CN104037300A - Light-emitting diode device, display device and electronic equipment - Google Patents
Light-emitting diode device, display device and electronic equipment Download PDFInfo
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- CN104037300A CN104037300A CN201410082854.9A CN201410082854A CN104037300A CN 104037300 A CN104037300 A CN 104037300A CN 201410082854 A CN201410082854 A CN 201410082854A CN 104037300 A CN104037300 A CN 104037300A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light-emitting diode device which comprises a light-emitting chip, a substrate, a first conducting element, a second conducting element, a plurality of wires and a support element, wherein the light-emitting chip is arranged on the substrate, the first conducting element and the second conducting element are separated from the substrate, the bottom surfaces of the substrate, the first conducting element and the second conducting element are in direct contact with the surface of the support element, and the wires are respectively and electrically connected between the first conducting element and the light-emitting chip and between the second conducting element and the light-emitting chip. The invention also discloses a display device and electronic equipment which adopt the light-emitting diode device.
Description
Technical field
The invention relates to a kind of light-emitting diode assembly and there is display device and the electronic equipment of this light-emitting diode assembly, particularly improve the light-emitting diode assembly of heat dissipation and there is display device and the electronic equipment of this light-emitting diode assembly about a kind of.
Background technology
Light-emitting diode chip for backlight unit is a kind of semiconductor optoelectronic element, in the time applying voltage, will emit beam.Because volume is little, the favourable characteristic such as long service life, efficient energy resource consumption and high-quality, utilize light-emitting diode chip for backlight unit to be tending towards gradually general as the electronic installation of light emitting source.But along with the raising of light-emitting diode chip for backlight unit input power, more heat will be supervened.If cannot promote the thermal diffusivity of light-emitting diode chip for backlight unit, be accumulated in heat in element characteristic, life-span and the reliability to element and all can exert an adverse impact, and then cause reliability significantly to reduce.
With reference to Fig. 1, it shows an existing light emitting module 500.Light emitting module 500 comprises a light-emitting diode assembly 510 and a circuit board 550.Light-emitting diode assembly 510 comprises a body 511, and wherein a cup-shaped recess 513 is positioned on body 511.Light-emitting diode chip for backlight unit 520 is fixed in the middle of groove 513 by crystal-bonding adhesive 530, and covered by packaging body 515.In tradition is made, multiple light-emitting diode assemblies 510 will be in order by tin cream 540 pieces on circuit board 550, to provide light-emitting diode chip for backlight unit 520 required electric power.Therefore, the heat being produced by light-emitting diode chip for backlight unit 520, by the back side of sequentially passing through crystal-bonding adhesive 530, metal electrode (not shown), tin cream 540 and circuit board 550 and being passed to circuit board 550, to disperse, the radiating efficiency of light emitting module 500 is accumulated the thermal impedance of above-mentioned each element and reduce.On the other hand, foregoing circuit plate 550 must be between the conductive layer of himself and heat-conducting layer sandwiched one insulating barrier, with not Yin Gaowen and damaging of the running in protective circuit layer.Arranging of insulating barrier will further reduce the coefficient of heat transfer of circuit board 550, unfavorable light emitting module 500 integral heat sink enhancing efficiencies.
Except considering the problem of above-mentioned heat radiation, the piece evenness of light-emitting diode assembly, cost control and the colour temperature of LED encapsulating structure, drill the optical design such as colour system number, fluorophor become because of regulation and control be also to need to be considered in canned program.Therefore, a kind of technology that can address the above problem is always by height requirement.
Summary of the invention
In view of this, the invention provides a kind of light-emitting diode assembly, luminescence chip is to be directly arranged at a substrate for dispelling the heat, makes it have good heat radiation function.
In an embodiment provided by the present invention, light-emitting diode assembly comprises: a luminescence chip, a substrate, one first conducting element, one second conducting element, multiple wire and a support component.Luminescence chip has a positive terminal and a negative pole end and is located on substrate.Substrate has one first bottom surface, the first conducting element has one second bottom surface, and the second conducting element has one the 3rd bottom surface, wherein the first bottom surface, the second bottom surface and the 3rd bottom surface are separated from one another, and the first bottom surface, the second bottom surface and the 3rd bottom surface are the surfaces that directly contacts support component.The one of these wires is electrically connected at this first conducting element and this positive terminal, and the another one of these wires is electrically connected at this second conducting element and this negative pole end.
