefore, the light emitting source of present embodiment encapsulation U16 can replace known fluorescent tube.
Should be noted that this body 92 can be laid with light reflector (not shown) on suitable inner surface.
Figure 28 and 29 shows the light emitting source encapsulation U17 of the 17 preferred embodiment of the present invention.Different with the 13 preferred embodiment, the conductive junction point 310 of the wafer 31 of the light emission unit of present embodiment is electrically connected to corresponding heat pipe 82 via lead 33.The output that DC circuit 37 is changeed in the interchange of this light emission unit 3 is electrically connected to corresponding heat pipe 82, and input is electrically connected to AC power.
It should be noted that this is being formed with light reflecting slant 820 to heat pipe 82 on the surface of the transparency carrier that wafer 31 is installed, it can strengthen the derivation of the light that emitted by wafer 31.
Figure 30 and 31 shows the light emitting source encapsulation U18 of the 18 preferred embodiment of the present invention.Different with the 17 preferred embodiment, the conductive junction point 310 of the wafer 31 of the light emission unit of present embodiment is electrically connected to first electrode trace and second electrode trace of circuit board via lead 33.This circuit board also has to exchange changes DC circuit.The output that DC circuit is changeed in this interchange is electrically connected to this first and second electrode trace, and its input is electrically connected to AC power supplies.The light emitting source encapsulation U18 of present embodiment also has heat abstractor.This heat abstractor comprises heat pipe 82, the cooling base 80 that is connected with this heat pipe 82 and is installed on radiating fin 81 on this cooling base 80.
It should be noted that identical with the 17 preferred embodiment, this circuit board also is formed with light reflecting slant 820, it can strengthen the derivation of the light that emitted by wafer 31.
In order to promote the brightness of light emitting source encapsulation of the present invention, DC circuit is changeed in the interchange of light emitting source encapsulation of the present invention can also comprise the control circuit zone.As shown in Figure 33, this control circuit zone comprises transistor T and pierce circuit OSC at least.
This transistor T have another output of being connected to this interchange and changeing the emitter of one of them output in DC circuit zone, being connected to this interchanges commentaries on classics DC circuit zone and this wafer 31,4 one of them electrode collector electrode and be connected to the base stage of the output of this pierce circuit OSC.
This pierce circuit OSC also is connected to another electrode of this wafer 31,4.
The effect of this control circuit is the conducting and not conducting by pierce circuit OSC oxide-semiconductor control transistors T, this wafer 31,4 become by the pulsed drive current signal and drive, so that when the output signal at the output of this pierce circuit OSC is in high level, this transistor T conducting, this wafer 31, therefore 4 are lighted, and when the output signal at the output of this pierce circuit OSC is in low level, this not conducting of transistor T, therefore this wafer 31,4 is not lighted.
Like this, by increasing the current value of this driving current signal, the instantaneous power of this wafer 31,4 is promoted, and then brightness is promoted.On the other hand, the output signal of the output by adjusting this pierce circuit OSC is in the duration of high level in the unit interval, and the consumed power in this unit interval can remain unchanged.
It should be noted that the principle and the effect that promote brightness in mode so at length disclosed already in the present application people's No. 200510052766.5 patent application case.
In sum, light emitting source of the present invention encapsulation really can be passed through above-mentioned disclosed structure, device, reaches its intended purposes and effect, and does not see the also unexposed use of publication before applying for, meets the important documents such as novelty, creativeness of patent of invention.
In addition, above-mentioned appended diagram and explanation only are embodiments of the invention, are not in order to limit embodiments of the invention; Those skilled in the art are according to feature category of the present invention, and other equivalences of being done change or revise, and all should be included in the scope that following claim defines.