CN103996664B - A kind of liquid forced cooling device of counnter attack diode - Google Patents
A kind of liquid forced cooling device of counnter attack diode Download PDFInfo
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- CN103996664B CN103996664B CN201410241133.8A CN201410241133A CN103996664B CN 103996664 B CN103996664 B CN 103996664B CN 201410241133 A CN201410241133 A CN 201410241133A CN 103996664 B CN103996664 B CN 103996664B
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Abstract
The invention discloses the liquid forced cooling device of a kind of counnter attack diode, it includes wire, heat-insulation layer, housing, the liquid of insulation heat transfer and refrigerating plant；Wherein heat-insulation layer is completely covered the low temperature face of housing and refrigerating plant, the liquid of insulation heat transfer it is full of in housing, counnter attack diode is completely submerged in inside the liquid of insulation heat transfer, counnter attack diode is connected in the convergence system in header box through housing and heat-insulation layer by wire, and housing is fully in close contact with the low temperature face of refrigerating plant.
Description
Technical field:
The invention belongs to the domain of control temperature of electronic power cell, the liquid more particularly to a kind of counnter attack diode is strong
Cooling device.
Background technology:
In order to reduce the line between solar photovoltaic assembly array and DC load or inverter, and in order to keep in repair and tie up
The convenience protected, is equipped with a series of header box after photovoltaic module, and the multi-channel DC in photovoltaic module is converged into one
Road, is connected on DC load or inverter.
In header box, there is a counnter attack diode on every road on the direct current incoming line of photovoltaic module, and its effect is:
(1) preventing photovoltaic module does not generates electricity when, the electric energy stored in battery flows backwards, and wastes the energy and causes photovoltaic
Assembly heating damages；(2) certain photovoltaic module is prevented because shade covers or during fault, other photovoltaic module electricity
Flow backwards, reduce output voltage and the electric current of whole photovoltaic plant.
Counnter attack diode is exactly a kind of diode bigger by current ratio, having electric current to pass through when, counnter attack two pole
Pipe, due to internal various losses, also can generate heat.With 16 tunnels, as a example by the header box of every road rated current 8A,
1.2 volts of calculating are pressed in pressure drop when counnter attack diode current flow, and the caloric value of the counnter attack diode of 16 conductings is
8A*1.2V*16 road=153.6W.If these heats can not be discharged in time, the temperature in header box will be too high, shadow
Ring electronics therein and the work of electric elements and life-span, easily cause fault, even affect sending out of whole photovoltaic plant
Electrical efficiency.
In order to solve this problem, patent 201310428734 devises the header box of a kind of cellular-type, allows counnter attack two pole
The heat that pipe produces does not affects other electronics within header box and the work of electric elements.And patent 201220255825
The simpliest counnter attack diode is arranged on the outside of header box, allows the sky that its heat produced can directly be scattered to outside casing
In gas.Patent 201320194559 and 201320214310 adds one to the counnter attack diode being contained in header box
Heat is scattered to the radiator structure outside header box.But, because header box is all directly installed on outdoor, at it
The when that generated energy being the highest, environment temperature is the highest, so, the side by heat conducting and radiating of above passiveness
Method all can not fundamentally solve the problem that counnter attack diode junction temperature is too high.
Summary of the invention:
It is an object of the invention to provide the liquid forced cooling device of a kind of counnter attack diode, it include wire, heat-insulation layer,
Housing, the liquid of insulation heat transfer and refrigerating plant, wherein heat-insulation layer is completely covered the low temperature face of housing and refrigerating plant,
Being full of the liquid of insulation heat transfer in housing, counnter attack diode is completely submerged in inside the liquid of insulation heat transfer, counnter attack two pole
Pipe is connected in the convergence system in the outside header box of cooling device through housing and heat-insulation layer by wire, housing and system
The low temperature face of device for cooling is fully in close contact；
Wherein wire has insulation protection, and housing can heat conduction；
Wherein refrigerating plant can be heat exchanger；It is distributed porose on heat exchanger, has low temperature refrigerant to flow through from hole, reach
The effect of heat exchange；
Heat exchanger obtains cold from heat transfer or the phase transformation of low temperature refrigerant, by the liquid cooling counnter attack of housing and insulation heat transfer
Diode；
Wherein refrigerating plant can also is that the semiconductor cooling device including semiconductor chilling plate and fin；
The cold end face of the semiconductor chilling plate of the energising liquid cooling counnter attack diode by housing and insulation heat transfer, energising
The face, hot junction of semiconductor chilling plate is dispersed into heat in environment by fin.