In above-mentioned preferred embodiment, this substrate, this first conducting element and this second conducting element are made by same material.
In above-mentioned preferred embodiment, light-emitting diode assembly also comprises a luminescent coating, wherein on this substrate, comprises a groove, and this luminescence chip is arranged in this groove, and this luminescent coating covers on this groove.
In above-mentioned preferred embodiment, light-emitting diode assembly also comprises a packaging body, covers on this luminescence chip, this substrate, this first conducting element and this second conducting element.
In above-mentioned preferred embodiment, light-emitting diode assembly, wherein this support component can be a kind of heat dissipation element or back of the body frame.
In above-mentioned preferred embodiment, light-emitting diode assembly comprises multiple light-emitting components, and wherein each light-emitting component is separately by two wire bond in this first conducting element and this second conducting element.
In another embodiment, light-emitting diode assembly comprises: luminescence chip, a substrate, one first conducting element, one second conducting element, a support component and multiple wire of multiple electrically connects each other.Luminescence chip is located at this substrate.Substrate and this first conducting element, this second conducting element are separated from one another, and the bottom surface of this substrate, the bottom surface of this first conducting element and the bottom surface of this second conducting element are all directly contacted with on this support component surface.The one of wire is directly electrically connected between this first conducting element and the one of these luminescence chips, and the another one of these wires is directly electrically connected between this second conducting element and the another one of these luminescence chips, electrically conducts to form.
The present invention more provides a display unit, and it comprises: a substrate; Two conducting elements, respectively with the substrate spacing of being separated by; One luminescence chip, is arranged at two conducting elements of substrate electrically connect; And one tabular packaging body be covered in substrate, two conducting elements and luminescence chip, making the bottom surface of substrate and the bottom surface of two conducting elements is to be exposed to outside packaging body, configures whereby from the light of luminescence chip and is transmitted in packaging body and via exiting surface one area source is provided.In part embodiment, in above-mentioned tabular packaging body, there is a fluorescent material.
The present invention also provides an electronic equipment, and it comprises a display unit.Above-mentioned display unit comprises a back of the body frame, a display floater, a support component and above-mentioned arbitrary light-emitting diode assembly, using the back light unit as display floater.Display floater is arranged on back of the body frame, and support component is arranged in back of the body frame.The bottom surface of the bottom surface of the substrate of light-emitting diode assembly, the bottom surface of the first conducting element and the second conducting element is the upper surface that directly contacts support component.In part embodiment, light-emitting diode assembly also comprises a tabular packaging body.Tabular packaging body at least covers the luminescence chip of light-emitting diode assembly, and has a fluorescent material in tabular packaging body.
Above-mentioned light-emitting diode assembly is directly arranged at luminescence chip on one substrate, makes directly to disperse outside self-luminous diode apparatus by substrate from the heat energy of luminescence chip, improves whereby the heat radiation function of light-emitting diode assembly.In addition, above-mentioned light-emitting diode assembly changes in prior art, and a light-emitting diode assembly only has the architectural feature of a luminescence chip, and multiple luminescence chips are arranged in a single individual packaging body, with reduce control in optical design become because of, improve whereby optical characteristics.
Brief description of the drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated, wherein:
Fig. 1 shows the schematic diagram of an existing light emitting module.
Fig. 2 shows the top view of a light-emitting diode assembly of one embodiment of the invention.
Fig. 3 shows the generalized section of looking along the A-A ' transversal of Fig. 2.
Fig. 4 shows the generalized section that is arranged at bending support component along the luminescence component of Fig. 2.
Fig. 5 shows the top view of a light-emitting diode assembly of another embodiment of the present invention.
Fig. 6 shows the generalized section of looking along the B-B ' transversal of Fig. 5.
Fig. 7 shows the top view of a light-emitting diode assembly of another embodiment of the present invention.
Fig. 8 shows the generalized section of the light-emitting diode assembly of another embodiment of the present invention.
Fig. 9 shows the generalized section of the light-emitting diode assembly of another embodiment of the present invention.
Figure 10 shows the luminous schematic diagram of forward formula of an electronic equipment of multiple embodiment of the present invention, is arranged at wherein comprising multiple light-emitting diode assemblies.
Figure 11 shows the luminous schematic diagram of side entering type of an electronic equipment of multiple embodiment of the present invention, is arranged at wherein comprising multiple light-emitting diode assemblies.
Figure 12 shows the top view of the electronic equipment of part embodiment of the present invention;
Figure 13 shows the profile of looking along Figure 12 C-C ' transversal;
Figure 14 shows the top view of the electronic equipment of part embodiment of the present invention;
Figure 15 shows the profile of looking along Figure 14 D-D ' transversal;
Figure 16 is a part of CIE1931 chroma figure, and the electronic equipment of its display application light-emitting diode assembly of the present invention is to have consistent optical characteristics.
Element numbers explanation in figure:
1,1 ', 1b, 1b '～electronic equipment;
10,10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h～light-emitting diode assembly;
20,20 ', 20b, 20b '～back of the body frame;
21～surface;
25,25b '～light guide plate;
30,30 '～liquid crystal panel;
100,100b, 100c, 100d, 100e～luminescence component;
110,110a, 110b～luminescence chip;
111,111a, 111b～positive terminal;
113,113a, 113b～negative pole end;
120d, 120e～luminescent coating;
130,130d, 130e～substrate;
131,133～side;
135d, 135e～groove;
136,137～side;
138～bottom surface (the first bottom surface);
150～the first conducting elements;
151～bottom surface (the second bottom surface);
170～the second conducting elements;
171～bottom surface (the 3rd bottom surface);
190～wire;
200,200a, 200f, 200g, 200h～support component (heat dissipation element);
201,201a～surface;
201f～upper surface;
203f～lower surface;
300,300d, 300e, 300g, 300h～packaging body;
302～fluorescent material;
301h, 301g～exiting surface;
303h, 303g～lower surface;
305h, 305g～side surface;
400～reflecting element;
500～light emitting module;
510～light-emitting diode assembly structure;
511～body;
513～groove;
515～packaging body;
520～light-emitting diode chip for backlight unit;
530～crystal-bonding adhesive;
540～tin cream;
550～circuit board;
G1, G2～spacing;
L1, L2～reference line;
S～optical parametric;
X～set direction.
Embodiment
For object of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and coordinate appended Fig. 2 to Figure 16, be described in detail.Specification of the present invention provides different embodiment that the technical characterictic of the different execution modes of the present invention is described.Wherein, the configuration of the each element in embodiment is the use for explanation, not in order to limit the present invention.And in embodiment, the part of drawing reference numeral repeats, and is for the purpose of simplifying the description, not means the relevance between different embodiment.
With reference to Fig. 2,3, the light-emitting diode assembly 10 of one embodiment of the invention comprises that a luminescence component 100 and is for supporting support component 200(Fig. 3 of luminescence component 100) and a packaging body 300.Luminescence component 100 comprises multiple luminescence chip 110, a substrate 130, two conducting elements (for example: the first conducting element 150, the second conducting element 170) and many wires 190.In this embodiment, multiple luminescence chips 110 are respectively a LED (light-emitting diode) chip.Luminescence chip 110 is adjacent one another are to be arranged on substrate 130, and is fixed on substrate 130 by suitable means.
The relative dual side-edge 131,133 of first and second conducting element 150,170 relative substrates 130 arranges, and wherein between first and second conducting element 150,170 and the relative dual side-edge 131,133 of substrate 130, has respectively a spacing G1, G2, is not connected each other.Spacing G1 is identical or is different from spacing G2, depending on application.Overall View it, the first conducting element 150, substrate 130 and the second conducting element 170 are sequentially to arrange along a set direction X to arrange and separated from one another, but are not limited thereto.In another embodiment, two conducting elements respectively relative substrate 130 adjacent dual side-edge setting and separate from substrate 130.In certain embodiments, luminescence component 100 is in the time manufacturing, and substrate 130, the first conducting element 150, the second conducting element 170 for example, are stamped to form by the plate (: aluminium) of a tool good heat conductive, conduction property jointly.Therefore, substrate 130, the first conducting element 150, the second conducting element 170 are made by identical material, but are not limited thereto.