The operation principle of the present invention is:
In the insulation heat transfer liquids that counnter attack diode is fully immersed in the housing being closed in heat conduction, it is cold that refrigerating plant produces
Measure and through housing and insulation heat transfer liquids, counnter attack diodes force is freezed.
Heat-insulation layer has two effects, and one is that the cold that refrigerating plant is produced is enclosed in this liquid forced cooling device,
Being completely used for cooling down counnter attack diode, two is to prevent liquid forced cooling device from condensing, and causes the damage of header box or touches
Electricity casualty accident.
Wire all has insulation protection, can be safely passed housing and will not condense.
The invention have the advantage that
1. constitute a complete thermal conductor with housing during counnter attack diode is directly immersed in insulation heat transfer liquids, make counnter attack two
The heat equivalent of pole pipe is greatly improved, and improves the tolerance of counnter attack diode pair thermal shock；2. counnter attack diode is complete
It is immersed in the middle of insulation heat transfer liquids, not ingress of air, condensed water can be produced in no instance；The most whole liquid
Body forced cooling device wraps in inside heat-insulation layer, and whenever all without producing condensed water, counnter attack diode will not short circuit
Or ground connection；4. insulation heat transfer liquids constitutes a big heat conductor with counnter attack diode, it is possible to alleviate unexpected thermal shock
Negative effect to counnter attack diode；The most whole forced cooling device has the guarantor of heat-insulation layer on the surface within header box
Protect, also will not destroy the insulating properties within header box because producing condensed water.
Accompanying drawing explanation
The liquid forced cooling device structural representation of Fig. 1 counnter attack diode
Fig. 2 refrigerating plant is the liquid forced cooling device structural representation of the counnter attack diode of heat exchanger
Fig. 3 refrigerating plant is the liquid forced cooling device structural representation of the counnter attack diode of semiconductor cooling device
Wherein: 1, have the wire of insulation protection；2, counnter attack diode；3, insulation heat transfer liquids；4, heat-insulation layer；5、
Housing；6, refrigerating plant；61, the low temperature face of refrigerating plant；7, heat exchanger；71, hole；8, semiconductor chilling plate；
81, the cold end face of semiconductor chilling plate；82, the face, hot junction of semiconductor chilling plate；9, fin
Detailed description of the invention,
The liquid forced cooling device of a kind of counnter attack diode, structural representation is shown in Fig. 1, and it includes wire (1), insulation
Layer (4), housing (5), the liquid (3) of insulation heat transfer and refrigerating plant (6), be full of absolutely in its middle shell (5)
The liquid (3) of edge heat transfer, counnter attack diode (2) is completely submerged in liquid (3) the inside of insulation heat transfer, counnter attack two
Pole pipe (2) is connected to cooling device by there being the wire (1) of insulation protection through housing (5) and heat-insulation layer (4)
In convergence system in outside header box, the surface of housing (5) fully closely connects with the low temperature face (61) of refrigerating plant
Touch；
Wherein wire (1) has insulation protection, and housing (5) can heat conduction.
Embodiment one
Shown in Fig. 2 is the liquid forced cooling device of the counnter attack diode using coolant refrigeration device.
In the present embodiment, the refrigerating plant (6) of the present invention is the heat exchanger (7) that an internal flow crosses low temperature refrigerant.
The refrigerant that hole (71) in heat exchanger (7) is flow through can by conduction and or phase transformation by the way of the housing (5) of heat conduction
Heat absorption come and lead out.Heat-insulation layer (4) is completely covered housing (5) and the heat exchanger (7) of heat conduction.As
The refrigerant really flow through in heat exchanger (7) is the water of 15 degree of low temperature, after absorbing the heat of housing (5) of heat conduction,
The temperature of water is increased to 25 degree and is then out, and at this moment, the temperature of the housing (5) of heat conduction will be about 27 degree, and
The surface temperature of counnter attack diode (2) should be unable to be more than 30 degree.If flow through in heat exchanger (7) is low pressure
Freon liquid, its evaporating temperature is 10 degree, and in evaporation process, freon absorbs the housing (5) of heat conduction in a large number
With the heat of insulation heat transfer liquids (3), the surface temperature of counnter attack diode (2) is made to be not higher than 25 degree.At this moment, as
Really counnter attack diode (2) is not surrounded by the liquid (3) of heat transfer of insulating, and its surface is bound to produce condensed water, makes
The insulating properties of counnter attack diode (2) is destroyed.