Many wire 190 is electrically connected at respectively between the first conducting element 150 and each luminescence chip 110 and between the second conducting element 170 and each luminescence chip 110.More specifically, many wires 190 are to be directly electrically connected at respectively between the first conducting element 150 and each luminescence chip 110 and between the second conducting element 170 and each luminescence chip 110, electrically conduct to form, directly send whereby electric power from the first conducting element 150 or the second conducting element 170 to each luminescence chip 110.Be understandable that, electrically conduct for luminescence chip 110 is formed, the first conducting element 150 and the second conducting element 170 be electrically different.For example, in certain embodiments, the first conducting element 150 is electrodes of positively charged, and the second conducting element 170 is electronegative electrodes, therefore link wire 190 electrically connects of the first conducting element 150 to the positive terminal 111 of luminescence chip 110, and link wire 190 electrically connects of the second conducting element 170 to the negative pole end 113 of luminescence chip 110.
Avoid the foreign substances such as light, heat and moisture content for protection said elements and corrode, so packaging body 300 configurations are in order to encapsulating light emitting chip 110, substrate 130, the first conducting element 150, the second conducting element 170 and many wires 190.In certain embodiments, packaging body 300 also comprises fluorescent material 302, the optical wavelength that configuration is sent in order to conversion luminescence chip 110.Fluorescent material 302 can be for example: commercially available YAG(yttriumaluminum garnet, Y3Al5O12:Ce) fluorescent material or TAG(terbium aluminum garnet) fluorescent material.In one embodiment, the gold-tinted (wavelength 550～560nm) that the blue light (wavelength: 450～470nm) that luminescence chip 110 itself sends can produce when YAG fluorescent material is subject to exciting mixes and produces white light.In addition, although the packaging body 300 of the present embodiment has a flat surfaces, be not limited thereto.In certain embodiments, packaging body 300 can have different structure kenel (for example: semispherical surface, convex surface), the light shape of the light sending with optimization luminescence chip 110.
It should be noted that in the following explanation of bottom surface 139(of substrate 130 with the first replacement bottom surface, bottom surface 139), in the following explanation of bottom surface 151(of the first conducting element 150 with the second replacement bottom surface, bottom surface 139) and the following explanation of bottom surface 171(of the second conducting element 170 in the 3rd replacement bottom surface, bottom surface 139) be not to be subject to packaging body 300 covered and be exposed to outside packaging body 300.Therefore in the time that luminescence component 100 is fixed on support component 200, the first bottom surface 139, the second bottom surface 151 of the first conducting element 150 and the 3rd bottom surface 171 of the second conducting element 170 of substrate 130 are the surfaces 201 that are directly contacted with support component 200.Support component 200 is for example the made heat dissipation element of any material that helps heat radiation (for example: the metal material of the high thermal conductivities such as aluminium, tin, copper, silver, gold and composition thereof, or the nonmetallic materials of the high thermal conductivity such as graphite the 3rd, silica gel, epoxy resin).
In this embodiment, the surface 201 of support component 200 is a plane, but is not limited thereto.When substrate 130, the first conducting element 150 and second conducting element 170 of luminescence component 100 are while being arranged at the support component of a bending, luminescence component 100 can bend with the kenel of support component.For example, in embodiment as shown in Figure 4, when the surperficial 201a of the support component 200a of light-emitting diode assembly 10a is a curved surface, substrate 130, the first conducting element 150 and second conducting element 170 of luminescence component 100 can bend with the curvature of the surperficial 201a of support component 200a.
Should be understood that, the luminescence chip 110 of luminescence component 100 should not be defined in above-described embodiment with the arrangement mode of wire 190, and those skilled in the art can change the configuration kenel of luminescence chip 110 and wire 190 on demand.
For example, please refer to Fig. 5,6, in this embodiment, adjacent one another are being arranged on substrate 130 of luminescence chip 110,110a, 110b of the luminescence component 100b of light-emitting diode assembly 10b, wherein luminescence chip 110a and luminescence chip 110b compared with all the other luminescence chips 110 side 136,137 near substrate 130.Each luminescence chip 110,110a, 110b have respectively a positive terminal 111,111a, 111b and a negative pole end 113,113a, 113b, and by wire 190 electrically connects.In details of the words, one of wire 190 is to be directly linked between the first conducting element 150 and the positive terminal 111b of luminescence chip 110b, and one of wire 190 is to be directly linked between the second conducting element 170 and the negative pole end 113a of luminescence chip 110a, to form path, send whereby electric power from the first conducting element 150 or the second conducting element 170 to luminescence chip 110,110a, 110b.By above-mentioned configuration, can solve the problem of current distributing inequality.
Again for example, please refer to Fig. 7, in this embodiment, the luminescence component 100c of light-emitting diode assembly 10c comprises two groups of luminescence chips 110,110a, 110b, two groups of luminescence chips 110,110a, 110b are arranged on substrate 130 and by wire 190 electrically connects along two reference line L1, L2 respectively, wherein luminescence chip 110a compared with luminescence chip 110 side 136 near substrate 130, and luminescence chip 110b compared with luminescence chip 110 side 137 near substrate 130.Each luminescence chip 110,110a, 110b have respectively a positive terminal 111,111a, 111b and a negative pole end 113,113a, 113b, and by wire 190 electrically connects.In details of the words, one of wire 190 is to be directly linked between the first conducting element 150 and the positive terminal 111b of luminescence chip 110b, and one of wire 190 is to be directly linked between the second conducting element 170 and the negative pole end 113a of luminescence chip 110a, to send electric power from the first conducting element 150 or the second conducting element 170 to luminescence chip 110,110a, 110b.By above-mentioned configuration, can solve problem the further optical uniformity that improves luminescence component 100b of current distributing inequality.
It should be noted that, in above-described embodiment, because multiple luminescence chips 110 are to be directly arranged on the substrate 130 with plane kenel, therefore be arranged at the light-emitting diode assembly of cup-shaped packaging body compared to traditional luminescence chip, the light type of luminescence component 100 can not be restricted, and can reach desired irradiation light shape according to demand.
With reference to Fig. 8, it shows another embodiment of the luminescence component 100d of light-emitting diode assembly 10d of the present invention, and the same or analogous element of luminescence component 100 shown with Fig. 2 in Fig. 8 will be bestowed identical label, and its feature will no longer illustrate.The difference of luminescence component 100d and luminescence component 100 is, the substrate 130d of luminescence component 100d comprises the groove 135d of multiple rectangles, and wherein luminescence chip 110 is arranged in groove 135d; And multiple luminescent coating 120d are covered in respectively on each groove 135d, the wavelength fluorescent powder 302 that wherein luminescent coating 120d comprises the light sending in order to conversion luminescence chip 110.In addition, packaging body 300d is the top that is covered in all elements of luminescence component 100d and all luminescent coating 120d.By this configuration, contribute to the formation of luminescent coating 120d.
With reference to Fig. 9, it shows another embodiment of the luminescence component 100e of light-emitting diode assembly 10e of the present invention, and the same or analogous element of luminescence component 100 shown with Fig. 2 in Fig. 9 will be bestowed identical label, and its feature will no longer illustrate.The difference of luminescence component 100e and luminescence component 100 is, the substrate 130e of luminescence component 100e comprises multiple cup-shaped groove 135e, and wherein luminescence chip 110 is arranged in groove 135e; And multiple luminescent coating 120e are covered in respectively the upper of each groove 135e, the wavelength fluorescent powder 302 that wherein luminescent coating 120e comprises the light sending in order to conversion luminescence chip 110.In addition, packaging body 300e is the top that is covered in all elements of luminescence component 100e and all luminescent coating 120e.By this configuration, contribute to the formation of luminescent coating 120e.
With reference to Figure 10, it shows the schematic diagram of an electronic equipment 1.Electronic equipment 1, for example electronic display unit, comprise a display unit, this display unit comprises a back of the body frame 20, a liquid crystal panel 30, multiple luminescence component (for example: luminescence component 100), a support component 200f and multiple packaging body (for example: packaging body 300).Back of the body frame 20 has an opening, and liquid crystal panel 30 is arranged at the opening part of back of the body frame 20.Support component 200f comprises a upper surface 201f and a lower surface 203f.It is packaged that multiple luminescence components 100 are respectively a packaging body 300, but be jointly arranged on single support component 200f, wherein the first bottom surface 139, the second bottom surface 151 of the first conducting element 150 and the 3rd bottom surface 171 of the second conducting element 170 of the substrate 130 of luminescence component 100 are the upper surface 201f that are directly contacted with support component 200f, the lower surface 203f of support component 200f is the surface 21 that is directly contacted with back of the body frame 20, is that the heat energy being distributed with luminescence component 100 can be passed to support component 200f and back of the body frame 20 by substrate 130 fast.