Embodiment two
Shown in Fig. 3 is the liquid forced refrigeration device of the counnter attack diode using semiconductor refrigerating.In the present embodiment,
The refrigerating plant (6) of the present invention is one and by semiconductor chilling plate (8) and is exposed at the fin (9) outside header box
A set of semiconductor cooling device of composition.Heat-insulation layer (4) cover heat conduction housing (5) on not with semiconductor chilling plate
The all surface that contacts of cold end face (81).The cold end face (81) of semiconductor chilling plate is close to the housing (5) of heat conduction
On, housing (5) and insulation heat transfer liquids (3) through heat conduction absorb the heat that counnter attack diode (2) sends.Half
Together with the face, hot junction (82) of conductor cooling piece fully fits tightly with fin (9), through fin (9),
In the middle of the air outside header box that the heat that counnter attack diode (2) absorbs is spread.Fin (9) and counnter attack two
Can there be one 30 to 60 temperature difference spent on pipe (2) surface, pole, such that make environment temperature reach 60 degree, and counnter attack
The surface temperature of diode (2) is also not above 30 degree.
Claims (4)
1. the liquid forced cooling device of a counnter attack diode, it is characterised in that it includes wire, heat-insulation layer, housing, absolutely
The liquid of edge heat transfer and refrigerating plant；
Wherein heat-insulation layer is completely covered the low temperature face of housing and refrigerating plant, is full of the liquid of insulation heat transfer, counnter attack in housing
Diode is completely submerged in inside the liquid of insulation heat transfer, and counnter attack diode is connected through housing and heat-insulation layer by wire
In convergence system in header box, housing is fully in close contact with the low temperature face of refrigerating plant.
The liquid forced cooling device of counnter attack diode the most according to claim 1, it is characterised in that
Wherein wire has insulation protection, and housing can heat conduction.
The liquid forced cooling device of counnter attack diode the most according to claim 1, it is characterised in that
Wherein refrigerating plant is heat exchanger；Being distributed porose on heat exchanger, low temperature refrigerant flows through from hole, reaches heat exchange
Effect.
The liquid forced cooling device of counnter attack diode the most according to claim 1, it is characterised in that
Wherein refrigerating plant is the semiconductor cooling device including semiconductor chilling plate and fin.
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| CN201410241133.8A CN103996664B (en) | 2014-05-30 | 2014-05-30 | A kind of liquid forced cooling device of counnter attack diode |
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| CN201410241133.8A CN103996664B (en) | 2014-05-30 | 2014-05-30 | A kind of liquid forced cooling device of counnter attack diode |
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| CN103996664B true CN103996664B (en) | 2016-08-24 |
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| DE102007017113A1 (en) * | 2007-01-31 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Semiconductor device with an optically active layer, arrangement with a plurality of optically active layers and method for producing a semiconductor device |
| FR2932356B1 (en) * | 2008-06-10 | 2011-03-25 | Airbus France | HEAT DISSIPATION SYSTEM |
| CN101655189A (en) * | 2009-07-16 | 2010-02-24 | 艾迪光电（杭州）有限公司 | Hollow liquid cooling LED bar-shaped lamp |
| KR101343233B1 (en) * | 2011-11-28 | 2013-12-18 | 삼성전기주식회사 | Power Module Package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991006958A1 (en) * | 1989-10-30 | 1991-05-16 | Dolphin Server Technology A.S | A method and a means for cooling electronic components |
| DE10010637A1 (en) * | 2000-03-03 | 2001-09-13 | Eupec Gmbh & Co Kg | Circuit arrangement especially semiconductor module, power semiconductor module or similar |
| CN101222006A (en) * | 2007-01-12 | 2008-07-16 | 泰硕电子股份有限公司 | Light emitting diode with heat radiating device (2) |
| CN101232061A (en) * | 2007-01-22 | 2008-07-30 | 沈育浓 | Luminous source packaging |
| CN201074794Y (en) * | 2007-05-30 | 2008-06-18 | 黄成功 | Cooling device of LED lamp |
| CN103221742A (en) * | 2010-07-16 | 2013-07-24 | 贺利氏特种光源有限责任公司 | Cooling device for cylindrical, couplable LED modules |
| CN203882991U (en) * | 2014-05-30 | 2014-10-15 | 佐志温控技术（上海）有限公司 | Liquid forced cooling device of anti-inversion diode |
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| CN103996664A (en) | 2014-08-20 |
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