In another embodiment, in the time that electronic specifications changes, for example: when back of the body frame 20 ' in the display unit of electronic equipment 1 ', liquid crystal panel 30 ' and support component 200f ' size strengthen, the quantity that only needs to increase luminescence component 100 can meet the demand of electronic installation 1 ' neatly.In another embodiment, support component 200f is omitted, and luminescence component 100 is directly arranged at back of the body frame 20.That is the first bottom surface 139, the second bottom surface 151 of the first conducting element 150 and the 3rd bottom surface 171 of the second conducting element 170 of the substrate 130 of luminescence component 100 is the surfaces 21 that are directly contacted with back of the body frame 20.
With reference to Figure 11, it shows the schematic diagram of an electronic equipment 1b.For example electronic display unit of electronic equipment 1b(or lamp box) comprise that a display unit, this display unit comprise a back of the body frame 20, a light guide plate 25, multiple luminescence component (for example: luminescence component 100) and multiple packaging body (for example: packaging body 300).Light guide plate 25 is arranged at back of the body frame 20.It is packaged that luminescence component 100 is respectively a packaging body 300, and be arranged at the side of back of the body frame 20b.The light that carrys out luminescent module 100 is entered in light guide plate 25 by the incidence surface 251 of light guide plate 25, and penetrates from the exiting surface 253 of light guide plate 25, so that an area source to be provided.For example, in the time that electronic installation specification changes: when the back of the body frame 20b ' of electronic equipment 1b ' and light guide plate 25b ' size strengthen, the quantity that only needs to increase luminescence component 100 can meet the demand of electronic installation 1b ' neatly.
In part embodiment, as shown in figure 11, owing to producing gap S between the light-emitting area of packaging body 300 and light guide plate 25, and make the light that luminescence component 100 is launched can be because gap S loss is in air.In addition,, when assembling is when light guide plate 25, can make both contrapositions of light guide plate 25 and luminescence component 100 not good because of actual assembled, and cause light energy loss.
Because above-mentioned observed result, so another embodiment proposes.The top view that shows the light-emitting diode assembly 10g of part embodiment of the present invention with reference to Figure 12 and 13, Figure 12, Figure 13 shows the profile of looking along Figure 12 C-C ' transversal.Light-emitting diode assembly 10g comprises one or more luminescence component (for example: luminescence component 100), a support component 200g and a packaging body 300g.
In part embodiment, as shown in figure 13 as, packaging body 300g has a platy structure, and comprises that an exiting surface 301g, a lower surface 303g and one link the side surface 305g of exiting surface 301g and lower surface 303g.Packaging body 300g is configured for encapsulating light emitting assembly 100, corrodes to protect luminescence component 100 to avoid the foreign substances such as light, heat and moisture content.In part embodiment, the bottom surface of substrate 130, the first conducting element 150 and second conducting element 171 of luminescence component 100 is the surfaces that are exposed to outside side surface 305g and directly contact support component 200g.Support component 200g is resisted against side surface 305g, and is not subject to packaging body 300h packaged.Part is carried out the light of luminescent module 100 via the lower surface 303g reflection of packaging body 300g outside from the exiting surface 301g of packaging body 300g ejaculation, with forming surface light source.In this embodiment, fluorescent material 302 can Direct Uniform make an addition in the platy structure that packaging body 300g forms, the platy structure of packaging body 300g now can replace the luminescence component 100 of Figure 11 and the function of light guide plate 25, can improve the problem producing because having gap between luminescence component 100 and light guide plate 25 in Figure 11.In this embodiment, the light that luminescence component 100 directly sends in packaging body 300g medium also conducts, and excites whereby fluorescent material 302 in packaging body 300g, makes the last sent wavelength of light of packaging body 300g convert required light wave band to.In another embodiment, fluorescent material alternative makes an addition to the region near luminescence component 100, or can rely on the distance of nearly luminescence component 100 optionally to change the interpolation concentration of fluorescent material, looks closely the demand of design.
In part embodiment, the exiting surface 301g of packaging body 300g or lower surface 303g have the surface of one patterned, or the lower surface 303g of packaging body 300g has site to promote the light uniformity.In part embodiment, the ratio of the thickness T of the length L of the lower surface 303g of packaging body 300g and its side surface 305g between approximately 180 to approximately between 315.In part embodiment, packaging body 300g is that mode with injection molding or model is with integrated mode encapsulating light emitting assembly 100.In other embodiment, the packaging body 300d of the light-emitting diode assembly 10d of Fig. 8 replaces with packaging body 300g, or the packaging body 300e of the light-emitting diode assembly 10e of Fig. 9 replaces with packaging body 300g, to form the light-emitting diode assembly of platy structure of similar extra quality ejaculation structure.With reference to the 14th and 15 figure, Figure 14 shows the top view of the light-emitting diode assembly 10h of part embodiment of the present invention, and Figure 15 shows the profile of looking along the D-D ' transversal of Figure 14.Light-emitting diode assembly 10h comprises one or more luminescence component (for example: luminescence component 100), a support component 200h, a packaging body 300h and a reflecting element 400.
As shown in figure 15, packaging body 300h has a platy structure, and comprises that an exiting surface 301h, a lower surface 303h and one link the side surface 305h of exiting surface 301h and lower surface 303h.Packaging body 300h is configured for encapsulating light emitting assembly 100, corrodes to protect luminescence component 100 to avoid the foreign substances such as light, heat and moisture content.In part embodiment, luminescence component 100 is arranged at the adjacent place of side surface 305h.Substrate 130, the first conducting element 150 and the second conducting element 171(of luminescence component 100 are not shown in Figure 15) bottom surface be to be exposed to outside lower surface 303h and the direct surface of contact support component 200h.Support component 200h is resisted against lower surface 303h, and is not subject to packaging body 300h packaged.Part is carried out the light of luminescent module 100 via the lower surface 303h reflection of packaging body 300h outside from the exiting surface 301h of packaging body 300h ejaculation.In this embodiment, fluorescent material 302 can Direct Uniform make an addition in the platy structure that packaging body 300h forms, the platy structure of packaging body 300h now can replace the luminescence component 100 of Figure 11 and the function of light guide plate 25, can improve the problem producing because having gap between luminescence component 100 and light guide plate 25 in Figure 11.In this embodiment, the light that luminescence component 100 directly sends in packaging body 300h medium also conducts, and excites whereby fluorescent material 302 in packaging body 300h, makes the last sent wavelength of light of packaging body 300h convert required light wave band to.In another embodiment, fluorescent material alternative makes an addition to the region near luminescence component 100, or can rely on the distance of nearly luminescence component 100 optionally to change the interpolation concentration of fluorescent material, looks closely the demand of design.In other embodiment, the packaging body 300d of the light-emitting diode assembly 10d of Fig. 8 replaces with packaging body 300h, or the packaging body 300e of the light-emitting diode assembly 10e of Fig. 9 replaces with packaging body 300h, to form the light-emitting diode assembly of platy structure of similar extra quality ejaculation structure.
In the foregoing description, because single light-emitting diode assembly comprises multiple luminescence chips, therefore can reduce and print cost and activity duration of light-emitting diode assembly, also can reduce simultaneously print the uncertain change that produces in processing procedure because of; For example: the warping phenomenon that inconsistent, the light-emitting diode assembly that light-emitting diode assembly arranges angle, height is sent out because of high-temperature baking and the side direction shearing producing while printing light-emitting diode assembly, or the problem that between indivedual light-emitting diode assembly, emission wavelength makes a variation.In addition, along with light-emitting diode assembly quantity reduces, the optical characteristics of the electronic equipment of application light-emitting diode assembly is also easier to control, produce whereby consistent optical parametric S, as shown in figure 16, wish the colourity of last bright dipping can comparatively be concentrated in a certain block, to reduce the optical difference problem that uses different LED package to produce because of original.
Although the present invention discloses as above with preferred embodiment; so it is not in order to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when doing a little amendment and perfect, therefore protection scope of the present invention is worked as with being as the criterion that claims were defined.
Claims (10)
1. a light-emitting diode assembly, comprising:
One luminescence chip, has a positive terminal and a negative pole end;
One substrate, this luminescence chip is located on this substrate, and this substrate has one first bottom surface;
One first conducting element, this first conducting element has one second bottom surface;
One second conducting element, this second conducting element has one the 3rd bottom surface;
One support component, this support component has a surface, and wherein this first bottom surface, this second bottom surface and the 3rd bottom surface are separated from one another, and this first bottom surface, this second bottom surface and the 3rd bottom surface directly contact the surface of this support component; And
Multiple wires, the one of the plurality of wire is electrically connected at this first conducting element and this positive terminal, and the another one of the plurality of wire is electrically connected at this second conducting element and this negative pole end.
2. light-emitting diode assembly as claimed in claim 1, also comprises a luminescent coating, wherein on this substrate, comprises a groove, and this luminescence chip is arranged in this groove, and this luminescent coating covers on this groove.
3. light-emitting diode assembly as claimed in claim 1 or 2, also comprises a packaging body, covers on this luminescence chip, this substrate, this first conducting element and this second conducting element.
4. light-emitting diode assembly as claimed in claim 3, it is characterized in that, this packaging body has a light-emitting area, a lower surface and and is linked to the side surface of this light-emitting area and this lower surface, and this first bottom surface, this second bottom surface and the 3rd bottom surface are exposed to outside this side surface and the direct surface of this support component of contact.
5. light-emitting diode assembly as claimed in claim 3, also comprise a reflecting element, wherein this packaging body has a light-emitting area, a lower surface and and is linked to the side surface of this light-emitting area and this lower surface, this first bottom surface, this second bottom surface and the 3rd bottom surface are exposed to outside this light-emitting area or this lower surface, and this reflecting element is towards this luminescence chip and be configured for the light of reflecting part from this luminescence chip.
6. light-emitting diode assembly as claimed in claim 1, also comprises multiple luminescence chips, it is characterized in that, the plurality of luminescence chip is with parallel way or this first conducting element of series system electrically connect and this second conducting element.
7. a display unit, comprising:
One substrate;
Two conducting elements, respectively with this substrate spacing of being separated by;
One luminescence chip, is arranged at these two conducting elements of this substrate electrically connect; And
One tabular packaging body, covers this substrate, this two conducting element and this luminescence chip, and the bottom surface of this substrate is exposed to outside this packaging body, is transmitted in this packaging body and via the exiting surface of this tabular packaging body one area source is provided from the light of this luminescence chip.
8. display unit as claimed in claim 7, is characterized in that, in this tabular packaging body, has a fluorescent material.
9. an electronic equipment, comprising:
One display unit, comprising:
One back of the body frame;
One display floater, is arranged on this back of the body frame;
One support component, is arranged in this back of the body frame, and has the lower surface of a upper surface and relative this upper surface; And
One light-emitting diode assembly, as a back light unit of this display floater, wherein this light-emitting diode assembly comprises:
One luminescence chip, has a positive terminal and a negative pole end;
One substrate, this luminescence chip is located on this substrate, and this substrate has one first bottom surface;
One first conducting element, this first conducting element has one second bottom surface;
One second conducting element, this second conducting element has one the 3rd bottom surface, and wherein this first bottom surface, this second bottom surface and the 3rd bottom surface are separated from one another, and this first bottom surface, this second bottom surface and the 3rd bottom surface directly contact the upper surface of this support component; And
Multiple wires, the one of the plurality of wire is electrically connected at this first conducting element and this positive terminal, and the another one of the plurality of wire is electrically connected at this second conducting element and this negative pole end.
10. electronic equipment as claimed in claim 9, is characterized in that, this light-emitting diode assembly also comprises a tabular packaging body, and this tabular packaging body at least covers this luminescence chip, and has a fluorescent material in this tabular packaging body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410082854.9A CN104037300A (en) | 2013-03-08 | 2014-03-07 | Light-emitting diode device, display device and electronic equipment |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310073728.2 | 2013-03-08 | ||
| CN201310073728 | 2013-03-08 | ||
| CN201410082854.9A CN104037300A (en) | 2013-03-08 | 2014-03-07 | Light-emitting diode device, display device and electronic equipment |
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| CN104037300A true CN104037300A (en) | 2014-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410082854.9A Pending CN104037300A (en) | 2013-03-08 | 2014-03-07 | Light-emitting diode device, display device and electronic equipment |
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